JP4324623B2 - 固体撮像装置およびそれを備えた電子機器 - Google Patents
固体撮像装置およびそれを備えた電子機器 Download PDFInfo
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- JP4324623B2 JP4324623B2 JP2007120199A JP2007120199A JP4324623B2 JP 4324623 B2 JP4324623 B2 JP 4324623B2 JP 2007120199 A JP2007120199 A JP 2007120199A JP 2007120199 A JP2007120199 A JP 2007120199A JP 4324623 B2 JP4324623 B2 JP 4324623B2
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- H—ELECTRICITY
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- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/26—Holders for containing light sensitive material and adapted to be inserted within the camera
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
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- H—ELECTRICITY
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
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- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
- Lens Barrels (AREA)
Description
まず、レンズユニット1aについて説明する。図2は、レンズユニット1aの断面図である。図3(a)はレンズユニット1aの外観の斜視図、図3(b)はレンズユニット1aの上面図である。図4(a)は、図3(a)のレンズユニット1aの上下(表裏)を逆にしたときの外観を示す斜視図であり、図4(b)は、レンズユニット1aの裏面図である。
次に、撮像ユニット2aについて説明する。
撮像ユニット2aは、レンズユニット1aによって形成される被写体像を、電気信号に変換する撮像部である。つまり、撮像ユニット2aは、レンズユニット1aから入射された入射光を光電変換するセンサデバイスである。
配線基板21は、図示しないパターニングされた配線を有する基板である。配線基板21は、例えば、プリント基板,またはセラミック基板などである。配線基板21の表面にはワイヤボンド用の端子21aが、裏面には、外部接続用の電極21bが、それぞれ形成されている。端子21aと電極21bとは、互いに電気的に接続される。
図7(a)および図7(b)は、レンズユニット1aと撮像ユニット2aとが一体構成されたカメラモジュール100bの断面図である。カメラモジュール100bは、レンズユニット1aと撮像ユニット2aとが、封止部28によって、一括して樹脂封止されている。つまり、カメラモジュール100bでは、封止部28が、撮像ユニット2aに加え、レンズユニット1aも封止するようになっている。カメラモジュール100bは、封止部28がレンズユニット1aと撮像ユニット2aとを一括して封止する以外は、図1のカメラモジュール100aと同様である。
次に、図8(a)に示すような押圧部材4aによって、レンズユニット1aと撮像ユニット2aとを、より強固に固定する構成について説明する。図8(a)は、レンズホルダ12に固定された押圧部材4aを示す斜視図であり、図8(b)および図8(c)は、押圧部材4aによって、レンズユニット1aと撮像ユニット2aとを固定する状態を示す断面図である。
2a 撮像ユニット
4a〜4d 押圧部材
11 レンズ
12 レンズホルダ
12a 鏡筒部
12b 位置合わせ部
12d 開口
21 配線基板
22 DSP
23 スペーサ
24 固体撮像素子
25 接着部
26 透光性蓋部
27 ボンディングワイヤ
28 封止部
29 接点
100a〜100d カメラモジュール(固体撮像装置)
S 空間(間隔)
Claims (6)
- 外部の光を固体撮像素子の受光面に導くレンズと、そのレンズを内部に保持するレンズホルダとを備えた光学ユニット、および、
固体撮像素子と、固体撮像素子の受光面に対向するとともに、固体撮像素子との間に間隔を有するように配置された透光性蓋部とを備えた撮像ユニットを備えた固体撮像装置であって、
レンズホルダが、透光性蓋部の外周部全域と嵌合するようになっており、
透光性蓋部におけるレンズホルダとの嵌合部が封止されないように、撮像ユニットを樹脂封止する一方、光学ユニットを樹脂封止しない封止部を備え、
レンズホルダと、封止部とが互いに接触した状態で、レンズホルダと透光性蓋部とが互いに嵌合するようになっていることを特徴とする固体撮像装置。 - レンズおよびレンズホルダが、いずれも樹脂からなることを特徴とする請求項1に記載の固体撮像装置。
- レンズホルダが、着色樹脂からなることを特徴とする請求項2に記載の固体撮像装置。
- 光学ユニットは、レンズホルダに固定された押圧部材と、その押圧部材を支持する支持部とを備え、
光学ユニットを撮像ユニットに固定したときに、押圧部材がレンズホルダを透光性蓋部に押圧することにより、レンズホルダが透光性蓋部に嵌合するようになっていることを特徴とする請求項1〜3のいずれか1項に記載の固体撮像装置。 - 上記押圧部材は、開口を有していることを特徴とする請求項4に記載の固体撮像装置。
- 請求項1〜5のいずれか1項に記載の固体撮像装置を備えた電子機器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007120199A JP4324623B2 (ja) | 2007-04-27 | 2007-04-27 | 固体撮像装置およびそれを備えた電子機器 |
US12/150,231 US7848639B2 (en) | 2007-04-27 | 2008-04-24 | Solid-state image sensing device and electronic apparatus comprising same |
CNA2008100959164A CN101295064A (zh) | 2007-04-27 | 2008-04-25 | 固态摄像装置和具有该装置的电子设备 |
KR1020080038782A KR20080096460A (ko) | 2007-04-27 | 2008-04-25 | 고체 촬상 장치 및 그것을 구비한 전자기기 |
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Application Number | Priority Date | Filing Date | Title |
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JP2007120199A JP4324623B2 (ja) | 2007-04-27 | 2007-04-27 | 固体撮像装置およびそれを備えた電子機器 |
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Publication Number | Publication Date |
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JP2008278260A JP2008278260A (ja) | 2008-11-13 |
JP4324623B2 true JP4324623B2 (ja) | 2009-09-02 |
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JP2007120199A Expired - Fee Related JP4324623B2 (ja) | 2007-04-27 | 2007-04-27 | 固体撮像装置およびそれを備えた電子機器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7848639B2 (ja) |
JP (1) | JP4324623B2 (ja) |
KR (1) | KR20080096460A (ja) |
CN (1) | CN101295064A (ja) |
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JP2011027853A (ja) * | 2009-07-22 | 2011-02-10 | Toshiba Corp | カメラモジュールの製造方法 |
TW201104747A (en) * | 2009-07-29 | 2011-02-01 | Kingpak Tech Inc | Image sensor package structure |
US8981511B2 (en) * | 2012-02-29 | 2015-03-17 | Semiconductor Components Industries, Llc | Multi-chip package for imaging systems |
JP2013232756A (ja) * | 2012-04-27 | 2013-11-14 | Sony Corp | 光学モジュール |
US9142695B2 (en) * | 2013-06-03 | 2015-09-22 | Optiz, Inc. | Sensor package with exposed sensor array and method of making same |
US10340250B2 (en) | 2017-08-15 | 2019-07-02 | Kingpak Technology Inc. | Stack type sensor package structure |
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FR3075465B1 (fr) | 2017-12-15 | 2020-03-27 | Stmicroelectronics (Grenoble 2) Sas | Couvercle de boitier de circuit electronique |
FR3075466B1 (fr) * | 2017-12-15 | 2020-05-29 | Stmicroelectronics (Grenoble 2) Sas | Couvercle de boitier de circuit electronique |
KR102543522B1 (ko) * | 2018-02-07 | 2023-06-15 | 현대모비스 주식회사 | 카메라 모듈 패키지 및 그 제조방법 |
CN110649047A (zh) * | 2018-06-26 | 2020-01-03 | 三赢科技(深圳)有限公司 | 感光芯片封装结构及其形成方法 |
US10943894B2 (en) * | 2018-10-05 | 2021-03-09 | Asahi Kasei Microdevices Corporation | Optical device having lens block having recessed portion covering photoelectric conversion block |
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KR100616662B1 (ko) | 2005-01-13 | 2006-08-28 | 삼성전기주식회사 | 진동특성과 내충격성이 향상된 초점조절장치 |
JP2006276463A (ja) * | 2005-03-29 | 2006-10-12 | Sharp Corp | 光学装置用モジュール及び光学装置用モジュールの製造方法 |
JP4233535B2 (ja) * | 2005-03-29 | 2009-03-04 | シャープ株式会社 | 光学装置用モジュール、光路画定器及び光学装置用モジュールの製造方法 |
JP4233536B2 (ja) * | 2005-03-31 | 2009-03-04 | シャープ株式会社 | 光学装置用モジュール |
JP4802605B2 (ja) | 2005-08-17 | 2011-10-26 | ソニー株式会社 | レンズ駆動装置及びカメラ付き携帯電話 |
US7298562B2 (en) | 2005-09-02 | 2007-11-20 | Nidec Sankyo Corporation | Lens drive unit |
JP2007094364A (ja) | 2005-09-02 | 2007-04-12 | Nidec Sankyo Corp | レンズ駆動装置 |
KR100708772B1 (ko) | 2005-10-07 | 2007-04-17 | 주식회사 뮤타스 | 다이아프램을 구비한 화상 촬영 장치 |
JP2007108413A (ja) | 2005-10-13 | 2007-04-26 | Nidec Sankyo Corp | レンズ駆動装置およびその駆動方法 |
JP3124292U (ja) | 2006-06-02 | 2006-08-10 | 一品國際科技股▲ふん▼有限公司 | オートフォーカスレンズモジュール |
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2007
- 2007-04-27 JP JP2007120199A patent/JP4324623B2/ja not_active Expired - Fee Related
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2008
- 2008-04-24 US US12/150,231 patent/US7848639B2/en not_active Expired - Fee Related
- 2008-04-25 KR KR1020080038782A patent/KR20080096460A/ko not_active Application Discontinuation
- 2008-04-25 CN CNA2008100959164A patent/CN101295064A/zh active Pending
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US7848639B2 (en) | 2010-12-07 |
JP2008278260A (ja) | 2008-11-13 |
CN101295064A (zh) | 2008-10-29 |
US20080267616A1 (en) | 2008-10-30 |
KR20080096460A (ko) | 2008-10-30 |
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