CN103872207A - 一种强光led光源模块及其生产工艺 - Google Patents

一种强光led光源模块及其生产工艺 Download PDF

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CN103872207A
CN103872207A CN201410059021.0A CN201410059021A CN103872207A CN 103872207 A CN103872207 A CN 103872207A CN 201410059021 A CN201410059021 A CN 201410059021A CN 103872207 A CN103872207 A CN 103872207A
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source module
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郑香奕
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Tu Bo
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DONGGUAN MEISHENG ELECTRICAL APPLIANCE PRODUCT Co Ltd
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Priority to US14/272,875 priority patent/US20150241002A1/en
Priority to EP14167763.3A priority patent/EP2911194A1/en
Priority to TW103117377A priority patent/TW201533931A/zh
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Abstract

本发明涉及LED技术领域，特指一种强光LED光源模块的生产工艺，其包括以下步骤：a.制备整体LED晶片，在LED晶片中的一个大尺寸非电极所在表面镀上一层高折射率薄膜；b.将镀好高折射率薄膜的LED晶片按需分割呈LED晶片单体；c.将LED晶片单体固晶于基片表面，已镀高折射率薄膜的一面与基片接触，并焊线连接LED晶片单体；d.在LED晶片单体的剩余五个表面也镀上一层高折射率薄膜；e.按需组装或封装成完整的LED光源模块。本发明的有益效果主要体现在：其一，LED晶片单体发光进入封装材料前，由于LED晶片单体周边均镀有高折射率薄膜，各面之间呈90°，起到倍增出光面的效果，而且大大降低了全反射率，增大出光效率、增强光线强度的效果。

Description

一种强光LED光源模块及其生产工艺
技术领域：
本发明涉及LED技术领域，特指一种强光LED光源模块的生产工艺及该强光LED光源模块。
背景技术：
现有LED光源模块普遍是在铝基板或铝支架上固定LED晶片，LED晶片通过金属线与设置铝基板或铝支架上的铜电极连接，再用环氧树脂等材料进行封装制得。由于铝基板、铝支架都是无法透光的，因此，这些LED光源都只能从单面出光，无法实现全角度出光。另外，LED晶片本身出光面有限以及受全反射等因素影响，其发光也无法完全进入封装材料，再者光线从封装材料进入空气界面时也会受到全反射等影响，因此整个LED光源的出光效率较低，光强度较弱。
发明内容：
本发明的目的在于克服现有产品的不足之处，提供一种强光LED光源模块的生产工艺及该强光LED光源模块。
本发明实现其目的采用的技术方案是：一种强光LED光源模块的生产工艺，其包括以下步骤：
a.制备整体LED晶片，在LED晶片中的一个大尺寸非电极所在表面镀上一层高折射率薄膜；
b.将镀好高折射率薄膜的LED晶片按需分割呈LED晶片单体；
c.将LED晶片单体固晶于基片表面，已镀高折射率薄膜的一面与基片接触，并焊线连接LED晶片单体；
d.在LED晶片单体的剩余五个表面也镀上一层高折射率薄膜；
e.按需组装或封装成完整的LED光源模块。
上述工艺中，所述的高折射率薄膜的厚度为0.1μm-1.0μm。
所述的高折射率薄膜为TiO2或荧光物质薄膜，或者采用其他高折射率材料形成。
同时，本发明还提供一种强光LED光源模块，包括基板、若干LED晶片单体、电极片、连接LED晶片单体和电极片的金属线以及封装料体，于所述LED晶片单体的六个表面均镀有一层高折射率薄膜，所述金属线穿过高折射率薄膜与LED晶片单体的电极连接。
上述光源模块中，所述的高折射率薄膜的厚度为0.1μm-1.0μm。所述的高折射率薄膜为TiO2或荧光物质薄膜，或者采用其他高折射率材料形成。
所述基板由与封装料体材质相同的透光材料成型，这样能使整体LED光源全角度出光。
于所述LED光源模块的封装料体表面还成型有若干圆锥状凸点。
本发明的有益效果主要体现在：其一，LED晶片单体发光进入封装材料前，由于LED晶片单体周边均镀有高折射率薄膜，各面之间呈90°，增大了LED晶片单体的出光面，起到倍增出光面的效果，而且大大降低了全反射率，使LED晶片单体的发光均进入封装料体中，从而起到增大出光效率、增强光线强度的效果；其二，在LED光源的封装料体表面设置圆锥凸点，在光线从封装料体进入空气时能破坏全反射（即即便在一面被反射，也会从另一面射出），进一步提高出光率和出光强度；其三，直接以封装用的透光材料来成型制作基板，因此，基板具有很好的透光性，当LED晶片固定并封装后，可以实现全角度出光，产品的视觉效果极佳。
附图说明：
图1是本发明一种实施例强光LED光源模块的剖面示意图；
图2是图1中的局部放大图。
具体实施方式：
下面结合具体实施例和附图对本发明进一步说明。
本发明所述的一种强光LED光源模块的生产工艺，其包括以下步骤：
a.制备整体LED晶片，在LED晶片中的一个大尺寸非电极所在表面镀上一层高折射率薄膜；
b.将镀好高折射率薄膜的LED晶片按需分割呈LED晶片单体；
c.将LED晶片单体固晶于基片表面，已镀高折射率薄膜的一面与基片接触，并焊线连接LED晶片单体；
d.在LED晶片单体的剩余五个表面也镀上一层高折射率薄膜；
e.按需组装或封装成完整的LED光源模块。
上述工艺中，所述的高折射率薄膜的厚度为0.1μm-1.0μm。所述的高折射率薄膜为TiO2或荧光物质薄膜，或者采用其他高折射率材料形成。高折射率薄膜可通过化学气相沉积（MOCVD、CVD）、物理真空蒸镀或者溅镀以及溶剂成膜等各种镀膜方式完成。
结合图1、图2所示，本发明还提供一种强光LED光源模块，包括基板1、若干LED晶片单体2、电极片3、连接LED晶片单体2和电极片3的金属线4以及封装料体5，于所述LED晶片单体2的六个表面均镀有一层高折射率薄膜21，所述金属线4穿过高折射率薄膜21与LED晶片单体2的电极连接。
所述基板1由与封装料体5材质相同的透光材料成型，这样能使整体LED光源全角度出光。封装用的透光材料例如可以是环氧树脂、橡胶、塑料等材料，这些材料中可以通过掺杂荧光粉来改变基板1和封装料体的颜色，从而改变出光颜色。
上述光源模块中，所述的高折射率薄膜21的厚度为0.1μm-1.0μm。所述的高折射率薄膜为TiO2或荧光物质薄膜，或者采用其他高折射率材料形成。光线从高折射率薄膜21射入封装料体5时，只要arcsin（封装材料折射率/高折射率薄膜折率）≥π/4时，可降低全反射，倍增出光面，即LED晶片单体的发光均可被取到封装料体5中，提高出光率。
于所述LED光源模块的封装料体5表面还成型有若干圆锥状凸点51，且圆锥状凸点51的圆锥顶角小于2arcsin（1/封装材料折射率），此时能破坏全反射，获得最大出光率。
本发明的有益效果主要体现在：其一，LED晶片单体发光进入封装材料前，由于LED晶片单体周边均镀有高折射率薄膜，各面之间呈90°，增大了LED晶片单体的出光面，起到倍增出光面的效果，而且大大降低了全反射率，使LED晶片单体的发光均进入封装料体中，从而起到增大出光效率、增强光线强度的效果；其二，在LED光源的封装料体表面设置圆锥凸点，在光线从封装料体进入空气时能破坏全反射（即即便在一面被反射，也会从另一面射出），进一步提高出光率和出光强度；其三，直接以封装用的透光材料来成型制作基板，因此，基板具有很好的透光性，当LED晶片固定并封装后，可以实现全角度出光，产品的视觉效果极佳。

Claims (8)

1.一种强光LED光源模块的生产工艺，其特征在于：其包括以下步骤：
a.制备整体LED晶片，在LED晶片中的一个大尺寸非电极所在表面镀上一层高折射率薄膜；
b.将镀好高折射率薄膜的LED晶片按需分割呈LED晶片单体；
c.将LED晶片单体固晶于基片表面，已镀高折射率薄膜的一面与基片接触，并焊线连接LED晶片单体；
d.在LED晶片单体的剩余五个表面也镀上一层高折射率薄膜；
e.按需组装或封装成完整的LED光源模块。
2.根据权利要求1所述的强光LED光源模块的生产工艺，其特征在于：所述的高折射率薄膜的厚度为0.1μm-1.0μm。
3.根据权利要求1或2所述的强光LED光源模块的生产工艺，其特征在于：所述的高折射率薄膜为TiO2或荧光物质薄膜，或者采用其他高折射率材料形成。
4.一种强光LED光源模块，包括基板、若干LED晶片单体、电极片、连接LED晶片单体和电极片的金属线以及封装料体，其特征在于：于所述LED晶片单体的六个表面均镀有一层高折射率薄膜，所述金属线穿过高折射率薄膜与LED晶片单体的电极连接。
5.根据权利要求5所述的强光LED光源模块，其特征在于：所述的高折射率薄膜的厚度为0.1μm-1.0μm。
6.根据权利要求5或6所述的强光LED光源模块，其特征在于：所述的高折射率薄膜为TiO2或荧光物质薄膜，或者采用其他高折射率材料形成。
7.根据权利要求5所述的强光LED光源模块，其特征在于：所述基板由与封装料体材质相同的透光材料成型。
8.根据权利要求5所述的强光LED光源模块，其特征在于：于所述LED光源模块的封装料体表面还成型有若干圆锥状凸点。
CN201410059021.0A 2014-02-21 2014-02-21 一种强光led光源模块及其生产工艺 Pending CN103872207A (zh)

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US14/272,875 US20150241002A1 (en) 2014-02-21 2014-05-08 Strong light light-emitting diode (led) light source module and production process thereof
EP14167763.3A EP2911194A1 (en) 2014-02-21 2014-05-09 Light-emitting diode (LED) light source module and production process thereof
TW103117377A TW201533931A (zh) 2014-02-21 2014-05-16 一種強光ｌｅｄ光源模組及其生產工藝
JP2014113646A JP2015159265A (ja) 2014-02-21 2014-06-01 強光ｌｅｄ光源モジュールとその製造方法

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CN104700726A (zh) * 2015-04-01 2015-06-10 矽照光电（厦门）有限公司 一种led显示装置
CN109073165A (zh) * 2016-03-24 2018-12-21 奥斯兰姆奥普托半导体有限责任公司 具有发光半导体芯片的灯丝、照明装置和用于制造灯丝的方法

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