JP3172667U - 光学モジュール - Google Patents
光学モジュール Download PDFInfo
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- JP3172667U JP3172667U JP2011006058U JP2011006058U JP3172667U JP 3172667 U JP3172667 U JP 3172667U JP 2011006058 U JP2011006058 U JP 2011006058U JP 2011006058 U JP2011006058 U JP 2011006058U JP 3172667 U JP3172667 U JP 3172667U
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Led Device Packages (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
【解決手段】 発光チップ30および受光チップ40は、それぞれ基板20の発光領域および受光領域に設けられる。キャップ60は、発光孔61および受光孔65を有し、基板20上に設けられる。発光孔61は発光チップ30を収容する第一チャンバー71を形成する。発光孔61の内壁面には内径が基板20の表面から離れるに従って大きくなる環状反射層62が形成される。受光孔61は受光チップ40を収容する第二チャンバー72を形成し、発光孔61の横に設けられる。これにより、発光チップ30および受光チップ40を同一の基板20上にパッケージするため製造コストが低減されるとともに、環状反射層62によって外部に放射する光線の強度が向上するため受光チップ40の受光強度を向上することができる。
【選択図】 図2
Description
(一実施形態)
図1から図3に示すように、本考案の一実施形態による光学モジュール10は、アレイ基板から切り取った一つの単位であり、基板20、発光チップ30、受光チップ40、パッケージコロイド50、51およびキャップ60を備える。
(A)本実施形態の光学モジュール10は、有機材料からなるBT基板のような安価な基板や一体成形されたポリプロピレンからなるキャップ60を用いるため、材料コストが低い。また単一のパッケージを別々に行う従来の技術に対し、本実施形態の光学モジュール10は発光チップ30および受光チップ40を同一の基板20に搭載するため、光学モジュール10の製造コストを低減することができる。
(ア)上述の実施形態では、発光領域および受光領域を形成する基板をBT基板とした。しかしながら、基板の材料はこれに限定されない。FR4などの非セラミックス基板であってもよい。
20:基板、
202:発光領域、
204:受光領域、
30:発光チップ、
40:受光チップ、
50、51:パッケージコロイド、
60:キャップ、
61:発光孔、
62a:直線部、
62b:円弧部、
65:受光孔、
66:第一受光孔、
67:第二受光孔、
71:第一チャンバー、
72:第二チャンバー。
Claims (8)
- 発光領域および受光領域が形成される基板と、
前記基板の前記発光領域に設けられる発光チップと、
前記基板の前記受光領域に設けられる受光チップと、
前記発光チップを収容する第一チャンバーを形成する発光孔、および前記受光チップを収容する第二チャンバーを形成する受光孔を有し、基板上に設けられる一体成形されたキャップと、
前記第一チャンバー内および前記第二チャンバー内に充填され、前記発光チップおよび前記受光チップを覆う二つのパッケージコロイドと、
を備え、
前記発光孔は内径が前記基板から離れるに従って大きくなる環状反射層を有し、
前記受光孔は前記基板とは反対側に形成される第一受光孔、および、前記基板側に形成され前記第一受光孔と連通し前記第一受光孔の内径とは異なる内径を有する第二受光孔から構成されることを特徴とする光学モジュール。 - 前記キャップは、一体成形された熱可塑性または熱硬化性のプラスチックからなる筐体であることを特徴とする請求項1に記載の光学モジュール。
- 前記環状反射層は、表面に金属材料がコーティングされていることを特徴とする請求項1に記載の光学モジュール。
- 前記第一受光孔の内径は、前記第二受光孔の内径より小さいことを特徴とする請求項1に記載の光学モジュール。
- 前記パッケージコロイドは、表面が円弧状に突出するように形成されることを特徴とする請求項1に記載の光学モジュール。
- 前記基板は、有機材料からなるBT基板または非セラミックス基板であることを特徴とする請求項1に記載の光学モジュール。
- 前記キャップは、ポリプロピレンまたは液晶ポリマから形成されることを特徴とする請求項2に記載の光学モジュール。
- 前記環状反射層は、開口縁部が直線部および円弧部から構成されることを特徴とする請求項1に記載の光学モジュール。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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TW100218095 | 2011-09-27 | ||
TW100218095U TWM428490U (en) | 2011-09-27 | 2011-09-27 | Optical module packaging unit |
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JP3172667U true JP3172667U (ja) | 2012-01-05 |
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JP2011006058U Expired - Lifetime JP3172667U (ja) | 2011-09-27 | 2011-10-17 | 光学モジュール |
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US (1) | US8362496B1 (ja) |
JP (1) | JP3172667U (ja) |
KR (1) | KR200476955Y1 (ja) |
CN (1) | CN202275833U (ja) |
TW (1) | TWM428490U (ja) |
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- 2011-10-17 JP JP2011006058U patent/JP3172667U/ja not_active Expired - Lifetime
- 2011-10-28 KR KR2020110009578U patent/KR200476955Y1/ko active IP Right Grant
- 2011-11-03 US US13/288,648 patent/US8362496B1/en active Active
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Also Published As
Publication number | Publication date |
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TWM428490U (en) | 2012-05-01 |
KR20130002137U (ko) | 2013-04-04 |
US8362496B1 (en) | 2013-01-29 |
CN202275833U (zh) | 2012-06-13 |
KR200476955Y1 (ko) | 2015-04-17 |
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