CN106449864B - 一种光探测器件的制造方法 - Google Patents
一种光探测器件的制造方法 Download PDFInfo
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- CN106449864B CN106449864B CN201610750586.2A CN201610750586A CN106449864B CN 106449864 B CN106449864 B CN 106449864B CN 201610750586 A CN201610750586 A CN 201610750586A CN 106449864 B CN106449864 B CN 106449864B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000011521 glass Substances 0.000 claims abstract description 18
- 239000004033 plastic Substances 0.000 claims abstract description 8
- 229920003023 plastic Polymers 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000004806 packaging method and process Methods 0.000 claims abstract description 3
- 230000005855 radiation Effects 0.000 claims description 73
- 239000004065 semiconductor Substances 0.000 claims description 62
- 238000001514 detection method Methods 0.000 claims description 38
- 239000000945 filler Substances 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 239000010426 asphalt Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229920000965 Duroplast Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1892—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Measurement Of Radiation (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610750586.2A CN106449864B (zh) | 2016-08-30 | 2016-08-30 | 一种光探测器件的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610750586.2A CN106449864B (zh) | 2016-08-30 | 2016-08-30 | 一种光探测器件的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106449864A CN106449864A (zh) | 2017-02-22 |
CN106449864B true CN106449864B (zh) | 2018-05-29 |
Family
ID=58182786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201610750586.2A Active CN106449864B (zh) | 2016-08-30 | 2016-08-30 | 一种光探测器件的制造方法 |
Country Status (1)
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CN (1) | CN106449864B (zh) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101436634A (zh) * | 2007-11-16 | 2009-05-20 | 欧姆龙株式会社 | 光半导体封装及其制造方法、具有该封装的光电传感器 |
CN202003990U (zh) * | 2011-01-31 | 2011-10-05 | 江阴长电先进封装有限公司 | 低成本芯片扇出结构 |
CN202025799U (zh) * | 2011-05-12 | 2011-11-02 | 浙江晶申微电子科技有限公司 | 应用于可见光通信的一体式白光led封装 |
CN103250249A (zh) * | 2010-12-08 | 2013-08-14 | 欧司朗光电半导体有限公司 | 光电子半导体器件、用于制造所述器件的方法和这种器件的应用 |
CN104952739A (zh) * | 2014-03-31 | 2015-09-30 | 菱生精密工业股份有限公司 | 具有聚光结构的光学模块及其封装方法 |
CN205209633U (zh) * | 2012-11-09 | 2016-05-04 | 株式会社信五电子 | 光学近照度传感器 |
CN105891136A (zh) * | 2015-02-13 | 2016-08-24 | 台医光电科技股份有限公司 | 多点测量配件、多点测量装置与多点测量系统 |
-
2016
- 2016-08-30 CN CN201610750586.2A patent/CN106449864B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101436634A (zh) * | 2007-11-16 | 2009-05-20 | 欧姆龙株式会社 | 光半导体封装及其制造方法、具有该封装的光电传感器 |
CN103250249A (zh) * | 2010-12-08 | 2013-08-14 | 欧司朗光电半导体有限公司 | 光电子半导体器件、用于制造所述器件的方法和这种器件的应用 |
CN202003990U (zh) * | 2011-01-31 | 2011-10-05 | 江阴长电先进封装有限公司 | 低成本芯片扇出结构 |
CN202025799U (zh) * | 2011-05-12 | 2011-11-02 | 浙江晶申微电子科技有限公司 | 应用于可见光通信的一体式白光led封装 |
CN205209633U (zh) * | 2012-11-09 | 2016-05-04 | 株式会社信五电子 | 光学近照度传感器 |
CN104952739A (zh) * | 2014-03-31 | 2015-09-30 | 菱生精密工业股份有限公司 | 具有聚光结构的光学模块及其封装方法 |
CN105891136A (zh) * | 2015-02-13 | 2016-08-24 | 台医光电科技股份有限公司 | 多点测量配件、多点测量装置与多点测量系统 |
CN105895641A (zh) * | 2015-02-13 | 2016-08-24 | 台医光电科技股份有限公司 | 光学传感模组、光学传感配件与光学传感装置 |
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CN106449864A (zh) | 2017-02-22 |
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Effective date of registration: 20180502 Address after: 226600 east side of the junction of development road and Ho Shun Road, Haian Economic Development Zone, Nantong, Jiangsu Applicant after: Jiangsu painuo photoelectric Polytron Technologies Inc Address before: 226300 266 Century Avenue, Nantong hi tech Zone, Nantong, Jiangsu Applicant before: Zhang Weifeng |
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Effective date of registration: 20190618 Address after: 226600 No. 8, Xiao Xing Road, Chengdong Town, Haian economic and Technological Development Zone, Nantong, Jiangsu Patentee after: Nantong one choice Industrial Design Co., Ltd. Address before: 226600 east side of the junction of development road and Ho Shun Road, Haian Economic Development Zone, Nantong, Jiangsu Patentee before: Jiangsu painuo photoelectric Polytron Technologies Inc |
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Effective date of registration: 20200508 Address after: No. 64, xinlai Road, Haian Development Zone, Haian City, Nantong City, Jiangsu Province Patentee after: JIANGSU HIPPO AUTOMATION EQUIPMENT Co.,Ltd. Address before: 226600 No. 8, Xiao Xing Road, Chengdong Town, Haian economic and Technological Development Zone, Nantong, Jiangsu Patentee before: NANTONG YIXUAN INDUSTRIAL DESIGN Co.,Ltd. |