WO2009041300A1 - 熱伝導性シート及びパワーモジュール - Google Patents

熱伝導性シート及びパワーモジュール Download PDF

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Publication number
WO2009041300A1
WO2009041300A1 PCT/JP2008/066551 JP2008066551W WO2009041300A1 WO 2009041300 A1 WO2009041300 A1 WO 2009041300A1 JP 2008066551 W JP2008066551 W JP 2008066551W WO 2009041300 A1 WO2009041300 A1 WO 2009041300A1
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WO
WIPO (PCT)
Prior art keywords
conductive sheet
heat conductive
inorganic filler
power module
secondary aggregation
Prior art date
Application number
PCT/JP2008/066551
Other languages
English (en)
French (fr)
Inventor
Kenji Mimura
Hideki Takigawa
Hiroki Shiota
Kazuhiro Tada
Takashi Nishimura
Hiromi Ito
Seiki Hiramatsu
Atsuko Fujino
Kei Yamamoto
Motoki Masaki
Original Assignee
Mitsubishi Electric Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corporation filed Critical Mitsubishi Electric Corporation
Priority to JP2009534282A priority Critical patent/JP5184543B2/ja
Priority to DE112008002566.5T priority patent/DE112008002566B4/de
Priority to US12/675,549 priority patent/US8193633B2/en
Priority to CN2008801090120A priority patent/CN101809734B/zh
Publication of WO2009041300A1 publication Critical patent/WO2009041300A1/ja

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    • H—ELECTRICITY
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
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    • H01L23/49575—Assemblies of semiconductor devices on lead frames
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    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
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Abstract

　本発明は、無機充填剤を熱硬化性樹脂中に分散してなる熱伝導性シートであって、前記無機充填剤が、１５μｍ以下の平均長径を有する鱗片状窒化ホウ素の一次粒子を等方的に凝集させて形成した二次凝集粒子を含み、且つ前記無機充填剤が、５０μｍ以上の粒径を有する前記二次凝集粒子を２０体積％より多く含むことを特徴とする熱伝導性シートである。この熱伝導性シートは、生産性やコスト面において有利であり、且つ熱伝導性及び電気絶縁性に優れている。
PCT/JP2008/066551 2007-09-26 2008-09-12 熱伝導性シート及びパワーモジュール WO2009041300A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009534282A JP5184543B2 (ja) 2007-09-26 2008-09-12 熱伝導性シート及びパワーモジュール
DE112008002566.5T DE112008002566B4 (de) 2007-09-26 2008-09-12 Wärmeleitfähige Lage und Verfahren zum Herstellen derselben, und Leistungsmodul
US12/675,549 US8193633B2 (en) 2007-09-26 2008-09-12 Heat conductive sheet and method for producing same, and powder module
CN2008801090120A CN101809734B (zh) 2007-09-26 2008-09-12 导热性片材及其制造方法和功率模块

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-248927 2007-09-26
JP2007248936 2007-09-26
JP2007248927 2007-09-26
JP2007-248936 2007-09-26

Publications (1)

Publication Number Publication Date
WO2009041300A1 true WO2009041300A1 (ja) 2009-04-02

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ID=40511187

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066551 WO2009041300A1 (ja) 2007-09-26 2008-09-12 熱伝導性シート及びパワーモジュール

Country Status (5)

Country Link
US (1) US8193633B2 (ja)
JP (1) JP5184543B2 (ja)
CN (1) CN101809734B (ja)
DE (1) DE112008002566B4 (ja)
WO (1) WO2009041300A1 (ja)

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011006586A (ja) * 2009-06-26 2011-01-13 Mitsubishi Electric Corp 熱硬化性樹脂組成物、熱伝導性樹脂シート及びその製造方法、並びにパワーモジュール
JP2011116913A (ja) * 2009-12-07 2011-06-16 Mitsubishi Electric Corp 熱硬化性樹脂組成物、熱伝導性樹脂シート及びその製造方法、並びにパワーモジュール
CN102140332A (zh) * 2010-01-29 2011-08-03 日东电工株式会社 导热性片材
CN102140331A (zh) * 2010-01-29 2011-08-03 日东电工株式会社 导热性片材
WO2011104996A1 (ja) * 2010-02-23 2011-09-01 三菱電機株式会社 熱硬化性樹脂組成物、ｂステージ熱伝導性シート及びパワーモジュール
JP2011178961A (ja) * 2010-03-03 2011-09-15 Mitsubishi Electric Corp 樹脂組成物、熱伝導性シート及びその製造方法、並びにパワーモジュール
CN102190862A (zh) * 2010-01-29 2011-09-21 日东电工株式会社 导热性片材、发光二极管安装基板和导热性粘接片材
WO2012070289A1 (ja) * 2010-11-26 2012-05-31 三菱電機株式会社 熱伝導性シート及びパワーモジュール
EP2492924A1 (en) * 2009-10-22 2012-08-29 Denki Kagaku Kogyo Kabushiki Kaisha Insulating sheet, circuit board, and process for production of insulating sheet
WO2012132926A1 (ja) * 2011-03-30 2012-10-04 日東電工株式会社 熱伝導性シートの製造方法および熱伝導性シート
JP2012253151A (ja) * 2011-06-01 2012-12-20 Toyota Industries Corp 電子機器
US20130037313A1 (en) * 2010-03-24 2013-02-14 Nhk Spring Co., Ltd. Liquid composition and metal-based circuit board
JP2013131525A (ja) * 2011-12-20 2013-07-04 Mitsubishi Electric Corp 熱伝導性シート用樹脂組成物、熱伝導性シート及びパワーモジュール
JP2014031506A (ja) * 2012-07-13 2014-02-20 Toyo Ink Sc Holdings Co Ltd 熱伝導性樹脂組成物、熱伝導部材とその製造方法、および熱伝導性接着シート
KR20140103106A (ko) * 2011-11-29 2014-08-25 미쓰비시 가가꾸 가부시키가이샤 질화붕소 응집 입자, 그 입자를 함유하는 조성물, 및 그 조성물로 이루어지는 층을 갖는 삼차원 집적 회로
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JP2021088621A (ja) * 2019-12-02 2021-06-10 信越化学工業株式会社 窒化ホウ素凝集粉を用いた熱伝導性樹脂組成物及び熱伝導性樹脂硬化物
WO2021241298A1 (ja) 2020-05-26 2021-12-02 住友ベークライト株式会社 金属板付熱伝導性シートおよび熱伝導性シートの製造方法
JP2022026651A (ja) * 2020-07-31 2022-02-10 長野県 熱伝導性樹脂組成物及びその成形物
JP7242019B2 (ja) 2020-07-31 2023-03-20 長野県 熱伝導性樹脂組成物及びその成形物

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CN101809734A (zh) 2010-08-18
US8193633B2 (en) 2012-06-05
JPWO2009041300A1 (ja) 2011-01-27
DE112008002566T5 (de) 2010-07-15
DE112008002566B4 (de) 2014-08-28

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