ATE549378T1 - Halogenfreie flammenhemmende harzzusammensetzung und prepreg, laminat und laminat für leiterplatte daraus - Google Patents

Halogenfreie flammenhemmende harzzusammensetzung und prepreg, laminat und laminat für leiterplatte daraus

Info

Publication number
ATE549378T1
ATE549378T1 AT10173740T AT10173740T ATE549378T1 AT E549378 T1 ATE549378 T1 AT E549378T1 AT 10173740 T AT10173740 T AT 10173740T AT 10173740 T AT10173740 T AT 10173740T AT E549378 T1 ATE549378 T1 AT E549378T1
Authority
AT
Austria
Prior art keywords
laminate
halogen
resin composition
flame retardant
retardant resin
Prior art date
Application number
AT10173740T
Other languages
English (en)
Inventor
Yueshan He
Tao Cheng
Shiguo Su
Biwu Wang
Jie Li
Original Assignee
Guangdong Shengyi Sci Tech Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Shengyi Sci Tech Co filed Critical Guangdong Shengyi Sci Tech Co
Application granted granted Critical
Publication of ATE549378T1 publication Critical patent/ATE549378T1/de

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/357—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/5399—Phosphorus bound to nitrogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2385/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon; Derivatives of such polymers
    • C08J2385/02—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon; Derivatives of such polymers containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
AT10173740T 2009-08-24 2010-08-23 Halogenfreie flammenhemmende harzzusammensetzung und prepreg, laminat und laminat für leiterplatte daraus ATE549378T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009101897282A CN101643570B (zh) 2009-08-24 2009-08-24 无卤阻燃型树脂组合物及用其制成的预浸料、层压板与印制电路用层压板

Publications (1)

Publication Number Publication Date
ATE549378T1 true ATE549378T1 (de) 2012-03-15

Family

ID=41655639

Family Applications (1)

Application Number Title Priority Date Filing Date
AT10173740T ATE549378T1 (de) 2009-08-24 2010-08-23 Halogenfreie flammenhemmende harzzusammensetzung und prepreg, laminat und laminat für leiterplatte daraus

Country Status (5)

Country Link
US (1) US8445605B2 (de)
EP (1) EP2290009B1 (de)
CN (1) CN101643570B (de)
AT (1) ATE549378T1 (de)
ES (1) ES2383507T3 (de)

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CN101643570B (zh) 2009-08-24 2011-08-10 广东生益科技股份有限公司 无卤阻燃型树脂组合物及用其制成的预浸料、层压板与印制电路用层压板
CN101691449B (zh) 2009-09-04 2011-05-18 广东生益科技股份有限公司 提高苯氧基磷腈化合物阻燃效率的方法及其制成的预浸料、层压板与印制电路用层压板
TWI400292B (zh) * 2010-06-14 2013-07-01 Nanya Plastics Corp Used in glass fiber laminates high glass transition temperature resin varnish composition
JP6157121B2 (ja) 2010-08-31 2017-07-05 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、および積層板
TWI409289B (zh) * 2010-09-02 2013-09-21 Taiwan Union Technology Corp 由氮氧雜環化合物所製得之聚合物之穩態溶液及其製法與用途
CN102399365B (zh) * 2010-09-08 2013-06-12 台燿科技股份有限公司 由氮氧杂环化合物所制得的聚合物的稳态溶液及该稳态溶液的制法与用途
CN102453226A (zh) * 2010-11-01 2012-05-16 台燿科技股份有限公司 树脂组合物及由其制成的预浸材与印刷电路板
CN102134376B (zh) * 2010-12-29 2012-12-05 四川东材科技集团股份有限公司 无卤阻燃树脂组合物及用于制备预浸料、层压板的方法
CN102775728B (zh) * 2011-05-11 2016-01-20 台燿科技股份有限公司 树脂组合物及由其制成的半固化片与印刷电路板
CN102153837B (zh) * 2011-05-26 2012-09-05 上海梅思泰克生态科技有限公司 高性能耐高温改性环氧树脂
EP2752449B1 (de) * 2011-09-02 2019-07-03 Shengyi Technology Co., Ltd Halogenfreie harzzusammensetzung und verfahren zur herstellung eines kupferkaschierten laminats damit
CN102433001A (zh) * 2011-09-13 2012-05-02 华烁科技股份有限公司 一种无卤阻燃材料组合物及其在粘结片、覆铜板和层压板中的应用
CN102504483A (zh) * 2011-10-10 2012-06-20 咸阳康隆工贸有限公司 一种环保型低温固化环氧粉末包封料
KR101582430B1 (ko) * 2011-10-18 2016-01-04 셍기 테크놀로지 코. 엘티디. 할로겐 미함유 저-유전성 수지 조성물, 및 이를 이용하여 제조된 프리프레그 및 구리 포일 적층체
CN102649867B (zh) * 2011-12-26 2014-07-23 无锡宏仁电子材料科技有限公司 配制覆铜箔基板用混合胶液的配料工序
CN102975430B (zh) * 2012-11-27 2016-03-23 上海南亚覆铜箔板有限公司 一种涂覆含磷无卤素的固形物的阻燃性覆铜箔板及其制备方法
CN102964777B (zh) * 2012-11-27 2015-05-27 上海南亚覆铜箔板有限公司 一种含磷无卤素的阻燃性树脂粘合剂,其制备方法和用途
CN103013046B (zh) 2012-12-13 2014-07-16 广东生益科技股份有限公司 一种无卤阻燃树脂组合物及其用途
CN103554437B (zh) * 2013-09-04 2016-08-17 东莞联茂电子科技有限公司 一种ic封装用无卤环氧树脂组合物
CN103724997B (zh) * 2013-12-31 2016-01-06 福建新世纪电子材料有限公司 一种无卤低吸水热固性阻燃树脂组合物及应用
KR101769264B1 (ko) 2014-06-10 2017-08-17 셍기 테크놀로지 코. 엘티디. 무할로겐 수지 조성물 및 이를 사용하는 프리프레그와 인쇄 회로용 적층판
CN105802128B (zh) * 2014-12-29 2018-05-04 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板
CN104804377B (zh) * 2015-01-28 2017-05-24 广东生益科技股份有限公司 一种无卤树脂组合物及用其制作的预浸料和层压板
CN105131283B (zh) * 2015-10-14 2017-08-11 四川东材科技集团股份有限公司 环三磷腈型苯并噁嗪树脂及其制备方法和环三磷腈型苯并噁嗪树脂组合物
CN105112001B (zh) * 2015-10-14 2017-09-12 四川东材科技集团股份有限公司 一种环三磷腈型苯并噁嗪树脂层压板及其制备方法
CN106832764A (zh) * 2015-12-04 2017-06-13 广东生益科技股份有限公司 一种无卤环氧树脂组合物以及含有它的预浸料、层压板和印制电路板
CN107227001B (zh) 2016-03-25 2019-06-14 广东生益科技股份有限公司 一种无卤热固性树脂组合物以及含有它的预浸料、层压板和印制电路板
CN107254142A (zh) * 2016-07-21 2017-10-17 广东广山新材料股份有限公司 一种阻燃树脂组合物、热固性树脂组合物、复合金属基板及阻燃电子材料
CN106189094B (zh) * 2016-08-03 2018-12-14 广东广山新材料股份有限公司 一种含有磷腈阻燃剂的碳纤维复合材料及其制备方法
CN106189093B (zh) * 2016-08-03 2018-12-14 广东广山新材料股份有限公司 一种含有磷腈阻燃剂的碳纤维增强聚酰胺复合材料及其制备方法
CN106046688B (zh) * 2016-08-03 2019-03-26 广东广山新材料股份有限公司 一种含有磷腈阻燃剂的碳纤维增强树脂复合材料及其制备方法
CN109467679B (zh) * 2017-09-08 2023-03-07 衡所华威电子有限公司 一种环氧模塑料的制备方法
CN113121957B (zh) * 2019-12-31 2023-05-02 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料、层压板及印制电路板

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Also Published As

Publication number Publication date
CN101643570A (zh) 2010-02-10
US8445605B2 (en) 2013-05-21
EP2290009A1 (de) 2011-03-02
ES2383507T3 (es) 2012-06-21
US20110045303A1 (en) 2011-02-24
CN101643570B (zh) 2011-08-10
EP2290009B1 (de) 2012-03-14

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