FR3100379B1 - Dispositif électronique comprenant des composants électroniques optiques et procédé de fabrication - Google Patents

Dispositif électronique comprenant des composants électroniques optiques et procédé de fabrication Download PDF

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Publication number
FR3100379B1
FR3100379B1 FR1909670A FR1909670A FR3100379B1 FR 3100379 B1 FR3100379 B1 FR 3100379B1 FR 1909670 A FR1909670 A FR 1909670A FR 1909670 A FR1909670 A FR 1909670A FR 3100379 B1 FR3100379 B1 FR 3100379B1
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France
Prior art keywords
electronic
manufacturing
encapsulating
electronic device
supporting
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Application number
FR1909670A
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English (en)
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FR3100379A1 (fr
Inventor
Romain Coffy
RéMI BRECHIGNAC
Jean-Michel Riviere
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STMicroelectronics Grenoble 2 SAS
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STMicroelectronics Grenoble 2 SAS
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Priority to FR1909670A priority Critical patent/FR3100379B1/fr
Priority to US17/006,128 priority patent/US11502227B2/en
Priority to CN202010910163.9A priority patent/CN112447624A/zh
Priority to CN202021890676.XU priority patent/CN213366572U/zh
Publication of FR3100379A1 publication Critical patent/FR3100379A1/fr
Application granted granted Critical
Publication of FR3100379B1 publication Critical patent/FR3100379B1/fr
Priority to US17/965,443 priority patent/US11935992B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H01L31/02164—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors for shielding light, e.g. light blocking layers, cold shields for infrared detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Light Receiving Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

Dispositif électronique et procédé de fabrication, dans lesquels un premier et un deuxième composants électroniques (1, 2) comprennent respectivement un substrat de support (3, 4) présentant une face arrière (5, 6) et une face avant (7, 8), une puce électronique (9, 10) incluant un élément optique intégré (15, 16), un bloc transparent surmoulé (21, 22) d’encapsulation de la puce au-dessus du substrat de support, et des connexions électriques entre la puce et des contacts électriques (21, 22) du substrat de support, et une grille surmoulée (102, 202) d’encapsulation et de support des composants électroniques, la grille d’encapsulation et de support étant configurée de sorte que les faces des composants électroniques soient au moins en partie découvertes. Figure pour l’abrégé : Fig 6
FR1909670A 2019-09-03 2019-09-03 Dispositif électronique comprenant des composants électroniques optiques et procédé de fabrication Active FR3100379B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR1909670A FR3100379B1 (fr) 2019-09-03 2019-09-03 Dispositif électronique comprenant des composants électroniques optiques et procédé de fabrication
US17/006,128 US11502227B2 (en) 2019-09-03 2020-08-28 Electronic device comprising optical electronic components and fabricating process
CN202010910163.9A CN112447624A (zh) 2019-09-03 2020-09-02 包括光学电子组件的电子器件及制造工艺
CN202021890676.XU CN213366572U (zh) 2019-09-03 2020-09-02 电子器件及电子组装件
US17/965,443 US11935992B2 (en) 2019-09-03 2022-10-13 Electronic device comprising optical electronic components and fabricating process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1909670 2019-09-03
FR1909670A FR3100379B1 (fr) 2019-09-03 2019-09-03 Dispositif électronique comprenant des composants électroniques optiques et procédé de fabrication

Publications (2)

Publication Number Publication Date
FR3100379A1 FR3100379A1 (fr) 2021-03-05
FR3100379B1 true FR3100379B1 (fr) 2021-09-24

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FR1909670A Active FR3100379B1 (fr) 2019-09-03 2019-09-03 Dispositif électronique comprenant des composants électroniques optiques et procédé de fabrication

Country Status (3)

Country Link
US (2) US11502227B2 (fr)
CN (2) CN112447624A (fr)
FR (1) FR3100379B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3100380B1 (fr) * 2019-09-03 2021-10-01 St Microelectronics Grenoble 2 Dispositif électronique comprenant des composants électroniques optiques et procédé de fabrication
FR3100379B1 (fr) * 2019-09-03 2021-09-24 St Microelectronics Grenoble 2 Dispositif électronique comprenant des composants électroniques optiques et procédé de fabrication

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100587560C (zh) 2003-04-01 2010-02-03 夏普株式会社 发光装置用组件、发光装置、背侧光照射装置、显示装置
DE10351704B4 (de) * 2003-11-03 2008-07-31 Infineon Technologies Ag Optoelektronische Sende- und/oder Empfangsanordnung mit einem opto-elektronischen Wandlermodul
US7906860B2 (en) * 2007-10-26 2011-03-15 Infineon Technologies Ag Semiconductor device
TW201037813A (en) * 2009-04-08 2010-10-16 Aussmak Optoelectronic Corp Light emitting apparatus
US8012799B1 (en) * 2010-06-08 2011-09-06 Freescale Semiconductor, Inc. Method of assembling semiconductor device with heat spreader
US8877567B2 (en) * 2010-11-18 2014-11-04 Stats Chippac, Ltd. Semiconductor device and method of forming uniform height insulating layer over interposer frame as standoff for semiconductor die
DE102011105374B4 (de) * 2011-06-22 2021-12-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Halbleiterbauelementen im Verbund
FR2977715A1 (fr) * 2011-07-08 2013-01-11 St Microelectronics Grenoble 2 Boitier electronique optique
TWM424605U (en) * 2011-09-27 2012-03-11 Lingsen Precision Ind Ltd The optical module package structure
TWM428490U (en) * 2011-09-27 2012-05-01 Lingsen Precision Ind Ltd Optical module packaging unit
US8815651B2 (en) * 2011-12-30 2014-08-26 Infineon Technologies Ag Method for manufacturing an electronic device by reducing thickness of electronic members attached to a carrier
US20140021491A1 (en) * 2012-07-18 2014-01-23 Carsem (M) Sdn. Bhd. Multi-compound molding
US9159643B2 (en) * 2012-09-14 2015-10-13 Freescale Semiconductor, Inc. Matrix lid heatspreader for flip chip package
KR20150025231A (ko) * 2013-08-28 2015-03-10 서울반도체 주식회사 광원 모듈 및 그 제조 방법, 및 백라이트 유닛
TWI619208B (zh) * 2014-03-31 2018-03-21 具聚光結構之光學模組的封裝方法
TWI667767B (zh) * 2014-03-31 2019-08-01 菱生精密工業股份有限公司 Package structure of integrated optical module
US10910350B2 (en) * 2014-05-24 2021-02-02 Hiphoton Co., Ltd. Structure of a semiconductor array
CN204651317U (zh) * 2014-06-10 2015-09-16 意法半导体(格勒诺布尔2)公司 包括光学传感器芯片的电子设备
CN105206627A (zh) 2014-06-13 2015-12-30 亿光电子工业股份有限公司 光传感器及其制造方法
US10211191B2 (en) * 2014-08-06 2019-02-19 Pixart Imaging Inc. Image module package with transparent sub-assembly
KR102237155B1 (ko) 2015-03-11 2021-04-07 엘지이노텍 주식회사 발광 소자 및 이를 구비한 라이트 유닛
US10061057B2 (en) 2015-08-21 2018-08-28 Stmicroelectronics (Research & Development) Limited Molded range and proximity sensor with optical resin lens
US10665578B2 (en) * 2015-09-24 2020-05-26 Apple Inc. Display with embedded pixel driver chips
US9837375B2 (en) * 2016-02-26 2017-12-05 Semtech Corporation Semiconductor device and method of forming insulating layers around semiconductor die
US10720545B2 (en) * 2016-05-27 2020-07-21 Rohm Co., Ltd. Semiconductor device
US10340256B2 (en) * 2016-09-14 2019-07-02 Innolux Corporation Display devices
US10424566B2 (en) * 2016-12-30 2019-09-24 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
CN109962041B (zh) * 2017-12-26 2023-10-24 意法半导体有限公司 具有光保护的环境光传感器
KR102521100B1 (ko) * 2018-01-08 2023-04-14 삼성디스플레이 주식회사 표시 장치
TWI667643B (zh) * 2018-04-18 2019-08-01 英屬開曼群島商錼創科技股份有限公司 微型發光二極體顯示面板
CN108933153B (zh) * 2018-07-27 2021-02-02 上海天马微电子有限公司 显示面板及其制作方法、显示装置
US20200083280A1 (en) * 2018-09-11 2020-03-12 Prilit Optronics, Inc. Top emission microled display and bottom emission microled display and a method of forming the same
US10892257B2 (en) * 2019-01-21 2021-01-12 Innolux Corporation Foldable display device
CN111987080B (zh) * 2019-05-24 2023-09-26 晶元光电股份有限公司 封装体与显示模块
US10734540B1 (en) * 2019-07-03 2020-08-04 Advanced Semiconductor Engineering, Inc. Optical device and method for manufacturing the same
FR3100379B1 (fr) 2019-09-03 2021-09-24 St Microelectronics Grenoble 2 Dispositif électronique comprenant des composants électroniques optiques et procédé de fabrication

Also Published As

Publication number Publication date
US20210066554A1 (en) 2021-03-04
CN112447624A (zh) 2021-03-05
CN213366572U (zh) 2021-06-04
US20230034445A1 (en) 2023-02-02
FR3100379A1 (fr) 2021-03-05
US11935992B2 (en) 2024-03-19
US11502227B2 (en) 2022-11-15

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