WO2015168825A1 - 一种高光效的led球泡灯 - Google Patents

一种高光效的led球泡灯 Download PDF

Info

Publication number
WO2015168825A1
WO2015168825A1 PCT/CN2014/076700 CN2014076700W WO2015168825A1 WO 2015168825 A1 WO2015168825 A1 WO 2015168825A1 CN 2014076700 W CN2014076700 W CN 2014076700W WO 2015168825 A1 WO2015168825 A1 WO 2015168825A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
stem
filament
chip
electrode
Prior art date
Application number
PCT/CN2014/076700
Other languages
English (en)
French (fr)
Inventor
严钱军
高基伟
徐小秋
肖兆新
Original Assignee
杭州杭科光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 杭州杭科光电股份有限公司 filed Critical 杭州杭科光电股份有限公司
Priority to PCT/CN2014/076700 priority Critical patent/WO2015168825A1/zh
Priority to EP14891350.2A priority patent/EP3006814A4/en
Publication of WO2015168825A1 publication Critical patent/WO2015168825A1/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F21V23/009—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing the casing being inside the housing of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2109/00—Light sources with light-generating elements disposed on transparent or translucent supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED bulb, and more particularly to a high efficacy LED bulb directly assembled from a filament.
  • LED lighting is considered to be one of the most promising areas in the 21st century.
  • LEDs are increasingly used in the field of lighting, in which LEDs are packaged on transparent substrates. Filaments are popular among end customers due to their high luminous efficacy and similar appearance to conventional tungsten filament lamps.
  • the filament is mainly because the PN junction of the LED chip is 4JI angle illumination, and the bracket or the ceramic package will lose half of the PN junction due to the reflection of the downward blue light, and finally the blue light loss is 25%; the transparent substrate can be used for this part.
  • the blue light is utilized to improve the light efficiency of the LED light source.
  • the filament of the transparent substrate is basically not capable of dissipating heat, and the assembled bulb is not prominent due to the high temperature, especially the use of the light bulb.
  • the filament is made into a high-brightness bulb, so the heat dissipation of the filament bulb is an urgent problem to be solved.
  • a high-efficiency LED bulb comprising: a plurality of LED filaments, a stem, an LED driver, a standard interface, a lampshade; the plurality of LED filaments and stems The lampshade is sealed, and the lampshade is filled with a heat dissipating material; both ends of each LED filament are spot-welded through the two filament electrodes of the LED filament and the two stem electrodes on the stem, and the plurality of LED filaments surround the bulb lamp
  • the core column is arranged; the lower part of the core column is connected to the exhaust pipe; the core electrode of the core column is connected to the LED driver through an electrical connection line, the LED driver is connected to the standard interface through a lead wire, and the standard interface is connected with an external AC or DC power source.
  • the plurality of LED filaments are arranged around the stem in the interior of the bulb lamp.
  • the LED filaments are arranged in a tapered linear shape around the stem, the LED filaments are linearly arranged around the stem, and the LED filaments are arranged in a regular polygon around the stem.
  • the cloth or LED filament is arranged in an M-shape around the stem.
  • the LED filament comprises: a filament electrode, a transparent substrate, a plurality of LED chips, a bonding wire and a fluorescent glue, wherein the plurality of LED chips are fixed on a transparent substrate having filament electrodes at both ends, between the LED chips, the LED chip and the filament electrode They are connected by a bonding wire, and the LED chip, the bonding wire and the transparent substrate are wrapped with a fluorescent glue.
  • the LED filament comprises: a filament electrode, a transparent substrate, a plurality of LED chips, a line and a fluorescent glue. The plurality of LED chips are fixed on a transparent substrate having a line, and the line on the transparent substrate and the filament on both ends of the transparent substrate are passed through the LED chip. The electrodes are connected, and the LED chip and the transparent substrate are wrapped with fluorescent glue.
  • the LED filament comprises: a filament electrode, a conductive substrate, a plurality of LED chips, a bonding wire, and a plurality of LED chips are fixed on the conductive substrate having micropores, one end of the conductive substrate acts as a filament electrode, and the other end of the conductive substrate passes
  • the bonding material is connected to the other filament electrode, and the LED chip and the filament electrode are connected by a bonding wire, and the LED chip, the bonding wire, the micro hole, the bonding material and the conductive substrate are wrapped with the fluorescent glue.
  • the inside of the stem includes one or more of an insulating layer, a first interlayer, a second interlayer, a first plating layer, a third interlayer, and a second plating layer;
  • the insulating layer is made of glass or transparent ceramic;
  • the material of the interlayer is metallic silver, aluminum or titanium;
  • the material of the second interlayer is paraffin or metal salt;
  • the material of the plating layer is silver, aluminum, titanium or platinum;
  • the material of the third interlayer is copper or its alloy material;
  • the second plating layer The material is one or more of alumina, silica, and titania.
  • the material of the stem electrode is gold, silver, copper, iron, aluminum or an alloy thereof.
  • the heat dissipating material is a gas or a liquid; when the heat dissipating material is a gas, the component is a base gas or a mixture of a base gas and an auxiliary gas, and the mass ratio of the base gas to the auxiliary gas is 80-100:0-20
  • the base gas is composed of one or more of hydrogen, nitrogen, and helium in any ratio, and the auxiliary gas is randomly mixed by one or more of helium, argon, helium, and neon.
  • Mixed composition When the heat dissipating material is a liquid, the components thereof are composed of one or more of water, ethanol, glycerin, and silicone oil in any ratio.
  • the lampshade is a transparent glass lampshade, a frosted glass lampshade or a glass lampshade coated with transparent silica gel.
  • the standard interface is E12, E14, E26, E27 or E39.
  • the transparent substrate is made of transparent glass, glass ceramic, transparent ceramic, yttrium aluminum garnet, alumina (sapphire:), nitrogen oxychloride, cerium oxide ceramic, magnesium fluoride ceramic, calcium fluoride ceramic or transparent resistant Thermal PC/PS/PMMA;
  • the material of the conductive substrate is copper, silver, aluminum, iron or an alloy thereof.
  • the LED chip is selected from one or more of a UV chip, a blue chip, and a green chip.
  • the material of the bonding wire is selected from the group consisting of gold, silver, copper, iron, aluminum or alloy materials thereof.
  • the fluorescent glue is formed by mixing LED package glue and phosphor, and the LED package glue is selected from the group consisting of silica gel, epoxy resin, Hybnd material, and PMMA; and the phosphor is one of green phosphor, yellow phosphor, and red phosphor.
  • the composition ratio of the package glue, green phosphor, yellow phosphor and red phosphor is 100: (0-30): (5-50): (0-10).
  • the beneficial effects of the invention are that, due to the use of a highly heat-dissipating material and a core material having a high specific heat capacity,
  • the high-efficiency LED filament works at lower temperatures to achieve its high luminous efficiency.
  • FIGS. 2(a) to (e) are schematic structural views of different embodiments of the bulb wick of the present invention
  • Figs. 3(a) to (e) are cross-sectional views showing different embodiments of the bulb filament of the bulb of the present invention
  • insulating layer 3-1 the first interlayer 3-2, the second interlayer 3-3, the first plating layer 3-4, the third interlayer 3-5, the second plating layer 3-6
  • the transparent substrate 12 the conductive substrate 17, the LED chip 13, the bonding Line 14, fluorescent glue 15, line 16, micro holes 18, bonding material 19.
  • a high-efficiency LED bulb of the present invention comprises: a plurality of LED filaments 1, a stem 3, an LED driver 7, a standard interface 9, a lampshade 10; the plurality of LED filaments 1 and a core
  • the column 3 is sealed by the lampshade 10, and the lampshade 10 is filled with the heat dissipating material 11; both ends of each LED filament 1 are spot-welded by the two filament electrodes 2 of the LED filament 1 and the two stem electrodes 4 on the stem 3 a plurality of LED filaments 1 are arranged in different shapes around the stem 3 inside the bulb lamp; the lower portion of the stem 3 is connected to the exhaust pipe 5; the stem electrode 4 of the stem 3 is connected to the LED driver 7 through the electrical connection line 6 Connected, LED driver 7 is connected to standard interface 9 via lead 8, and standard interface 9 is connected to an external AC or DC power supply;
  • Figure 1 (a) is a first embodiment of a bulb lamp in which the LED filament 1 is arranged in a tapered linear shape
  • Figure 1 (b) is a second embodiment of the bulb lamp in which the LED filament 1 is linearly arranged in a cross
  • Figure 1 (c) is a third embodiment of the bulb lamp, wherein the LED filament 1 is arranged in a regular polygon
  • Figure 1 (d) is a fourth embodiment of the bulb lamp, wherein the LED filament 1 is arranged in an M-shape; as shown in picture 2:
  • Figure 2 (a) is a first embodiment of the stem 3: the stem 3 is composed of an insulating layer 3-1 wrapped with a first interlayer 3-2 (a metal having a high reflectance such as silver, aluminum or titanium:);
  • a first interlayer 3-2 a metal having a high reflectance such as silver, aluminum or titanium:
  • Figure 2 (b) is a second embodiment of the stem 3: the stem 3 is composed of an insulating layer 3-1 wrapped with a first interlayer 3-2 (a metal having a high reflectivity such as silver, aluminum or titanium), and An interlayer 3-2 contains a second interlayer 3-3 (thermal phase change material such as paraffin or metal salt);
  • first interlayer 3-2 a metal having a high reflectivity such as silver, aluminum or titanium
  • second interlayer 3-3 thermo phase change material such as paraffin or metal salt
  • Figure 2 (c) is a third embodiment of the stem 3:
  • the stem 3 is composed of a third interlayer 3-5 (copper or its alloy material) wrapped by an insulating layer 3-1, and the third interlayer 3-5 is plated.
  • Figure 2 (d) is a fourth embodiment of the stem 3: the stem 3 is wrapped with a third interlayer by an insulating layer 3-1 3-5 (copper or its alloy material), and the third interlayer 3-5 contains a second interlayer 3-3 (thermal phase change material such as paraffin or metal salt), and the surface is plated with the first plating layer 3-4 (reflection)
  • the material of the material is silver, aluminum, titanium or platinum
  • Figure 2 (e) is the fifth embodiment of the stem 3: the stem 3 is made of the third interlayer 3-5 (copper or its alloy material) and plated in the third The second plating layer 3-6 on the surface of the interlayer 3-5 (reflecting material is alumina, silica, titanium dioxide).
  • Figure 3 (a) is a first embodiment of the LED filament 1, the LED filament 1 comprises a filament electrode 2, a transparent substrate 12, a plurality of LED chips 13, a bonding wire 14 and a fluorescent glue 15, and an LED chip 13 (mainly for formal wear) Chip) is fixed on the transparent substrate 12 containing the filament electrode 2 at both ends by a solid crystal material (such as silica gel, epoxy resin, Hybrid, PMMA, PU) (such as transparent glass, transparent ceramic, yttrium aluminum garnet, sapphire, transparent heat resistant) On the PC/PS/PMMA), the LED chip 13 and the chip 13 are connected to the electrode 2 through a bonding wire, and the LED chip 13, the bonding wire 14 and the substrate 12 are wrapped by the fluorescent glue 15 to form a 360-degree light.
  • LED filament 1 comprises a filament electrode 2, a transparent substrate 12, a plurality of LED chips 13, a bonding wire 14 and a fluorescent glue 15, and an LED chip 13 (mainly for formal wear) Chip) is fixed on the transparent substrate 12 containing the filament electrode 2
  • Figure 3 (b) is a second embodiment of the LED filament 1, the LED filament 1 comprises a filament electrode 2, a transparent substrate 12, a plurality of LED chips 13, a line 16, a fluorescent glue 15, and an LED chip 13 (mainly facing the flip chip) Fixing on a transparent substrate 12 (such as transparent glass, transparent ceramic, yttrium aluminum garnet, sapphire, transparent heat-resistant PC/PS/PMMA) with a solid crystal material (such as gold, gold-tin alloy, solder paste) The line 16 on the substrate 12 is connected to the filament electrode 2 at both ends of the substrate through the LED chip 13; the LED chip 13 and the substrate 12 are wrapped by the fluorescent glue 15 to form a 360-degree light-emitting LED filament 1.
  • a transparent substrate 12 such as transparent glass, transparent ceramic, yttrium aluminum garnet, sapphire, transparent heat-resistant PC/PS/PMMA
  • a solid crystal material such as gold, gold-tin alloy, solder paste
  • Figure 3 (c) ⁇ (e) is the third embodiment of the LED filament 1
  • Figure 3 (c) is a perspective view of the LED filament 1
  • Figure 3 (d) is a semi-finished diagram of the LED filament 1
  • Figure 3 (e) It is the finished appearance of the LED filament 1.
  • the LED filament 1 includes a filament electrode 2, a conductive substrate 17, a plurality of LED chips 13, and a bonding wire 14.
  • the plurality of LED chips 13 are fixed by a solid crystal material (such as silica gel, epoxy resin, Hybrid, PMMA, PU).
  • a solid crystal material such as silica gel, epoxy resin, Hybrid, PMMA, PU.
  • the conductive substrate 17 such as copper, silver, iron or its alloy material
  • the hole 18 small cavity composed of air, size 10 nm to 100 um
  • one end of the conductive substrate 17 serves as a filament electrode 2, and the other end of the conductive substrate 17 passes.
  • the bonding material 19 (polymer materials such as PPA, PCT, EMC, SMC, LCP) is connected to the other filament electrode 2, and between the LED chips 13, the LED chip 13 and the filament electrode 2 are connected by a bonding wire 14, Then, the LED chip 13, the bonding wire 14, the microholes 18, the bonding material 19, and the conductive substrate 17 are wrapped by the fluorescent glue 15 by means of Molding, leaving only the filament electrode 2, as shown in Fig. 3(e).

Abstract

一种高光效的LED球泡灯，包括多个LED灯丝（1）、芯柱（3）、LED驱动器（7）、标准接口（9）和灯罩（10）；多个LED灯丝和芯柱由灯罩密封，且灯罩中填充散热材料（11）；每个LED灯丝的两端均通过LED灯丝的两个灯丝电极（2）与芯柱上的两个芯柱电极（4）点焊连接，多个LED灯丝在球泡灯内部围绕芯柱排布；芯柱下部连接排气管（5）；芯柱的下端电极通过电连接线（6）与LED驱动器相连，LED驱动器通过引线与标准接口连接，标准接口与外部AC或DC电源相连通。由于采用高散热性材料和具有高导热性能的芯柱材料，使高光效LED灯丝在较低温度下工作发挥其高光效。

Description

一种高光效的 LED球泡灯
技术领域
本发明涉及一种 LED球泡灯，尤其涉及一种由灯丝直接组装的高光效 LED 球泡灯。
背景技术
半导体发光二极管 (LED)照明被认为是 21世纪最具发展前景的领域之一， 随着各国禁用白炽灯法令的出台， LED在照明领域应用越来越广泛， 其中在透 明基板上进行封装的 LED灯丝由于光效高且外观类似传统的钨丝灯备受终端客 户喜爱。 该灯丝主要是由于 LED芯片的 P-N结是 4JI角度发光， 采用支架或者 陶瓷封装会由于向下的蓝光反射回来经过 P-N结而损失一半， 最终导致蓝光损 失 25%;采用透明基板可以将这一部分的蓝光利用起来，提高 LED光源的光效， 但是目前采用这种透明基板的灯丝基本不具有散热能力， 组装的球泡灯由于温 度过高而导致光效高的特点并不突出， 尤其是采用该灯丝做成高光通量的球泡 灯， 所以灯丝球泡灯的散热是急需解决的问题。
发明内容
本发明的目的在于针对现有技术的不足， 提供一种高光效的 LED球泡灯。 本发明的目的是通过以下技术方案实现的： 一种高光效的 LED球泡灯， 包 括： 多个 LED灯丝、 芯柱、 LED驱动器、 标准接口、 灯罩； 所述多个 LED灯 丝和芯柱由灯罩密封，且灯罩中填充散热材料;每个 LED灯丝的两端均通过 LED 灯丝的两个灯丝电极与芯柱上的两个芯柱电极点焊连接， 多个 LED灯丝在球泡 灯内部围绕芯柱排布； 所述芯柱下部连接排气管； 芯柱的芯柱电极通过电连接 线与 LED驱动器相连， LED驱动器通过引线与标准接口连接， 标准接口与外部 AC或 DC电源相连通。
所述多个 LED灯丝在球泡灯内部围绕芯柱排布具体为： LED灯丝围绕芯柱 呈锥状线性排布、 LED灯丝围绕芯柱呈线性交叉排布、 LED灯丝围绕芯柱呈正 多边形排布或 LED灯丝围绕芯柱呈 M型排布。
所述 LED灯丝包括： 灯丝电极、透明基板、 多个 LED芯片、 键合线和荧光 胶，多个 LED芯片固定在两端含有灯丝电极的透明基板上， LED芯片之间、 LED 芯片与灯丝电极之间通过键合线相连接， LED 芯片、 键合线和透明基板上包裹 荧光胶。 所述 LED灯丝包括：灯丝电极、透明基板、多个 LED芯片、线路和荧光胶， 多个 LED芯片固定在具有线路的透明基板上，通过 LED芯片将透明基板上的线 路与透明基板两端的灯丝电极连接起来， LED芯片和透明基板上包裹荧光胶。
所述 LED灯丝包括： 灯丝电极、 导电基板、 多个 LED芯片、 键合线， 多个 LED 芯片固定在具有微孔的导电基板上， 导电基板的一端作为一个灯丝电极， 导电基板的另一端通过粘结材料与另一个灯丝电极相连， LED 芯片之间、 LED 芯片与灯丝电极之间通过键合线连接起来， LED 芯片、 键合线、 微孔、 粘结材 料和导电基板上包裹荧光胶。
所述芯柱内部包括绝缘层、 第一夹层、 第二夹层、 第一镀层、 第三夹层和 第二镀层中的一种或者几种； 所述绝缘层的材料为玻璃或者透明陶瓷； 第一夹 层的材料为金属银、 铝或钛； 第二夹层的材料为石蜡或金属盐； 镀层的材料为 银、 铝、 钛或铂； 第三夹层的材料为铜或其合金材料； 第二镀层的材料为氧化 铝、 二氧化硅、 二氧化钛中的一种或几种。
所述芯柱电极的材料为金、 银、 铜、 铁、 铝或其合金材料。
所述散热材料为气体或液体； 当散热材料是气体时， 其组分是基础气体或 由基础气体与辅助气体混合组成， 所述基础气体与辅助气体的质量比为 80-100:0-20， 所述基础气体由氢气、 氮气、 氦气的一种或多种按任意配比混合 组成， 所述辅助气体由氖气、 氩气、 氪气、 氙气的一种或多种按任意配比混合 组成； 当散热材料是液体时， 其组分由水、 乙醇、 甘油、 硅油的一种或多种按 任意配比混合组成。
所述灯罩为透明的玻璃灯罩、 磨砂的玻璃灯罩或外部涂覆透明硅胶的玻璃 灯罩。
所述标准接口为 E12、 E14、 E26、 E27或 E39。
所述透明基板的材料为透明玻璃、 微晶玻璃、 透明陶瓷、 钇铝石榴石、 氧 化铝 (蓝宝石：)、 氮氧化氯、 氧化钇陶瓷、 氟化镁陶瓷、 氟化钙陶瓷或透明的耐热 PC/PS/PMMA; 所述导电基板的材料为铜、 银、 铝、 铁或其合金材料。
所述 LED芯片选自 UV芯片、 蓝光芯片、 绿光芯片中的一种或几种。
所述键合线的材料选自金、 银、 铜、 铁、 铝或其合金材料。
所述荧光胶由 LED封装胶水和荧光粉混合而成， LED封装胶水选自硅胶、 环氧树脂、 Hybnd材料、 PMMA; 荧光粉由绿色荧光粉、 黄色荧光粉、 红色荧 光粉中的一种或者几种组成， 封装胶水、 绿色荧光粉、 黄色荧光粉和红色荧光 粉的质量比为 100： (0-30)： (5-50)： (0-10 )。
本发明的有益效果是， 由于采用高散热性材料和具有高比热容的芯柱材料， 使高光效 LED灯丝在较低温度下工作发挥其高光效的优点。
附图说明
图 1 (a) ~ (d) 是本发明球泡灯不同实施案例的结构示意图；
图 2 (a) ~ (e) 是本发明球泡灯芯柱不同实施案例的结构示意图； 图 3 (a) ~ ( e ) 是本发明球泡灯 LED灯丝不同实施案例的截面图； 图中， LED灯丝 1、 灯丝电极 2、 芯柱 3、 芯柱电极 4、 排气管 5、 电连接 线 6、 LED驱动器 7、 引线 8、 标准接口 9、 灯罩 10、 散热材料 11 ; 绝缘层 3-1、 第一夹层 3-2、 第二夹层 3-3、 第一镀层 3-4、 第三夹层 3-5、 第二镀层 3-6 ； 透 明基板 12、 导电基板 17、 LED芯片 13、 键合线 14、 荧光胶 15、 线路 16、 微孔 18、 粘结材料 19。
具体实施方式
以下参照附图， 对本发明做作进一歩详细说明。
如图 1所示， 本发明一种高光效的 LED球泡灯， 包括： 多个 LED灯丝 1、 芯柱 3、 LED驱动器 7、 标准接口 9、 灯罩 10; 所述多个 LED灯丝 1和芯柱 3 由灯罩 10密封， 且灯罩 10中填充散热材料 11 ; 每个 LED灯丝 1的两端均通过 LED灯丝 1的两个灯丝电极 2与芯柱 3上的两个芯柱电极 4点焊连接，多个 LED 灯丝 1在球泡灯内部围绕芯柱 3呈不同形状排布;所述芯柱 3下部连接排气管 5; 芯柱 3的芯柱电极 4通过电连接线 6与 LED驱动器 7相连， LED驱动器 7通过 引线 8与标准接口 9连接， 标准接口 9与外部 AC或 DC电源相连通；
图 1 (a) 是球泡灯的第一实施案例， 其中 LED灯丝 1呈锥状线性排布； 图 1 (b) 是球泡灯的第二实施案例， 其中 LED灯丝 1呈线性交叉排布； 图 1 (c) 是球泡灯的第三实施案例， 其中 LED灯丝 1呈正多边形排布； 图 1 (d) 是球泡灯的第四实施案例， 其中 LED灯丝 1呈 M型排布； 如图 2所示：
图 2 (a) 是芯柱 3的第一实施案例： 芯柱 3是由绝缘层 3-1包裹第一夹层 3-2(具有高反射率的金属如银、 铝或钛:)构成；
图 2 (b) 是芯柱 3的第二实施案例： 芯柱 3是由绝缘层 3-1包裹第一夹层 3-2 (具有高反射率的金属如银、 铝或钛） 构成， 而第一夹层 3-2 内部含有第二 夹层 3-3 (热相变材料如石蜡或金属盐）；
图 2 (c) 是芯柱 3的第三实施案例： 芯柱 3是由绝缘层 3-1包裹第三夹层 3-5 (铜或其合金材料）构成， 而第三夹层 3-5表面镀有第一镀层 3-4 (反射材料 材料为银、 铝、 钛或铂）；
图 2 (d) 是芯柱 3的第四实施案例： 芯柱 3是由绝缘层 3-1包裹第三夹层 3-5 (铜或其合金材料）构成， 而第三夹层 3-5内部含有第二夹层 3-3 (热相变材 料如石蜡或金属盐）、表面镀有第一镀层 3-4 (反射材料材料为银、铝、钛或铂）; 图 2 (e)是芯柱 3的第五实施案例： 芯柱 3是由第三夹层 3-5 (铜或其合金 材料） 和镀在第三夹层 3-5表面的第二镀层 3-6 (反射材料材料为氧化铝、 二氧 化硅、 二氧化钛） 构成。
如图 3所示：
图 3 (a) 是 LED灯丝 1的第一实施案例， LED灯丝 1包括灯丝电极 2、 透 明基板 12、 多个 LED芯片 13、 键合线 14和荧光胶 15， LED芯片 13 (主要是 针对正装芯片） 通过固晶材料 （如硅胶、 环氧树脂、 Hybrid、 PMMA、 PU) 固 定在两端含有灯丝电极 2的透明基板 12 (如透明玻璃、 透明陶瓷、钇铝石榴石、 蓝宝石、 透明耐热 PC/PS/PMMA)上， 接着通过键合线将 LED芯片 13、 以及芯 片 13与电极 2连接起来， 再通过荧光胶 15将 LED芯片 13、 键合线 14以及基 板 12包裹起来形成 360度出光的 LED灯丝 1。
图 3 (b) 是 LED灯丝 1的第二实施案例， LED灯丝 1包括灯丝电极 2、 透 明基板 12、 多个 LED芯片 13、 线路 16、 荧光胶 15， LED芯片 13 (主要是正对 倒装芯片） 通过固晶材料 （如金、 金锡合金、 锡膏） 固定在具有线路 16的透明 基板 12 (如透明玻璃、透明陶瓷、钇铝石榴石、蓝宝石、透明耐热 PC/PS/PMMA) 上， 通过 LED芯片 13将基板 12上的线路 16与基板两端的灯丝电极 2连接起 来；再通过荧光胶 15将 LED芯片 13和基板 12包裹起来形成 360度出光的 LED 灯丝 1。
图 3 (c) ~ (e) 是 LED灯丝 1的第三实施案例， 图 3 (c) 是 LED灯丝 1 的透视图， 图 3 (d) 是 LED灯丝 1的半成品图， 图 3 (e) 是 LED灯丝 1的成 品外观图。
LED灯丝 1包括灯丝电极 2、 导电基板 17、 多个 LED芯片 13、 键合线 14， 多个 LED芯片 13通过固晶材料 （如硅胶、 环氧树脂、 Hybrid、 PMMA、 PU) 固定在具有微孔 18 (空气组成的微小空洞， 尺寸 10nm~100um)的导电基板 17 (如铜、 银、 铁或其合金材料） 上， 导电基板 17的一端作为一个灯丝电极 2， 导电基板 17的另一端通过粘结材料 19 (高分子材料如 PPA、 PCT、 EMC、 SMC, LCP)与另一个灯丝电极 2相连， LED芯片 13之间、 LED芯片 13与灯丝电极 2之间通过键合线 14连接起来， 然后通过 Molding的方式由荧光胶 15将 LED 芯片 13、 键合线 14、 微孔 18、 粘结材料 19、 导电基板 17包裹起来， 只留出 灯丝电极 2， 如图 3 (e) 所示。
本发明不限于以上实施方式， 在本发明的精神和权利要求的保护范围内， 对本发明作出的任何修改和改变， 均应认为是本发明的保护范围。

Claims

权 利 要 求 书
1. 一种高光效的 LED球泡灯， 其特征在于， 包括： 多个 LED灯丝 （1)、 芯柱 （3)、 LED驱动器 （7)、 标准接口 （9)、 灯罩 （10); 所述多个 LED灯丝
(1) 和芯柱 （3) 由灯罩 （10) 密封， 且灯罩 （10) 中填充散热材料 （11); 每 个 LED灯丝（1)的两端均通过 LED灯丝（1)的两个灯丝电极（2)与芯柱（3) 上的两个芯柱电极 （4) 点焊连接， 多个 LED灯丝 （1) 在球泡灯内部围绕芯柱
(3) 排布； 所述芯柱 （3) 下部连接排气管 （5); 芯柱 （3) 的芯柱电极 （4) 通过电连接线 （6) 与 LED驱动器 （7) 相连， LED驱动器 （7) 通过引线 （8) 与标准接口 （9) 连接， 标准接口 （9) 与外部 AC或 DC电源相连通。
2.根据权利要求 1所述高光效的 LED球泡灯， 其特征在于， 所述多个 LED 灯丝（1)在球泡灯内部围绕芯柱（3)排布具体为： LED灯丝（1)围绕芯柱（3) 呈锥状线性排布、 LED灯丝（1)围绕芯柱（3)呈线性交叉排布、 LED灯丝（1) 围绕芯柱 （3) 呈正多边形排布或 LED灯丝 （1) 围绕芯柱 （3) 呈 M型排布。
3.根据权利要求 1所述高光效的 LED球泡灯， 其特征在于， 所述 LED灯丝 (1)包括： 灯丝电极（2)、 透明基板（12)、 多个 LED芯片（13)、 键合线（14) 和荧光胶 （15)， 多个 LED芯片 （13) 固定在两端含有灯丝电极 （2) 的透明基 板 （12)上， LED芯片 （13) 之间、 LED芯片 （13) 与灯丝电极（2) 之间通过 键合线 （14) 相连接， LED芯片 （13)、 键合线 （14) 和透明基板 （12) 上包裹 荧光胶 （15)。
4.根据权利要求 1所述高光效的 LED球泡灯， 其特征在于， 所述 LED灯丝 (1) 包括： 灯丝电极 （2)、 透明基板 （12)、 多个 LED芯片 （13)、 线路 （16) 和荧光胶 （15)， 多个 LED芯片 （13) 固定在具有线路 （16) 的透明基板 （12) 上， 通过 LED芯片 （13) 将透明基板 （12) 上的线路 （16) 与透明基板 （12) 两端的灯丝电极（2) 连接起来， LED芯片 （13) 和透明基板 （12) 上包裹荧光 胶 （15)。
5.根据权利要求 1所述高光效的 LED球泡灯， 其特征在于， 所述 LED灯丝 (1)包括： 灯丝电极（2)、导电基板（17)、多个 LED芯片（13)、键合线（14)， 多个 LED芯片（13)固定在具有微孔（18)的导电基板（17)上， 导电基板（17) 的一端作为一个灯丝电极 （2)， 导电基板 （17) 的另一端通过粘结材料 （19) 与另一个灯丝电极（2)相连， LED芯片 （13)之间、 LED芯片 （13) 与灯丝电 极 （2) 之间通过键合线 （14) 连接起来， LED芯片 （13)、 键合线 （14)、 微孔 (18)、 粘结材料 （19) 和导电基板 （17) 上包裹荧光胶 （15)。
6. 根据权利要求 1所述的高光效的 LED球泡灯， 其特征在于， 所述芯柱 ( 3 )内部包括绝缘层（3-1 )、第一夹层（3-2)、第二夹层（3-3 )、第一镀层（3-4)、 第三夹层 （3-5 ) 和第二镀层 （3-6 ) 中的一种或者几种； 所述绝缘层 （3-1 ) 的 材料为玻璃或者透明陶瓷； 第一夹层 （3-2 ) 的材料为金属银、 铝或钛； 第二夹 层 （3-3 ) 的材料为石蜡或金属盐； 镀层 （3-4) 的材料为银、 铝、 钛或铂； 第三 夹层 （3-5 ) 的材料为铜或其合金材料； 第二镀层 （3-6 ) 的材料为氧化铝、 二氧 化硅、 二氧化钛中的一种或几种； 所述芯柱电极（4 ) 的材料为金、 银、 铜、 铁、 铝或其合金材料； 所述标准接口 （9) 为 E12、 E14、 E26、 E27或 E39。
7. 根据权利要求 1所述的高光效的 LED球泡灯， 其特征在于， 所述散热 材料 （11 ) 为气体或液体； 当散热材料是气体时， 其组分是基础气体或由基础 气体与辅助气体混合组成， 所述基础气体与辅助气体的质量比为 80-100:0-20， 所述基础气体由氢气、 氮气、 氦气的一种或多种按任意配比混合组成， 所述辅 助气体由氖气、 氩气、 氪气、 氙气的一种或多种按任意配比混合组成； 当散热 材料是液体时， 其组分由水、 乙醇、 甘油、 硅油的一种或多种按任意配比混合 组成； 所述灯罩 （10) 为透明的玻璃灯罩、 磨砂的玻璃灯罩或外部涂覆透明硅 胶的玻璃灯罩。
8. 根据权利要求 3或 4所述高光效的 LED球泡灯， 其特征在于， 所述透 明基板（12)的材料为透明玻璃、微晶玻璃、透明陶瓷、钇铝石榴石、氧化铝 (蓝 宝石）、 氮氧化氯、 氧化钇陶瓷、 氟化镁陶瓷、 氟化钙陶瓷或透明的耐热 PC/PS/PMMA;
9. 根据权利要求 5所述高光效的 LED球泡灯， 其特征在于， 所述导电基 板 （17 ) 的材料为铜、 银、 铝、 铁或其合金材料。
10. 根据权利要求 3、 4或 5所述高光效的 LED球泡灯， 其特征在于， 所 述 LED芯片 （13 ) 选自 UV芯片、 蓝光芯片、 绿光芯片中的一种或几种； 所述 键合线 （14 ) 的材料选自金、 银、 铜、 铁、 铝或其合金材料； 所述荧光胶 （15 ) 由 LED封装胶水和荧光粉混合而成， LED封装胶水选自硅胶、环氧树脂、 Hybrid 材料、 PMMA; 荧光粉由绿色荧光粉、 黄色荧光粉、 红色荧光粉中的一种或者 几种组成， 封装胶水、 绿色荧光粉、 黄色荧光粉和红色荧光粉的质量比为 100:
(0-30)： (5-50)： (0-10)。
PCT/CN2014/076700 2014-05-04 2014-05-04 一种高光效的led球泡灯 WO2015168825A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2014/076700 WO2015168825A1 (zh) 2014-05-04 2014-05-04 一种高光效的led球泡灯
EP14891350.2A EP3006814A4 (en) 2014-05-04 2014-05-04 Led bulb light with high luminous efficacy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/076700 WO2015168825A1 (zh) 2014-05-04 2014-05-04 一种高光效的led球泡灯

Publications (1)

Publication Number Publication Date
WO2015168825A1 true WO2015168825A1 (zh) 2015-11-12

Family

ID=54391924

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/076700 WO2015168825A1 (zh) 2014-05-04 2014-05-04 一种高光效的led球泡灯

Country Status (2)

Country Link
EP (1) EP3006814A4 (zh)
WO (1) WO2015168825A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105508895A (zh) * 2016-01-06 2016-04-20 山东晶泰星光电科技有限公司 一种仿白炽灯结构的led灯
RU188947U1 (ru) * 2018-05-23 2019-04-30 Федеральное государственное бюджетное образовательное учреждение высшего образования "Томский государственный университет систем управления и радиоэлектроники" (ТУСУР) Светодиодная лампа

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101968181A (zh) * 2010-09-08 2011-02-09 葛世潮 一种高效率led灯泡
CN102109115A (zh) * 2010-12-29 2011-06-29 葛世潮 一种P-N结4π出光的高压LED及LED灯泡
CN201944638U (zh) * 2010-11-22 2011-08-24 葛世潮 一种可直接替换白炽灯用于感应灯的led灯泡
CN103712106A (zh) * 2013-12-26 2014-04-09 四川柏狮光电技术有限公司 一种大角度全周光led灯泡
CN203553214U (zh) * 2013-11-01 2014-04-16 四川柏狮光电技术有限公司 一种led灯丝

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2810658C (en) * 2010-09-08 2015-02-10 Zhejiang Ledison Optoelectronics Co., Ltd. Led light bulb and led light-emitting strip being capable of emitting 4.pi. light
WO2013135153A1 (zh) * 2012-03-12 2013-09-19 浙江锐迪生光电有限公司 Led发光柱及使用其的led灯
JP5864349B2 (ja) * 2012-04-20 2016-02-17 スタンレー電気株式会社 Ｌｅｄ電球
CN203395690U (zh) * 2013-08-13 2014-01-15 宁波卓明电子有限公司 一种 led 灯泡

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101968181A (zh) * 2010-09-08 2011-02-09 葛世潮 一种高效率led灯泡
CN201944638U (zh) * 2010-11-22 2011-08-24 葛世潮 一种可直接替换白炽灯用于感应灯的led灯泡
CN102109115A (zh) * 2010-12-29 2011-06-29 葛世潮 一种P-N结4π出光的高压LED及LED灯泡
CN203553214U (zh) * 2013-11-01 2014-04-16 四川柏狮光电技术有限公司 一种led灯丝
CN103712106A (zh) * 2013-12-26 2014-04-09 四川柏狮光电技术有限公司 一种大角度全周光led灯泡

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3006814A4 *

Also Published As

Publication number Publication date
EP3006814A4 (en) 2017-01-04
EP3006814A1 (en) 2016-04-13

Similar Documents

Publication Publication Date Title
US9217544B2 (en) LED based pedestal-type lighting structure
JP5147997B2 (ja) 発光装置、電球形ランプ及び照明装置
US10359152B2 (en) LED filament and LED light bulb
JP5276226B2 (ja) 実装用基板、発光装置及びランプ
CN102454907B (zh) 发光二极管灯及其制造方法
CN103994349A (zh) 高光效的led球泡灯
JP2017532793A (ja) Ｌｅｄ封止に使用する基板、３次元ｌｅｄ封止体、３次元ｌｅｄ封止体を有する電球及びこれらの製造方法
WO2013135153A1 (zh) Led发光柱及使用其的led灯
WO2009129689A1 (zh) 管形led照明装置
WO2015089873A1 (zh) 一种led封装结构
CA3011489A1 (en) Led light bulb
CN101737645A (zh) 一种led白光灯泡及其制作方法
TW201227920A (en) LED package substrate and fabrication method thereof
CN106015991A (zh) 一种使用2πLED灯丝的电源内置球泡灯
CN103775858A (zh) 芯片倒装于透明陶瓷管的4π出光LED发光管及照明灯
CN104154444B (zh) 一种带有金属反射柱体的led灯
CN202013881U (zh) 垂直结构led芯片集成封装结构
CN207602616U (zh) 一种新型led封装结构
WO2015168825A1 (zh) 一种高光效的led球泡灯
CN107305922B (zh) 一种带电源一体化360度立体发光光源的制备方法
WO2019179228A1 (zh) Led灯丝结构及基于其的led照明灯
CN102903838A (zh) 带散热结构的封装led光源及其制备方法
CN203023841U (zh) 芯片倒装于透明陶瓷管的4π出光LED发光管及照明灯
CN201936915U (zh) 一种led封装结构及其led模组
CN205877785U (zh) 一种使用2πLED灯丝的电源内置球泡灯

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2014891350

Country of ref document: EP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14891350

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE