WO2019033523A1 - 一种具有硅通孔的指纹识别芯片的封装结构及其封装方法 - Google Patents

一种具有硅通孔的指纹识别芯片的封装结构及其封装方法 Download PDF

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Publication number
WO2019033523A1
WO2019033523A1 PCT/CN2017/104590 CN2017104590W WO2019033523A1 WO 2019033523 A1 WO2019033523 A1 WO 2019033523A1 CN 2017104590 W CN2017104590 W CN 2017104590W WO 2019033523 A1 WO2019033523 A1 WO 2019033523A1
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WIPO (PCT)
Prior art keywords
fingerprint identification
silicon via
identification chip
package structure
chip
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PCT/CN2017/104590
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English (en)
French (fr)
Inventor
王小龙
于大全
刘卫东
王奎
刘宇环
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华天科技（西安）有限公司
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Publication of WO2019033523A1 publication Critical patent/WO2019033523A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H01L23/5283—Cross-sectional geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13005—Structure
    • H01L2224/13009—Bump connector integrally formed with a via connection of the semiconductor or solid-state body

Definitions

  • the invention belongs to the technical field of identification, and in particular relates to a packaging mechanism of a fingerprint identification chip with a through-silicon via and a packaging method thereof.
  • the fingerprint sensor can be built in an electronic device, such as a notebook computer, a tablet computer, a smart phone, etc., by reading the fingerprint pattern of the user, so that the device can be unlocked by the authorized user of the device through the authentication of the fingerprint pattern of the authorized user, thereby greatly improving the The safety of electronic devices.
  • an electronic device such as a notebook computer, a tablet computer, a smart phone, etc.
  • the fingerprint sensor is characterized in that a sensing area exists on the surface of the fingerprint sensing chip, and the area acts on the external stimulus to be identified, and generates an electrical signal that the chip can recognize and process.
  • the distance between the area and the external stimulus should be as short as possible so that the generated signal can be detected.
  • the chip pads are generally located on the same surface. If the die pad is taken out by the wire bonding method, the height of the bonding wire inevitably raises the distance between the sensing area and the outside of the package body. In order to solve the problem that the wire is higher than the surface of the sensor chip affects the performance of the sensor.
  • Patent No. CN201420009042 in which the invention name is a wafer level package structure and a fingerprint identification device, a step is made at the edge of the sensor chip, and the surface pad of the chip is led to the step through the conductive layer, and then Make a line.
  • a sensing region is formed on a silicon substrate by a deposition technique, and a slope is formed on the edge of the silicon substrate to facilitate the extraction of an electrical signal generated by the sensing region through the conductive layer.
  • the technical solutions of the above two patents are to make a step on the front side of the sensor chip, and then perform wire bonding, the chip and the substrate are electrically connected by a metal wire, and finally the plastic package is cut into a fingerprint sensor. Due to the thickness of the substrate, the fingerprint sensor cannot be made thinner.
  • the invention provides a package structure of a fingerprint identification chip with a through silicon via, the package structure has two layers of plastic seals, and the fingerprint identification chip is provided with a through silicon via hole, thereby making the package structure thinner, the package structure and the existing package structure Compared to the structure, the thickness is reduced and the cost is smaller.
  • the invention also provides a packaging method of a fingerprint identification chip with a through-silicon via, which obtains the above-mentioned package structure of a fingerprint identification chip with through-silicon vias by performing two plastic packages, and the package structure has a smaller thickness. More light.
  • the technical solution of the present invention is: a package structure of a fingerprint identification chip having a through-silicon via, comprising a fingerprint identification chip having a through-silicon via, the fingerprint recognition chip including a first surface and a second surface; and the first surface is provided with a fingerprint a sensing area, a pad electrically connected to the fingerprint sensing area; a second surface is provided with a plurality of conductive terminals and a groove; the groove is provided with a through silicon via, the through hole exposing the pad on the first surface; The pad is electrically connected to the conductive terminal through the through-silicon via and the metal line on the sidewall of the recess; wherein the periphery of the fingerprint identification chip and the outer side of the second surface are wrapped with a second plastic body, and the second plastic body exposes the conductive terminal; The second plastic body and the first surface are wrapped with a first plastic body.
  • the present invention is also characterized by:
  • the four vertical sides of the second molding body are wrapped inside the first molding body.
  • the first molding body has a thickness on the first surface of 50 to 100 ⁇ m.
  • the groove comprises a first sloped surface obliquely downward along the second surface, the bottom of the first sloped surface is disposed as a horizontal groove bottom surface; and the through silicon via is disposed on the bottom surface of the groove.
  • Another technical solution of the present invention is: a method for packaging a fingerprint identification chip having a through-silicon via, comprising the following steps:
  • Step 1 attaching a film on the carrier, and mounting a second surface of the fingerprint identification chip having a through-silicon via on the film;
  • Step 2 performing blank chip molding on the completed fingerprint identification chip; specifically filling the circumference of the fingerprint identification chip and the conductive terminal with a plastic sealing material, so that the first surface of the fingerprint identification chip is exposed to obtain a second plastic package;
  • Step 3 using a molding material to form a first molding body on the first surface of the fingerprint identification chip and the outer side of the second molding body;
  • Step 4 separating the carrier plate and the adhesive film in an environment of 200 ° C to obtain a packaged finished product
  • step 5 the packaged product is cut into a single package structure.
  • the present invention is also characterized by:
  • the portion of the first molding body on the first surface is ground to 50-100 ⁇ m to obtain a package structure.
  • the package structure obtained by cutting in step 5 is rectangular, elliptical, circular or other shapes.
  • the molding material used in the steps 2 and 3 has a dielectric constant of 3-5 or 7-25.
  • the invention has the beneficial effects that the package structure is a secondary plastic sealing structure for a fingerprint identification chip having a through-silicon via, and the package structure is omitted compared with the existing one-time package structure.
  • the four sides of the second molding body are exposed, which can reduce the volume of the packaging structure.
  • the thickness of the first molding body is smaller, so that the thickness of the package structure can be made smaller.
  • a groove formed by the first bevel and the bottom surface of the groove is used for etching the through silicon via and defining an optimum etching angle and size of the groove; the first bevel and the horizontal groove are first etched on the groove The bottom surface can prevent the etched portion from being broken, thereby facilitating further etching of the through silicon via.
  • the invention also has the beneficial effects that the method performs the plastic sealing on the fingerprint identification chip with through-silicon via holes, and fixes the fingerprint identification chip by using the panel and the film for the first time, thereby avoiding the use of the substrate and realizing the encapsulation of the fingerprint identification chip.
  • the method performs the plastic sealing on the fingerprint identification chip with through-silicon via holes, and fixes the fingerprint identification chip by using the panel and the film for the first time, thereby avoiding the use of the substrate and realizing the encapsulation of the fingerprint identification chip.
  • the first molding body is ground to reduce the volume of the package structure.
  • the package structure is cut to make the package structure smaller.
  • the package structure uses a larger range of molding materials, and can be packaged using more different types of molding materials, and has wide applicability.
  • the fingerprint identification chip package structure obtained by the method can have a thickness of 0.3 mm or less, and is thinner and lighter than the existing fingerprint identification chip package structure.
  • Figure 1 is a schematic structural view of the present invention
  • FIG. 2 is a schematic structural view of another embodiment of the present invention.
  • Figure 3 is a schematic view showing the structure of the mounting in the present invention.
  • Figure 4 is a schematic view showing the structure of a second plastic sealing body in the present invention.
  • Fig. 5 is a schematic view showing the structure of a first molded body in the present invention.
  • the invention provides a package structure of a fingerprint identification chip with a through silicon via, as shown in FIG. 1 , comprising a fingerprint identification chip 4 having a through silicon via; the fingerprint identification chip 4 includes a first surface 13 and a second surface 14 .
  • the first surface 13 is provided with a fingerprint sensing area 11 and a pad 12, the fingerprint sensing area 11 and the pad 12 are electrically connected, and the second surface 14 is provided with a plurality of conductive terminals 3, and the second surface 14
  • the end is provided with a recess 5 by etching, the recess 5 comprising a first bevel 8 etched obliquely downward along the second surface 14, wherein the first bevel 8 has an angle of inclination of 60-70°, preferably 65°, concave Slot 5
  • the vertical depth is 60-100 ⁇ m, preferably 80 ⁇ m, and the bottom of the first inclined surface 8 is provided with an etched horizontal groove bottom surface 9 having a length of 240-250 ⁇ m, preferably 245 ⁇
  • the one end of the through silicon via 10 having a small diameter is disposed on the first surface 13 and has a diameter of 55 to 65 ⁇ m, preferably 60 ⁇ m. And the through silicon via 10 is opposite to the pad 12 at the position of the first surface 13 , and the pad 12 is electrically connected to the conductive terminal 3 through the through silicon via 10 and the recess 5 .
  • the outer side of the fingerprint identification chip 4 is wrapped with a square-shaped package structure, and the package structure includes a first molding body 1 and a second molding body 2; wherein the second molding body 2 is wrapped in the fingerprint identification chip 4 On the side surface and the second surface 14, and the second molding body 2 exposes the first surface 13 and the conductive terminal 3; the first molding body 1 is wrapped around the outside of the second molding body 2, and the first molding body 1 wraps the first surface 13 and four sides of the second molding body 2; the package structure exposes the power-off terminal 3.
  • the outer side of the fingerprint identification chip 4 is wrapped with a square-shaped package structure, and the package structure includes a first molding body 1 and a second molding body 2; wherein the second molding body 2 is wrapped in the fingerprint identification chip 4 On the side and the second surface 14, and the second molding body 2 exposes the first surface 13 and the conductive terminal 3; the first molding body 1 is wrapped on the first surface 13, and the first molding body 1 is vertically set up The sides are flush with the four sides of the second molding body 2 which are vertically set up.
  • the molding materials used in the first molding body 1 and the second molding body 2 of the package structure are all plastic sealing materials having a dielectric constant of 3-5 or 7-25, wherein the higher the dielectric constant, the fingerprinting performance of the molding material. The better, the molding material having a dielectric constant of 7 is preferable.
  • the thickness of the first molding body 1 is 50-100 ⁇ m, and the total thickness of the package structure is less than 0.3 mm.
  • the first plastic package body 1 and the second plastic package body 2 both adopt a plastic sealing material with a dielectric constant of 3-5; when the fingerprint identification chip adopts another fingerprint chip algorithm
  • the first molding body and the second molding body are both made of a molding material having a dielectric constant of 7-25.
  • the invention also provides a method for packaging a fingerprint identification chip, comprising the following steps:
  • Step 1 as shown in FIG. 3, the adhesive film 6 is adhered to the carrier 7, wherein the film 6 is thermally separated by an epoxy resin material.
  • the film, the carrier 7 is made of steel or other metal material, or tempered glass material; then the second surface 14 of the fingerprint identification chip 4 having through-silicon vias is mounted on the adhesive film 6, wherein the conductive terminals of the fingerprint identification chip 4 3 is adhered to the film 6, and the first surface 13 is disposed upward to complete the mounting of the fingerprint identification chip.
  • Step 2 as shown in FIG. 4, performing bare chip packaging on the completed fingerprint identification chip 4; the specific process is to closely fit the mold and the chip surface, and then outside the four sides of the fingerprint identification chip 4 and the conductive terminal 3
  • a molding material having a dielectric constant of 3-5 or 7-25 is filled, and the first surface 13 is exposed, and then the mold is opened to obtain a second molding body 2, completing the bare chip package.
  • a protective soft layer is disposed on the mold surface to prevent the mold from crushing the chip surface, and at the same time, the second plastic body 2 is lower than the first surface 13.
  • the bare chip package has the first surface 13 facing upward and completely exposed, and the conductive terminal 3 is exposed.
  • the second molding body 2 is a molding material filled between the circumference of the fingerprint identification chip 4 and the conductive terminal 3, and is integrated into one. The upper surface of the second plastic body 2 exposes the first surface 13 .
  • Step 3 as shown in FIG. 5, on the basis of step 2, a molding material having a dielectric constant of 3-5 or 7-25 is used on the first surface 13 of the fingerprint identification chip 4 and the circumference of the second molding body 2. Molding is performed to obtain the first molding body 1; the thickness of the first molding body 1 is ground to 50-100 ⁇ m by using a grinding machine, and then cutting is performed. After cutting, the four sides of the second molding body 2 are exposed, and the second The four sides of the molded body 2 are flush with the four sides of the first molded body 1 to obtain an initial product.
  • step 4 the initial product is placed in an environment of 200 ° C to disengage the film 6 from the second surface 14 to obtain a packaged finished product of the fingerprint identification chip, and the thickness of the packaged product is less than 0.3 mm.
  • step 5 the packaged product is cut to obtain a single fingerprint identification chip package structure, and the package structure is cut into a rectangle, a diamond, an ellipse or a circle.
  • This embodiment employs a fingerprint identification chip having through-silicon vias, and the chip employs an FPC fingerprint chip algorithm.
  • a thermal separation film is pasted on a steel carrier, and then the second surface 14 of the fingerprint identification chip 4 having through-silicon vias is mounted on the thermal separation film, and the first surface 13 having the chip sensing region 11 faces Then; using a mold having a protective soft layer to closely adhere to the first surface 13; then molding using a molding material having a dielectric constant of 4 between the circumference of the fingerprint identification chip and the conductive terminal 3 to obtain a second molded body 2 And then molding on the outside of the first surface 13 and the second molding body 2 with a dielectric material having a dielectric constant of 4 to obtain a first molding body 1; finally, the first molding body is ground using a grinding machine body, ground to 50 ⁇ m, and Cutting it, as shown in FIG.
  • This embodiment uses a fingerprint identification chip with a through-silicon via, and the chip uses a Huiding technology fingerprint chip algorithm.
  • a thermal separation film is attached to a stainless steel carrier, and then a fingerprint identification chip 4 having through-silicon vias is placed on the thermal separation film so that the first surface 13 faces upward; and then the mold is used to closely adhere to the second surface 14.
  • molding using a molding material having a dielectric constant of 3 between the circumference of the fingerprint identification chip 4 having through-silicon vias and the conductive terminals to obtain a second molding body 2; then, at the first surface 13 and the second molding body 2
  • the four sides are plastically sealed with a dielectric material having a dielectric constant of 5 to obtain a first molded body; finally, the first molded body 1 is ground using a grinding machine body, ground to 60 ⁇ m, and then cut, as shown in FIG.
  • the first molding body 1 is wrapped around the second molding body 2; then, the second surface 14 is separated from the thermal separation film in an environment of 200 ° C, and finally a fingerprint identification chip package having a thickness of less than 0.30 mm is obtained, and then the package is packaged.
  • the finished product is cut into a circular or elliptical single fingerprint identification chip package structure.
  • This embodiment employs a fingerprint recognition chip having a through-silicon via, and the chip employs an ordinary fingerprint chip algorithm.
  • a thermal separation film is attached to a stainless steel carrier, and then the fingerprint identification chip 4 having through-silicon vias is placed on the heat. Separating the film so that the first surface 13 faces upward; then bonding to the second surface 14 using a mold having a protective soft layer; and using a molding material having a dielectric constant of 7 in the periphery of the fingerprint identification chip having through-silicon vias And sealing the conductive terminal to obtain a second plastic package; then molding on the first surface and the second plastic body with a dielectric material having a dielectric constant of 7 to obtain a first plastic package; and finally using the polishing body to the first plastic package
  • the body is ground, ground to 100 ⁇ m, and then the package structure is cut; then, the second surface 14 is separated from the heat separation film in an environment of 200 ° C, and finally a packaged product of a fingerprint identification chip having a thickness of 0.30 mm is obtained, and then The packaged product is cut into an elliptical single fingerprint identification chip package structure.

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Abstract

一种具有硅通孔的指纹识别芯片的封装结构及其封装方法，包括具有硅通孔（10）的指纹识别芯片（4），指纹识别芯片包括第一表面（13）和第二表面（14）；第一表面上设置有指纹感测区（11），与指纹感测区电性连接的焊盘（12）；第二表面上设置有若干导电端子（3）和凹槽（5）；凹槽上设置有硅通孔，硅通孔暴露第一表面上的焊盘；焊盘通过硅通孔和凹槽侧壁上的金属线路与导电端子电性连接；其中指纹识别芯片的四围和第二表面外侧包裹有第二塑封体（2），第二塑封体使导电端子裸露；第二塑封体和第一表面外侧包裹有第一塑封体（1）。该封装结构具有塑封保护，且指纹识别芯片设置有硅通孔，从而使得封装结构更薄，该封装结构与现有的结构相比，厚度降低，且成本更小。

Description

一种具有硅通孔的指纹识别芯片的封装结构及其封装方法 技术领域
本发明属于身份识别技术领域，具体涉及一种具有硅通孔的指纹识别芯片的封装机构及其封装方法。
背景技术
指纹传感器可以内置于电子装置，如笔记本电脑、平板电脑、智能手机等，通过读取用户的指纹图案，使得装置可以由装置的授权用户通过该授权用户的指纹图案的认证进行解锁，大大提高了电子装置的安全性。
指纹传感器，其特征在于指纹传感芯片表面存在感应区域，该区域与其所要识别的外界刺激发生作用，产生芯片可以识别和处理的电信号。该区域与外界刺激的距离要尽可能短，以使得产生的信号可以被侦测。当前很多的芯片工艺，芯片焊盘一般也位于同一表面，若采用焊线方式将芯片焊盘引出，焊线高度不可避免会抬升感应区域与封装体外界的距离。为解决焊线高于传感芯片表面影响传感器性能问题。
专利号为CN201420009042，发明名称为晶圆级封装结构和指纹识别装置的实用新型中，提出了一种在传感芯片边缘制作台阶，将芯片表面焊盘通过导电层引至该台阶处，然后再进行打线。专利号为US20140285263A1的文献中，采用在硅基板上用沉积技术形成感应区域，上述硅基板边缘存在斜坡，以便于将感应区域产生的电信号通过导电层引出。
上述两个专利的技术方案均是在传感芯片正面制作台阶，然后进行打线，芯片与基板通过金属线形成电性连接，最后塑封切割成指纹传感器。由于基板有一定的厚度，使得指纹传感器无法做到更薄。
发明内容
本发明提供了一种具有硅通孔的指纹识别芯片的封装结构，该封装结构具有两层塑封，且指纹识别芯片设置有硅通孔，从而使得封装结构更薄，该封装结构与现有的结构相比，厚度降低，且成本更小。
本发明还提供了一种具有硅通孔的指纹识别芯片的封装方法，该方法通过进行两次塑封，得到了上述的具有硅通孔的指纹识别芯片的封装结构，该封装结构的厚度更小，更加轻盈。
本发明的技术方案是：一种具有硅通孔的指纹识别芯片的封装结构，包括具有硅通孔的指纹识别芯片，指纹识别芯片包括第一表面和第二表面；第一表面上设置有指纹感测区，与指纹感测区电性连接的焊盘；第二表面上设置有若干导电端子和凹槽；凹槽上设置有硅通孔，硅通孔暴露第一表面上的焊盘；焊盘通过硅通孔和凹槽侧壁上的金属线路与导电端子电性连接；其中指纹识别芯片的四周和第二表面外侧包裹有第二塑封体，第二塑封体使导电端子裸露；第二塑封体和第一表面外侧包裹有第一塑封体。
更进一步的，本发明的特点还在于：
其中第二塑封体的四个竖直侧面包裹在第一塑封体内部。
其中第二塑封体的四个竖直侧面裸露，且与第一塑封体相应的四个侧面齐平。
其中第一塑封体在第一表面上的厚度为50-100μm。
其中凹槽包括沿第二表面斜向下的第一斜面，第一斜面的底部设置为水平的凹槽底面；且硅通孔设置在凹槽底面上。
本发明的另一技术方案是：一种具有硅通孔的指纹识别芯片的封装方法，包括以下步骤：
步骤1，在载板上粘贴胶膜，将具有硅通孔的指纹识别芯片的第二表面贴装在胶膜上；
步骤2，对完成贴装的指纹识别芯片进行裸露芯片塑封；具体的使用塑封材料填充在指纹识别芯片的四围和导电端子之间，使指纹识别芯片的第一表面裸露，得到第二塑封体；
步骤3，使用塑封材料在指纹识别芯片的第一表面和第二塑封体的外侧进行塑封，得到第一塑封体；
步骤4，在200℃的环境下，使载板与胶膜分离，得到封装成品；
步骤5，将封装成品切割成单颗封装结构。
更进一步的，本发明的特点还在于：
其中步骤3中将第一塑封体位于第一表面上的部分研磨至50-100μm后，得到封装结构。
其中步骤5中切割得到的封装结构为矩形、椭圆形、圆形或者其他形状。
其中步骤2和步骤3中使用的塑封材料的介电常数为3-5或7-25。
与现有技术相比，本发明的有益效果是：该封装结构为对具有硅通孔的指纹识别芯片的二次塑封结构，相对于现有的一次塑封的封装结构，该封装结构省去了基板的使用，从而降低了封装结构的厚度，并且使用具有硅通孔的指纹识别芯片；其中第二塑封体用于封装指纹识别芯片四围和导电端子之间的间隙，第一塑封体用于封装第二塑封体和指纹识别芯片的第一表面。
更进一步的，第二塑封体的四个侧面裸露，能够减少封装结构的体积。
更进一步的，第一塑封体的厚度更小，从而实现该封装结构的厚度能够达到更小。
更进一步的，第一斜面和凹槽底面组成的凹槽用于蚀刻硅通孔，并且限定了凹槽的最佳蚀刻角度和大小；凹槽上通过先蚀刻一个第一斜面和水平的凹槽底面，能够防止蚀刻的部分发生断裂，从而方便进一步蚀刻硅通孔。
本发明的有益效果还在于：该方法通过对具有硅通孔的指纹识别芯片进行两次塑封，并且首次使用裁板和胶膜固定指纹识别芯片，避免了使用基板，实现指纹识别芯片的封装，通过在芯片的四围和芯片面封装得第二塑封体和第一塑封体，从而减少了塑封材料的使用，并且降低了封装结构的厚度。
更进一步的，在第一塑封体封装之后，对第一塑封体进行研磨，减小了封装结构的体积。
更进一步的，对封装结构进行切割，使得封装结构的体积更小。
更进一步的，该封装结构使用的塑封材料的范围较大，能够使用更多不同类型的塑封材料进行封装，适用性较广。
本方法得到的指纹识别芯片封装结构其厚度能够达到0.3mm或小于0.3mm，相比于现有的指纹识别芯片封装结构，其厚度更小，更加轻薄。
附图说明
图1为本发明的一种结构示意图；
图2为本发明的另一种结构示意图；
图3为本发明中贴装的结构示意图；
图4为本发明中第二塑封体的结构示意图；
图5为本发明中第一塑封体的结构示意图。
图中，1为第一塑封体；2为第二塑封体；3为导电端子；4为指纹识别芯片；5为凹槽；6为胶膜；7为载板；8为第一斜面；9为凹槽底面；10为硅通孔；11为指纹感测区；12为焊盘；13为第一表面；14为第二表面。
具体实施方式
下面结合附图和具体实施例对本发明的技术方案进一步说明。
本发明提供了一种具有硅通孔的指纹识别芯片的封装结构，如图1所示，包括具有硅通孔的指纹识别芯片4；指纹识别芯片4包括第一表面13和第二表面14，第一表面13上设置有指纹感测区11和焊盘12，指纹感测区11和焊盘12之间电性连接，第二表面14上设置有若干导电端子3，且第二表面14的端部通过蚀刻设置有凹槽5，凹槽5包括沿第二表面14斜向下蚀刻出的第一斜面8，其中第一斜面8的倾斜角度为60-70°，优选设置65°，凹槽5的 垂直深度为60-100μm，优选为80μm，第一斜面8的底部设置有蚀刻出的水平的凹槽底面9，凹槽底面9的长度为240-250μm，优选为245μm；其中凹槽底面9上蚀刻有圆台形的硅通孔10，硅通孔10的深度为55-65μm，优选为60μm；硅通孔10直径大的一端设置在凹槽底面9上，直径为100-105μm，优选为104μm；硅通孔10直径小的一端设置在第一表面13上，直径为55-65μm，优选为60μm。且硅通孔10在第一表面13的位置正对焊盘12，且焊盘12穿过硅通孔10和凹槽5与导电端子3电性连接。
如图1所示，指纹识别芯片4的外侧包裹有方体状的封装结构，封装结构包括第一塑封体1和第二塑封体2；其中第二塑封体2包裹在指纹识别芯片4的四个侧面和第二表面14上，且第二塑封体2使第一表面13和导电端子3裸露；第一塑封体1包裹在第二塑封体2的外部，第一塑封体1包裹第一表面13和第二塑封体2的四个侧面；封装结构使断电端子3裸露。
如图2所示，指纹识别芯片4的外侧包裹有方体状的封装结构，封装结构包括第一塑封体1和第二塑封体2；其中第二塑封体2包裹在指纹识别芯片4的四个侧面和第二表面14上，且第二塑封体2使第一表面13和导电端子3裸露；第一塑封体1包裹在第一表面13上，且第一塑封体1竖直设立的四个侧面与第二塑封体2竖直设立的四个侧面齐平设置。
该封装结构的第一塑封体1和第二塑封体2所使用的塑封材料均为介电常数为3-5或7-25的塑封材料，其中介电常数越高的塑封材料其指纹识别性能越好，优选为介电常数为7的塑封材料。且第一塑封体1的厚度为50-100μm，该封装结构的总厚度小于0.3mm。
当指纹识别芯片4采用FPC或汇顶科技的指纹芯片算法时，第一塑封体1和第二塑封体2均采用介电常数为3-5的塑封材料；当指纹识别芯片采用其他指纹芯片算法时，第一塑封体和第二塑封体均采用介电常数为7-25的塑封材料。
本发明还提供了一种指纹识别芯片的封装方法，包括以下步骤：
步骤1，如图3所示，将胶膜6粘贴在载板7上，其中胶膜6为环氧树脂类材料的热分离 膜，载板7为钢材质或其他金属材质、或钢化玻璃材质；然后将具有硅通孔的指纹识别芯片4的第二表面14贴装在胶膜6上，其中指纹识别芯片4的导电端子3与胶膜6粘连，第一表面13朝上设置，完成指纹识别芯片的贴装。
步骤2，如图4所示，对完成贴装的指纹识别芯片4进行裸露芯片封装；具体过程是使用模具和芯片面紧密贴合，然后在指纹识别芯片4的四个侧面外和导电端子3之间填充介电常数为3-5或7-25的塑封材料，且使第一表面13裸露，然后打开模具，得到第二塑封体2，完成裸露芯片封装。其中模具面上设置有防护软层，能够防止模具压坏芯片面，同时能够实现第二塑封体2低于第一表面13。裸露芯片封装得到第一表面13朝上且完全裸露，同时导电端子3裸露，第二塑封体2为填充在指纹识别芯片4的四围和导电端子3之间的塑封材料，且连成一体，第二塑封体2的上表面使第一表面13裸露。
步骤3，如图5所示，在步骤2的基础上，在指纹识别芯片4的第一表面13上和第二塑封体2的四围使用介电常数为3-5或7-25的塑封材料进行塑封，得到第一塑封体1；再使用研磨机台将第一塑封体1的厚度研磨至50-100μm，然后进行切割，切割后，第二塑封体2的四个侧面裸露，并且第二塑封体2的四个侧面与第一塑封体1的四个侧面齐平，得到初产物。
步骤4，将初产物放置在200℃的环境中，使胶膜6与第二表面14脱离，即得到指纹识别芯片的封装成品，该封装成品的厚度小于0.3mm。
步骤5，将封装成品进行切割，得到单颗的指纹识别芯片封装结构，该封装结构被切割为矩形、菱形、椭圆形或圆形。
本发明指纹识别芯片的封装方法的实施例为：
实施例1
该实施例采用具有硅通孔的指纹识别芯片，并且该芯片采用FPC指纹芯片算法。
首先在钢材质的载板上粘贴热分离膜，然后将具有硅通孔的指纹识别芯片4的第二表面14贴装在热分离膜上，且具有芯片感测区11的第一表面13朝上；然后使用具有防护软层的模具与第一表面13紧密贴合；然后使用介电常数为4的塑封材料在指纹识别芯片的四围和导电端子3之间进行塑封，得到第二塑封体2；然后在第一表面13和第二塑封体2外侧使用介电常数为4的塑封材料进行塑封，得到第一塑封体1；最后使用研磨机体对第一塑封体进行研磨，研磨至50μm，并且对其进行切割，如图2所示，使第二塑封体2的四个侧面裸露出来，并且第二塑封体2的四个侧面与第一塑封体1相应的四个侧面齐平；然后在200℃的环境下，使第二表面14与热分离膜脱离，最后得到厚度为0.30mm的具有指纹识别芯片的封装成品，然后将封装成品切割成矩形或菱形的单颗指纹识别芯片封装结构。
实施例2
该实施例采用具有硅通孔的指纹识别芯片，并且该芯片采用汇顶科技指纹芯片算法。
首先在不锈钢材质的载板上贴热分离膜，然后将具有硅通孔的指纹识别芯片4贴装在热分离膜上，使第一表面13朝上；然后使用模具与第二表面14紧密贴合；并且使用介电常数为3的塑封材料在具有硅通孔的指纹识别芯片4的四围和导电端子间进行塑封，得到第二塑封体2；然后在第一表面13和第二塑封体2的四个侧面上使用介电常数为5的塑封材料进行塑封，得到第一塑封体；最后使用研磨机体对第一塑封体1进行研磨，研磨至60μm，然后对其进行切割，如图1所示，使第一塑封体1包裹第二塑封体2；然后在200℃的环境下，使第二表面14与热分离膜脱离，最后得到厚度小于0.30mm的指纹识别芯片封装成品，然后将封装成品切割成圆形或椭圆形的单颗指纹识别芯片封装结构。
实施例3
该实施例采用具有硅通孔的指纹识别芯片，并且该芯片采用普通的指纹芯片算法。
首先在不锈钢材质的载板上贴热分离膜，然后将具有硅通孔的指纹识别芯片4贴装在热 分离膜上，使第一表面13朝上；然后使用具有防护软层的模具与第二表面14紧密贴合；并且使用介电常数为7的塑封材料在具有硅通孔的指纹识别芯片的四围和导电端子间进行塑封，得到第二塑封体；然后在第一表面和第二塑封体上使用介电常数为7的塑封材料进行塑封，得到第一塑封体；最后使用研磨机体对第一塑封体进行研磨，研磨至100μm，然后对封装结构进行切割；然后在200℃的环境下，使第二表面14与热分离膜脱离，最后得到厚度为0.30mm的指纹识别芯片的封装成品，然后将封装成品切割成椭圆形的单颗指纹识别芯片封装结构。

Claims (9)

  1. 一种具有硅通孔的指纹识别芯片的封装结构，其特征在于，包括具有硅通孔的指纹识别芯片(4)，指纹识别芯片(4)包括第一表面(13)和第二表面(14)；第一表面(13)上设置有指纹感测区(11)，与指纹感测区(11)电性连接的焊盘(12)；第二表面(14)上设置有若干导电端子(3)和凹槽(5)；凹槽(5)上设置有硅通孔(10)，硅通孔(10)使第一表面(13)上的焊盘(12)暴露；焊盘(12)通过硅通孔(10)和凹槽(5)侧壁上的金属线路与导电端子(3)电性连接；
    所述指纹识别芯片(4)的四围和第二表面(14)外侧包裹有第二塑封体(2)，第二塑封体(2)使导电端子(3)裸露；第二塑封体(2)和第一表面(13)外侧包裹有第一塑封体(1)。
  2. 根据权利要求1所述的具有硅通孔的指纹识别芯片的封装结构，其特征在于，所述第二塑封体(2)的四个竖直侧面包裹在第一塑封体(1)内部。
  3. 根据权利要求1所述的具有硅通孔的指纹识别芯片的封装结构，其特征在于，所述第二塑封体(2)的四个竖直侧面裸露，且与第一塑封体(1)相应的四个侧面齐平。
  4. 根据权利要求1所述的具有硅通孔的指纹识别芯片的封装结构，其特征在于，所述第一塑封体(1)在第一表面(13)上的厚度为50-100μm。
  5. 根据权利要求1所述的具有硅通孔的指纹识别芯片的封装结构，其特征在于，所述凹槽(5)包括沿第二表面(14)斜向下的第一斜面(8)，第一斜面(8)的底部设置为水平的凹槽底面(9)；且硅通孔(10)设置在凹槽底面(9)上。
  6. 一种具有硅通孔的指纹识别芯片的封装方法，其特征在于，包括以下步骤：
    步骤1，在载板(7)上粘贴胶膜(6)，将具有硅通孔的指纹识别芯片(4)的第二表面(14)贴装在胶膜(6)上；
    步骤2，对完成贴装的指纹识别芯片(4)进行裸露芯片塑封；具体的使用塑封材料填充在指纹识别芯片(4)的四周和导电端子(3)之间，使指纹识别芯片(4)的第一表面(13)裸露，得到第二塑封体(2)；
    步骤3，使用塑封材料在指纹识别芯片(4)的第一表面(13)和第二塑封体(2)的外侧进行塑封，得到第一塑封体(1)；
    步骤4，在200℃的环境下，使载板(7)与胶膜分离，得到封装成品；
    步骤5，将封装成品切割成单颗封装结构。
  7. 根据权利要求6所述的具有硅通孔的指纹识别芯片的封装方法，其特征在于，所述步骤3中将第一塑封体(1)位于第一表面(13)上的部分研磨至50-100μm后，得到封装结构。
  8. 根据权利要求6所述的具有硅通孔的指纹识别芯片的封装方法，其特征在于，所述步骤5中切割得到的封装结构为矩形、菱形、椭圆形或圆形。
  9. 根据权利要求6所述的具有硅通孔的指纹识别芯片的封装方法，其特征在于，所述步骤2和步骤3中使用的塑封材料的介电常数为3-5或7-25。
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