WO2009041137A1 - エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ、金属張積層板、及びプリント配線板 - Google Patents

エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ、金属張積層板、及びプリント配線板 Download PDF

Info

Publication number
WO2009041137A1
WO2009041137A1 PCT/JP2008/061852 JP2008061852W WO2009041137A1 WO 2009041137 A1 WO2009041137 A1 WO 2009041137A1 JP 2008061852 W JP2008061852 W JP 2008061852W WO 2009041137 A1 WO2009041137 A1 WO 2009041137A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
epoxy resin
epoxy
compound
prepreg
Prior art date
Application number
PCT/JP2008/061852
Other languages
English (en)
French (fr)
Inventor
Hiroaki Fujiwara
Masao Imai
Yuki Kitai
Original Assignee
Panasonic Electric Works Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Electric Works Co., Ltd. filed Critical Panasonic Electric Works Co., Ltd.
Priority to US12/675,856 priority Critical patent/US20100218982A1/en
Priority to CN2008801060233A priority patent/CN101796132B/zh
Priority to EP20080777703 priority patent/EP2194098B1/en
Priority to JP2009534224A priority patent/JP5335683B2/ja
Priority to KR1020107003936A priority patent/KR101144566B1/ko
Publication of WO2009041137A1 publication Critical patent/WO2009041137A1/ja
Priority to US14/831,235 priority patent/US20150359093A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/02—Halogenated hydrocarbons
    • C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C08K5/3417—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08J2371/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2471/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C08J2471/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08J2471/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08J2471/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

　本発明は、エポキシ化合物と、低分子量化されたフェノール変性ポリフェニレンエーテルと、シアネート化合物とを必須成分として含むエポキシ樹脂組成物において、難燃性を維持しながら高い耐熱性を備えることができる、誘電特性に優れたエポキシ樹脂組成物を提供することを目的とする。 　上記目的を解決する本発明のエポキシ樹脂組成物は、（Ａ）数平均分子量が１０００以下で、一分子中に少なくとも２個のエポキシ基を有するハロゲン原子を含有しないエポキシ化合物、（Ｂ）数平均分子量５０００以下のポリフェニレンエーテル、（Ｃ）シアネートエステル化合物、（Ｄ）硬化触媒、及び（Ｅ）ハロゲン系難燃剤を含有する樹脂ワニスからなる熱硬化性樹脂組成物であって、前記（Ａ）～（Ｃ）成分は何れも前記樹脂ワニス中で溶解されており、且つ、前記（Ｅ）成分が前記樹脂ワニス中で、溶解されずに分散されていることを特徴とする。
PCT/JP2008/061852 2007-09-27 2008-06-30 エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ、金属張積層板、及びプリント配線板 WO2009041137A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US12/675,856 US20100218982A1 (en) 2007-09-27 2008-06-30 Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board
CN2008801060233A CN101796132B (zh) 2007-09-27 2008-06-30 环氧树脂组合物、使用该环氧树脂组合物的半固化片、覆金属箔层压板以及印刷线路板
EP20080777703 EP2194098B1 (en) 2007-09-27 2008-06-30 Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board
JP2009534224A JP5335683B2 (ja) 2007-09-27 2008-06-30 エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ、金属張積層板、及びプリント配線板
KR1020107003936A KR101144566B1 (ko) 2007-09-27 2008-06-30 에폭시 수지 조성물, 그 에폭시 수지 조성물을 이용한 프리프레그, 금속 클래드 적층판, 및 프린트 배선판
US14/831,235 US20150359093A1 (en) 2007-09-27 2015-08-20 Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPPCT/JP2007/068873 2007-09-27
PCT/JP2007/068873 WO2009040921A1 (ja) 2007-09-27 2007-09-27 エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/675,856 A-371-Of-International US20100218982A1 (en) 2007-09-27 2008-06-30 Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board
US14/831,235 Continuation US20150359093A1 (en) 2007-09-27 2015-08-20 Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board

Publications (1)

Publication Number Publication Date
WO2009041137A1 true WO2009041137A1 (ja) 2009-04-02

Family

ID=40510834

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2007/068873 WO2009040921A1 (ja) 2007-09-27 2007-09-27 エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板
PCT/JP2008/061852 WO2009041137A1 (ja) 2007-09-27 2008-06-30 エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ、金属張積層板、及びプリント配線板

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/068873 WO2009040921A1 (ja) 2007-09-27 2007-09-27 エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板

Country Status (6)

Country Link
US (2) US20100218982A1 (ja)
EP (1) EP2194098B1 (ja)
KR (1) KR101144566B1 (ja)
CN (1) CN101796132B (ja)
TW (1) TW200914528A (ja)
WO (2) WO2009040921A1 (ja)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011052165A (ja) * 2009-09-04 2011-03-17 Panasonic Electric Works Co Ltd 樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板
JP2011074210A (ja) * 2009-09-30 2011-04-14 Panasonic Electric Works Co Ltd 樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板
JP2011225647A (ja) * 2010-04-15 2011-11-10 Kaneka Corp 難燃性付与方法、イミド難燃剤、樹脂溶液、フィルム、及び、その製造方法
JP2012092195A (ja) * 2010-10-26 2012-05-17 Panasonic Corp 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
WO2012128313A1 (ja) * 2011-03-24 2012-09-27 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び樹脂シート並びに金属箔張り積層板
US20130101863A1 (en) * 2010-04-21 2013-04-25 Mitsubishi Gas Chemical Company, Inc. Heat curable composition
JP2013187460A (ja) * 2012-03-09 2013-09-19 Sumitomo Bakelite Co Ltd 金属箔張基板製造用仮基板および金属箔張基板の製造方法
WO2013146302A1 (ja) * 2012-03-29 2013-10-03 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、樹脂シート及び金属箔張り積層板
JP2014240474A (ja) * 2013-05-17 2014-12-25 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、樹脂シート、金属箔張積層板及びプリント配線板
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
WO2016155263A1 (zh) * 2015-04-01 2016-10-06 广东生益科技股份有限公司 一种活性酯以及含有该活性酯的热固性树脂组合物、预浸料和层压板
JP2016540851A (ja) * 2013-11-26 2016-12-28 ドゥーサン コーポレイション 耐熱性及び低誘電損失特性を有する熱硬化性樹脂組成物、これを用いたプリプレグ及び銅張積層板
JP2017025228A (ja) * 2015-07-24 2017-02-02 三菱瓦斯化学株式会社 プリプレグ
US9567481B2 (en) 2013-02-12 2017-02-14 Panasonic Intellectual Property Management Co., Ltd. Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board
JP2017047648A (ja) * 2015-09-04 2017-03-09 三菱瓦斯化学株式会社 銅張積層板
JP2017141314A (ja) * 2016-02-08 2017-08-17 三菱瓦斯化学株式会社 プリプレグ
JP2017157787A (ja) * 2016-03-04 2017-09-07 三菱瓦斯化学株式会社 多層基板
KR20230124715A (ko) 2020-12-28 2023-08-25 니끼 쇼꾸바이 카세이 가부시키가이샤 중공 입자 및 그 제조 방법, 그리고 수지 조성물
KR20230161426A (ko) 2021-03-31 2023-11-27 니끼 쇼꾸바이 카세이 가부시키가이샤 분체 및 그 제조 방법, 그리고 수지 조성물의 제조 방법
KR20230164008A (ko) 2021-03-31 2023-12-01 니끼 쇼꾸바이 카세이 가부시키가이샤 분체 및 그 제조 방법, 그리고 수지 조성물의 제조 방법

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110244183A1 (en) * 2008-09-24 2011-10-06 Sekisui Chemical Co., Ltd. Resin composition, cured body and multilayer body
US8698003B2 (en) 2008-12-02 2014-04-15 Panasonic Corporation Method of producing circuit board, and circuit board obtained using the manufacturing method
US9082438B2 (en) 2008-12-02 2015-07-14 Panasonic Corporation Three-dimensional structure for wiring formation
EP2440995A4 (en) * 2009-06-12 2013-04-17 Diebold Inc BANKING SYSTEM OPERATING IN RESPONSE TO DATA RELEASED FROM DATA SUPPORT RECORDINGS
WO2011052211A1 (ja) 2009-10-30 2011-05-05 パナソニック電工株式会社 回路基板及び回路基板に部品が実装された半導体装置
US9332642B2 (en) 2009-10-30 2016-05-03 Panasonic Corporation Circuit board
KR101906687B1 (ko) * 2010-03-08 2018-12-05 아지노모토 가부시키가이샤 트렌치형 회로 기판의 제조방법
CN102181143B (zh) * 2011-04-08 2012-10-31 苏州生益科技有限公司 一种高频用热固性树脂组合物、半固化片及层压板
CN102206399B (zh) * 2011-04-15 2013-01-02 广东生益科技股份有限公司 低介电常数的覆铜箔层压板用组合物及使用其制作的覆铜箔层压板
CN102585437A (zh) * 2011-12-27 2012-07-18 广东生益科技股份有限公司 高耐热环氧树脂组合物以及使用其制作的粘结片与覆铜箔层压板
WO2013097133A1 (zh) * 2011-12-29 2013-07-04 广东生益科技股份有限公司 热固性树脂组合物以及用其制作的预浸料与印刷电路板用层压板
WO2014197458A1 (en) 2013-06-03 2014-12-11 Polyone Corporation Low molecular weight polyphenylene ether prepared without solvents
DE102014101413A1 (de) 2014-02-05 2015-08-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Chemisch Abbaubares Epoxidharzsystem
CN105623238B (zh) 2014-11-06 2018-07-27 江苏雅克科技股份有限公司 含磷官能化聚(亚芳基醚)及以其为原料制备组合物
WO2016074289A1 (zh) * 2014-11-11 2016-05-19 广东生益科技股份有限公司 一种热固性树脂组合物及用其制作的预浸料与层压板
KR101915918B1 (ko) 2014-11-11 2018-11-06 셍기 테크놀로지 코. 엘티디. 열경화성 수지 조성물 및 이로 제조한 프리프레그와 적층판
CN104744687B (zh) * 2015-04-16 2017-12-12 腾辉电子（苏州）有限公司 一种低分子量聚苯醚的制备方法
JP6623640B2 (ja) * 2015-09-18 2019-12-25 三菱瓦斯化学株式会社 プリプレグ
JP7082454B2 (ja) * 2015-10-16 2022-06-08 三菱瓦斯化学株式会社 プリプレグ、積層体及びプリント配線基板
CN105440586B (zh) * 2015-12-18 2018-02-09 宏昌电子材料股份有限公司 一种介电特性优良的改性环氧树脂组合物及其应用
JP6631834B2 (ja) * 2016-01-26 2020-01-15 パナソニックＩｐマネジメント株式会社 金属張積層板、樹脂付き金属部材、及び配線板
JP7102093B2 (ja) * 2016-09-28 2022-07-19 味の素株式会社 樹脂組成物、樹脂シート、回路基板及び半導体チップパッケージ
CN106700475B (zh) 2016-12-28 2019-03-19 广东生益科技股份有限公司 一种阻燃的聚苯醚树脂组合物
CN106750260B (zh) * 2016-12-29 2019-09-13 广东生益科技股份有限公司 一种改性聚苯醚树脂及其应用
WO2018164833A1 (en) 2017-03-07 2018-09-13 Icl-Ip America Inc. Non-migratory, high-melting/softening polymeric phosphorus-containing flame retardant for printed wiring boards
TWI627205B (zh) * 2017-03-08 2018-06-21 國立中興大學 固化物及其製備方法
JP7316570B2 (ja) * 2017-09-29 2023-07-28 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板、及び配線板
US20190127576A1 (en) * 2017-10-27 2019-05-02 Frx Polymers, Inc. Phosphonate based halogen-free compositions for printed circuit board applications
WO2019150774A1 (ja) * 2018-01-31 2019-08-08 三洋電機株式会社 電池パック
JP7445830B2 (ja) 2018-10-05 2024-03-08 パナソニックＩｐマネジメント株式会社 銅張積層板、配線板、及び樹脂付き銅箔
KR20210075982A (ko) * 2018-10-12 2021-06-23 혼슈우 카가쿠고교 가부시키가이샤 에폭시 수지 조성물
JP6967674B2 (ja) * 2019-08-06 2021-11-17 昭和電工株式会社 プライマー付き熱可塑性樹脂材及び樹脂−樹脂接合体
CN115091828A (zh) * 2022-06-30 2022-09-23 江苏耀鸿电子有限公司 一种高耐蚀高韧性的ppo树脂基覆铜板及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08245871A (ja) * 1995-03-08 1996-09-24 Asahi Chem Ind Co Ltd 硬化性ポリフェニレンエーテル系樹脂組成物
JPH10265669A (ja) * 1997-03-25 1998-10-06 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPH10279781A (ja) * 1997-04-01 1998-10-20 Matsushita Electric Works Ltd エポキシ樹脂組成物
JP2003224367A (ja) * 2002-01-29 2003-08-08 Hitachi Chem Co Ltd 高周波用プリント配線板およびその製造方法
WO2004029127A1 (ja) * 2002-09-30 2004-04-08 Hitachi Chemical Co., Ltd. 印刷配線板用樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4320038A (en) * 1979-04-25 1982-03-16 Union Carbide Corporation Flame retardant composition based on an alkylene-alkyl acrylate copolymer, coated talc filler and a non-polar flame retardant
US4522957A (en) * 1982-09-03 1985-06-11 A. Schulman, Inc. Process for preparing curable polyolefin polymers
DE3342414A1 (de) * 1983-11-24 1985-06-05 Bayer Ag, 5090 Leverkusen Neue flammschutzmittelkombinationen und ihre verwendung in thermoplastischen formmassen aus polycarbonaten und abs-polymerisaten
US5127158A (en) * 1989-09-06 1992-07-07 Idemitsu Kosan Co., Ltd. Process for producing a printed circuit board with a syndiotactic polystyrene support
US5409996A (en) * 1993-02-23 1995-04-25 Japan Synthetic Rubber Co., Ltd. Thermoplastic resin composition
US5401787A (en) * 1994-05-04 1995-03-28 Quantum Chemical Corporation Flame retardant insulation compositions
US5834565A (en) * 1996-11-12 1998-11-10 General Electric Company Curable polyphenylene ether-thermosetting resin composition and process
TW550278B (en) * 1996-11-12 2003-09-01 Gen Electric A curable polyphenylene ether-thermosetting resin composition
IL125240A (en) * 1997-07-07 2001-01-28 Hitachi Chemical Co Ltd Brominated 1,3-dimethyl-3-phenyl-1-(2-methyl-2-phenylpropyl)-indane and method for preparing the same
US6455784B1 (en) * 1999-10-27 2002-09-24 Asahi Kasei Kabushiki Kaisha Curable sheet for circuit transfer
JP2001261791A (ja) * 2000-03-23 2001-09-26 Matsushita Electric Works Ltd エポキシ樹脂組成物、プリプレグ及び積層板
CN1255474C (zh) * 2001-05-08 2006-05-10 东洋纺织株式会社 聚酰胺系包覆成形体
JP2005523976A (ja) * 2002-04-26 2005-08-11 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー プリント回路基板および集積回路チップパッケージ用低損失誘電材料
JP2004059643A (ja) * 2002-07-25 2004-02-26 Mitsubishi Gas Chem Co Inc プリプレグ及び積層板
US7413791B2 (en) * 2003-01-28 2008-08-19 Matsushita Electric Works, Ltd. Poly (phenylene ether) resin composition, prepreg, and laminated sheet
JP4576794B2 (ja) * 2003-02-18 2010-11-10 日立化成工業株式会社 絶縁樹脂組成物及びその使用
US7271206B2 (en) * 2003-12-23 2007-09-18 Industrial Technology Research Institute Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof
JP4093216B2 (ja) * 2004-08-24 2008-06-04 松下電工株式会社 プリプレグ、及びプリプレグの製造方法
WO2007075769A1 (en) * 2005-12-22 2007-07-05 Dow Global Technologies Inc. A curable epoxy resin composition and laminates made therefrom
TWI441866B (zh) * 2006-02-17 2014-06-21 Hitachi Chemical Co Ltd A thermosetting resin composition of a semi-IPN type composite and a varnish, a prepreg and a metal laminate
KR101019738B1 (ko) * 2006-02-24 2011-03-08 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 수지 조성물, 프리프레그 및 금속-호일-클래드 라미네이트
US20080039595A1 (en) * 2006-06-07 2008-02-14 Joseph Gan Oligomeric halogenated chain extenders for preparing epoxy resins
JP5104507B2 (ja) * 2007-04-26 2012-12-19 日立化成工業株式会社 セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板
US8178611B2 (en) * 2007-05-31 2012-05-15 Sanc Salaam Corporation Polymer composition
US8069559B2 (en) * 2007-08-24 2011-12-06 World Properties, Inc. Method of assembling an insulated metal substrate
WO2009034023A2 (en) * 2007-09-13 2009-03-19 Basf Se Flame retardant combinations of hydroxyalkyl phosphine oxides with 1,3,5-triazines and epoxides
JP2009071233A (ja) * 2007-09-18 2009-04-02 Nitto Denko Corp 太陽電池パネル用シール材および太陽電池モジュール
US8318292B2 (en) * 2008-03-26 2012-11-27 Sumitomo Bakelite Co., Ltd. Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device
EP2113534B8 (en) * 2008-04-01 2011-09-21 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg and metal-foil-clad laminate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08245871A (ja) * 1995-03-08 1996-09-24 Asahi Chem Ind Co Ltd 硬化性ポリフェニレンエーテル系樹脂組成物
JPH10265669A (ja) * 1997-03-25 1998-10-06 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPH10279781A (ja) * 1997-04-01 1998-10-20 Matsushita Electric Works Ltd エポキシ樹脂組成物
JP2003224367A (ja) * 2002-01-29 2003-08-08 Hitachi Chem Co Ltd 高周波用プリント配線板およびその製造方法
WO2004029127A1 (ja) * 2002-09-30 2004-04-08 Hitachi Chemical Co., Ltd. 印刷配線板用樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011052165A (ja) * 2009-09-04 2011-03-17 Panasonic Electric Works Co Ltd 樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板
JP2011074210A (ja) * 2009-09-30 2011-04-14 Panasonic Electric Works Co Ltd 樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板
JP2011225647A (ja) * 2010-04-15 2011-11-10 Kaneka Corp 難燃性付与方法、イミド難燃剤、樹脂溶液、フィルム、及び、その製造方法
US20130101863A1 (en) * 2010-04-21 2013-04-25 Mitsubishi Gas Chemical Company, Inc. Heat curable composition
JP2012092195A (ja) * 2010-10-26 2012-05-17 Panasonic Corp 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
WO2012128313A1 (ja) * 2011-03-24 2012-09-27 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び樹脂シート並びに金属箔張り積層板
US9318402B2 (en) 2011-03-24 2016-04-19 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg and resin sheet and metal foil-clad laminate
JP5846396B2 (ja) * 2011-03-24 2016-01-20 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び樹脂シート並びに金属箔張り積層板
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
JP2013187460A (ja) * 2012-03-09 2013-09-19 Sumitomo Bakelite Co Ltd 金属箔張基板製造用仮基板および金属箔張基板の製造方法
KR101971757B1 (ko) 2012-03-29 2019-08-13 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 수지 시트 및 금속박 피복 적층판
US9394439B2 (en) 2012-03-29 2016-07-19 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, resin sheet, and metal foil-clad laminate
WO2013146302A1 (ja) * 2012-03-29 2013-10-03 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、樹脂シート及び金属箔張り積層板
JPWO2013146302A1 (ja) * 2012-03-29 2015-12-10 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、樹脂シート及び金属箔張り積層板
KR20140146589A (ko) * 2012-03-29 2014-12-26 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 수지 시트 및 금속박 피복 적층판
US9567481B2 (en) 2013-02-12 2017-02-14 Panasonic Intellectual Property Management Co., Ltd. Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board
JP2014240474A (ja) * 2013-05-17 2014-12-25 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、樹脂シート、金属箔張積層板及びプリント配線板
JP2016540851A (ja) * 2013-11-26 2016-12-28 ドゥーサン コーポレイション 耐熱性及び低誘電損失特性を有する熱硬化性樹脂組成物、これを用いたプリプレグ及び銅張積層板
WO2016155263A1 (zh) * 2015-04-01 2016-10-06 广东生益科技股份有限公司 一种活性酯以及含有该活性酯的热固性树脂组合物、预浸料和层压板
JP2017025228A (ja) * 2015-07-24 2017-02-02 三菱瓦斯化学株式会社 プリプレグ
JP2017047648A (ja) * 2015-09-04 2017-03-09 三菱瓦斯化学株式会社 銅張積層板
JP2017141314A (ja) * 2016-02-08 2017-08-17 三菱瓦斯化学株式会社 プリプレグ
JP2017157787A (ja) * 2016-03-04 2017-09-07 三菱瓦斯化学株式会社 多層基板
KR20230124715A (ko) 2020-12-28 2023-08-25 니끼 쇼꾸바이 카세이 가부시키가이샤 중공 입자 및 그 제조 방법, 그리고 수지 조성물
KR20230161426A (ko) 2021-03-31 2023-11-27 니끼 쇼꾸바이 카세이 가부시키가이샤 분체 및 그 제조 방법, 그리고 수지 조성물의 제조 방법
KR20230164008A (ko) 2021-03-31 2023-12-01 니끼 쇼꾸바이 카세이 가부시키가이샤 분체 및 그 제조 방법, 그리고 수지 조성물의 제조 방법

Also Published As

Publication number Publication date
EP2194098B1 (en) 2012-08-15
US20150359093A1 (en) 2015-12-10
EP2194098A1 (en) 2010-06-09
KR20100044231A (ko) 2010-04-29
CN101796132A (zh) 2010-08-04
TWI371466B (ja) 2012-09-01
US20100218982A1 (en) 2010-09-02
WO2009040921A1 (ja) 2009-04-02
TW200914528A (en) 2009-04-01
CN101796132B (zh) 2012-07-04
KR101144566B1 (ko) 2012-05-11
EP2194098A4 (en) 2011-05-11

Similar Documents

Publication Publication Date Title
WO2009041137A1 (ja) エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ、金属張積層板、及びプリント配線板
EP3037479B1 (en) Halogen-free resin composition and use thereof
EP3053963B1 (en) Halogen-free resin composition and uses thereof
TW200504146A (en) Resin composition for interlayer insulation of multilayer printed circuit board, adhesive film and prepreg
TW200617053A (en) Epoxy resin composition for prepreg, prepreg, and multilayered printed wiring board
ATE549378T1 (de) Halogenfreie flammenhemmende harzzusammensetzung und prepreg, laminat und laminat für leiterplatte daraus
MY150705A (en) Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board
EP2896653B1 (en) Epoxy resin composition, and, prepreg and copper clad laminate manufactured using the composition
CN107793702B (zh) 一种树脂组合物及其制作的胶膜、覆盖膜
TW200635985A (en) Modified phenolic resin and its manufacturing method, epoxy resin composition containing the same, and prepreg impregnated with the composition
EP2896654B1 (en) Epoxy resin compound, and, prepreg and copper-clad laminate manufactured using the compound
EP2933293A1 (en) Halogen-free flame-retardant resin composition and use thereof
CN108893090B (zh) 树脂组合物及其制作的胶膜、覆盖膜
TW200736292A (en) Epoxy resin composition
EP2952535A1 (en) Halogen-free resin composition, and prepreg and laminate for printed circuits using same
EP3040358A1 (en) Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the same
KR20140086517A (ko) 프리프레그, 이의 제조방법 및 이를 이용한 동박 적층판
JP2013045806A (ja) プリプレグ及びプリント配線板
TWI596155B (zh) Halogen-free thermosetting resin composition and prepreg and printed circuit laminate using the same
JP4852292B2 (ja) 銅張り積層板
JP5028971B2 (ja) （変性）グアナミン化合物溶液、熱硬化性樹脂組成物並びに、これを用いたプリプレグ及び積層板
JP6575151B2 (ja) 熱硬化性樹脂組成物、並びにそれを用いたプリプレグ、積層板及びプリント配線板
EP3156451B1 (en) Halogen-free resin composition, and prepreg and laminated board for printed circuit using same
TW201835212A (zh) 無鹵熱固性樹脂組合物及使用它的預浸料、層壓板、覆金屬箔層壓板和印刷電路板
JP5909693B2 (ja) 高耐熱性エポキシ樹脂組成物、プリプレグ、金属張積層板およびプリント配線板

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880106023.3

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08777703

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20107003936

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12675856

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 2008777703

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2009534224

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE