JP2015198243A - 光学モジュール及びそのパッケージング方法 - Google Patents
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Abstract
Description
成形部材を基板の上に形成するステップと、
基板において、発光ゾーン及び受光ゾーンを定義するステップと、
発光チップと受光チップを基板の発光ゾーン及び受光ゾーンに各々電気的に接続するステップと、
頂板を成形部材の上に固設するステップと、
成形部材内にパッケージコロイドを充填することで、パッケージコロイドが発光チップと受光チップの上に覆わせるステップと、を含む。
本発明の構造、特徴及び効果を詳細に説明するため、本発明の一実施形態を下記の図面に基づいて後記の通り説明する。
20 基板、
21 発光ゾーン、
23 受光ゾーン、
30 発光チップ、
40 受光チップ、
50 封止用蓋体、
51 第1の収容室、
52 第2の収容室、
53 発光穴、
54 受光穴、
55 頂板、
551 第2の導光層、
56 成形部材、
561 第1の導光層、
60 第1のパッケージコロイド、
61 第1の集光層、
70 第2のパッケージコロイド、
71 第2の集光層。
Claims (10)
- 発光ゾーン、及び、受光ゾーンが定義されている基板と、
前記基板の発光ゾーンに設けられた発光チップと、
前記基板の受光ゾーンに設けられた受光チップと、
前記基板の上に覆い被さり、2つの独立した空間である第1の収容室および第2の収容室、ならびに、前記第1の収容室及び前記第2の収容室に各々連通する発光穴及び受光穴を有し、前記第1の収容室が前記発光チップを収容し、前記発光穴が前記発光チップの上方に位置し、前記第2の収容室が前記受光チップを収容し、前記受光穴が前記受光チップの上方に位置する封止用蓋体と、
前記第1の収容室及び前記発光穴の中に形成されており、前記発光チップを覆い、前記発光穴の近傍に第1の集光層が設けられている第1のパッケージコロイドと、
前記第2の収容室内に形成されており、前記受光チップを覆い、前記受光穴の近傍に第2の集光層が設けられている第2のパッケージコロイドと、を備えることを特徴とする集光構造を有する光学モジュール。 - 前記第1の集光層の外側に向く表面は、凹円弧状を呈することを特徴とする請求項1に記載の集光構造を有する光学モジュール。
- 前記第2の集光層の前記受光穴に対応する表面は、凸円弧状を呈することを特徴とする請求項1に記載の集光構造を有する光学モジュール。
- 前記封止用蓋体は、頂板、及び、前記頂板と前記基板との間にある成形部材により構成されており、前記頂板に前記発光穴及び前記受光穴が形成されており、前記成形部材に前記第1の収容室および前記第2の収容室が形成されていることを特徴とする請求項1に記載の集光構造を有する光学モジュール。
- 前記成形部材の前記第1の収容室は、側周縁部に、内側から外側へ徐々に拡張する第1の導光層が設けられていることを特徴とする請求項4に記載の集光構造を有する光学モジュール。
- 前記頂板の前記発光穴は、側周縁部に、内側から外側へ徐々に拡張する第2の導光層が設けられていることを特徴とする請求項4に記載の集光構造を有する光学モジュール。
- 成形部材を基板の上に形成するステップと、
前記基板に、発光ゾーン、及び、受光ゾーンを定義するステップと、
前記基板の前記発光ゾーン、及び、前記受光ゾーンに発光チップおよび受光チップを各々電気的に接続するステップと、
頂板を前記成形部材の上に固設するステップと、
前記成形部材内に第1のパッケージコロイドと第2のパッケージコロイドを充填することで、前記第1のパッケージコロイドと前記第2のパッケージコロイドを用いて前記発光チップと前記受光チップを覆うステップと、を含むことを特徴とする集光構造を有する光学モジュールのパッケージング方法。 - モールド工程を利用して、第1の収容室と第2の収容室と第1の導光層とを有する成形部材を形成するステップを更に含むことを特徴とする請求項7に記載の集光構造を有する光学モジュールのパッケージング方法。
- モールド工程を利用して発光穴と受光穴とを有する頂板を形成するステップを更に含むことを特徴とする請求項7に記載の集光構造を有する光学モジュールのパッケージング方法。
- 前記第1のパッケージコロイドの表面に凹円弧状の第1の集光層を形成するステップと、
前記第2のパッケージコロイドの表面に凸円弧状の第2の集光層を形成するステップと、を更に含むことを特徴とする請求項7に記載の集光構造を有する光学モジュールのパッケージング方法。
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CN108960007B (zh) * | 2017-05-19 | 2022-01-04 | 致伸科技股份有限公司 | 光学式指纹识别模块 |
US10720751B2 (en) * | 2017-09-27 | 2020-07-21 | Advanced Semiconductor Engineering, Inc. | Optical package structure, optical module, and method for manufacturing the same |
CN107871789A (zh) * | 2017-12-13 | 2018-04-03 | 刘向宁 | 收发一体式光电转换器 |
TW202103294A (zh) * | 2019-07-04 | 2021-01-16 | 菱生精密工業股份有限公司 | 嵌入式光學模組封裝結構 |
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