JP4525804B2 - 光半導体パッケージおよびこれを備えた光電センサ - Google Patents
光半導体パッケージおよびこれを備えた光電センサ Download PDFInfo
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- JP4525804B2 JP4525804B2 JP2008173501A JP2008173501A JP4525804B2 JP 4525804 B2 JP4525804 B2 JP 4525804B2 JP 2008173501 A JP2008173501 A JP 2008173501A JP 2008173501 A JP2008173501 A JP 2008173501A JP 4525804 B2 JP4525804 B2 JP 4525804B2
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- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
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- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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Description
図1は、本発明の実施の形態1における光半導体パッケージの外観構造を示す概略斜視図である。図2は、図1に示す光半導体パッケージの内部構造を示す図であり、図1中に示すII−II線に沿った模式断面図である。また、図3は、図1に示すリフレクタの形状を示す図であり、図3(A)は上面図、図3(B)は断面図である。まず、これら図1ないし図3を参照して、本発明の実施の形態1における光半導体パッケージの構造について説明する。
図14は、本発明の実施の形態2における光半導体パッケージの内部構造を示す模式断面図である。次に、この図14を参照して本発明の実施の形態2における光半導体パッケージについて詳説する。なお、上述の実施の形態1における光半導体パッケージと同様の部分については図中同一の符号を付し、その説明は繰り返さない。
図15は、本発明の実施の形態3における光半導体パッケージの製造方法を説明するための工程図であり、図16は、当該製造方法を採用した場合に利用されるリフレクタの製造過程における形状を示す上面図である。また、図17は、図15に示す光半導体パッケージの製造方法を利用して製作した光半導体パッケージの一つを示す模式上面図である。次に、これら図15ないし図17を参照して、本実施の形態における光半導体パッケージの製造方法について詳説する。
図18は、本発明の実施の形態4における光半導体パッケージの内部構造を示す模式断面図である。次に、この図18を参照して本発明の実施の形態4における光半導体パッケージについて詳説する。なお、上述の実施の形態2における光半導体パッケージと同様の部分については図中同一の符号を付し、その説明は繰り返さない。
図23は、本発明の実施の形態5における光半導体パッケージの内部構造を示す模式断面図である。次に、この図23を参照して本発明の実施の形態5における光半導体パッケージについて詳説する。なお、上述の実施の形態1における光半導体パッケージと同様の部分については図中同一の符号を付し、その説明は繰り返さない。
Claims (5)
- 光を投光または受光する光半導体素子と、
前記光半導体素子が実装された基材とを備えた光半導体パッケージであって、
前記光半導体素子は、前記基材に搭載された素子搭載部材を介して前記基材に搭載され、
前記素子搭載部材は、平板状の底部と、当該底部の周縁から連続して延び、上方に向かうに連れて拡径する円錐板状の側部と、当該側部の前記底部側とは反対側の端部から連続して外側に向かって延びる延設部と、前記底部および前記側部によって規定される上面開口の収容室とを含み、
前記収容室を規定する壁面は、照射された光を反射することが可能に構成され、
前記光半導体素子は、前記素子搭載部材の前記収容室内であってかつ前記底部上に搭載され、
前記光半導体素子および前記素子搭載部材が、透光性の樹脂封止層によって封止され、
前記延設部が、前記樹脂封止層の側面にまで達している、光半導体パッケージ。 - 前記素子搭載部材が搭載された部分以外の前記基材上に受動素子または能動素子が実装されている、請求項1に記載の光半導体パッケージ。
- 前記樹脂封止層が、前記光半導体素子が位置する部分に対応した位置にレンズ部を含んでいる、請求項1または2に記載の光半導体パッケージ。
- 前記基材上に、前記光半導体素子を搭載した前記素子搭載部材が複数個搭載されている、請求項1から3のいずれかに記載の光半導体パッケージ。
- 請求項1から4のいずれかに記載の光半導体パッケージを備えた、光電センサ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008173501A JP4525804B2 (ja) | 2007-11-16 | 2008-07-02 | 光半導体パッケージおよびこれを備えた光電センサ |
DE102008043645A DE102008043645A1 (de) | 2007-11-16 | 2008-11-11 | Optische Halbleiterbaugruppe, diese enthaltender photoelektrischer Sensor und Verfahren zur Herstellung der optischen Halbleiterbaugruppen |
CN2008101766614A CN101436634B (zh) | 2007-11-16 | 2008-11-14 | 光半导体封装及其制造方法、具有该封装的光电传感器 |
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JP2007298413 | 2007-11-16 | ||
JP2008173501A JP4525804B2 (ja) | 2007-11-16 | 2008-07-02 | 光半導体パッケージおよびこれを備えた光電センサ |
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JP2009141317A JP2009141317A (ja) | 2009-06-25 |
JP4525804B2 true JP4525804B2 (ja) | 2010-08-18 |
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CN (1) | CN101436634B (ja) |
DE (1) | DE102008043645A1 (ja) |
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WO2011062148A1 (ja) * | 2009-11-19 | 2011-05-26 | 株式会社 明王化成 | 半導体用パッケージ及び放熱形リードフレーム |
KR101645008B1 (ko) * | 2010-06-30 | 2016-08-03 | 서울반도체 주식회사 | 발광 다이오드 패키지 실장 방법 |
JP4962635B1 (ja) * | 2011-03-15 | 2012-06-27 | オムロン株式会社 | 光半導体パッケージおよび光半導体モジュールならびにこれらの製造方法 |
CN102956758B (zh) * | 2011-08-22 | 2015-03-25 | 赛恩倍吉科技顾问(深圳)有限公司 | Led封装结构的制作方法 |
DE102013114345A1 (de) * | 2013-12-18 | 2015-06-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
CN106449864B (zh) * | 2016-08-30 | 2018-05-29 | 江苏派诺光电科技股份有限公司 | 一种光探测器件的制造方法 |
CN109065527A (zh) * | 2018-07-31 | 2018-12-21 | 江门黑氪光电科技有限公司 | 一种无电阻led灯串 |
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CN111323118A (zh) * | 2018-12-17 | 2020-06-23 | 山东华光光电子股份有限公司 | 一种避免光串扰的探测半导体激光器出光的装置及其安装方法 |
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CN101436634B (zh) | 2011-03-23 |
DE102008043645A1 (de) | 2009-08-20 |
CN101436634A (zh) | 2009-05-20 |
JP2009141317A (ja) | 2009-06-25 |
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