TWI458113B - Proximity sensor and its manufacturing method - Google Patents

Proximity sensor and its manufacturing method Download PDF

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Publication number
TWI458113B
TWI458113B TW101115960A TW101115960A TWI458113B TW I458113 B TWI458113 B TW I458113B TW 101115960 A TW101115960 A TW 101115960A TW 101115960 A TW101115960 A TW 101115960A TW I458113 B TWI458113 B TW I458113B
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Taiwan
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light
photosensitive
emitting
wafer
proximity sensor
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TW101115960A
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TW201347219A (zh
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Taiwan Ic Packaging Corp
Upi Semiconductor Corp
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Priority to TW101115960A priority Critical patent/TWI458113B/zh
Priority to CN201210552379.8A priority patent/CN103383457B/zh
Priority to US13/769,634 priority patent/US9140600B2/en
Publication of TW201347219A publication Critical patent/TW201347219A/zh
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Publication of TWI458113B publication Critical patent/TWI458113B/zh
Priority to US14/828,527 priority patent/US20150357505A1/en

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    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
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Description

近接感測器及其製法
本發明是關於一種近接感測器及其製法，特別是指利用封裝體包覆感光晶片與發光晶片的近接感測器及其製法。
近接感測器係一種光的感測裝置，請參考圖5所示，已知的近接感測器60主要包含有一底板61、一金屬遮罩62、一發光元件63與一感光元件64。
該底板61與金屬遮罩62對合而成為一殼體，該金屬遮罩62的內部具有一隔板620，用以分隔出兩個腔室621，該兩腔室621分別在金屬遮罩62的表面形成開口622；該發光元件63與感光元件64分別設於該兩腔室621內。只要一物體65夠接近該近接感測器60，物體65將反射由發光元件63所發出的光線，該感光元件64可檢測出被物體65反射的光線。
然而，近接感測器的體積較小，而金屬遮罩62係採用衝壓技術製成的構件，製造小體積的金屬遮罩62難度較高，故需要較高的成本製造。
請參考美國專利公告第US8,097,852號所揭露的近接感測器，其透過二次封膠的製法形成近接感測器，製法如下所述：
請參考圖6A所示，在一導線架70上設置發光晶片71與感光晶片72後，係在該兩晶片71、72上分別形成透明膠層73，使該兩透明膠層73分別包覆該兩晶片71、72，上述為第一次封膠。
請參考圖6B所示，待該兩透明膠層73固化後，將一壓模74設於該兩透明膠層73上，其中該壓模74具有兩凸部740，該兩凸部740分別壓抵在透明膠73的表面。
請參考圖6C所示，填充黑膠75，即為第二次封膠，令黑膠75包覆晶片71、72以阻隔水氣與雜質，避免該些晶片71、72受到汙染，確保產品品質。
請參考圖6D所示，待黑膠75固化後即移除壓模，原先被壓模之凸部740所佔的空間分別形成透光孔750，是以，該感光晶片71得以透過透光孔750以感測外界的光線，而該發光晶片72得以發射光線到外界。
在前案的製法中，如圖6C所示，在執行黑膠填充的製程中，由於透明膠層73已經固化，且因透明膠層73內部設有感光晶片71與發光晶片72，該壓模74施於透明膠層73的壓力不可過大，以避免壓模74壓壞感光晶片71與發光晶片72，因此凸部740與透明膠層73之間的密合度不佳；此時，黑膠75係以射出方式成形在壓模74與導線架70之間，黑膠75因射出成型的壓力會滲入凸部740與透明膠層73之間，請參考圖6D所示，將造成透明膠層73的表面形成殘留黑膠751。
感光晶片71是用於感測周遭環境光線強度的變化，當該發光元件72所發出的光被物體反射至感光元件71時，該感光晶片71即可感應出光線強度的差異，因此讓感光晶片71與發光晶片72可正常發出、接收光線係相當重要的。然而，若透明膠層73的表面形成殘留黑膠751，不論是發光晶片72所發出的光線，或感光晶片71所感測到的光線，都將受到殘留黑膠751的遮蔽，導致近接感測器的準確度降低。
有鑒於殘留黑膠導致近接感測器準確度降低的問題，本發明的主要目的在於提供一種近接感測器及其製法，在封膠的過程中，避免黑膠形成在感光晶片與發光晶片上方，而導致遮蔽感光晶片與發光晶片。
為達前揭目的，本發明所採用的技術手段是令該近接感測器包含有：一感光單元，具有一感光部；一發光單元，具有一發光部；複數透明膠層，分別形成在該感光單元與發光單元的表面，各透明膠層之表面係形成一環狀凸部；及一封裝體，包覆該感光單元與該發光單元，該封裝體的頂面對應該感光部與發光部的區域分別形成一通孔，該通孔連通該環狀凸部所包圍之區域而構成一凹口。
為達前揭目的，本發明所採用的技術手段是令該近接感測器的製法包含以下步驟：準備一導電架，該導電架包含有一感光晶片座、一發光晶片座與複數個引腳；在該感光晶片座及該發光晶片座上分別設置一感光晶片與一發光晶片，其中該感光晶片的頂面具有一感光部，該發光晶片的頂面具有一發光部；利用複數導線將該感光晶片與發光晶片分別電連接到該些引腳；在該感光部與發光部表面分别形成一透明膠；利用一壓模壓入透明膠，其中該壓模對應感光部與發光部區域具有凸塊，當壓模壓入透明膠時，凸塊的底部陷入透明膠，使透明膠包覆凸塊的底緣；在導電架與壓模之間注入黑膠；待黑膠與透明膠固化後，移除封裝膠帶與壓模，其中黑膠固化而成為一封裝體；及切割該封裝體，以獲得近接感測器。
綜上所述，在進行封膠的製程中，由於透明膠仍具有可塑性，當壓模下壓在透明膠上時，壓模的凸塊會係陷入透明膠的頂端，透明膠將包覆凸塊的底部，因此凸塊的底部與透明膠之間係緊密接觸的，故當黑膠注入時，黑膠無法滲進凸塊與透明膠層之間，藉此避免黑膠形成在感光部與發光部上方，進而提升近接感測器的準確度。
請參考圖1所示，係本發明近接感測器的製程流程圖，以下配合圖2A~圖2G說明本發明的製法與結構。
請參考圖2A所示，首先準備一導電架10(101)，該導電架10包含有一感光晶片座11、一發光晶片座12與複數個引腳13，該些引腳13設置於該感光晶片座11與發光晶片座12的周邊。在封裝的製程中，該導電架10係設於一封裝膠帶(tape)100上，由封裝膠帶100帶領導電架10進行接下來的製程。
請參考圖2B所示，在該感光晶片座11及該發光晶片座12上分別設置一感光晶片110與一發光晶片120(102)，該感光晶片110的頂面具有一感光部111用以感測光線，該發光晶片120的頂面具有一發光部121用以發出光線，該些晶片110、120與晶片座11、12之間可由一黏著層14黏合，該黏著層14可為一環氧樹酯(Epoxy)層；其中，該感光晶片110可為一環境光源感測元件(ALS sensor)，該發光晶片120可為一紅外線(IR)發射元件。
請參考圖2C所示，係進行一打線製程(103)，感光晶片110與發光晶片120的頂面分別具有電極，將感光晶片110與發光晶片120的電極分別透過導線15電連接到該些引腳13。
請參考圖2D所示，係進行一點膠製程(104)，以在該感光晶片110的感光部111與該發光晶片120的發光部121表面分别形成一透明膠16。
請參考圖2E所示，進行封膠製程(105)。在該些透明膠16完全固化之前，利用一壓模20壓入透明膠16，該壓模20具有一基板21及複數個形成在基板21底面的凸塊22，該些凸塊22的位置分別對應到該些透明膠16的位置；當壓模20壓入透明膠16時，由於透明膠16尚未固化而具有可塑性，凸塊22將陷入於透明膠16的頂端，透明膠16頂端進而包覆凸塊22的底緣，此時在導電架10與壓模20之間注入黑膠30，令黑膠30包覆該些晶片110、120與導線414，並填滿壓模20與導電架10之間的間隙。
請參考圖2F所示，待黑膠30與透明膠16固化後，移除封裝膠帶100與壓模20(106)，原本凸塊22所佔的空間形成凹口17，該黑膠30固化而形成一封裝體，透明膠16固化、定形而成為透明膠層，對於凹口17而言，該透明膠層係在其底部形成環狀凸部160，該感光晶片110、感光晶片座11、發光晶片120、發光晶片座12與引腳13係被固定在該封裝體內而不致位移或脫落。
請參考圖2G所示，切割封裝體，以獲得本發明的近接感測器(107)。
綜上所述，請參考圖3所示，本發明近接感測器包含有一感光單元40、一發光單元41、複數個透明膠層42與一封裝體43。
該感光單元40包含有一感光晶片座400、一感光晶片401與複數個引腳402，該感光晶片401設於該感光晶片座400上且具有一感光部403與複數個電極，該些電極係透過導線404而連接到引腳402，該感光晶片401與感光晶片座400之間設有一膠層405，以使感光晶片401固接於感光晶片座400上。
該發光單元41包含有一發光晶片座410、一發光晶片411與複數個引腳412，該發光晶片411設於該發光晶片座410上且具有一發光部413與複數個電極，該些電極係透過導線414而連接到引腳412，該發光晶片411與發光晶片座410之間設有一膠層415，以使發光晶片411固接於發光晶片座410上。
該些透明膠層42分別形成在感光單元40與發光單元41的表面，且該些透明膠層42的表面對應感光部403與發光部413的區域分別形成一環狀凸部422，該環狀凸部422所包圍的區域形成凹部421。
該封裝體43係包覆該感光單元40與該發光單元41，該些引腳402、412係外露於該封裝體43的底面，該封裝體43的頂面對應該感光部403與發光部413區域分別形成一通孔431，通孔431係連通透明膠層42的凹部421，其中該通孔431與凹部421構成如圖2G所示的凹口17。
是以，該發光晶片411發出的光線可穿透該透明膠層42而投射到外界，外界環境的光線可穿透感光晶片401上方的透明膠層42，以供該感光晶片401感應出外界的光線變化。
綜上所述，請參考圖4所示，在進行封膠製程中，由於在透明膠層42未固化前，壓模的凸塊即已壓入透明膠層42的頂端，此時透明膠層42具有可塑性，令凸塊凹入於透明膠層42的頂端，因此凸塊的底部與透明膠層42之間係緊密接觸的，故當黑膠注入時，黑膠無法滲進凸塊與透明膠層42之間，確保黑膠不會形成在感光晶片401的感光部403及發光晶片的發光部。
相較於已知技術利用金屬遮罩隔離發光元件與感光元件，本發明係採用黑膠作為阻隔體，避免發光元件產生的光直接影響該感光元件，此外，發光元件與感光元件表面設有透明膠層，該些透明膠層是經過點膠製程而得，封膠或點膠製程的成本係低於生產金屬遮罩的成本，故本發明的成本係有效降低。
10．．．導電架
100．．．封裝膠帶
11．．．感光晶片座
12．．．發光晶片座
13．．．引腳
110．．．感光晶片
111．．．感光部
120．．．發光晶片
121．．．發光部
14．．．黏著層
15．．．導線
16．．．透明膠
160．．．環狀凸部
17．．．凹口
20．．．壓模
21．．．基板
22．．．凸塊
30．．．黑膠
40．．．感光單元
400．．．感光晶片座
401．．．感光晶片
402．．．引腳
403．．．感光部
404．．．導線
405．．．膠層
41．．．發光單元
410．．．發光晶片座
411．．．發光晶片
412．．．引腳
413．．．發光部
414．．．導線
415．．．膠層
42．．．透明膠層
421．．．凹部
422．．．環狀凸部
43．．．封裝體
431．．．通孔
60．．．近接感測器
61．．．底板
62．．．金屬遮罩
620．．．隔板
621．．．腔室
622．．．開口
63．．．發光元件
64．．．感光元件
65．．．物體
70．．．導線架
71．．．發光晶片
72．．．感光晶片
73．．．透明膠層
74．．．壓模
740．．．凸部
75．．．黑膠
750．．．透光孔
751．．．殘留黑膠
圖1：本發明製法較佳實施例的流程示意圖。
圖2A~2G：本發明流程中各階段的半成品示意圖。
圖3：本發明近接感測器的側視示意圖。
圖4：圖3的局部放大圖。
圖5：已知近接感測器的側視示意圖。
圖6A~6D：另一已知近接感測器在製程中的半成品示意圖。
40．．．感光單元
400．．．感光晶片座
401．．．感光晶片
402．．．引腳
403．．．感光部
404．．．導線
405．．．膠層
41．．．發光單元
410．．．發光晶片座
411．．．發光晶片
412．．．引腳
413．．．發光部
414．．．導線
415．．．膠層
42．．．透明膠層
421．．．凹部
43．．．封裝體
431．．．通孔

Claims (8)

  1. 一種近接感測器，其包含有：一感光單元，其頂面具有一感光部，且該感光部之表面上具有一第一透明膠層，其中該第一透明膠層對應該感光部之區域形成一第一環狀凸部，且該第一環狀凸部所包圍的區域係形成一第一凹部；一發光單元，其頂面具有一發光部，且該發光部之表面上具有一第二透明膠層，其中該第二透明膠層對應該發光部之區域形成一第二環狀凸部，且該第二環狀凸部所包圍的區域係形成一第二凹部；以及一封裝體，包覆該感光單元與該發光單元，該封裝體的頂面對應該感光部與發光部的區域分別形成一第一通孔與一第二通孔，該第一通孔連通該第一凹部而構成一第一凹口，且該第二通孔連通該第二凹部而構成一第二凹口；其中，該第一凹口係做為外部光投射至感光部之通道，而該第二凹口係做為發光部放出光至外部之通道。
  2. 如請求項1所述之近接感測器，其中：該感光單元包含：一感光晶片座；複數個引腳，係外露於該封裝體；及一感光晶片，設於該感光晶片座上且電連接該些引腳，該感光晶片具有所述的感光部；該發光單元包含：一發光晶片座；複數個引腳，係外露於該封裝體；及 一發光晶片，設於該發光晶片座上且電連接該些引腳，該發光晶片具有所述的發光部。
  3. 如請求項1所述之近接感測器，其中該第一環狀凸部與該第二環狀凸部係藉由一壓模對應該感光部與該發光部上之凸塊壓入該感光部與該發光部上未固化之透明膠所形成。
  4. 如請求項2所述之近接感測器，該感光晶片與感光晶片座之間設有一膠層，，且該發光晶片與發光晶片座之間設有另一膠層。
  5. 如請求項2所述之近接感測器，該感光晶片為一環境光源感測元件(ALS sensor)，該發光晶片為一紅外線(IR)發射元件。
  6. 一種近接感測器的製法，其步驟包含：準備一導電架，該導電架上部包含有至少一感光晶片座、至少一發光晶片座與複數個引腳，以及該導電架下部係具有一封裝膠帶；在該感光晶片座及該發光晶片座上分別設置一感光晶片與一發光晶片，其中該感光晶片的頂面具有一感光部，該發光晶片的頂面具有一發光部；利用複數個導線將該感光晶片與該發光晶片分別電連接到該些引腳；在該感光部與該發光部表面分別形成一未固化之透明膠；利用一壓模壓入該些未固化之透明膠，其中該壓模對應該感光部與該發光部區域分別具有凸塊，當壓模壓入該 些未固化之透明膠時，該些凸塊的底部分別陷入該些未固化之透明膠，使該些未固化之透明膠分別包覆所對應之凸塊的底緣；在該導電架與該壓模之間注入一黑膠；待該黑膠與該些未固化之透明膠皆固化後，移除該封裝膠帶與該壓模，其中該黑膠固化而成為一封裝體；及對該封裝體進行裁切，以獲得至少一個近接感測器。
  7. 如請求項6所述近接感測器的製法，在設置該感光晶片與該發光晶片的步驟中，該感光晶片座與該感光晶片之間形成一膠層，該發光晶片座與該發光晶片之間形成另一膠層。
  8. 如請求項7所述近接感測器的製法，所述的膠層為環氧樹酯層。
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