JP2013519995A - 近接センサパッケージ構造及びその製造方法 - Google Patents
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- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
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- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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Abstract
【選択図】図6
Description
Claims (17)
- 第1溝及び第2溝を有し、透光性を有さない基板と、
前記基板上に設けられ、互いに電気的に絶縁される2つの第1導電層と、
前記基板上に設けられ、第1導電部分及び第2導電部分を有し、互いに電気的に絶縁される複数の第2導電層と、
前記第1溝内に配置され、前記第1導電層と電気的に接続される発光チップと、
前記第2溝内で前記第2導電層の前記第1導電部分上に配置され、前記第2導電層と電気的に接続されるセンサチップと、
前記発光チップ及び前記センサチップ上にそれぞれ設けられる2つの封止体と
を備え、
前記第1溝及び前記第2溝はそれぞれ、底面、及び、前記基板の下面から上面へと延在する内側側壁により画定され、
前記2つの第1導電層はそれぞれ、前記第1溝の底面から、前記第1溝の前記内側側壁に沿って、前記2つの第1導電層の他方に対して反対の方向に、前記基板の外側側壁まで延在し、
前記第2導電層の前記第1導電部分は、前記第2溝の底面の中央領域に設けられ、前記第2導電層の前記第2導電部分は、前記第2溝の前記底面から、前記第2溝の前記内側側壁に沿って、前記基板の前記外側側壁まで延在する近接センサパッケージ構造。 - 前記基板は、前記基板の1以上の表面上に、レーザー照射によって活性化されることにより前記第1導電層及び前記第2導電層を形成可能な複合材料によって形成される請求項1に記載の近接センサパッケージ構造。
- 前記基板は更に、前記第1溝の前記内側側壁から前記基板の前記上面へと延在する第3溝を備え、
前記2つの第1導電層のうちの一方は、前記第1溝に設けられ、
前記2つの第1導電層のうちの他方は、前記第3溝に設けられる請求項2に記載の近接センサパッケージ構造。 - 前記第1導電層は、前記第1溝の前記内側側壁及び前記底面を完全に覆う請求項2に記載の近接センサパッケージ構造。
- 前記第3溝の深さは、前記第1溝の深さよりも小さい請求項3に記載の近接センサパッケージ構造。
- 前記センサチップは、近接センサデバイス及び前記近接センサデバイス上に設けられるフィルタ被覆層を有し、
前記センサチップ上の前記封止体は、透明なコロイドを含む請求項1に記載の近接センサパッケージ構造。 - 前記センサチップ上の前記封止体は、フィルタ封止剤を含む請求項6に記載の近接センサパッケージ構造。
- 前記基板上、及び、前記第1導電層及び前記第2導電層の間に設けられる2つの第3導電層を更に備える請求項1に記載の近接センサパッケージ構造。
- 前記第3導電層上に設けられ、前記第3導電層と電気的に接続される環境光センサチップを更に備える請求項8に記載の近接センサパッケージ構造。
- 前記基板上の前記第1導電層に対して前記第2導電層の反対側に設けられる2つの第3導電層を更に備える請求項1に記載の近接センサパッケージ構造。
- 前記第3導電層上に設けられ、前記第3導電層と電気的に接続される環境光センサチップを更に備える請求項10に記載の近接センサパッケージ構造。
- 前記発光チップは、発光ダイオード(LED)チップを含む請求項1に記載の近接センサパッケージ構造。
- 第1溝及び第2溝を有し、透光性を有さない基板を用意する段階と、
パターニングされたトレンチの各々内の前記基板の対応する部分が粗面となるように、前記基板の1以上の面上に、前記パターニングされたトレンチを複数形成する段階と、
前記基板の複数の前記パターニングされたトレンチ内の部分に、2つの第1導電層及び複数の第2導電層を形成する段階と、
光発光チップ及びセンサチップをそれぞれ、前記基板の前記第1溝及び前記第2溝内に接着する段階と、
前記2つの第1導電層の間に前記発光チップを電気的に接続する段階と、
前記センサチップを前記第2導電層に電気的に接続する段階と
を備える近接センサパッケージ構造の製造方法。 - 前記基板は、前記基板の1以上の表面上に、レーザー照射によって活性化されることにより前記第1導電層及び前記第2導電層を形成可能な複合材料によって形成される請求項13に記載の近接センサパッケージ構造の製造方法。
- 前記基板の1以上の面にパターニングされたトレンチを複数形成する段階は、
前記基板の前記1以上の面をレーザー照射することにより活性化させる段階を有する請求項13に記載の近接センサパッケージ構造の製造方法。 - 前記2つの第1導電層及び複数の第2導電層を形成する段階は、
前記基板の前記パターニングされたトレンチ内の部分に第1めっき層を形成するべく、化学めっきプロセスを実行する段階と、
前記第1めっき層上に少なくとも1つの第2めっき層を形成するべく、無電解めっきプロセスを実行する段階とを有し、
前記第1導電層及び前記第2導電層は、第1めっき層及び第2めっき層からなる請求項13に記載の近接センサパッケージ構造の製造方法。 - 前記2つの第1導電層の間に前記発光チップを電気的に接続する段階、及び、前記センサチップを前記第2導電層に電気的に接続する段階の後に、
前記発光チップ及び前記センサチップ上にそれぞれ設けられる2つの封止体を形成するべく、接着剤を塗布する段階を更に備える請求項13に記載の近接センサパッケージ構造の製造方法。
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Application Number | Priority Date | Filing Date | Title |
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CN2010101281767A CN102157510B (zh) | 2010-02-12 | 2010-02-12 | 近接传感器封装结构及其制作方法 |
CN201010128176.7 | 2010-02-12 | ||
PCT/CN2011/070904 WO2011098036A1 (zh) | 2010-02-12 | 2011-02-10 | 近接传感器封装结构及其制作方法 |
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JP2013519995A true JP2013519995A (ja) | 2013-05-30 |
JP2013519995A5 JP2013519995A5 (ja) | 2013-10-10 |
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US (1) | US20120305771A1 (ja) |
JP (1) | JP2013519995A (ja) |
KR (1) | KR20120137359A (ja) |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2019145586A (ja) * | 2018-02-16 | 2019-08-29 | 京セラ株式会社 | 受発光素子モジュールおよびセンサー装置 |
JP2020072119A (ja) * | 2018-10-29 | 2020-05-07 | 京セラ株式会社 | 近接センサ用パッケージ、近接センサ装置および電子モジュール |
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CN102969388A (zh) * | 2011-09-02 | 2013-03-13 | 光宝新加坡有限公司 | 整合式感测封装结构 |
TWI458113B (zh) * | 2012-05-04 | 2014-10-21 | Taiwan Ic Packaging Corp | Proximity sensor and its manufacturing method |
TWI512313B (zh) * | 2012-11-09 | 2015-12-11 | Upi Semiconductor Corp | 接近感測器及其運作方法 |
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US9018645B2 (en) * | 2013-08-29 | 2015-04-28 | Stmicroelectronics Pte Ltd | Optoelectronics assembly and method of making optoelectronics assembly |
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TWI587003B (zh) * | 2014-10-15 | 2017-06-11 | 昇佳電子股份有限公司 | 內建光障元件之封裝結構、形成光學封裝結構之方法與所形成之光學封裝結構 |
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JP2021515983A (ja) * | 2018-03-06 | 2021-06-24 | スリーエム イノベイティブ プロパティズ カンパニー | 回路ダイと相互接続部との間の自動位置合わせ |
KR102068161B1 (ko) * | 2018-03-14 | 2020-01-20 | (주)파트론 | 광학 센서 패키지 및 그 제조 방법 |
CN109346534B (zh) * | 2018-11-23 | 2024-05-07 | 中国电子科技集团公司第四十四研究所 | 一种陶瓷管壳结构及其封装结构 |
IT201900022632A1 (it) * | 2019-12-02 | 2021-06-02 | St Microelectronics Srl | Procedimento per fabbricare dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente |
CN111935939B (zh) * | 2020-09-03 | 2021-01-22 | 潍坊歌尔微电子有限公司 | 密封结构、密封方法、传感器和电子设备 |
KR102546105B1 (ko) * | 2020-12-15 | 2023-06-21 | (주)파트론 | 광학 센서 패키지 |
US11715753B2 (en) * | 2020-12-30 | 2023-08-01 | Applied Materials, Inc. | Methods for integration of light emitting diodes and image sensors |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0878457A (ja) * | 1994-08-31 | 1996-03-22 | Sharp Corp | 半導体装置の製造方法 |
JPH08130325A (ja) * | 1994-09-08 | 1996-05-21 | Sharp Corp | 反射型フォトインタラプタおよびその製造方法 |
JPH0983011A (ja) * | 1995-09-18 | 1997-03-28 | Sharp Corp | 光半導体装置 |
JPH1041539A (ja) * | 1996-07-23 | 1998-02-13 | Shichizun Denshi:Kk | 赤外線送受信モジュールの構造 |
JP2000205951A (ja) * | 1999-01-18 | 2000-07-28 | Seitai Hikari Joho Kenkyusho:Kk | 光測定装置 |
JP2004022588A (ja) * | 2002-06-12 | 2004-01-22 | New Japan Radio Co Ltd | 光半導体素子 |
JP2009088435A (ja) * | 2007-10-03 | 2009-04-23 | Citizen Electronics Co Ltd | フォトリフレクタ及びその製造方法 |
JP2010021301A (ja) * | 2008-07-10 | 2010-01-28 | Kaneka Corp | 絶縁材料、ならびにプリント配線板 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004066398A1 (ja) * | 2003-01-20 | 2004-08-05 | Sharp Kabushiki Kaisha | 光センサフィルタ用の透明樹脂組成物、光センサおよびその製造方法 |
JP2005317878A (ja) * | 2004-04-30 | 2005-11-10 | Citizen Electronics Co Ltd | フォトリフレクタ装置及びその製造方法 |
JP2006135090A (ja) * | 2004-11-05 | 2006-05-25 | Seiko Epson Corp | 基板の製造方法 |
-
2010
- 2010-02-12 CN CN2010101281767A patent/CN102157510B/zh not_active Expired - Fee Related
-
2011
- 2011-02-10 US US13/578,601 patent/US20120305771A1/en not_active Abandoned
- 2011-02-10 KR KR1020127022563A patent/KR20120137359A/ko active IP Right Grant
- 2011-02-10 JP JP2012552248A patent/JP2013519995A/ja active Pending
- 2011-02-10 WO PCT/CN2011/070904 patent/WO2011098036A1/zh active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0878457A (ja) * | 1994-08-31 | 1996-03-22 | Sharp Corp | 半導体装置の製造方法 |
JPH08130325A (ja) * | 1994-09-08 | 1996-05-21 | Sharp Corp | 反射型フォトインタラプタおよびその製造方法 |
JPH0983011A (ja) * | 1995-09-18 | 1997-03-28 | Sharp Corp | 光半導体装置 |
JPH1041539A (ja) * | 1996-07-23 | 1998-02-13 | Shichizun Denshi:Kk | 赤外線送受信モジュールの構造 |
JP2000205951A (ja) * | 1999-01-18 | 2000-07-28 | Seitai Hikari Joho Kenkyusho:Kk | 光測定装置 |
JP2004022588A (ja) * | 2002-06-12 | 2004-01-22 | New Japan Radio Co Ltd | 光半導体素子 |
JP2009088435A (ja) * | 2007-10-03 | 2009-04-23 | Citizen Electronics Co Ltd | フォトリフレクタ及びその製造方法 |
JP2010021301A (ja) * | 2008-07-10 | 2010-01-28 | Kaneka Corp | 絶縁材料、ならびにプリント配線板 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019145586A (ja) * | 2018-02-16 | 2019-08-29 | 京セラ株式会社 | 受発光素子モジュールおよびセンサー装置 |
JP2020072119A (ja) * | 2018-10-29 | 2020-05-07 | 京セラ株式会社 | 近接センサ用パッケージ、近接センサ装置および電子モジュール |
JP7072486B2 (ja) | 2018-10-29 | 2022-05-20 | 京セラ株式会社 | 近接センサ用パッケージ、近接センサ装置および電子モジュール |
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CN102157510A (zh) | 2011-08-17 |
US20120305771A1 (en) | 2012-12-06 |
WO2011098036A1 (zh) | 2011-08-18 |
KR20120137359A (ko) | 2012-12-20 |
CN102157510B (zh) | 2013-11-06 |
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