CN101796132A - 环氧树脂组合物、使用该环氧树脂组合物的半固化片、覆金属箔层压板以及印刷线路板 - Google Patents
环氧树脂组合物、使用该环氧树脂组合物的半固化片、覆金属箔层压板以及印刷线路板 Download PDFInfo
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- CN101796132A CN101796132A CN200880106023A CN200880106023A CN101796132A CN 101796132 A CN101796132 A CN 101796132A CN 200880106023 A CN200880106023 A CN 200880106023A CN 200880106023 A CN200880106023 A CN 200880106023A CN 101796132 A CN101796132 A CN 101796132A
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- epoxy resin
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- composition epoxy
- flame retardant
- resin composition
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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Abstract
本发明的目的在于提供一种环氧树脂组合物,该环氧树脂组合物作为必须成分含有:环氧化合物;经过低分子量化的苯酚改性聚苯醚;以及氰酸化合物,该环氧树脂组合物具备优异的介电特性,而且能够维持阻燃性并具有高耐热性。为了实现上述目的,本发明的环氧树脂组合物是包含树脂清漆的热固性树脂组合物,所述树脂清漆含有:数均分子量为1000以下且在各分子中具有至少两个环氧基的不含卤素原子的环氧化合物(A);数均分子量为5000以下的聚苯醚(B);氰酸酯化合物(C);硬化催化剂(D);以及卤素系阻燃剂(E);其中,所述(A)成分至(C)成分均溶解于所述树脂清漆中,并且所述(E)成分不溶解而分散于所述树脂清漆中。
Description
技术领域
本发明涉及一种可作为印刷线路板(printed wiring board)的绝缘材料而优选使用的环氧树脂组合物。更具体而言,本发明涉及一种为了制造耐热性优异的印刷线路板而优选使用的环氧树脂组合物、使用该环氧树脂组合物的半固化片(prepreg)、覆金属箔层压板(metal-clad laminate)以及印刷线路板。
背景技术
近年来,在信息通讯领域所使用的电子设备中,信号的大容量化和高速化不断发展。因此,要求高频特性良好且可应对用以增加布线数的高多层化的印刷线路板。
对于这种电子设备中所使用的印刷线路板,为了维持从MHz频带到GHz频带的高频域的可靠性,从而要求低介电常数(ε)以及低介质损耗因数(tanδ)。以往,作为具有这种电气特性的印刷线路板已知有:在其绝缘层中使用通过将聚苯醚(PPE)调配到环氧树脂中而制得的热固性树脂组合物的印刷线路板。这种热固性树脂组合物显示出比通常的环氧树脂组合物优异的介电特性。然而,与作为其它昂贵的高频基板用材料的PTFE等含氟树脂、BT树脂、或者聚酰亚胺树脂等相比较,仍然存在耐热性低的问题。
为了改良这种耐热性低下的性质,在下述专利文献1和专利文献2中公开了一种环氧树脂组合物,该环氧树脂组合物作为必须成分含有:特定的环氧化合物;经过低分子量化的苯酚改性聚苯醚;以及氰酸化合物。这种环氧树脂组合物具备高耐热性,亦具有优异的介电特性。
另外,对于印刷线路板的绝缘层中所使用的环氧树脂组合物,除了如上所述的介电特性和耐热性以外,还要求较高的阻燃性。为了对这种环氧树脂组合物赋予阻燃性,广泛采用如下方法:调配指定量的经过溴化的环氧化合物作为环氧树脂成分(例如专利文献1至4、)。
然而,如上所述的作为必须成分含有:环氧化合物;低分子量的苯酚改性聚苯醚;以及氰酸化合物的环氧树脂组合物,虽然介电特性优异,但与其它高频基板用材料相比,耐热性仍不充分。
专利文献1:日本专利公开公报特开平10-265669号
专利文献2:日本专利公开公报特开2000-7763号
专利文献3:日本专利公开公报特开平9-227659号
专利文献4:日本专利公开公报特开平11-302529号
发明内容
本发明的目的在于提供一种环氧树脂组合物,该环氧树脂组合物作为必须成分含有:环氧化合物;经过低分子量化的苯酚改性聚苯醚;以及氰酸化合物,该环氧树脂组合物具备优异的介电特性,而且能够维持阻燃性并具有高耐热性。
为了实现上述目的,本发明一方面涉及环氧树脂组合物,该环氧树脂组合物是包含树脂清漆的热固性树脂组合物,所述树脂清漆含有:数均分子量为1000以下且在各分子中具有至少两个环氧基的不含卤素原子的环氧化合物(A);数均分子量为5000以下的聚苯醚(B);氰酸酯化合物(C);硬化催化剂(D);以及卤素系阻燃剂(E);其中,所述(A)成分至(C)成分均溶解于所述树脂清漆中,并且所述(E)成分不溶解而分散于所述树脂清漆中。
通过以下详细说明使本发明的目的、特征、样态以及优点更加明确。
具体实施方式
本发明人针对含有:环氧化合物;经过低分子量化的苯酚改性聚苯醚;以及氰酸化合物作为必须成分的环氧树脂组合物,进行了用以改良耐热性的研究,结果发现:在同时使用为实现环氧树脂组合物的阻燃化而通常使用的溴化环氧化合物和氰酸化合物时,引起耐热性降低;反之,在不使用溴化环氧化合物时,耐热性则大幅度地提高。从而进一步展开了研究,结果得出能够推想如下现象所进行的几点知识:以实现环氧树脂组合物的阻燃化为目的,在使用如溴化环氧化合物之类的卤化环氧化合物或者通常的卤素系阻燃剂时,在高温时由于卤素脱离而生成卤离子(或者卤素自由基),该脱离的卤素使硬化物分解。另外,以维持硬化物的耐热性为目的进行了努力研究,结果得出如下知识:在树脂清漆中使用不溶解而分散的卤素系阻燃剂时,能够不降低耐热性而赋予阻燃性。根据如上知识来完成了本发明。
以下,对本发明的实施方式进行详细说明。
在本实施方式中,对于数均分子量为1000以下且在各分子中具有至少两个环氧基的不含卤素原子的环氧化合物(A)的种类并无特别限定。作为其具体例子,例如有二环戊二烯型环氧化合物(dicyclopentadiene epoxy compounds)、双酚A型环氧化合物(bisphenol A epoxy compounds)、双酚F型环氧化合物(bisphenol F epoxy compounds)、酚醛型环氧化合物(phenolic novolac epoxy compounds)、萘型环氧化合物、联苯型环氧化合物(biphenyl epoxy compounds)等。这些化合物可单独使用,也可两种以上组合使用。在这些化合物中,从与聚苯醚的相溶性良好的观点出发,优选使用二环戊二烯型环氧化合物、双酚F型环氧化合物、双酚A型环氧化合物或联苯型环氧化合物。另外,热固性树脂组合物优选不含有卤化环氧化合物,但也可以在不损及本发明效果的范围内根据需要进行添加。
从可维持充分的耐热性和优异的机械特性以及电气特性的观点出发,本实施方式的环氧树脂组合物中的环氧化合物(A)的配比,相对于(A)成分至(C)成分的合计量优选为20质量%至60质量%,更优选为30质量%至50质量%。
在本实施方式中,数均分子量为5000以下的聚苯醚(B)可通过聚合反应而获得,也可通过在酚系化合物和自由基引发剂存在下在甲苯等溶剂中对高分子量(具体而言,数均分子量约为10000至30000)的PPE进行加热使其再分配反应而获得。
再说,由于通过上述再分配反应获得的聚苯醚在分子链的两个末端具有有助于硬化的来自酚系化合物的羟基,因此从进一步维持高耐热性的观点出发,聚苯醚优选为通过上述再分配反应获得的聚苯醚。另外,从显示出优异的流动性的观点出发,聚苯醚优选为通过聚合获得的聚苯醚。
聚苯醚(B)的数均分子量为5000以下,优选为2000至4000。当所述数均分子量超过5000时,流动性变差,并且与环氧基的反应性也降低,硬化反应需要很长时间,且未渗入到硬化体系的未反应物质增多而造成玻璃转化温度降低,不能充分改善耐热性。
在所述再分配反应中,可以通过调整所使用的酚系化合物的调配量来调节聚苯醚(B)的分子量。即,酚系化合物的调配量越多,聚苯醚(B)的分子量越低。
作为提供给所述再分配反应的高分子量PPE,可使用市售品等公知的化合物,其具体例子有聚(2,6-二甲基-1,4-苯醚)。而且,对于所述再分配反应中所使用的酚系化合物并无特别限定,优选使用例如双酚A、酚醛、甲酚醛(cresol novolac)等的、在分子内具有两个以上酚性羟基的多官能酚系化合物。这些化合物可单独使用,也可两种以上组合使用。
从可充分赋予优异的介电特性的观点出发,本实施方式的环氧树脂组合物中的聚苯醚(B)的配比相对于(A)成分至(C)成分的合计量优选为20质量%至60质量%,更优选为20质量%至40质量%。
在本实施方式中,作为氰酸酯化合物(C),若是在分子中具有两个以上氰酸基的化合物则可无特别限定地使用。其具体例子例如有2,2-双(4-氰酸苯基)丙烷、双(3,5-二甲基-4-氰酸苯基)甲烷、2,2-双(4-氰酸苯基)乙烷等或者其衍生物等的芳香族系氰酸酯化合物等。这些化合物可单独使用,也可两种以上组合使用。
氰酸酯化合物(C)作为用于形成环氧树脂的环氧化合物的硬化剂而发挥作用,是形成刚性骨架(rigid framework)的成分。因此可引起较高的玻璃态转变温度(glasstransition temperature,Tg)。而且,由于粘度低,因此可维持所获得的树脂清漆的高流动性。
另外,氰酸酯化合物(C)在硬化催化剂(D)的存在下,氰酸酯化合物之间也进行自聚。该自聚反应通过氰酸基之间进行反应形成三嗪环从而推进聚合反应。这种自聚反应也有助于提高耐热性。
从充分获得耐热性、并且对于基材的含浸性优异、即使在树脂清漆中也难以析出结晶的观点出发,本实施方式的环氧树脂组合物中的氰酸酯化合物(C)的配比相对于(A)成分至(C)成分的合计量优选为20质量%至60质量%,更优选为20质量%至40质量%。
在本实施方式中,硬化催化剂(D)是促进环氧化合物(A)以及聚苯醚(B)与作为硬化剂的氰酸酯化合物(C)反应的催化剂,具体而言,例如有:如辛酸、硬脂酸、乙酰丙酮、环烷酸、水杨酸等有机酸和Zn、Cu、Fe等的有机金属盐;三乙胺、三乙醇胺等叔胺;2-乙基-4-咪唑、4-甲基咪唑等咪唑类;等等。这些催化剂可单独使用,也可两种以上组合使用。这些催化剂中,从获得更高耐热性的观点出发,优选使用有机金属盐、特别优选辛酸锌。
对于硬化催化剂(D)的配比并无特别限定,例如在使用有机金属盐时,优选相对于所述(A)成分至(C)成分的合计量100质量份为0.005质量份至5质量份左右;在使用咪唑类时,优选相对于所述(A)成分至(C)成分的合计量100质量份为0.01质量份至5质量份左右。
在本实施方式中,作为卤素系阻燃剂(E),如果是不溶解于由甲苯等溶剂调制的清漆中的卤素系阻燃剂,则并无特别限定。在使用这种不溶解于清漆中的卤素系阻燃剂时,阻燃剂在母料(matrix)中以粒状存在,因此难以使硬化物的玻璃态转变温度(Tg)降低,并且卤素难以脱离,因此并不会大幅度地降低获得的硬化物的耐热性。作为这种卤素系阻燃剂的具体例子,例如有乙撑二五溴苯(ethylene dipentabromobenzene)、乙撑双四溴酰亚胺(ethylene bistetrabromoimide)、十溴二苯醚(decabromodiphenyl oxide)、十四溴二苯氧基苯(tetradecabromo diphenoxybenzene)、双(三溴苯氧基)乙烷(bis(tribromophenoxy)ethane)等。这些卤素系阻燃剂中,从熔点为300℃以上且耐热性高的观点出发,优选使用乙撑二五溴苯、乙撑双四溴酰亚胺、十溴二苯醚或十四溴二苯氧基苯。在使用这种熔点为300℃以上的耐热性高的卤素系阻燃剂时,可抑制高温时的卤素脱离,由此可抑制由于获得的硬化物分解而造成的耐热性降低。
从可充分维持耐热性以及层间绝缘性的观点出发,所述卤素系阻燃剂(E)的分散状态的平均粒径优选为0.1μm至50μm,更优选为1μm至10μm。另外,所述平均粒径可使用岛津制作所株式会社(Shimadzu Corporation)制造的粒度分布测定装置(SALD-2100)等来测定。
所述卤素系阻燃剂(E)的配比,优选在获得的硬化物中的树脂成分(即,除无机成分以外的成分)的总量中以卤素浓度为5质量%至30质量%左右的比例而含有。
为实现提高加热时的尺寸稳定性、提高阻燃性等目的,也可以根据需要在本实施方式的环氧树脂组合物中添加无机填充材料(F)。
作为无机填充材料(F)的具体例子,例如有球形二氧化硅等二氧化硅、氧化铝、滑石、氢氧化铝、氢氧化镁、氧化钛、云母、硼酸铝、硫酸钡、碳酸钙等。
另外,作为无机填充材料(F),特别优选用环氧硅烷型(epoxysilane type)硅烷偶联剂或氨基硅烷型(aminosilane type)硅烷偶联剂进行了表面处理的无机填充材料。使用调配有如上所述的用硅烷偶联剂进行了表面处理的无机填充材料的环氧树脂组合物而获得的覆金属箔层压板,具有吸湿时的耐热性增高,且层间剥离强度也增高的倾向。
从不降低流动性和与金属箔的粘着性而提高尺寸稳定性的观点出发,无机填充材料(F)的配比,相对于所述(A)成分至(C)成分的合计量100质量份优选为10质量份至100质量份,更优选为20质量份至70质量份,更加优选为20质量份至50质量份。
在不损及本发明效果的范围内,也可以根据需要在本实施方式的环氧树脂组合物中调配其它通常调配于环氧树脂组合物中的成分,例如热稳定剂、抗静电剂、紫外线吸收剂、阻燃剂、染料或颜料、润滑剂等。
本实施方式的环氧树脂组合物是所述(A)成分至(C)成分均溶解于树脂清漆中,所述(E)成分不溶解而分散于所述树脂清漆中的环氧树脂组合物。这种树脂清漆例如可利用如下方式进行调制。
在使高分子量的PPE在甲苯中进行再分配反应而获得的数均分子量为5000以下的聚苯醚(B)的树脂溶液中,分别溶解指定量的环氧化合物(A)和氰酸酯化合物(C)。此时,也可以根据需要进行加热。另外,在溶解时,从树脂清漆中难以生成析出物等观点出发,作为环氧化合物(A)和氰酸酯化合物(C)优选使用在常温下溶解于甲苯等溶剂中的化合物。
接着,添加卤素系阻燃剂(E)和根据需要使用的无机填充材料(F),使用球磨机(ballmill)、珠磨机(beads mill)、行星式搅拌机(planetary mixer)、辊轧机(roll mill)等进行分散直至其变为指定的分散状态,由此来调制树脂清漆。
作为使用获得的树脂清漆来制造半固化片的方法,例如有使所述树脂清漆含浸到纤维质基材中后进行干燥的方法。
作为纤维质基材,例如有玻璃布(glass cloth)、芳纶布(aramide cloth)、聚酯布、玻璃无纺布、芳纶无纺布、聚酯无纺布、纸浆纸、棉绒纸等。另外,使用玻璃布可以获得机械强度优异的层压板,特别优选经过扁平(flattening)处理加工的玻璃布。扁平加工例如可通过如下方式进行:以适宜的压力用压辊对玻璃布连续加压,将纱线压缩为扁平。另外,通常可使用厚度为0.04mm至0.3mm的基材。
含浸是通过浸渍(dipping)、涂布等来进行的。含浸也可以根据需要反复进行多次。而且,此时也可以使用组成或浓度不同的多种溶液反复进行含浸,最终调整为所希望的组成以及树脂量。
将含浸有所述树脂清漆的基材在所需的加热条件下,例如80℃至170℃下加热1分钟至10分钟从而获得半硬化状态(B阶段)的半固化片。
作为使用如上所述获得的半固化片制作覆金属箔层压板的方法,可以是:取一片所述半固化片或者将多片所述半固化片重叠,进一步在其上下两个面或者一个面上叠放铜箔等金属箔,对其进行加热加压成形而层压一体化,由此制作两个面覆有金属箔或者一个面覆有金属箔的层压体。加热加压条件可以根据所制造的层压板的厚度或半固化片的树脂组合物的种类等来适当设定,例如可以将温度设定为170℃至210℃,将压力设定为3.5Pa至4.0Pa,将时间设定为60分钟至150分钟。
另外,本实施方式的环氧树脂组合物在该硬化反应中,聚苯醚(B)的末端的酚性羟基与环氧化合物(A)的环氧基进行反应,进一步与氰酸酯化合物(C)进行反应,由此形成牢固的交联结构。使用氰酸酯化合物(C)而获得的硬化物不仅电气特性优异而且耐热性也优异。而且,作为环氧化合物(A),使用不含卤素原子的环氧化合物,为了赋予阻燃性,使用不溶解于树脂清漆中的卤素系阻燃剂,因此可维持较高的耐热性,且可赋予阻燃性。
而且,通过对如此制作的层压体表面的金属箔进行蚀刻加工等而形成电路,可获得在层压体表面设置了导线分布图(conductor pattern)来作为电路的印刷线路板。由此获得的印刷线路板的介电特性优异,且具有高耐热性和阻燃性。
以下,通过实施例对本发明更具体地进行说明,但本发明的范围并不局限于这些实施例。
[实施例]
(制造例1:利用再分配反应制造数均分子量为2500的聚苯醚(PPE1)溶液)
将甲苯250g放入到装备有搅拌装置以及搅拌叶片的2000ml的烧瓶中。将所述烧瓶的内部温度控制为90℃,并且放入高分子量PPE(数均分子量为25000的PPE(日本通用电气塑料株式会社(Japan GE Plastics)制造的“Noryl 640-111”)90g、双酚A 7g、过氧化苯甲酰7g,持续搅拌2小时使其进行反应,由此调制出数均分子量为2500的聚苯醚(PPE1)溶液(固体成分浓度为28质量%)。另外,数均分子量是利用凝胶渗透色谱(Gel Permeation Chromatography,GPC)测定的苯乙烯换算值。
(制造例2:制造聚合获得的数均分子量为2500的聚苯醚(PPE2)溶液)
在80℃下使日本通用电气塑料株式会社制造的SA120(数均分子量为2500的PPE)溶解于甲苯中,调制出数均分子量为2500的聚苯醚(PPE2)溶液(固体成分浓度为28质量%)。
(制造例3:制造数均分子量为4000的聚苯醚(PPE3)溶液)
除将双酚A设为3.6g、将过氧化苯甲酰设为3.6g以外,以与制造例1相同的方式进行反应,由此调制出数均分子量为4000的聚苯醚(PPE3)溶液(固体成分浓度为28质量%)。
(实施例1至实施例11、比较例1至比较例4)
首先,将本实施例中使用的原材料汇总表示如下。
<环氧化合物>
·二环戊二烯型环氧化合物、数均分子量(Mn)为550的Epiclon HP7200(大日本油墨化学工业株式会社制造)
·双酚F型环氧化合物、Mn为350的Epiclon 830S(大日本油墨化学工业株式会社制造)
·四溴双酚A型环氧化合物、Mn为800的Epiclon 153(大日本油墨化学工业株式会社制造)
·双酚A型环氧化合物、Mn为1500的Epiclon 3050(大日本油墨化学工业株式会社制造)
<氰酸酯化合物)
·2,2-双(4-氰酸苯基)丙烷(龙沙日本公司(Lonza Japan)制造的BandCy)
·下式(1)所示的氰酸酯化合物(亨斯迈日本公司(Huntsman Japan)制造的XU366)
<阻燃剂>
·不溶解于甲苯的乙撑双(五溴苯)(雅保日本公司(Albemarle Japan)制造的SAYTEX8010、熔点为350℃)
·不溶解于甲苯的乙撑双四溴邻苯二甲酰亚胺(雅保日本公司制造的BT-93、熔点为456℃)
·不溶解于甲苯的双(三溴苯氧基)乙烷(大湖(Great Lakes)公司制造的FF-680、熔点为225℃)
·溶解于甲苯的四溴双酚A(雅保日本公司制造的SAYTEX CP-2000、熔点为181℃)
·溶解于甲苯的溴化聚苯乙烯(雅保日本公司制造的SAYTEX HP-7010、熔点为182℃)
<硬化催化剂>
·辛酸锌(大日本油墨化学工业株式会社制造、锌浓度为18%)
·2-乙基-4-甲基咪唑(2E4MZ)(四国化成株式会社(Shikoku Chemicals Corperation)制造)
<无机填料>
·未经过表面处理的球形二氧化硅(SiO2)SO25R(Admatechs公司(AdmatechsCompany Limited)制造)
·经过表面处理的球形二氧化硅A SC-2500-SEJ(进行了环氧硅烷型硅烷偶联剂处理、Admatechs公司制造)
·经过表面处理的球形二氧化硅B SC-2500-GRJ(进行了环氧硅烷型硅烷偶联剂处理、Admatechs公司制造)
·经过表面处理的球形二氧化硅C SC-2500-SXJ(进行了氨基硅烷型硅烷偶联剂处理、Admatechs公司制造)
·经过表面处理的球形二氧化硅D SC-2500-SVJ(进行了乙烯基硅烷型硅烷偶联剂处理、Admatechs公司制造)
·经过表面处理的球形二氧化硅E SC-2500-SYJ(进行了丙烯酰氧基硅烷型硅烷偶联剂处理、Admatechs公司制造)
[树脂清漆的调制]
将聚苯醚的甲苯溶液加热到90℃,以表1中所示的配比添加环氧化合物和氰酸酯化合物后,搅拌30分钟使其完全溶解。接着,进一步添加硬化催化剂、阻燃剂和无机填料,用球磨机使其分散,由此获得树脂清漆。另外,实施例的阻燃剂均不溶解,而是以1μm至10μm的平均粒子径分散在树脂清漆中。
接着,将获得的树脂清漆含浸到玻璃布(日东纺绩株式会社制造的“WEA116E”)中后,在150℃下加热干燥3分钟至5分钟,由此获得半固化片。
接着,分别将获得的各半固化片6片重叠并进行层压,进一步在其两个外层分别配置铜箔(古河电路铜箔株式会社(Furukawa Circuit Foil Co.,Ltd.)制造的F2-WS 18μm),在温度为220℃、压力为3MPa的条件下进行加热加压,由此获得厚度为0.75mm的覆铜箔层压板。
使用获得的半固化片和覆铜箔层压板,进行下述评价。
<半固化片的流动性评价>
制备尺寸为长150mm、宽100mm、厚0.8mm的芯材,其上以2mm的间距形成有1000个孔径为0.3mm的贯通孔。接着,在所述芯材的一个面上依次层压获得的半固化片和铜箔,在另一个面上仅层压铜箔。接下来,通过将所述层压体在220℃×2小时、压力为3MPa的条件下进行加热压制而成形。然后,数出1000个孔中被完全填充的孔的个数,求出其比例。
<烘箱耐热性>
根据JIS C 6481的规格,将切成指定大小的覆铜箔层压板在设定为指定温度的恒温槽中放置1小时后取出。接着,目视观察进行了处理的试片,求出未产生鼓起时的最高温度。
<吸湿耐热性>
将根据JIS C 6481的规格制作的试片在121℃、两个大气压的高压釜中处理120分钟后,在260℃的焊锡槽中浸渍20秒,将铜箔及层压板未产生鼓起和剥落的情况判定为“良”,将产生鼓起或剥落的情况判定为“差”。
<阻燃性>
根据UL 94的燃烧试验法对切成指定大小的覆铜箔层压板进行燃烧试验,判定其阻燃性。
<介电特性>
根据JIS C 6481的规格,求出1MHz时的介电常数以及介质损耗因数。
<热膨胀系数>
根据JIS C 6481的规格,求出Z轴方向的热膨胀系数。另外,在升温速度为5℃/分钟、温度范围为75℃至125℃的测定条件下进行测定。
<层间粘着强度>
根据JIS C 6481的规格,测定层间粘着强度。
根据表1,使用本发明所涉及的实施例1至实施例11的环氧树脂组合物获得的覆铜箔层压板的耐热性均为260℃以上且阻燃性亦均为V-0。并且,对除了使用熔点不同的阻燃剂之外以相同组成进行评价的实施例1至实施例3进行比较,可知如下事实。即,在使用使用了熔点为300℃以上的阻燃剂的实施例1以及实施例2的环氧树脂组合物时,烘箱耐热性高达270℃。另一方面,在使用使用了熔点为225℃的阻燃剂的实施例3的环氧树脂组合物时,烘箱耐热性稍降低至260℃。另外,作为PPE,对使用了利用再分配反应获得的实施例1与使用了利用聚合反应获得的实施例7的耐热性进行比较,实施例1的耐热性较高。另一方面,使用了溶解于溶剂中的卤素系阻燃剂的比较例1、比较例2的耐热性低。而且,使用了溴化环氧化合物的比较例3和使用了溴化聚苯乙烯的比较例4的覆铜箔层压板的耐热性亦低。
另外,根据表2,使用了调配有用环氧硅烷型硅烷偶联剂进行了表面处理的无机填充材料的环氧树脂组合物的实施例13、实施例14以及使用了调配有用氨基硅烷型硅烷偶联剂进行了表面处理的无机填充材料的环氧树脂组合物的实施例15的层压板,吸湿耐热性优异且层间粘着强度亦高。另一方面,使用了调配有未经过表面处理的无机填充材料的环氧树脂组合物的实施例12以及使用了调配有用乙烯基硅烷型硅烷偶联剂或丙烯酰氧基硅烷型硅烷偶联剂进行了表面处理的无机填充材料的环氧树脂组合物的实施例16、实施例17的层压板,在吸湿时耐热性稍微降低。
如以上详述,本发明一方面涉及环氧树脂组合物,该环氧树脂组合物是包含树脂清漆的热固性树脂组合物,所述树脂清漆含有:数均分子量为1000以下且在各分子中具有至少两个环氧基的不含卤素原子的环氧化合物(A);数均分子量为5000以下的聚苯醚(B);氰酸酯化合物(C);硬化催化剂(D);以及卤素系阻燃剂(E);其中,所述(A)成分至(C)成分均溶解于所述树脂清漆中,并且所述(E)成分不溶解而分散于所述树脂清漆中。根据该构成,通过使用不溶解于树脂清漆中的溶剂的卤素系阻燃剂(E),高温时的卤素脱离得到抑制,由此可获得具有阻燃性以及高耐热性的硬化物。
从获得具有更高耐热性的硬化物的方面考虑,优选所述卤素系阻燃剂(E)选自由乙撑二五溴苯、乙撑双四溴酰亚胺、十溴二苯醚、十四溴二苯氧基苯以及双(三溴苯氧基)乙烷构成的组中的至少一种。
从具有特高耐热性的方面考虑,作为所述卤素系阻燃剂(E)优选使用熔点为300℃以上的卤素系阻燃剂,具体而言,例如选自由乙撑二五溴苯、乙撑双四溴酰亚胺、十溴二苯醚以及十四溴二苯氧基苯构成的组中的至少一种。
另外,从与所述聚苯醚(B)的相溶性良好的方面考虑,所述环氧化合物(A)优选使用选自二环戊二烯型环氧化合物、双酚F型环氧化合物、双酚A型环氧化合物以及联苯型环氧化合物中的至少一种环氧化合物。
另外,所述聚苯醚(B)优选为在酚系化合物和自由基引发剂的存在下,使数均分子量为10000至30000的聚苯醚在溶剂中进行再分配反应而制得的聚苯醚。由于这种聚苯醚在分子链的两个末端具有有助于硬化的来自酚系化合物的羟基,因此可进一步维持较高的耐热性。
另外,从维持更高的耐热性和流动性的方面考虑,所述硬化催化剂(D)优选含有有机金属盐。
另外,从提高加热时的尺寸稳定性和阻燃性的方面考虑,所述环氧树脂组合物优选还含有无机填充材料(F),该无机填充材料(F)例如选自由球形二氧化硅、氢氧化铝以及氢氧化镁构成的组中的至少一种。
从使用环氧树脂组合物获得的覆金属箔层压板具有即使在吸湿时耐热性也增高,而且层间剥离强度也增高的倾向的方面考虑,无机填充材料(F)优选为用选自环氧硅烷型硅烷偶联剂和氨基硅烷型硅烷偶联剂中的至少一种硅烷偶联剂处理过的球形二氧化硅。
本发明另一方面涉及半固化片,该半固化片是将所述环氧树脂组合物含浸到纤维质基材中,并使其硬化而制得的。
本发明另一方面还涉及覆金属箔层压板,该覆金属箔层压板是在所述半固化片上层压金属箔,并进行加热加压成形而制得的。
本发明另一方面再涉及印刷线路板,该印刷线路板是通过部分去除所述覆金属箔层压板表面的金属箔来形成电路而制得的。
Claims (13)
1.一种环氧树脂组合物,是包含树脂清漆的热固性树脂组合物,其特征在于:
所述树脂清漆含有:数均分子量为1000以下且在各分子中具有至少两个环氧基的不含卤素原子的环氧化合物(A);数均分子量为5000以下的聚苯醚(B);氰酸酯化合物(C);硬化催化剂(D);以及卤素系阻燃剂(E);其中,
所述(A)成分至(C)成分均溶解于所述树脂清漆中,并且所述(E)成分不溶解而分散于所述树脂清漆中。
2.根据权利要求1所述的环氧树脂组合物,其特征在于:
所述卤素系阻燃剂(E)选自由乙撑二五溴苯、乙撑双四溴酰亚胺、十溴二苯醚、十四溴二苯氧基苯以及双(三溴苯氧基)乙烷构成的组中的至少一种。
3.根据权利要求1所述的环氧树脂组合物,其特征在于:
所述卤素系阻燃剂(E)的熔点为300℃以上。
4.根据权利要求3所述的环氧树脂组合物,其特征在于:
所述熔点为300℃以上的卤素系阻燃剂(E)选自由乙撑二五溴苯、乙撑双四溴酰亚胺、十溴二苯醚以及十四溴二苯氧基苯构成的组中的至少一种。
5.根据权利要求1至4中任一项所述的环氧树脂组合物,其特征在于:
所述环氧化合物(A)是选自二环戊二烯型环氧化合物、双酚F型环氧化合物、双酚A型环氧化合物、以及联苯型环氧化合物中的至少一种环氧化合物。
6.根据权利要求1至5中任一项所述的环氧树脂组合物,其特征在于:
所述聚苯醚(B)是在酚系化合物和自由基引发剂的存在下,在溶剂中使数均分子量为10000至30000的聚苯醚进行再分配反应而制得的。
7.根据权利要求1至6中任一项所述的环氧树脂组合物,其特征在于:
所述硬化催化剂(D)含有有机金属盐。
8.根据权利要求1至7中任一项所述的环氧树脂组合物,其特征在于:
所述树脂清漆还含有无机填充材料(F)。
9.根据权利要求8所述的环氧树脂组合物,其特征在于:
所述无机填充材料(F)选自由球形二氧化硅、氢氧化铝以及氢氧化镁构成的组中的至少一种。
10.根据权利要求9所述的环氧树脂组合物,其特征在于:
所述无机填充材料(F)是用选自环氧硅烷型硅烷偶联剂和氨基硅烷型硅烷偶联剂中的至少一种硅烷偶联剂处理过的球形二氧化硅。
11.一种半固化片,其特征在于:
将权利要求1至10中任一项所述的环氧树脂组合物含浸到纤维质基材中,并使其硬化而制得。
12.一种覆金属箔层压板,其特征在于:
在权利要求11所述的半固化片上层压金属箔,并进行加热加压成形而制得。
13.一种印刷线路板,其特征在于:
通过部分去除权利要求12所述的覆金属箔层压板表面的金属箔来形成电路而制得。
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- 2008-06-30 KR KR1020107003936A patent/KR101144566B1/ko active IP Right Grant
- 2008-06-30 US US12/675,856 patent/US20100218982A1/en not_active Abandoned
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2015
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Also Published As
Publication number | Publication date |
---|---|
EP2194098A1 (en) | 2010-06-09 |
US20150359093A1 (en) | 2015-12-10 |
CN101796132B (zh) | 2012-07-04 |
US20100218982A1 (en) | 2010-09-02 |
TW200914528A (en) | 2009-04-01 |
EP2194098A4 (en) | 2011-05-11 |
KR20100044231A (ko) | 2010-04-29 |
EP2194098B1 (en) | 2012-08-15 |
TWI371466B (zh) | 2012-09-01 |
KR101144566B1 (ko) | 2012-05-11 |
WO2009041137A1 (ja) | 2009-04-02 |
WO2009040921A1 (ja) | 2009-04-02 |
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