CN206742222U - 光学式指纹感测封装结构 - Google Patents
光学式指纹感测封装结构 Download PDFInfo
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Abstract
一种光学式指纹感测封装结构,有别于传统的点胶封装,而是以封胶注模的方式,将感测模块与发光组件以封胶层包覆起来,且将感测模块与发光组件裸露至相同高度,并将导光组件设置于感测模块、发光组件与封胶层的上方,其出光面面向感测模块,入光面邻接于发光组件,则发光组件所发出的光线自入光面进入导光组件后,会由出光面射出并导向感测模块来接收;藉此,本实用新型除了可通过封胶注模提高封装结构的可靠度及增加作业效率,同时,感测模块与发光组件之间无须腾出空间架设导光组件,而可达到薄化封装结构的目的。
Description
技术领域
本实用新型是有关于一种指纹感测装置,特别是一种可实现薄化封装尺寸及促进生产效率的光学式指纹感测封装结构。
背景技术
指纹识别技术为生物特征识别技术中的一种,其感测人体手指上独有的指纹特征来进行辨识,以其在安全性和方便性方面的优点受到广泛的应用。一种指纹感测封装结构100,请参照图1,包括具有凹槽(cavity)111的基板110,凹槽111内设置有感测模块120,感测模块120通常可包括感测芯片121及玻璃盖板122,玻璃盖板122表面更可形成有光学膜123;其中感测芯片121是以打线接合方式安装于基板110的凹槽111内,并使用点胶方式,将封胶体140覆盖接合的焊线124。而导光组件150是罩设于感测模块120的上方,将基板110的整个凹槽111封闭,发光组件130则设置于导光组件150的外围,使得发光组件130所发出的光线可通过导光组件150导引至基板110凹槽111内的感测模块120,让感测芯片121得以接收。
然而,目前此种指纹感测封装结构100于尺寸轻薄化的发展仍有局限,原因在于感测模块120和发光组件130之间必须腾出一定空间来配合导光组件150的安装使用,会使得封装体积和封装厚度增加,难以达到封装轻薄的需求。再者,因为此种指纹感测封装结构100是使用点胶封装,其仅包覆接合焊点,组件的可靠度较低,而且点胶作业往往一次只能针对一处进行点胶,也导致作业效率不佳。
有鉴于此,本实用新型为一种光学式指纹感测封装结构及其制造方法,除了能够有效薄化封装结构,同时可提高封装结构的良率及产率,不但有别于先前技术的结构,更能有效克服其各种缺失。
发明内容
本实用新型的主要目的在于提供一种光学式指纹感测封装结构,有别于习知封装结构必须于感测模块与发光组件之间腾出空间来架设导光组件,而是采用封胶层将感测模块与发光组件予以包覆,且将感测模块与发光组件裸露至相同高度,至于导光组件则设置于感测模块、发光组件与封胶层的上方,其出光面面向感测模块,入光面则邻接于发光组件,从而可达到薄化封装结构的目的。
本实用新型的另一目的在于提供一种光学式指纹感测封装结构,乃不同于传统的点胶封装,而是以封胶注模的方式,将感测模块与发光组件包覆起来,无须增设遮光结构,同时,配合离模层的使用,可让封胶注模的过程不会漏胶,并达到露出感测模块与发光组件的上表面的稳定,可提高封装结构的产品良率与生产效率。
为达到上述的目的,本实用新型揭露一种光学式指纹感测封装结构,主要包括一基板、至少一发光组件、一感测模块、一封胶层及一导光组件。其中,发光组件设置于基板上;感测模块设置于基板上,且位于发光组件的一侧,而感测模块与发光组件的高度齐平;封胶层设置于基板上,以包覆感测模块与发光组件,并暴露出感测模块和发光组件的上表面,且感测模块和发光组件的上表面乃相对于封胶层突出一相同高度;而导光组件设置于感测模块、发光组件与封胶层的上方,且导光组件具有一出光面与至少一入光面,出光面面对于感测模块,入光面邻接于发光组件。其中,发光组件所提供的光线自入光面进入导光组件后,由出光面射出,而导向感测组件来予以接收。
具体而言,导光组件更包括至少一反光组件,反光组件设置于导光组件的侧边。
具体而言,感测模块包括一感测芯片与一玻璃盖板,且感测芯片设置于基板上,玻璃盖板设置于感测芯片上。
具体而言,封胶层为透光或不透光。
附图说明
图1为先前技术的指纹感测封装结构的剖面图。
图2为本实用新型的实施例的光学式指纹感测封装结构的剖面图。
图3A-3B为本实用新型的实施例的光学式指纹感测封装结构的制造方法的流程图。
图4A-4H为本实用新型的实施例的光学式指纹感测封装结构的制造方法中对应各步骤的结构剖面图。
图5A-5C为本实用新型的实施例的光学式指纹感测封装结构的制造方法中对应封胶注模方法的各步骤的结构剖面图。
附图标记说明:100-指纹感测封装结构;110-基板;111-凹槽;120-感测模块;121-感测芯片;122-玻璃盖板;123-光学膜;124-焊线;130-发光组件;140-封胶体;150-导光组件;200-光学式指纹感测封装结构;210-基板;211-电路层;220-感测模块;221-感测芯片;222-玻璃盖板;223-光学膜;224-焊线;230-发光组件;240-封胶层;250-导光组件;251-反光组件;260-成型模具;261-离模层;262-封胶。
具体实施方式
请参照图2,绘示本实用新型的实施例所提供的光学式指纹感测封装结构200的剖面图。
此光学式指纹感测封装结构200包括一基板210,基板210的材质可为陶瓷或硅,在基板210上设有电路层211以及与电路层211电性连接的感测模块220,感测模块220是由感测芯片221和玻璃盖板222所组成;其中,感测芯片221是用以撷取影像,可以利用打线方式,以焊线224与电路层211连接,上方的玻璃盖板222保护感测芯片221。
另外,基板210上更设有相邻于感测模块220且与电路层211电性连接的发光组件230,以作为光源;发光组件230可为发光二极管,较佳可为红外线发光二极管,此发光组件230的出光面较佳为上表面,且发光组件230的数量可以为一个或多个,在此仅以二个为示例。
封胶层240将发光组件230与感测模块220予以包覆,并裸露出发光组件230与感测模块240的上表面;封胶层240的材料可为环氧树脂或硅胶,此封胶层240可为透光或不透光,较佳者,此封胶层240为不透光,以作为发光组件230侧面的遮蔽层,使发光组件230侧向的发光光线或其他光线不会直接照射在感测芯片221上,可防止发光组件230发生漏光的现象,能避免造成质量不均匀的指纹影像。
本实施例中,感测模块220和发光组件230的高度大略齐平,以使封装结构更为精简,且感测模块220和发光组件230的上表面相对于封胶层240略为突出一相同高度,较佳者,此突出高度约为50微米(μm)以下,以避免注胶过程的漏胶现象,确保不会影响感测模块220的感测与发光组件230的发光。
本实施例中,由封胶层240所裸露的感测模块220的上表面,即玻璃盖板222上,可进一步形成用于准直光线的光学膜223。
至于导光组件250则设置在上述感测模块220、发光组件230与封胶层240的上方,此导光组件250的出光面乃面向于感测模块220,入光面邻接于发光组件230。本实施例中,导光组件250的两端乃分别安装于二发光组件230的上表面,亦即,发光组件230的出光面连接于导光组件250的入光面。藉此,发光组件230所发出的光线会由导光组件250的入光面导入后,再由导光组件250的出光面导出,并首先通过光学膜223的准直作用后,再往感测模块220的方向来传送,最后由感测芯片221予以接收。
本实施例中,导光组件250上方的两个侧边更分别设置一反光组件251,用以将光线反射至其出光面,可提高光的传导效率。
接着,请依序参照图3A-3B,为本实用新型的实施例所提供的光学式指纹感测封装结构200的制造方法的流程图;同时,请依序参照图4A-4H,为本实用新型的实施例所提供的光学式指纹感测封装结构200的制造方法中对应各步骤的结构剖面图。该制造流程包括如下步骤:
首先,见步骤S10,如图4A所示,提供一基板210,在基板210上设有电路层211;本实施例采用硅基板或陶瓷基板210。
见步骤S20,如图4B所示,将发光组件230安装于基板210上,并电性连接电路层211;本实施例采用红外线发光二极管作为发光组件230,发光组件230的出光面为上表面,并以二个发光组件230来表示,实务上并不限制其数量或种类。
然后,见步骤S30,且如图4C-4E所示,将感测模块220安装于基板210上而位于发光组件230的一侧,感测模块220与发光组件230的高度大略齐平,感测模块220是由感测芯片221和玻璃盖板222所组成;在此仅作为示例,实务上并不限制构成感测模块220的组件。详细而言,首先,如第4C图所示,是将感测芯片221设置于基板210上,并如第4D图所示,利用打线方式,将感测芯片221以焊线224与电路层211电性连接,如图4E所示,再将玻璃盖板222设置于感测芯片221上。
见步骤S40,如图4F所示,利用封胶注模方法,形成封胶层240于基板210上,使封胶层240将感测模块220与发光组件230予以包覆,并裸露出感测模块220和发光组件230的上表面,同时,感测模块220和发光组件230的上表面略为突出于封胶层240,且感测模块220和发光组件230所突出的高度一致,此突出高度大略为50微米以下;封胶注模的作业环境可在压模成形(compression mold)、移转成形(transfer mold)或热传导成形(TCM)等系统的成型模具的腔体内作业。请参照第5A-5C图,说明本实用新型的实施例的光学式指纹感测封装结构200的制造方法中对应封胶注模方法的各步骤的结构剖面图。
如图5A所示,提供一成型模具260,成型模具260内壁形成有离模层(releasefilm)261,并将设置有感测模块220与发光组件230的基板210放入成型模具260的内腔中,再将成型模具260密封,使离模层261压合于感测模块220和发光组件230的上表面。其中,离模层261为厚度可压缩的材质,例如聚对苯二甲酸丁二酯(PBT)、聚对苯二甲酸乙二酯(PET)、聚四氟乙烯(PTFE)等具高延展性的树脂,来完整包覆组件,让封胶过程不易产生漏胶现象,且离模层261的厚度较佳约为100微米以下,若超过100微米,则边缘容易脆弱,导致封装结构的可靠度下降。
如图5B所示,再将封胶262注入封装模具260内腔,在125-175℃的温度下,持续2-4分钟固化成型后,脱模,如第5C图所示,于基板210上形成封胶层240;制作为封胶层240的封胶262材料主要为环氧树脂或硅胶,并选择硬化剂、填充剂、离型剂去做调配,以达到低温、低收缩率及低热膨胀系数(CTE)的效果,且封胶层240可设计成透光或不透光,若选择不透光的封胶层240,则同时具有发光组件230侧面的遮蔽层的作用。
见步骤S50,如图4G所示,由于光学膜223通常不耐热,在形成封胶层240之后,再把光学膜223形成于感测模块220的玻璃盖板222上。
最后,见步骤S60,如图4H所示,将导光组件250设置于感测模块220、发光组件230与封胶层240的上方,即制得光学式指纹感测封装结构200。本实施例中,导光组件250上方的两个侧边分别设置有一反光组件251,且导光组件250下方的两端为入光面、中间底侧为出光面,其两端安装于发光组件230的出光面上,使得发光组件230所发出的光线可直接导入导光组件250的入光面,再由导光组件250的出光面来导出,而导光组件250的出光面面向于感测模块220,并配合反光组件251的辅助,因此光线可容易集中并导向感测模块220,而可经由光学膜223及玻璃盖板222传送至感测芯片221来予以接收。
综上所述,根据本实用新型所揭露的光学式指纹感测封装结构及其制造方法,乃利用封胶层将感测模块与发光组件包覆起来,并让感测模块与发光组件裸露出相同高度,使得组件的可靠度大幅提升,而进一步采用不透光的封胶层,更可避免发光组件的漏光现象,从而提升指纹影像的感测质量。再者,本实用新型将导光组件设置于发光组件上方,在感测模块和发光组件之间无须腾出空间提供导光组件安装使用,不仅容易将光源引导至感测模块,达到更佳的感测效果,也使得整体的封装尺寸可予以缩小,进而达到薄化封装结构的目的。
而另一方面,本实用新型利用封胶注模取代点胶制程,一次能同时针对多个基板进行作业,有助于提高作业效率,同时,本实用新型更配合离模层的使用,不仅可利于封胶注模制程中完成裸露一定高度的感测模块与发光组件,以达到封装轻薄的需求,并可用来维持封胶注模过程的稳定性,有助于进一步提高封装产品良率及生产效率。
以上说明对本实用新型而言只是说明性的,而非限制性的,本领域普通技术人员理解,在不脱离以下所附权利要求所限定的精神和范围的情况下,可做出许多修改,变化,或等效,但都将落入本实用新型的保护范围内。
Claims (4)
1.一种光学式指纹感测封装结构,其特征在于,包括:
一基板;
至少一发光组件,设置于该基板上;
一感测模块,设置于该基板上,且位于该发光组件的一侧,该感测模块与该发光组件的高度齐平;
一封胶层,设置于该基板上,以包覆该感测模块与该发光组件,并暴露出该感测模块和该发光组件的上表面,该感测模块和该发光组件的上表面相对于该封胶层突出一相同高度;及
一导光组件,设置于该感测模块、该发光组件与该封胶层的上方,且该导光组件具有一出光面与至少一入光面,该出光面面对于该感测模块,该入光面邻接于该发光组件。
2.根据权利要求1所述的光学式指纹感测封装结构,其特征在于,该导光组件更包括至少一反光组件,该反光组件设置于该导光组件的侧边。
3.根据权利要求1所述的光学式指纹感测封装结构,其特征在于,该感测模块包括一感测芯片与一玻璃盖板,该感测芯片设置于该基板上,该玻璃盖板设置于该感测芯片上。
4.根据权利要求1所述的光学式指纹感测封装结构,其特征在于,该封胶层为透光或不透光。
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