JP2015026804A - 光学モジュール、およびその製造方法 - Google Patents
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- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/732—Location after the connecting process
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
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Abstract
Description
以下、本発明の構造、特徴及び効果を詳細に説明するため、本発明の一実施形態を図面に基づいて説明する。
ステップAでは、各アレイ基板(Substrate array)の単一基板20上で発光ゾーン22及び受光ゾーン24を定義する。
ステップBでは、発光チップ30及び受光チップ40をダイアタッチ(Die Attach)及びワイヤボンディング(Wire Bond)プロセスにより基板20の発光ゾーン22と受光ゾーン24の中に設ける。
ステップCでは、モールド(Mold)方式で発光チップ30及び受光チップ40の上方に透明のパッケージ部材50を形成し、透明のパッケージ部材50の発光チップ30及び受光チップ40に対応する位置に、半球状を呈する第1のレンズ部52および第2のレンズ部54を形成する。パッケージ部材50の水平表面に少なくとも1個の凹穴56を形成する。
ステップDでは、遮光可能な封止用蓋体60を更にモールド(Mold)方式で基板20とパッケージ部材50の上に固設する。封止用蓋体60は発光チップ30及び受光チップ40に対応する位置に位置する発光穴62および受光穴64を有し、凹穴56に対応する位置に凸縁部66を有する。パッケージ部材50の第1のレンズ部52および第2のレンズ部54は発光穴62及び受光穴64の中に収容されており、凸縁部66は凹穴56の位置に対応しており、互いに嵌合する。
20・・・基板、
22・・・発光ゾーン、
24・・・受光ゾーン、
30・・・発光チップ、
40・・・受光チップ、
50・・・パッケージ部材、
52・・・第1のレンズ部、
54・・・第2のレンズ部、
56・・・凹穴、
60・・・封止用蓋体、
62・・・発光穴、
64・・・受光穴、
66・・・凸縁部、
70・・・結合手段。
Claims (10)
- 発光ゾーン、及び、受光ゾーンが定義されている基板と、
前記基板の前記発光ゾーンに設けられている発光チップと、
前記基板の前記受光ゾーンに設けられている受光チップと、
前記発光チップ、及び、前記受光チップを覆い、且つ、前記発光チップの前記基板とは反対側に半球状に形成されている第1のレンズ部、及び、前記受光チップの前記基板とは反対側に半球状に形成されている第2のレンズ部を有するパッケージ部材と、
前記基板の前記パッケージ部材側に設けられており、前記発光チップ及び前記受光チップと対応する位置に、前記第1のレンズ部を収容する発光穴および前記第2のレンズ部を収容する受光穴とを有する封止用蓋体と、
前記パッケージ部材と前記封止用蓋体とを結合させる接合手段と、
を含むことを特徴とする光学モジュールのパッケージ。 - 前記接合手段は、
前記パッケージ部材の水平方向の表面に形成されている少なくとも1個の凹穴と、
前記封止用蓋体の前記凹穴と対応する位置に形成されている凸縁部とを有し、
前記凸縁部が前記凹穴の中に嵌め込まれていることを特徴とする請求項1に記載の光学モジュール。 - 前記パッケージ部材、及び、前記封止用蓋体が、モールド方式で形成されていることを特徴とする請求項1に記載の光学モジュールのパッケージ。
- 前記パッケージ部材の第1のレンズ部および第2のレンズ部は、同じ屈折率又は異なる屈折率を有することを特徴とする請求項1に記載の光学モジュールのパッケージ。
- 前記パッケージ部材は、透光性樹脂により形成されていることを特徴とする請求項1に記載の光学モジュールのパッケージ。
- 前記封止用蓋体が、一体成形により形成されており、遮光性の樹脂により形成されていることを特徴とする請求項1に記載の光学モジュールのパッケージ。
- 前記基板は、有機材質のビスマレイミドトリアジン基板を含む非セラミック基板であることを特徴とする請求項1に記載の光学モジュールのパッケージ。
- (a)基板に、発光ゾーン、及び、受光ゾーンを定義するステップと、
(b)発光チップと受光チップを前記基板に電気的に接続するステップと、
(c)透光可能なパッケージ部材を前記発光チップおよび前記受光チップの前記基板とは反対側に形成するステップと、
(d)遮光である封止用蓋体を前記パッケージ部材の前記基板とは反対側に固設するステップと、を含むことを特徴とする光学モジュールのパッケージの製造方法。 - 前記発光チップおよび前記受光チップが前記基板に電気的に接続する方法は、ワイヤボンディングプロセス、及び、ダイアタッチプロセスであることを特徴とする請求項8に記載の光学モジュールのパッケージの製造方法。
- 前記ステップ(a)〜前記ステップ(d)により製造された光学モジュールをカット、又は、ダイカットするステップ(e)を更に含むことを特徴とする請求項8に記載の光学モジュールのパッケージの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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TW102126697 | 2013-07-25 | ||
TW102126697A TW201505135A (zh) | 2013-07-25 | 2013-07-25 | 光學模組的封裝結構 |
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JP2015026804A true JP2015026804A (ja) | 2015-02-05 |
JP6062349B2 JP6062349B2 (ja) | 2017-01-18 |
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US (1) | US20150028357A1 (ja) |
JP (1) | JP6062349B2 (ja) |
TW (1) | TW201505135A (ja) |
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KR20160103415A (ko) * | 2015-02-24 | 2016-09-01 | 엘지이노텍 주식회사 | 근접센서와 이를 포함하는 카메라 모듈과 이를 포함하는 이동 단말기 |
US10170658B2 (en) * | 2015-11-13 | 2019-01-01 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structures and method of manufacturing the same |
CN107611147B (zh) | 2016-07-11 | 2020-02-18 | 胜丽国际股份有限公司 | 多芯片塑胶球状数组封装结构 |
TWI619959B (zh) * | 2016-07-11 | 2018-04-01 | 光寶新加坡有限公司 | 感測裝置及其製造方法 |
CN108269793A (zh) * | 2016-12-30 | 2018-07-10 | 菱生精密工业股份有限公司 | 光学模块的封装结构 |
TWI616670B (zh) * | 2016-12-30 | 2018-03-01 | 遠距離感測器的封裝結構 | |
US10147835B2 (en) * | 2017-03-17 | 2018-12-04 | Advanced Semiconductor Engineering, Inc. | Optical device and method of manufacturing the same |
TWI640929B (zh) * | 2017-04-18 | 2018-11-11 | Gingy Technology Inc. | 指紋辨識方法以及指紋辨識裝置 |
US10720751B2 (en) * | 2017-09-27 | 2020-07-21 | Advanced Semiconductor Engineering, Inc. | Optical package structure, optical module, and method for manufacturing the same |
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2013
- 2013-07-25 TW TW102126697A patent/TW201505135A/zh unknown
- 2013-11-05 US US14/072,154 patent/US20150028357A1/en not_active Abandoned
- 2013-11-15 JP JP2013236807A patent/JP6062349B2/ja active Active
Patent Citations (6)
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JP2006005141A (ja) * | 2004-06-17 | 2006-01-05 | Citizen Electronics Co Ltd | 光半導体パッケージ及びその製造方法 |
JP2009088435A (ja) * | 2007-10-03 | 2009-04-23 | Citizen Electronics Co Ltd | フォトリフレクタ及びその製造方法 |
JP2009111129A (ja) * | 2007-10-30 | 2009-05-21 | Rohm Co Ltd | フォトインタラプタ |
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JP3172668U (ja) * | 2011-09-27 | 2012-01-05 | 菱生精密工業股▲分▼有限公司 | 光学モジュール |
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TW201505135A (zh) | 2015-02-01 |
TWI500120B (ja) | 2015-09-11 |
US20150028357A1 (en) | 2015-01-29 |
JP6062349B2 (ja) | 2017-01-18 |
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