TW201617548A - Led燈蕊結構 - Google Patents
Led燈蕊結構 Download PDFInfo
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
Abstract
本發明提供一種LED燈蕊結構,提供一種機械強度佳、散熱良好且能夠360度角發光的作用。包含有一基板,該基板具有至少兩側面,且基板上設有至少一連通所述側面的開口,並於側面臨近開口處設置至少一LED,俾使LED所發出的光線,經由開口投射至LED所設置側面之相對向側。如此,藉由開口的透光設計,即可採用金屬來製成基板,令基板不易碎裂,可提升製程良率,且對於LED具有絕佳的散熱效果,亦可利用開口形成基板兩面透光的效果,可直接取代傳統螢光燈管或白熾燈泡的鎢絲電極,並突破傳統LED發光角度的限制。
Description
本發明的技術領域是有關於螢光燈管、白熾燈泡和LED的相關技術,特別是指一種可取代傳統螢光燈管或白熾燈泡之鎢絲電極的LED燈蕊結構,尤其涉及該LED燈蕊之金屬製基板,以及裝設於該基板表面的LED。
目前之居家、辦公室、教室和工廠等的照明,大多是以螢光燈管為主,白熾燈泡在使用上的便利性雖已不如螢光燈管,但仍被許多場所採用,可依需求以白熾燈泡來輔助照明。螢光燈管是含有汞及氬氣的玻璃製管體,管體兩端的燈帽內密封有鎢絲電極,通電後可發出紫外光,而激發塗在管體內壁的螢光粉,藉以發出可見光。白熾燈泡則是將鎢絲密封於玻璃泡內,透過通電把鎢絲加熱至白熾,進而發出可見光。但是,雖然螢光燈管和白熾燈泡的價格都不高,但是其內部由鎢絲所構成的燈蕊結構,在運作發光時相當耗電;此外,白熾燈泡內的汞會污染環境。
因此,從節能和環保的觀點來看,採用以LED(發光二極體)發光的燈具是不錯的替代方案。但是,LED燈具卻面臨了一個全面取代白熾燈泡和螢光燈管時,不得不克服的困難。傳統由LED所構成之燈蕊結構,是將LED設在印刷電路板上,由於印刷電路板不透光,若將LED設在印刷電路板同一面上,則只能朝單一方向投射光線,無法產生360度角發光的作用。如果在印刷電路板兩面都設置LED,雖可產生360度角發光的作用,卻徒增LED之設置成本,而且印刷電路板一面上LED所發出的光線,無法透過印刷電路板另一面,造成光源的浪費。
有鑑於此,市面上已存在一種將LED設在透光材料上的燈蕊結構,該透光材料係採用藍寶石基板,將LED設在藍寶石基板單一面上,並利用微細之金屬引線將LED的陽極和陰極連接至燈具外,以連接建築電源,驅使LED發光,令LED所出的光線透過該藍寶石基板,而照亮藍寶石基板兩側,達到產生360度角發光的作用。
惟,上述藍寶石基板在生產、運送和使用過程中,非常容易破碎和斷裂,造成製程良率欠佳的問題。而且,藍寶石基板的導熱率較差,因此其對於LED的散熱特性欠佳,致使LED容易過熱燒毀,造成產品信賴性不穩定。此外,由於藍寶石基板是電的絕緣體,因此需要在正、負極加上金屬電極,容易產生金屬電極脫落的情形,更加重製程良率欠佳的問題。
有鑑於此,本發明人特以其專門從事LED燈具和相關器材與設備之生產、製造及設計的多年經驗,進而研創出本發明,以克服上述先前技術中之缺失。
爰是,本發明之主要目的,即在於提供一種LED燈蕊結構,尤其涉及一種機械強度佳、散熱良好且能夠360度角發光,足以取代傳統螢光燈管或白熾燈泡之鎢絲電極的LED燈蕊結構。以克服上述先前技術中,傳統藍寶石基板之散熱性欠佳與易碎等缺失;並且,提供360度角發光的效果。
為達成上述之目的,本發明之LED燈蕊結構,包含有一基板,該基板具有至少兩側面,且基板上設有至少一連通所述側面的開口,並於該等側面臨近開口處設置至少一LED,俾使該LED所發出的光線,能夠經由該開口投射至該LED所設置側面之相對向側。
藉由上述,由於該開口連通基板兩側面的結構設計,當位於基板一側面的LED發光時,該LED所產生的光線除了可照亮該基板一側以外,亦可透過該開口照亮該基板另一側,而產生360度角發光的效果;因此,即可採用金屬材料來製成該基板及開口,而使基板產生不易破碎和斷裂的效果,以提升製程良率,且金屬基板對於LED具有絕佳的散熱效果,撤除了傳統傾向於應用藍寶石基板的容易破碎、斷裂和散熱性不良等結構組合設計,並且具備基板兩面透光的效果,可直接取代傳統螢光燈管和白熾燈泡的鎢絲電極,突破傳統LED發光角度的限制。
依據上述主要結構特徵,該基板可設於一燈泡內。或者,該基板亦可設於一燈管內,該燈管兩端分別設有一燈帽,該燈帽上設有二電連接該LED的導電端子,該燈帽上的二導電端子分別位在相對於該基板兩側面的位置。此外,所述基板及LED之外包覆有包覆層,該包覆層包含有螢光粉。如此,該基板所構成的LED燈蕊結構,可適用於傳統之螢光燈管和白熾燈泡的現有規格,以改善傳統採用鎢絲所構成之燈蕊結構的缺點。
依據上述主要結構特徵,所述開口可間隔排列於該基板側面,該LED位於相鄰的二開口之間。該LED的至少局部可跨設於該開口上。或者,該LED的全部均跨設於該開口上。所述LED可等間隔或非等間隔排列於該基板側面。如此,使該基板形成燈條或燈串型態,並可依需求改變LED的照明角度,藉以提供多變的照明型態。
為能明確且充分揭露本發明,併予列舉較佳實施之圖例,以詳細說明其實施方式如後述:
請合併參閱第1及2圖,揭示出本發明之實施方式的圖式,由上述圖式說明本發明之LED燈蕊結構,包含有一長形基板1,該基板1具有至少兩側面11、12,且基板1上設有至少一連通所述側面11、12的開口13,所述開口13在本實施上可設為多數,且所述開口13可等間隔或非等間隔排列於該基板1側面11、12,該開口13可設成矩形輪廓。
圖中並描繪了,該等側面11臨近開口13處設置至少一LED 2,所述LED 2在本實施上可設為多數,且LED 2位於相鄰的二開口13之間,而使所述LED 2等間隔或非等間隔排列於該基板1側面11,令該基板1形成燈條或燈串型態。而且,所述LED 2之間係利用多數金屬引線3相互連接。
具體來說,該LED 2兩端可設為陽極和陰極,該陽極和陰極未接觸基板1,所述LED 2之陽極可朝向相同方向,各引線3可連接於一LED 2之陰極與另一LED 2的陽極之間,使引線3跨越該開口13,且所述LED 2之間形成串聯形態,再將最外側兩個LED 2所連接的引線3外接電源,驅使全部LED 2發光,且各LED 2於該基板1一側面11所發出的光線,可經由該開口13投射至該LED 2所設置側面11之相對向側,令光線投射至該基板1另一側面12以外。
請參閱第3圖,說明該基板1可設於一燈泡4內,該燈泡4結合有一燈帽5,上述最外側兩個LED 2的引線3係連接至燈帽5。此外,所述基板1及LED 2以外亦可包覆一包覆層6,且包覆層6包含有螢光粉。依據上述結構,由於該開口13連通基板1兩側面11、12的結構設計,當位於基板1一側面11的LED 2發光時,該LED 2所產生的光線除了可照亮該基板1一側以外,亦可透過該開口13照亮該基板1另一側,而產生360度角發光的效果。而且,該LED 2所發出的光線,更可激發塗在基板1和LED 2外的包覆層6,以加強光線亮度和均勻度。
請參閱第4圖,說明該基板1亦可設於一燈管7內,該燈管7兩端分別設有一燈帽8,該基板1兩端可分別固定於兩燈帽8內部,該燈帽8上設有二導電端子81,且上述最外側兩個LED 2的引線3係通過該燈帽8而電連接至導電端子81。而且,該燈帽8上的二導電端子81分別位在相對於該基板1兩側面11、12的位置。藉此,當燈管7兩側之導電端子81外接電源時,可經由引線3供電至各LED 2,而驅使各LED 2在基板1一側發光,並透過該開口13投射光線至基板1另一側,產生360度角發光的效果。
可瞭解的是,由於該燈帽8的二導電端子81分別位在相對於基板1兩側面11、12的位置,因此當燈管7安裝於天花板之燈座(圖略)以後,該基板1兩側面11、12恰好朝向燈座兩側方向,避免發生基板1其中一側面11或12朝向天花板上方的情形,使基板1兩側面11、12的光線都能夠充分的用來照亮天花板下方區域。
如此一來,即可採用金屬材料來製成該基板1,並且冲製金屬基板1上的開口13,使基板1產生不易破碎和斷裂的效果,以提升製程良率,且金屬基板1對於LED 2具有絕佳的散熱效果,撤除了傳統傾向於應用藍寶石基板的容易破碎、斷裂和散熱性不良等結構組合設計,並且具備基板1兩面透光的效果。據此,該基板1所構成的LED燈蕊結構,可適用於傳統之螢光燈管和白熾燈泡的現有規格,以改善傳統螢光燈管或白熾燈泡採用鎢絲所構成之燈蕊結構的缺點,突破傳統LED發光角度的限制。
請參閱第5圖,在一可行的實施例中,該基板1側面11、12間隔設置多數開口13,各LED 2分別設於相鄰的二開口13之間,且LED 2至少局部跨設於該開口13上,使開口13局部被LED 2所遮蔽,令LED 2位於開口13上的部分能夠分別朝基板1兩側投射光線。
請參閱第6及7圖,在另一可行的實施例中,該基板1側面11、12設置單一長形開口14,且開口14沿著基板1的長度方向延伸,該LED 2的全部均跨設於該開口14上,而使所述LED 2沿著開口14的長度方向間隔排列,令LED 2中段的發光部分位於開口14上,而能夠分別朝基板1兩側投射光線。前述各LED 2之間引線3的連接方式,可選擇跨越開口14。
請參閱第8圖,在又一可行的實施例中,亦可調整LED 2之陽極和陰極的排列方向,讓引線3沿著開口14外緣設置。請參閱第9圖,於再又一可行的實施例中,亦可將各LED 2設於開口14外緣,使引線3跨越開口14及沿著開口14外緣設置。
依據上述,該金屬基板1所構成的LED燈蕊結構,除了具有機械強度佳和散熱良好等效果以外,更加具備能夠360度角發光的能力,可適用於傳統之螢光燈管和白熾燈泡的現有規格,以直接取代傳統採用鎢絲所構成的燈蕊結構,並產生節能和環保的功效。此外,更可依需求改變LED 2與開口13、14之間的相對位置,以及引線3的配置形態,以提供多變的照明型態。
綜上所陳,僅為本發明之較佳實施例而已,並非用以限定本發明,凡其他未脫離本發明所揭示之精神下而完成之等效修飾或置換,均應包含於後述申請專利範圍內。
1‧‧‧基板
11、12‧‧‧側面
13、14‧‧‧開口
2‧‧‧LED
3‧‧‧引線
4‧‧‧燈泡
5、8‧‧‧燈帽
6‧‧‧包覆層
7‧‧‧燈管
81‧‧‧導電端子
第1圖為本發明較佳實施例的立體圖。
第2圖為第1圖的立體分解圖。
第3圖為第1圖之一種使用型態的立體圖。
第4圖為第1圖之另一種使用型態的立體圖。
第5圖為第1圖之一附加實施型態的立體圖。
第6圖為第1圖之另一附加實施型態的立體圖。
第7圖為第6圖的立體分解圖。
第8圖為第1圖之又一附加實施型態的立體圖。
第9圖為第1圖之再一附加實施型態的立體圖。
1‧‧‧基板
11、12‧‧‧側面
13‧‧‧開口
2‧‧‧LED
3‧‧‧引線
6‧‧‧包覆層
Claims (30)
- 一種LED燈蕊結構,包含有一基板,該基板具有至少兩側面,且基板上設有至少一連通所述側面的開口,並於該等側面臨近開口處設置至少一LED,俾使該LED所發出的光線,能夠經由該開口投射至該LED所設置側面之相對向側。
- 如申請專利範圍第1項所述LED燈蕊結構,其中該基板設於一燈泡內。
- 如申請專利範圍第1項所述LED燈蕊結構,其中該基板設於一燈管內,該燈管兩端分別設有一燈帽,該燈帽上設有二電連接該LED的導電端子。
- 如申請專利範圍第3項所述LED燈蕊結構,其中該燈帽上的二導電端子分別位在相對於該基板兩側面的位置。
- 如申請專利範圍第1或2或3或4項所述LED燈蕊結構,其中所述開口間隔排列於該基板側面,該LED位於相鄰的二開口之間。
- 如申請專利範圍第1或2或3或4項所述LED燈蕊結構,其中該LED的至少局部跨設於該開口上。
- 如申請專利範圍第5項所述LED燈蕊結構,其中該LED的至少局部跨設於該開口上。
- 如申請專利範圍第1或2或3或4項所述LED燈蕊結構,其中該LED的全部均跨設於該開口上。
- 如申請專利範圍第5項所述LED燈蕊結構,其中該LED的全部均跨設於該開口上。
- 如申請專利範圍第1或2或3或4項所述LED燈蕊結構,其中所述LED等間隔排列於該基板側面。
- 如申請專利範圍第5項所述LED燈蕊結構,其中所述LED等間隔排列於該基板側面。
- 如申請專利範圍第6項所述LED燈蕊結構,其中所述LED等間隔排列於該基板側面。
- 如申請專利範圍第8項所述LED燈蕊結構,其中所述LED等間隔排列於該基板側面。
- 如申請專利範圍第1或2或3或4項所述LED燈蕊結構,其中所述LED非等間隔排列於該基板側面。
- 如申請專利範圍第5項所述LED燈蕊結構,其中所述LED非等間隔排列於該基板側面。
- 如申請專利範圍第6項所述LED燈蕊結構,其中所述LED非等間隔排列於該基板側面。
- 如申請專利範圍第8項所述LED燈蕊結構,其中所述LED非等間隔排列於該基板側面。
- 如申請專利範圍第1或2或3或4項所述LED燈蕊結構,其中所述基板及LED之外包覆有包覆層,該包覆層包含有螢光粉。
- 如申請專利範圍第5項所述LED燈蕊結構,其中所述基板及LED之外包覆有包覆層,該包覆層包含有螢光粉。
- 如申請專利範圍第6項所述LED燈蕊結構,其中所述基板及LED之外包覆有包覆層,該包覆層包含有螢光粉。
- 如申請專利範圍第8項所述LED燈蕊結構,其中所述基板及LED之外包覆有包覆層,該包覆層包含有螢光粉。
- 如申請專利範圍第10項所述LED燈蕊結構,其中所述基板及LED之外包覆有包覆層,該包覆層包含有螢光粉。
- 如申請專利範圍第14項所述LED燈蕊結構,其中所述基板及LED之外包覆有包覆層,該包覆層包含有螢光粉。
- 如申請專利範圍第1或2或3或4項所述LED燈蕊結構,其中該基板由金屬材料製成。
- 如申請專利範圍第5項所述LED燈蕊結構,其中該基板由金屬材料製成。
- 如申請專利範圍第6項所述LED燈蕊結構,其中該基板由金屬材料製成。
- 如申請專利範圍第8項所述LED燈蕊結構,其中該基板由金屬材料製成。
- 如申請專利範圍第10項所述LED燈蕊結構,其中該基板由金屬材料製成。
- 如申請專利範圍第14項所述LED燈蕊結構,其中該基板由金屬材料製成。
- 如申請專利範圍第18項所述LED燈蕊結構,其中該基板由金屬材料製成。
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TW103138562A TW201617548A (zh) | 2014-11-06 | 2014-11-06 | Led燈蕊結構 |
US14/665,297 US9689559B2 (en) | 2014-11-06 | 2015-03-23 | LED light core structure |
EP15166182.4A EP3018399A1 (en) | 2014-11-06 | 2015-05-04 | Led light core structure |
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TW103138562A TW201617548A (zh) | 2014-11-06 | 2014-11-06 | Led燈蕊結構 |
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USD774686S1 (en) * | 2015-02-27 | 2016-12-20 | Star Headlight & Lantern Co., Inc. | Optical lens for projecting light from LED light emitters |
DE102016113206A1 (de) * | 2016-07-18 | 2018-01-18 | Osram Opto Semiconductors Gmbh | Strahlung emittierende Vorrichtung |
US20180100625A1 (en) * | 2016-10-12 | 2018-04-12 | Double Good Co. | Led light bulb and fabrication method thereof |
IT201900022149A1 (it) * | 2019-11-26 | 2021-05-26 | Osram Gmbh | Lampada e procedimento corrispondente |
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US8052303B2 (en) * | 2006-09-12 | 2011-11-08 | Huizhou Light Engine Ltd. | Integrally formed single piece light emitting diode light wire and uses thereof |
CN105135238A (zh) * | 2008-11-19 | 2015-12-09 | 罗姆股份有限公司 | Led照明装置 |
US8177388B2 (en) * | 2010-08-05 | 2012-05-15 | Hsu Li Yen | LED tube structure capable of changing illumination direction |
EP2535640B2 (en) * | 2010-09-08 | 2020-09-23 | Zhejiang Ledison Optoelectronics Co., Ltd. | Led lamp bulb and led lighting bar capable of emitting light over 4 pi |
TW201315931A (zh) * | 2011-10-12 | 2013-04-16 | Econova Optronics Co Ltd | 照明裝置 |
US9618185B2 (en) * | 2012-03-08 | 2017-04-11 | Flextronics Ap, Llc | LED array for replacing flourescent tubes |
CN103456869B (zh) * | 2012-05-29 | 2016-12-28 | 晶元光电股份有限公司 | 发光装置、用于形成多方向出光的发光二极管芯片及其蓝宝石基板 |
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US20160131339A1 (en) | 2016-05-12 |
US9689559B2 (en) | 2017-06-27 |
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