FR3075466B1 - Couvercle de boitier de circuit electronique - Google Patents

Couvercle de boitier de circuit electronique Download PDF

Info

Publication number
FR3075466B1
FR3075466B1 FR1762276A FR1762276A FR3075466B1 FR 3075466 B1 FR3075466 B1 FR 3075466B1 FR 1762276 A FR1762276 A FR 1762276A FR 1762276 A FR1762276 A FR 1762276A FR 3075466 B1 FR3075466 B1 FR 3075466B1
Authority
FR
France
Prior art keywords
electronic circuit
box cover
circuit box
face
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1762276A
Other languages
English (en)
Other versions
FR3075466A1 (fr
Inventor
Jean-Michel Riviere
Romain Coffy
Karine Saxod
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Grenoble 2 SAS
Original Assignee
STMicroelectronics Grenoble 2 SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Grenoble 2 SAS filed Critical STMicroelectronics Grenoble 2 SAS
Priority to FR1762276A priority Critical patent/FR3075466B1/fr
Priority to US16/218,948 priority patent/US10965376B2/en
Publication of FR3075466A1 publication Critical patent/FR3075466A1/fr
Application granted granted Critical
Publication of FR3075466B1 publication Critical patent/FR3075466B1/fr
Priority to US17/169,010 priority patent/US11546059B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
    • H01L31/161—Semiconductor device sensitive to radiation without a potential-jump or surface barrier, e.g. photoresistors
    • H01L31/162—Semiconductor device sensitive to radiation without a potential-jump or surface barrier, e.g. photoresistors the light source being a semiconductor device with at least one potential-jump barrier or surface barrier, e.g. a light emitting diode
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure

Abstract

L'invention concerne un couvercle de boîtier de circuit électronique, comprenant : un corps (135) traversé par une ouverture (140) ; un premier élément (130) situé dans l'ouverture et ayant une face en prolongement de formes planes ou arrondies d'une face du couvercle ; et un deuxième élément (150) de liaison du premier élément au corps.
FR1762276A 2017-12-15 2017-12-15 Couvercle de boitier de circuit electronique Expired - Fee Related FR3075466B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR1762276A FR3075466B1 (fr) 2017-12-15 2017-12-15 Couvercle de boitier de circuit electronique
US16/218,948 US10965376B2 (en) 2017-12-15 2018-12-13 Cover for an electronic circuit package
US17/169,010 US11546059B2 (en) 2017-12-15 2021-02-05 Cover for an electronic circuit package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1762276A FR3075466B1 (fr) 2017-12-15 2017-12-15 Couvercle de boitier de circuit electronique
FR1762276 2017-12-15

Publications (2)

Publication Number Publication Date
FR3075466A1 FR3075466A1 (fr) 2019-06-21
FR3075466B1 true FR3075466B1 (fr) 2020-05-29

Family

ID=61750319

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1762276A Expired - Fee Related FR3075466B1 (fr) 2017-12-15 2017-12-15 Couvercle de boitier de circuit electronique

Country Status (2)

Country Link
US (2) US10965376B2 (fr)
FR (1) FR3075466B1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3075466B1 (fr) 2017-12-15 2020-05-29 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
FR3075465B1 (fr) 2017-12-15 2020-03-27 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
US11837518B2 (en) * 2020-08-26 2023-12-05 Texas Instruments Incorporated Coated semiconductor dies
FR3132959A1 (fr) * 2022-02-22 2023-08-25 Stmicroelectronics (Grenoble 2) Sas Capteur temps de vol

Family Cites Families (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4004705B2 (ja) * 2000-02-29 2007-11-07 松下電器産業株式会社 撮像装置と撮像装置組立方法
US6384473B1 (en) * 2000-05-16 2002-05-07 Sandia Corporation Microelectronic device package with an integral window
US6531341B1 (en) 2000-05-16 2003-03-11 Sandia Corporation Method of fabricating a microelectronic device package with an integral window
JP3821652B2 (ja) 2001-02-26 2006-09-13 三菱電機株式会社 撮像装置
JP3980933B2 (ja) 2002-05-23 2007-09-26 ローム株式会社 イメージセンサモジュールの製造方法
JP2005072978A (ja) 2003-08-25 2005-03-17 Renesas Technology Corp 固体撮像装置およびその製造方法
CN2731475Y (zh) * 2002-10-04 2005-10-05 雅马哈株式会社 微透镜阵列和具有导销插入孔的装置
US7326583B2 (en) 2004-03-31 2008-02-05 Cree, Inc. Methods for packaging of a semiconductor light emitting device
DE102004051379A1 (de) 2004-08-23 2006-03-23 Osram Opto Semiconductors Gmbh Vorrichtung für ein optoelektronisches Bauteil und Bauelement mit einem optoelektronischen Bauteil und einer Vorrichtung
FR2887637B1 (fr) * 2005-06-23 2008-02-22 Varioptic Sa Procede de fabrication d'une lentille a focale variable a electromouillage
US20070070494A1 (en) * 2005-09-27 2007-03-29 Brott Robert L Multilayer optical interference film
JP4760426B2 (ja) * 2006-02-13 2011-08-31 ソニー株式会社 光学素子およびレンズアレイ
US20080029879A1 (en) * 2006-03-01 2008-02-07 Tessera, Inc. Structure and method of making lidded chips
JP4906496B2 (ja) 2006-12-25 2012-03-28 新光電気工業株式会社 半導体パッケージ
KR100809718B1 (ko) * 2007-01-15 2008-03-06 삼성전자주식회사 이종 칩들을 갖는 적층형 반도체 칩 패키지 및 그 제조방법
US7837369B2 (en) 2007-01-22 2010-11-23 Seiko Epson Corporation Light-emitting device, image-printing device, and manufacturing method of sealing member
JP4324623B2 (ja) * 2007-04-27 2009-09-02 シャープ株式会社 固体撮像装置およびそれを備えた電子機器
JP2009097872A (ja) * 2007-10-12 2009-05-07 Sharp Corp 光学式測距センサ、物体検出装置、洗浄便座、および光学式測距センサの製造方法
US7708475B2 (en) * 2008-04-24 2010-05-04 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Electro-optical assembly and method for making an electro-optical assembly
WO2009139029A1 (fr) 2008-05-12 2009-11-19 パイオニア株式会社 Dispositif de capteur lumineux et procédé de fabrication de celui-ci
JP2010266829A (ja) * 2009-05-18 2010-11-25 Three M Innovative Properties Co 光学部材およびこれを用いたデバイス
WO2011002208A2 (fr) 2009-07-03 2011-01-06 서울반도체 주식회사 Boîtier de diode électroluminescente
KR101716919B1 (ko) 2009-07-30 2017-03-15 니치아 카가쿠 고교 가부시키가이샤 발광 장치 및 그 제조 방법
US8384559B2 (en) 2010-04-13 2013-02-26 Silicon Laboratories Inc. Sensor device with flexible interface and updatable information store
FR2966979A1 (fr) * 2010-10-28 2012-05-04 St Microelectronics Grenoble 2 Dispositif optique, procede pour sa fabrication et boitier electronique comprenant ce dispositif optique
JP5742348B2 (ja) * 2011-03-23 2015-07-01 セイコーエプソン株式会社 撮像装置
US20120242814A1 (en) * 2011-03-25 2012-09-27 Kenneth Kubala Miniature Wafer-Level Camera Modules
DE102011102350A1 (de) * 2011-05-24 2012-11-29 Osram Opto Semiconductors Gmbh Optisches Element, optoelektronisches Bauelement und Verfahren zur Herstellung dieser
SG10201605065QA (en) 2011-12-22 2016-08-30 Heptagon Micro Optics Pte Ltd Opto-electronic modules, in particular flash modules, and method for manufacturing the same
US9263658B2 (en) 2012-03-05 2016-02-16 Seoul Viosys Co., Ltd. Light-emitting device and method of manufacturing the same
KR101973395B1 (ko) 2012-08-09 2019-04-29 엘지이노텍 주식회사 발광 모듈
JP2014041181A (ja) * 2012-08-21 2014-03-06 Hitachi Chemical Co Ltd レンズ付き基板及びその製造方法、並びにレンズ付き光導波路
JP6030656B2 (ja) * 2012-08-30 2016-11-24 京セラ株式会社 受発光素子およびこれを用いたセンサ装置
US9613939B2 (en) 2013-01-10 2017-04-04 Heptagon Micro Optics Pte. Ltd. Opto-electronic modules including features to help reduce stray light and/or optical cross-talk
US9831357B2 (en) * 2013-05-31 2017-11-28 Stmicroelectronics Pte Ltd. Semiconductor optical package and method
US9094593B2 (en) 2013-07-30 2015-07-28 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
US9746349B2 (en) 2013-09-02 2017-08-29 Heptagon Micro Optics Pte. Ltd. Opto-electronic module including a non-transparent separation member between a light emitting element and a light detecting element
US9258467B2 (en) * 2013-11-19 2016-02-09 Stmicroelectronics Pte Ltd. Camera module
KR101873132B1 (ko) 2013-11-22 2018-06-29 헵타곤 마이크로 옵틱스 피티이. 리미티드 컴팩트 광전자 모듈들
WO2015136100A2 (fr) 2014-03-14 2015-09-17 Mesa Imaging Ag Modules opto-électroniques utilisables pour reconnaître des réflexions parasites et pour compenser les erreurs causées par ces réflexions parasites
NL2013191B1 (en) * 2014-07-15 2016-07-14 Sencio B V Integrated circuit package moulding method and mould.
US9746557B2 (en) 2014-07-25 2017-08-29 Heptagon Micro Optics Pte. Ltd. Proximity sensor module including time-of-flight sensor wherein a second group of light sensitive elements is in a second one of the chambers of the module
CN106471620B (zh) 2014-09-19 2019-10-11 京瓷株式会社 电子元件安装用基板及电子装置
JP6230124B2 (ja) * 2014-12-05 2017-11-15 太陽誘電株式会社 撮像素子内蔵基板及びその製造方法、並びに撮像装置
FR3029687A1 (fr) * 2014-12-09 2016-06-10 Stmicroelectronics (Grenoble 2) Sas Procede de fabrication de dispositifs electroniques et dispositif electronique a double anneau d'encapsulation
US20170057134A1 (en) * 2015-09-01 2017-03-02 Proradiant Opto. Co., Ltd. Method for manufacturing an optical element
US9850124B2 (en) * 2015-10-27 2017-12-26 Advanced Semiconductor Engineering, Inc. Semiconductor device package for reducing parasitic light and method of manufacturing the same
TWI580990B (zh) * 2015-12-27 2017-05-01 昇佳電子股份有限公司 感測裝置及感測裝置製作方法
WO2017142487A1 (fr) * 2016-02-19 2017-08-24 Heptagon Micro Optics Pte. Ltd. Module optoélectronique ayant une double encapsulation comportant une ouverture pour recevoir un ensemble optique
WO2017203953A1 (fr) * 2016-05-27 2017-11-30 ローム株式会社 Dispositif à semi-conducteurs
US10461066B2 (en) 2016-06-29 2019-10-29 Maxim Integrated Products, Inc. Structure and method for hybrid optical package with glass top cover
CN107785357A (zh) * 2016-08-26 2018-03-09 意法半导体研发(深圳)有限公司 用于光学传感器封装体的防粘胶溢出帽盖
US9907169B1 (en) * 2016-08-30 2018-02-27 Avago Technologies General Ip (Singapore) Pte. Ltd. Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB
US10304793B2 (en) * 2016-11-29 2019-05-28 Taiwan Semiconductor Manufacturing Co., Ltd. Package structure and method for forming the same
TWI616670B (zh) * 2016-12-30 2018-03-01 遠距離感測器的封裝結構
US11543572B2 (en) * 2017-10-10 2023-01-03 3M Innovative Properties Company Curved reflective polariser films and methods of shaping
FR3073356A1 (fr) 2017-11-06 2019-05-10 Stmicroelectronics (Grenoble 2) Sas Capot d'encapsulation pour boitier electronique et procede de fabrication
FR3075466B1 (fr) 2017-12-15 2020-05-29 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
FR3075465B1 (fr) 2017-12-15 2020-03-27 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
FR3075467B1 (fr) 2017-12-15 2020-03-27 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique

Also Published As

Publication number Publication date
US20190190606A1 (en) 2019-06-20
US20210159985A1 (en) 2021-05-27
US10965376B2 (en) 2021-03-30
FR3075466A1 (fr) 2019-06-21
US11546059B2 (en) 2023-01-03

Similar Documents

Publication Publication Date Title
FR3075466B1 (fr) Couvercle de boitier de circuit electronique
FR3055042B1 (fr) Dispositif d'eclairage
EP3050456A3 (fr) Dispositif portable
WO2006119479A3 (fr) Determination de reputations de sites web faisant appel a un test automatique
DE50306232D1 (de) Ampholytisches copolymer und dessen verwendung
FR3047117B1 (fr) Unite de composant electronique et boitier de connexion electrique
TN2013000214A1 (fr) Carte electronique ayant un connecteur externe
USD804479S1 (en) Card reader enclosure
FR3028578B1 (fr) Dispositif de fixation d'un composant electronique, notamment d'un capteur d'acceleration de systeme de protection par coussins gonflables
HRP20080413T3 (en) Medicament for the treatment of fungal infections, particularly aspergillosis
EP3293675A3 (fr) Carte de transaction à bande magnétique interne
FR2939221B1 (fr) Carte a puce comportant un module electronique porte par un corps de carte pourvue de moyens d'authentification de l'appairage du module avec le corps
FR3075467B1 (fr) Couvercle de boitier de circuit electronique
USD804478S1 (en) Card reader enclosure
FR3073327B1 (fr) Module de barre de bus et barre de bus
FR3044646B1 (fr) Emballage pour batteries
FR3075484B1 (fr) Antenne pour circuit imprime, circuit electronique et equipement electronique pourvus d'une telle antenne
EA202090320A1 (ru) Крепежный блок
TR201721292A1 (tr) Bi̇r katlanabi̇len anten si̇stemi̇
ES1157408U (es) Cartera portatabaco
FI20055526A0 (fi) Mittausjärjestelmä
ATE365842T1 (de) Bewegbare verbindung
FR3102583B1 (fr) Dispositif à connecteur USB
ATE385006T1 (de) Anzeige der genauigkeit einer quantitativen analyse
EP2824620A3 (fr) Terminal de paiement électronique comprenant un système de verrouillage du boitier amélioré

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20190621

PLFP Fee payment

Year of fee payment: 3

ST Notification of lapse

Effective date: 20210806