WO2018166269A1 - 一种发光二极管灯丝及一种灯具 - Google Patents

一种发光二极管灯丝及一种灯具 Download PDF

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Publication number
WO2018166269A1
WO2018166269A1 PCT/CN2017/118824 CN2017118824W WO2018166269A1 WO 2018166269 A1 WO2018166269 A1 WO 2018166269A1 CN 2017118824 W CN2017118824 W CN 2017118824W WO 2018166269 A1 WO2018166269 A1 WO 2018166269A1
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Prior art keywords
bracket
led
region
solid crystal
led filament
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PCT/CN2017/118824
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English (en)
French (fr)
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陈翔
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浙江鼎鑫工艺品有限公司
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Priority to EP17900977.4A priority Critical patent/EP3598491B1/en
Publication of WO2018166269A1 publication Critical patent/WO2018166269A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the invention relates to the field of filaments, in particular to an LED filament and a luminaire.
  • LED Since the 20th century, the revolutionary new light source LED has rapidly gained popularity in the lighting market due to its advantages of energy saving, environmental protection and long life. LED has become the mainstream lighting source in the future, and is widely used in commercial lighting, industrial lighting, outdoor lighting and so on. However, the development of civil lighting is relatively slow. For many people, LED lights are a new type of light source that has never been heard.
  • Japan's Niuwei Light Source introduced the introduction of LED bulb light bulbs "LED filament bulbs” with the appearance of incandescent lamp prototypes. This phenomenon has been reversed. "Traditional appearance", upgraded 'recipe', people have seen it made LED lamps can be understood as familiar lighting fixtures. Then, candle lights, crystal lamps and bulbs with LED filaments as light sources began to appear in large numbers and were accepted by more and more consumers.
  • Publication No. CN104241501A discloses an omnidirectional plant growth lamp LED filament comprising an elongated transparent substrate, a metal bracket fixed at two ends of the transparent substrate, a plurality of blue LED chips fixed on the transparent substrate, and a plurality of blue LED chips forming at least one column
  • the LED strings running through the transparent substrate, the blue LED chips of each LED string are connected in series by wires; the blue LED chips at the two ends of the transparent substrate are respectively connected to the bracket by wires; the transparent substrate is also wrapped with red phosphor a layer, the red phosphor layer is a mixture of a red phosphor and a binder.
  • the present invention provides an LED filament that is not easily damaged.
  • the present invention provides an LED filament comprising a plurality of LED chips, a first bracket and a second bracket, the LED chip being fixedly connected to the first bracket and/or the second bracket,
  • the first bracket and the second bracket are made of metal; the two ends of the LED chip are electrically connected to the first bracket and the second bracket, respectively, or the plurality of LED chips are divided into multiple sets of LEDs connected in series
  • the chip is electrically connected to the first bracket and the second bracket at each end of each of the LED chips connected in series with each other.
  • the first bracket includes a solid crystal portion, and the solid crystal portion includes a die-bonding region and a connecting region, the cross-sectional area of the solid crystal region being larger than a cross-section of the connecting region
  • the LED chip is fixed to the die bonding region.
  • the cross-sectional area of the solid crystal portion gradually decreases from a middle portion of the solid crystal region toward a middle portion of the connection region.
  • the die bonding region and the connection region are plate-like structures, and the die bonding region and the connection region are adjacent to a first edge of the second bracket and the die bonding region
  • the surface of the LED chip is fixed to be perpendicular, and a cross-sectional line of the surface of the LED chip fixed to the first edge and the solid crystal region is sinusoidal.
  • the first bracket and the second bracket are wrapped with a light transmissive layer.
  • the first bracket and the second bracket extend outward from the light transmissive layer with a first pin and a second pin.
  • the second pin is located at an end of the second bracket adjacent to the first pin.
  • the first bracket and the second bracket are fixed to each other by an insulator.
  • the insulator is made of epoxy.
  • the LED chips or each group of LED chips are connected in parallel with each other, even if some of the LED chips are damaged or the wires are damaged, the LED filaments are not completely damaged.
  • FIG. 1 is a schematic structural view of an LED filament according to a first embodiment of the present invention.
  • FIG. 2 is a schematic view showing the structure of the first bracket and the second bracket of the LED filament of FIG. 1.
  • Figure 3 is a partial enlarged view of the middle portion of the first bracket and the second bracket of Figure 2;
  • Figure 4 is a cross-sectional view taken at 1-1 and 2-2 of Figure 3.
  • FIG. 5 is a schematic structural view of an LED filament according to a second embodiment of the present invention.
  • FIG. 6 is a schematic structural view of an LED filament according to a third embodiment of the present invention.
  • FIG. 7 is a schematic structural view of an LED filament according to a fourth embodiment of the present invention.
  • FIG. 8 is a schematic structural view of an LED filament according to a fifth embodiment of the present invention.
  • FIG. 9 is a schematic structural view of an LED filament according to a sixth embodiment of the present invention.
  • FIG. 10 is a schematic structural view of an LED filament according to a sixth embodiment of the present invention.
  • Figure 11 is a schematic view showing the structure of an LED filament according to a seventh embodiment of the present invention.
  • Figure 12 is a cross-sectional view taken at 3-3 of Figure 11.
  • the LED filament of the embodiment includes a first bracket 10 , a second bracket 20 , and an insulator 30 for fixing the first bracket 10 and the second bracket 20 , and wraps the middle of the first bracket 10 and the second bracket 20 .
  • Light transmissive layer 40 The insulator 30 is located near the ends of the first bracket 10 and the second bracket 20.
  • the insulator 30 is preferably made of epoxy resin. Of course, the insulator 30 can also be made of plastic or rubber.
  • the first bracket 10 is divided into a first pin 11 and a solid crystal portion 12 .
  • the first pin 11 is located at two ends of the solid crystal portion 12
  • the second bracket 20 includes a second pin 21 and a power supply portion 22 .
  • the second pin 21 is located at both ends of the power supply portion 22.
  • the first pin 11 and the second pin 21 are used to be connected to a power supply circuit.
  • the first bracket 10 LED filament further includes a plurality of LED chips 50, and the plurality of LED chips 50 are uniformly fixed on the upper surface of the solid crystal portion 12 in a row. In other embodiments, the lower surface of the first power supply portion is also fixed with a plurality of LED chips 50.
  • the light transmissive layer may be a silica gel layer, an epoxy resin layer, a fluorescent gel layer made of silica gel and phosphor.
  • the solid crystal portion 12 is a fixed crystal region A and a connection region.
  • the cross-sectional area of the solid crystal region A is larger than the cross-sectional area of the connection region, and the width of the solid crystal region A is larger than the width of the connection region. (The width is the length in the x direction in FIG. 3)
  • the LED chip 50 is fixed to the upper surface of the solid crystal region A.
  • the cross-sectional area of the middle portion of the preferred solid crystal region A gradually becomes smaller and gradually smaller toward the cross-sectional area of the middle portion of the connecting region.
  • the specific solid crystal portion 12 faces the first edge 120 of the power supply portion 22 as a wavy surface, and the first edge 120 and the solid portion
  • the solid crystal region and the connection region are plate-like structures.
  • x is a variable of the first edge 120 in a direction perpendicular to one end of the first power supply portion toward the other end;
  • a 1 is the amplitude and A 1 may be 0.5 mm.
  • k 1 , k 2 is the offset, which is reflected in the coordinate system and is the left and right movement of the curve;
  • ⁇ is the angular velocity, which controls the vibration frequency of the curve.
  • the power supply portion 22 is a third region C and a fourth region D which are spaced apart, the cross-sectional area of the third region C is smaller than the cross-sectional area of the fourth region D, and the width of the third region C is smaller than the width of the fourth region D.
  • the cross-sectional area of the middle portion of the preferred third region C gradually becomes gradually larger toward the cross-sectional area of the middle portion of the fourth region D.
  • the solid crystal region A corresponds to the third region C, and the connection region corresponds to the fourth region D.
  • the width of the LED filament can be relatively small.
  • the LED chip 50 passes through the wire 50a and the solid crystal region A of the solid crystal portion 12, respectively.
  • the third region C of the power supply portion 22 is electrically connected.
  • the LED chip 50 is electrically connected to the solid crystal region A of the solid crystal portion 12 and the fourth region D of the power supply portion 22 via the wires 50a.
  • the second edge 220 of the power supply portion 22 facing the first power supply portion 22 is also a wavy surface, the second edge 220 is perpendicular to the surface of the solid crystal portion 12 to which the LED chip 50 is fixed, and the second edge 220 and the solid crystal portion 12 fix the LED chip 50.
  • section line of the sinusoidal surface x a 2 sin ( ⁇ y + ⁇ ) + k 2, where y is the first edge in a direction toward the other end 120 of the first end portion of the variable power supply.
  • x is a variable of the first edge 120 in a direction perpendicular to one end of the first power supply portion toward the other end;
  • a 2 is the amplitude, A 1 is greater than A 2 ; A 2 may be 0.25 mm.
  • k 1 , k 2 is the offset, which is reflected in the coordinate system and is the left and right movement of the curve;
  • ⁇ is the angular velocity, which controls the vibration frequency of the curve.
  • Both ends of the LED chip 50 are connected to the solid crystal portion 12 and the power supply portion 22 via the wires 50a.
  • the first pin 11 is located at one end of the first power supply portion
  • the second pin 21 is located at an end of the power supply portion away from the first pin 11 .
  • the first pin 11 is located at one end of the first power supply portion
  • the second pin 21 is located at one end of the power supply portion close to the first pin 11 .
  • the light transmissive layer 40 has a flame structure.
  • the first power supply portion and the power supply portion in the middle of the first bracket 10 and the second bracket 20 are curved.
  • each of the two LED chips is connected in series to form a group of LED chips, and two ends of each group of LED chips are electrically connected to the first bracket 10 and the second bracket 20 respectively. This can be 6V depending on the power supply.
  • each of the three LED chips is connected in series to form a group of LED chips, and two ends of each group of LED chips are electrically connected to the first bracket 10 and the second bracket 20, respectively.
  • This can be 9V depending on the power supply.
  • the first bracket 10 and the second bracket 20 have the same structure, and the solid crystal region A of the first bracket 10 has a convex shape, and the first bracket 10 and the second bracket 20 are both on the same.
  • a plurality of LED chips are fixed, and two ends of the LED chip are electrically connected to the first bracket 10 and the second bracket 20, respectively.
  • the LED filament of the present invention has at least the following advantages:
  • the cross-sectional area of the solid crystal region is larger than the connection region, when the LED filament is subjected to a force, the deformation of the connection region is large, and the deformation of the solid crystal region is small, and the LED chip is not easily damaged.
  • the LED chips or each group of LED chips are connected in parallel with each other, even if some of the LED chips are damaged or the wires are damaged, the LED filaments are not completely damaged.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

提供一种LED灯丝，包括多个LED芯片（50）、第一支架（10）和第二支架（20），LED芯片（50）与第一支架（10）和/或第二支架（20）连接固定，第一支架（10）和第二支架（20）由金属制成；LED芯片（50）两端分别与第一支架（10）和第二支架（20）电连接，或多个LED芯片（50）分成多组相互串联的LED芯片，每组相互串联的LED芯片两端分别与第一支架（10）和第二支架（20）电连接。

Description

一种发光二极管灯丝及一种灯具 技术领域
本发明涉及灯丝领域，特别是一种LED灯丝及一种灯具。
背景技术
自20世纪出现革命性的新光源LED，凭借着节能环保，寿命长等优点迅速走红照明市场，LED成为未来主流的照明光源，广泛应用于商业照明，工业照明，户外照明等。但在民用照明方面的发展较之缓慢，对于很多人来说，LED灯是一款从未听说的新型光源。2008年，日本牛尾光源推出以白炽灯原型配置LED的灯泡式灯具“LED灯丝灯泡”的出现扭转了这一现象，“传统的外型”，升级的‘配方’，人们看到它做成的LED灯具便能想明白它就是熟悉的照明灯具。随后以LED灯丝就是发光二极管为光源的蜡烛灯、水晶灯、球泡灯开始大量出现且被越来越多的消费者所接受。
公布号CN104241501A公开了一种全向植物生长灯LED灯丝，包括长条形透明基板，固定于透明基板两端的金属支架，透明基板上固定有多个蓝光LED芯片，多个蓝光LED芯片形成至少一列贯穿透明基板的LED串，每一LED串的蓝光LED芯片之间利用导线连接成串联形式；位于透明基板两端的蓝光LED芯片分别用导线连接到支架；所述透明基板外部还包裹有红色荧光粉层，所述红色荧光粉层由红色荧光粉及胶联剂混合而成。
现有LED灯丝，微小形变就会导致金线断裂或LED芯片损坏， 而LED灯丝中一处金线断裂或LED芯片损坏就会导致LED灯丝损坏。
发明内容
为了克服上述问题，本发明提供不容易损坏的LED灯丝。
为达上述优点，本发明提供一种LED灯丝，包括多个LED芯片、第一支架和第二支架，所述LED芯片与所述第一支架和/或所述第二支架连接固定，所述第一支架和所述第二支架由金属制成；所述LED芯片两端分别与所述第一支架和所述第二支架电连接，或多个所述LED芯片分成多组相互串联的LED芯片，每组所述相互串联的LED芯片两端分别与所述第一支架和所述第二支架电连接。
在本发明的一个实施例中，所述第一支架包括固晶部，所述固晶部包括间隔布置的固晶区域和连接区域，所述固晶区域的截面面积大于所述连接区域的截面面积，所述LED芯片固定于所述固晶区域。
在本发明的一个实施例中，所述固晶部的截面面积自所述固晶区域中部逐渐朝向所述连接区域中部逐渐变小。
在本发明的一个实施例中，所述固晶区域和所述连接区域为板状结构，所述固晶区域和所述连接区域靠近所述第二支架的第一边缘与所述固晶区域固定所述LED芯片的表面垂直，所述第一边缘与所述固晶区域固定所述LED芯片的表面的截面线为正弦曲线。
在本发明的一个实施例中，所述第一支架和所述第二支架之间具有间隙。
在本发明的一个实施例中，所述第一支架和所述第二支架外包裹有透光层。
在本发明的一个实施例中，所述第一支架和所述第二支架从所述透光层向外延伸出第一引脚和第二引脚。
在本发明的一个实施例中，所述第二引脚位于所述第二支架靠近所述第一引脚的一端。
在本发明的一个实施例中，所述第一支架和所述第二支架通过绝缘体相互固定。
在本发明的一个实施例中，所述绝缘体由环氧树脂制成。
在本发明中由于LED芯片或每组LED芯片相互并联即使部分LED芯片损坏或者导线损坏都不会导致LED灯丝完全损坏。
附图说明
图1所示为本实用新型第一实施例的LED灯丝的结构示意图。
图2所示为图1的LED灯丝的第一支架和第二支架的结构示意图。
图3所示为图2的第一支架和第二支架中部的局部放大图。
图4所示为图3的1-1和2-2处的截面图。
图5所示为本实用新型第二实施例的LED灯丝的结构示意图。
图6所示为本实用新型第三实施例的LED灯丝的结构示意图。
图7所示为本实用新型第四实施例的LED灯丝的结构示意图。
图8所示为本实用新型第五实施例的LED灯丝的结构示意图。
图9所示为本实用新型第六实施例的LED灯丝的结构示意图。
图10所示为本实用新型第六实施例的LED灯丝的结构示意图。
图11所示为本实用新型第七实施例的LED灯丝的结构示意图。
图12所示为图11的3-3处的截面图。
具体实施方式
为更进一步阐述本发明为达成预定发明目的所采取的技术手段及功效，以下结合附图及较佳实施例，对依据本发明提出具体实施方式、结构、特征及其功效，详细说明如后。
请参见图1，本实施例的LED灯丝，包括第一支架10、第二支架20、用于固定第一支架10和第二支架20的绝缘体30，包裹第一支架10和第二支架20中部的透光层40。绝缘体30位于第一支架10和第二支架20的端部附近。绝缘体30优选的采用环氧树脂制成，当然绝缘体30还可以采用塑料或橡胶制成。
请参见图2，第一支架10分为第一引脚11和固晶部12，第一引脚11位于固晶部12的两端，第二支架20包括第二引脚21和供电部22，第二引脚21位于供电部22的两端。第一引脚11和第二引脚21用于和供电电路连接。第一支架10和第二支架20之间具有间隙，即第一支架10与第二支架20断路，需要注意的是第一支架10和第二支架20之间的间隙填充有透光层40。第一支架10LED灯丝还包括多个LED芯片50，多个LED芯片50均匀固定在固晶部12上表面排成一列。在其他实施例中，第一供电部的下表面也固定有多个LED芯片50。透光 层可以是硅胶层、环氧树脂层、硅胶与荧光粉制成的荧光胶层。
请参见图3，4固晶部12为间隔布置的固晶区域A和连接区域，固晶区域A的截面面积大于连接区域的截面面积，固晶区域A的宽度大于连接区域的宽度。(宽度为图3中x方向的长度)LED芯片50固定于固晶区域A的上表面。优选的固晶区域A中部的截面面积逐渐朝向连接区域中部的截面面积逐渐连续的变小，具体的固晶部12朝向供电部22的第一边缘120为波浪形面，第一边缘120与固晶部12固定LED芯片50的表面垂直，第一边缘120与固晶部12固定LED芯片50的表面的截面线为正弦曲线x＝A 1sin(ωπy+φ)+k 1。固晶区域和连接区域为板状结构。
x为第一边缘120在垂直于第一供电部的一端朝向另一端方向的变量；
A 1为振幅，A 1可以是0.5mm。
Φ为初相，x＝0时的相位；反映在坐标系上则为曲线的上下移动；
k 1，k 2为偏距，反映在坐标系上则为曲线的左右移动；
ω为角速度，控制曲线的震动频率。
供电部22为间隔布置的第三区域C和第四区域D，第三区域C的截面面积小于第四区域D的截面面积，第三区域C的宽度小于第四区域D的宽度。优选的第三区域C中部的截面面积逐渐朝向第四区域D中部的截面面积逐渐连续的变大。固晶区域A与第三区域C对应，连接区域与第四区域D对应这样LED灯丝的宽度可以比较小，本实施例中LED芯片50分别通过导线50a与固晶部12的固晶 区域A、供电部22的第三区域C电连接，在其他实施例中LED芯片50分别通过导线50a与固晶部12的固晶区域A、供电部22的第四区域D电连接。
供电部22朝向第一供电部22的第二边缘220也为波浪形面，第二边缘220与固晶部12固定LED芯片50的表面垂直，第二边缘220与固晶部12固定LED芯片50的表面的截面线为正弦曲线x＝A 2sin(ωπy+φ)+k 2，其中y为第一边缘120在第一供电部的一端朝向另一端方向的变量。
x为第一边缘120在垂直于第一供电部的一端朝向另一端方向的变量；
A 2为振幅，A 1大于A 2；A 2可以是0.25mm。
Φ为初相，x＝0时的相位；反映在坐标系上则为曲线的上下移动；
k 1，k 2为偏距，反映在坐标系上则为曲线的左右移动；
ω为角速度，控制曲线的震动频率。
LED芯片50两端通过导线50a与固晶部12和供电部22连接。
请参见图5，本实施例中，第一引脚11位于第一供电部的一端，第二引脚21位于供电部远离第一引脚11的一端。
请参见图6，本实施例中，第一引脚11位于第一供电部的一端，第二引脚21位于供电部靠近第一引脚11的一端。
请参见图7，本实施例中，透光层40为火焰形结构。
请参见图8，本实施例中，第一支架10和第二支架20中部的 第一供电部和供电部为弧形。
请参见图9，本实施例中，每两个LED芯片串联成一组LED芯片，每组LED芯片的两端分别与第一支架10和第二支架20电连接。这样就可以根据供电电源的可以是6V。
请参见图10，本实施例中，每三个LED芯片串联成一组LED芯片，每组LED芯片的两端分别与第一支架10和第二支架20电连接。这样就可以根据供电电源的可以是9V。
请参见图11、图12，本实施例中，第一支架10和第二支架20的结构相同，第一支架10的固晶区域A为凸台形，第一支架10和第二支架20上均固定有多个LED芯片，LED芯片的两端分别与第一支架10和第二支架20电连接。
综上，本发明的LED灯丝至少具有以下的优点:
在本发明中由于固晶区域的截面面积大于连接区域，这样当LED灯丝受力时连接区域的变形大，固晶区域的变形小，LED芯片就不容易损坏。
在本发明中由于LED芯片或每组LED芯片相互并联即使部分LED芯片损坏或者导线损坏都不会导致LED灯丝完全损坏。
以上，仅是本发明的较佳实施例而已，并非对本发明作任何形式上的限制，虽然本发明已以较佳实施例揭露如上，然而并非用以限定本发明，任何熟悉本专业的技术人员，在不脱离本发明技术方案范围内，当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例，但凡是未脱离本发明技术方案内容，依据本 发明的技术实质对以上实施例所作的任何简单修改、等同变化和修饰，均仍属于本发明技术方案的范围内。

Claims (11)

  1. 一种LED灯丝，其特征在于，包括多个LED芯片、第一支架和第二支架，所述LED芯片与所述第一支架和/或所述第二支架连接固定，所述第一支架和所述第二支架由金属制成；
    所述LED芯片两端分别与所述第一支架和所述第二支架电连接，或多个所述LED芯片分成多组相互串联的LED芯片，每组所述相互串联的LED芯片两端分别与所述第一支架和所述第二支架电连接。
  2. 根据权利要求1所述的LED灯丝，其特征在于，所述第一支架包括固晶部，所述固晶部包括间隔布置的固晶区域和连接区域，所述固晶区域的截面面积大于所述连接区域的截面面积，所述LED芯片固定于所述固晶区域。
  3. 根据权利要求2所述的LED灯丝，其特征在于，所述固晶部的截面面积自所述固晶区域中部逐渐朝向所述连接区域中部逐渐变小。
  4. 根据权利要求3所述的LED灯丝，其特征在于，所述固晶区域和所述连接区域为板状结构，所述固晶区域和所述连接区域靠近所述第二支架的第一边缘与所述固晶区域固定所述LED芯片的表面垂直，所述第一边缘与所述固晶区域固定所述LED芯片的表面的截面线为正弦曲线。
  5. 根据权利要求4所述的LED灯丝，其特征在于，所述第一支架和所述第二支架之间具有间隙。
  6. 根据权利要求1所述的LED灯丝，其特征在于，所述第一支架和所述第二支架外包裹有透光层。
  7. 根据权利要求6任意一项所述的LED灯丝，其特征在于，所述第一支架和所述第二支架从所述透光层向外延伸出第一引脚和第二引脚。
  8. 根据权利要求6任意一项所述的LED灯丝，其特征在于，所述第二引脚位于所述第二支架靠近所述第一引脚的一端。
  9. 根据权利要求1-8任意一项所述的LED灯丝，其特征在于，所述第一支架和所述第二支架通过绝缘体相互固定。
  10. 根据权利要求9所述的LED灯丝，其特征在于，所述绝缘体由环氧树脂制成。
  11. 一种灯具，其特征在于，所述灯具以如权利要求1-10中任意一项所述的LED灯丝作为光源。
PCT/CN2017/118824 2017-03-13 2017-12-27 一种发光二极管灯丝及一种灯具 WO2018166269A1 (zh)

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