TWI616670B - 遠距離感測器的封裝結構 - Google Patents

遠距離感測器的封裝結構 Download PDF

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TWI616670B
TWI616670B TW105144094A TW105144094A TWI616670B TW I616670 B TWI616670 B TW I616670B TW 105144094 A TW105144094 A TW 105144094A TW 105144094 A TW105144094 A TW 105144094A TW I616670 B TWI616670 B TW I616670B
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Jing-Yi Lin
Ming-De Du
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Abstract

一種遠距離感測器的封裝結構，包含一基板、一發光晶片、一感測晶 片、二封裝膠體以及一封蓋，基板具有一承載面，發光晶片與該感測晶片係相互分離地設置於承載面，二封裝膠體係分別包覆發光晶片以及感測晶片並且彼此分離，封蓋設置於承載面以及各封裝膠體之上，並且藉由黏性膠體固接於承載面以及各封裝膠體，封蓋設有一光發射孔以及一光接收孔，光發射孔以及光接收孔分別位於發光晶片以及感測晶片上方。

Description

遠距離感測器的封裝結構
本發明係與封裝結構有關，特別是指一種遠距離感測器的封裝結構。
習知的遠距離感測器封裝結構係在一基板上設置一發光晶片及一感測晶片，接著經由模壓製程(Molding)將二封裝膠體分別包覆該發光晶片及該感測晶片，同時在各該封裝膠體頂面形成一半球狀透鏡部以對應該發光晶片及該感測晶片，最後同樣經由模壓製程將一封蓋設置於該基板及各該封裝膠體上方以完成整個封裝流程，值得一提的是，該封蓋通常會開設一光發射孔以及一光接收孔分別用以容納各該透鏡部。
惟，此種經由二次模壓製程形成各該封裝膠體以及該封蓋之方式，該封蓋與各該封裝膠體及該基板之間的結合性較差，並且，此種利用模壓製程形成該封蓋的方式，因為模壓模具無法接近各該透鏡部，因此該封蓋較無法貼近各該透鏡部，使得遠距離感測器的感測距離較短，因此，習用的遠距離感測器封裝結構以及其封裝方法仍有其缺點，而有待改進。
綜合上述說明，本發明之主要目的係在於提供一種遠距離感測器的封裝結構，其具有封裝材料結合性較佳並且感測的距離較遠之優點。
該遠距離感測器的封裝結構包含一基板、一發光晶片、一感測晶片、二封裝膠體以及一封蓋，該基板具有一承載面，該發光晶片與該感測晶片 係相互分離地設置於該承載面，該二封裝膠體係分別包覆該發光晶片以及該感測晶片並且彼此分離，該封蓋設置於該承載面以及各該封裝膠體之上，並且藉由黏性膠體固接於該承載面以及各該封裝膠體，該封蓋設有一光發射孔以及一光接收孔，該光發射孔以及該光接收孔分別位於該發光晶片以及該感測晶片上方。
藉此，該封蓋可藉由黏性膠體固接於該承載面以及各該封裝膠體，提升了封裝結構的材料結合度。
本發明之次要目的係在於提供一種遠距離感測器的封裝方法，包含下列步驟：(a)提供一基板，並將一發光晶片以及一感測晶片相互分離地設置於該基板之承載面；(b)將二封裝膠體分別包覆該發光晶片以及該感測晶片，並同時將各該封裝膠體相互分離；以及(c)將一預先成型之封蓋設置於該基板之承載面以及各該封裝膠體上方，並藉由黏性膠體將該封蓋固接於該基板之承載面以及各該封裝膠體。
較佳地，於步驟(b)中，係利用模壓(Molding)的方式將二封裝膠體分別包覆該發光晶片以及該感測晶片。
藉此，由於該封蓋係為預先成型，可直接藉由黏性膠體黏貼並固接於各該封裝膠體以及該承載面，並且可克服習知技術係利用兩次模壓分別形成封裝膠體以及封蓋，導致封蓋無法接近封裝膠體進而降低感測距離之缺點。
有關本發明所提供之詳細構造、特點，將於後續的實施方式詳細說明中予以描述。然而，在本領域中具有通常知識者應能瞭解，該等詳細 說明以及實施本發明所列舉的特定實施例，僅係用於說明本發明，並非用以限制本發明之專利申請範圍。
10、10’‧‧‧封裝結構
20‧‧‧基板
30‧‧‧發光晶片
40‧‧‧感測晶片
50、50’‧‧‧封裝膠體
55‧‧‧封裝膠體
60‧‧‧封蓋
22‧‧‧承載面
51‧‧‧凹溝
52‧‧‧透鏡部
54‧‧‧肩部
70‧‧‧黏性膠體
72‧‧‧光發射孔
74‧‧‧光接收孔
76‧‧‧橫向段
78‧‧‧延伸段
第1圖為本發明第一較佳實施例之俯視圖。
第2圖為第1圖之2-2剖線剖視圖。
第3圖為本發明第二較佳實施例之剖視圖。
第4A~4D圖為本發明第一較佳實施例之製造流程圖。
第5A~5E圖為本發明第二較佳實施例之製造流程圖。
請參考第1~2圖，係顯示本發明第一較佳實施例所提供之遠距離感測器的封裝結構10，係包含一基板20、一發光晶片30、一感測晶片40、二封裝膠體50以及一封蓋60。
基板20於本較佳實施例中係可為印刷電路板(通稱PCB)、雙馬來醯亞胺三嗪基板(通稱BT)、玻璃纖維基板(通稱FR4)或是直接覆銅基板(通稱DBC)但並不以此為限，藉此，基板20之生產成本較低，基板20具有一承載面22。
發光晶片30係設置於承載面22，並可藉由打線製程(Wire Bonding)電性連接於基板20，於本較佳實施例中發光晶片30係為LED晶片並可用以發射光源。
感測晶片40係設置於承載面22並與發光晶片30相互分離，其中，感測晶片40亦可藉由打線製程電性連接於基板20，感測晶片40可用以感測發光晶片30所發出的光源。
二封裝膠體50係利用模壓(Molding)的方式形成並分別包覆發光晶片30以及感測晶片40，二封裝膠體50係相互分離並於彼此之間形成一凹溝51，各封裝膠體50頂面具有一透鏡部52以及一肩部54，於本較佳實施例中，各封裝膠體50頂面之肩部54係圍繞透鏡部52，各封裝膠體50頂面之透鏡部52係呈半球狀，並且各封裝膠體50頂面之透鏡部52曲率可視需求於製造時進行調整，各封裝膠體50係為透光材質製成，如透明的環氧樹脂(Epoxy Resin)。
封蓋60係設置於承載面22以及各封裝膠體50之上，並藉由黏性膠體70固設於承載面22以及各封裝膠體50，封蓋60設有一光發射孔72以及一光接收孔74，光發射孔72以及光接收孔74分別位於發光晶片30以及感測晶片40上方，更進一步來說，封蓋60係包含一橫向段76以及複數由橫向段76向下延伸之延伸段78，橫向段76係設有光發射孔72以及光接收孔74，橫向段76係藉由黏性膠體70固設於各封裝膠體50頂面之肩部54，並且光發射孔72以及光接收孔74分別位於各封裝膠體50頂面之透鏡部52上方，各封裝膠體50頂面之透鏡部52係分別容納於光發射孔72及光接收孔74中，各延伸段78係分別位於凹溝51以及各封裝膠體50外周並且藉由黏性膠體70固接於承載面22。
封蓋60係由不透光材質所製成，如不透光的環氧樹脂(Epoxy Resin)。
請接著參考第4A~4D圖，係為本發明第一較佳實施例遠距離感測器的封裝結構10的封裝方法，係包含下列步驟：
步驟(a)：提供基板20，並將發光晶片30以及感測晶片40相互分離地設置於基板20之承載面22。
步驟(b)：將二封裝膠體50分別包覆發光晶片30及感測晶片40，同時將各封裝膠體50彼此分離，值得一提的是，於本較佳實施例中係使用模壓(Molding)的方式將二封裝膠體50分別包覆發光晶片30及感測晶片40，並且係使用直接模壓成型的方式使各封裝膠體50彼此分離，另外，於本步驟中，於形成各封裝膠體50時，可同時於各封裝膠體50頂面形成一透鏡部52以及一肩部54。
步驟(c)：將一預先成型之封蓋60設置於基板20之承載面22以及各封裝膠體50之上，並藉由黏性膠體70將封蓋60固接於基板20之承載面22以及各封裝膠體50，更進一步來說，於本步驟中，可將黏性膠體70(如不透光之環氧樹脂)經由點膠製程(Dispensing)塗佈於基板20之承載面22以及各封裝膠體50頂面之肩部54，再將封蓋60設置於基板20之承載面22以及各封裝膠體50之上，經由烘烤製程(Baking)使封蓋60固接於基板20之承載面22以及各封裝膠體50頂面之肩部54。
請接著參考第5A~5E圖，係為本發明第二較佳實施例遠距離感測器的封裝結構10’的封裝方法，值得一提的是，第二較佳實施例之步驟(a)與第一較佳實施例之步驟(a)相同，其差異在於，第二較佳實施例之步驟(b)中，係使用模壓(Molding)的方式將單一封裝膠體55包覆發光晶片30及感測晶片40，並同時在上述單一封裝膠體55頂面形成二透鏡部52，各透鏡部52係分別位於發光晶片30及感測晶片40上方，之後再使用切割的方式將上述單一封裝膠體55切割成二彼此分離之封裝膠體50’，其中，各封裝膠體50’分別包覆發光晶片30及感測晶片40。
接著於第二較佳實施例之步驟(c)中，先將黏性膠體70(如錫膏)以網版印刷(Screen Printing)的方式塗佈於封蓋60底部，同時在各封裝膠體50’頂面 之肩部54以及各封裝膠體50’之間以點膠製程塗佈黏性膠體70(如不透光之環氧樹脂)，在將封蓋60設置於基板20之承載面22以及各封裝膠體50’之上，經由烘烤製程(Baking)使封蓋60固接於基板20之承載面22以及各封裝膠體50’頂面之肩部54。
經由上述步驟，請參考第3圖，係為第二較佳實施例之封裝方法所製成之遠距離感測器之封裝結構10’。
綜合上述說明，封蓋60可藉由黏性膠體70固接於承載面22以及各封裝膠體(50、50’)，提升了封裝結構(10、10’)的材料結合度，並且，由於封蓋60係為預先成型，於製造封蓋60時即可將光發射孔72及光接收孔74製成貼近各透鏡部52之尺寸，再直接藉由黏性膠體70將封蓋60固接於承載面22以及各封裝膠體(50、50’)之上，由於光發射孔72及光接收孔74可貼近各透鏡部52，因此可提高遠距離感測器之感測距離。
最後必須再次說明，本發明於前揭實施例中所揭露的構成元件，僅為舉例說明，並非用來限制本案之範圍，其他等效元件的替代或變化，亦應為本案之申請專利範圍所涵蓋。
10‧‧‧封裝結構
20‧‧‧基板
30‧‧‧發光晶片
40‧‧‧感測晶片
50‧‧‧封裝膠體
60‧‧‧封蓋
22‧‧‧承載面
51‧‧‧凹溝
52‧‧‧透鏡部
54‧‧‧肩部
70‧‧‧黏性膠體
72‧‧‧光發射孔
74‧‧‧光接收孔
76‧‧‧橫向段
78‧‧‧延伸段

Claims (8)

  1. 一種遠距離感測器的封裝結構，係包含：一基板，具有一承載面；一發光晶片，設置於該承載面；一感測晶片，設置於該承載面並且與該發光晶片相互分離；二封裝膠體，分別包覆該發光晶片以及該感測晶片，各該封裝膠體係彼此分離；以及一封蓋，設置於該承載面以及各該封裝膠體之上，並藉由黏性膠體固設於該承載面以及各該封裝膠體，該封蓋設有一光發射孔以及一光接收孔，該光發射孔以及該光接收孔分別位於該發光晶片以及該感測晶片上方。
  2. 如申請專利範圍第1項所述遠距離感測器的封裝結構，各該封裝膠體之頂面具有一透鏡部以及一肩部，該封蓋包含一橫向段，該橫向段係設有該光發射孔以及該光接收孔，該光發射孔以及該光接收孔分別位於各該透鏡部上方，該封蓋之該橫向段係藉由黏性膠體固設於各該封裝膠體頂面之肩部。
  3. 如申請專利範圍第2項所述遠距離感測器的封裝結構，各該封裝膠體頂面之該肩部係圍繞該透鏡部。
  4. 如申請專利範圍第2項所述遠距離感測器的封裝結構，各該透鏡部係呈半球狀並分別容納於該光發射孔以及該光接收孔中。
  5. 如申請專利範圍第2項所述遠距離感測器的封裝結構，該二封裝膠體之間形成一凹溝，該封蓋更包含複數由該橫向段向下延伸之延伸段，各該延伸段係分別位於該凹溝以及各該封裝膠體外周並且藉由黏性膠體固接於該承載面。
  6. 如申請專利範圍第1項所述遠距離感測器的封裝結構，該發光晶片及該感測晶片係利用打線製程(Wire Bonding)電性連接於該基板。
  7. 如申請專利範圍第1項所述遠距離感測器的封裝結構，各該封裝膠體係利用模壓(Molding)的方式形成。
  8. 如申請專利範圍第1項所述遠距離感測器的封裝結構，各該封裝膠體係為透光材質製成，該封蓋係為不透光材質製成。
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