CN103956422A - 一种led灯丝 - Google Patents

一种led灯丝 Download PDF

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Publication number
CN103956422A
CN103956422A CN201410176331.0A CN201410176331A CN103956422A CN 103956422 A CN103956422 A CN 103956422A CN 201410176331 A CN201410176331 A CN 201410176331A CN 103956422 A CN103956422 A CN 103956422A
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China
Prior art keywords
substrate
electrode suppor
led filament
led
electrode support
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Pending
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CN201410176331.0A
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English (en)
Inventor
胡大鹏
郑元利
杨晓梅
苏勇肯
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Xiamen Xindeco Optoelectronics Co Ltd
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Xiamen Xindeco Optoelectronics Co Ltd
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Priority to CN201410176331.0A priority Critical patent/CN103956422A/zh
Publication of CN103956422A publication Critical patent/CN103956422A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开了一种LED灯丝，包括端部相互搭接连接的电极支架及基板，该基板上固定并电连接有若干LED芯片，该电极支架与基板的相互搭接段两侧边固定有卡板将两者接触面的两侧边包裹在其内。这种结构，卡板对电极支架与基板的连接段可以起到加固的作用，可确保电连接更为确实。

Description

一种LED灯丝
技术领域
本发明涉及一种LED灯，尤指一种LED灯丝。
背景技术
LED灯丝灯是一种仿制白炽灯的灯具，其以LED灯丝代替传统白炽灯的灯丝。这种新型的LED灯，无需加装透镜就可以达到与白炽灯相同的光照角度与光照面积，又具有LED灯的耗能低、寿命高、环保等功效。
LED灯丝灯的结构如图1所示，主要包括LED灯丝1、用以固定并实现灯丝与内部电路元件电连接的灯丝支架2，在LED灯丝1的外侧还罩有透明的玻璃泡壳3。这种LED灯丝灯外表与白炽灯类似，只是两者的灯丝结构不同。
LED灯丝1的一般结构如图2所示，其包括电极支架11以及基板12，该基板12上固定并电连接有若干LED芯片13，该电极支架11与基板12之间相互固定并实现电连接。该LED灯丝1则通过其电极支架11固定在灯具的灯丝支架2上。现有LED灯丝的电机支架11与基板12之间的连接是通过简单的粘合方式，具体是将两者相连接的端部相互层叠一小段，然后以（银）胶粘合。然而这种结构的LED灯丝却存在如下缺点：泡壳3在封口时，封口温度远远高于（银）胶的固化温度，泡壳封口时的高温可能导致（银）胶发生化学反应并液化，使得电极支架11与基板12之间出现虚粘、甚至脱落，进而造成LED灯丝失效；另外，当出现虚粘时，可能LED灯丝仍可正常点亮，但LED灯丝灯成品组装或运输过程中的振动可能使虚焊部位脱离，导致LED灯成品失效。
发明内容
本发明所要解决的技术问题在于提供一种可使电连接更确实的LED灯丝。
为解决上述技术问题，本发明的技术解决方案是：
一种LED灯丝，包括端部相互搭接连接的电极支架及基板，该基板上固定并电连接有若干LED芯片，该电极支架与基板的相互搭接段两侧边固定有卡板将两者接触面的两侧边包裹在其内。
所述的卡板一体成型在所述电极支架上，其从电极支架的侧边先向基板一侧弯折再向内侧弯折而成L形，从而使该基板的端部卡固在两个L形卡板与电极支架主体之间。
所述的电极支架与基板相互搭接段的接触面以胶进行粘合。
采用上述方案后，由于本发明在LED灯丝的电极支架与基板的搭接段两侧边固定了卡板，一方面对两者的连接段进行加固，确保电连接更为确实，另一方面可以将电极支架与基板的接触面两侧包裹在内，虽然接触面的两端还是暴露在空气中，但是受泡壳封口时的高温影响将大为降低，因此可有效防止因银胶液化而导致的虚粘现象，避免灯丝失效及因振动引起的脱离现象。
附图说明
图1是现有LED灯丝灯的结构示意图；
图2是现有LED灯丝的结构示意图；
图3是本发明的立体示意图；
图4是本发明的主视图；
图5是本发明的俯视图。
具体实施方式
下面结合附图和具体实施例对本发明作进一步详述。
本发明所揭示的是一种LED灯丝，如图3至图5所示，为本发明的较佳实施例。所述的LED灯丝1包括端部相互搭接连接的电极支架11及基板12，该基板12上固定并电连接有若干LED芯片13，该电极支架11与基板12的相互搭接段两侧边固定有卡板111将两者接触面的两侧边包裹在其内。
该卡板111可以一体成型在所述电极支架11上，其从电极支架11的侧边先向基板一侧弯折再向内侧弯折而成L形，从而使该基板12的端部卡固在两个L形卡板111与电极支架11主体之间。
为了使连接更为可靠，所述电极支架11与基板12相互搭接段的接触面以胶进行粘合。
固定了卡板111之后，卡板111对电极支架11与基板12的连接段可以起到加固的作用，可确保电连接更为确实。另一方面，卡板11还可以将电极支架11与基板12相互接触面的两侧包裹在其内，虽然接触面的两端还是暴露在空气中，但是受泡壳封口时的高温影响将大为降低，因此可有效防止因银胶液化而导致的虚粘现象，避免灯丝失效及因振动引起的脱离现象。
以上所述，仅为本发明的较佳实施例而已，并非用来限定本发明实施的范围。故但凡依本发明的权利要求和说明书所做的变化或修饰，皆应属于本发明专利涵盖的范围之内。

Claims (3)

1.一种LED灯丝，包括端部相互搭接连接的电极支架及基板，该基板上固定并电连接有若干LED芯片，其特征在于：该电极支架与基板的相互搭接段两侧边固定有卡板将两者接触面的两侧边包裹在其内。
2.根据权利要求1所述的一种LED灯丝，其特征在于：所述的卡板一体成型在所述电极支架上，其从电极支架的侧边先向基板一侧弯折再向内侧弯折而成L形，从而使该基板的端部卡固在两个L形卡板与电极支架主体之间。
3.根据权利要求1或2所述的一种LED灯丝，其特征在于：所述的电极支架与基板相互搭接段的接触面以胶进行粘合。
CN201410176331.0A 2014-04-29 2014-04-29 一种led灯丝 Pending CN103956422A (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202281062U (zh) * 2011-08-29 2012-06-20 浙江锐迪生光电有限公司 一种LED芯片4π出光的高显色指数LED灯泡
US20130058080A1 (en) * 2010-09-08 2013-03-07 Zhejiand Ledison Optoelectronics Co, Ltd. Led light bulb and led light-emitting strip being capable of emitting 4tt light
CN203386796U (zh) * 2013-07-25 2014-01-08 浙江锐迪生光电有限公司 一种led发光条封装支架
CN103700652A (zh) * 2013-12-02 2014-04-02 张晓峰 一种螺旋形led封装灯丝
CN203839403U (zh) * 2014-04-29 2014-09-17 厦门市信达光电科技有限公司 一种led灯丝

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130058080A1 (en) * 2010-09-08 2013-03-07 Zhejiand Ledison Optoelectronics Co, Ltd. Led light bulb and led light-emitting strip being capable of emitting 4tt light
CN202281062U (zh) * 2011-08-29 2012-06-20 浙江锐迪生光电有限公司 一种LED芯片4π出光的高显色指数LED灯泡
CN203386796U (zh) * 2013-07-25 2014-01-08 浙江锐迪生光电有限公司 一种led发光条封装支架
CN103700652A (zh) * 2013-12-02 2014-04-02 张晓峰 一种螺旋形led封装灯丝
CN203839403U (zh) * 2014-04-29 2014-09-17 厦门市信达光电科技有限公司 一种led灯丝

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Application publication date: 20140730