CN106700475B - 一种阻燃的聚苯醚树脂组合物 - Google Patents

一种阻燃的聚苯醚树脂组合物 Download PDF

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CN106700475B
CN106700475B CN201611232814.3A CN201611232814A CN106700475B CN 106700475 B CN106700475 B CN 106700475B CN 201611232814 A CN201611232814 A CN 201611232814A CN 106700475 B CN106700475 B CN 106700475B
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resin
combination
resin combination
phosphorous
polyphenylene oxide
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CN106700475A (zh
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孟运东
方克洪
徐莹
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Shengyi Technology Co Ltd
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Shengyi Technology Co Ltd
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Priority to CN201611232814.3A priority Critical patent/CN106700475B/zh
Priority to US16/468,534 priority patent/US20190300649A1/en
Priority to KR1020197016887A priority patent/KR102216098B1/ko
Priority to PCT/CN2017/084318 priority patent/WO2018120590A1/zh
Priority to JP2019524498A priority patent/JP6891279B2/ja
Priority to EP17886959.0A priority patent/EP3564316A4/en
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Abstract

本发明涉及一种阻燃的聚苯醚树脂组合物,其按重量百分含量包含:(A)数均分子量为1000~6000的含磷聚苯醚树脂:10%~45%;(B)环氧树脂组合物:10%~50%;(C)氰酸酯树脂:10%~50%;(D)可溶解性卤素阻燃剂:10%~30%;本发明通过采用含磷低分子量聚苯醚树脂,将其与环氧树脂、氰酸酯等复合使用时改善了体系的相容性,其分相区域减少,板材粘合力增大,韧性增强;采用可溶解性的卤素阻燃剂,进一步增强了树脂体系的均一性,板材均一性较好,粘结性增加,介电常数和介电损耗较低。

Description

一种阻燃的聚苯醚树脂组合物
技术领域
本发明涉及覆铜板技术领域,尤其涉及一种阻燃的聚苯醚树脂组合物以及使用它的粘结片及覆铜箔层压板。
背景技术
聚苯醚树脂具有很好的耐热性、介电性能和韧性,在层压板等复合材料中具有很好的应用前途。但是,由于聚苯醚与传统的热固性树脂之间存在极性差异,相容性较差,易于分相,聚苯醚改性环氧树脂、氰酸酯等热固性树脂体系覆铜板中一般会出现树脂分相,导致材料受热时应力不均,在高温加工时易出现爆板等问题。因此聚苯醚的应用存在各种难度。
常用的改善相容性的方法,一般是降低聚苯醚树脂的分子量,增强其相容性,或在低分子量聚苯醚的结构中接入反应基团,增强聚苯醚与其他树脂的连接,也有在聚苯醚树脂组合物中引入相容剂,以促进聚苯醚与其他树脂之间的相容性。
CN101796132A中提到聚苯醚、环氧树脂、氰酸酯、卤素阻燃剂等组成的树脂组合物,其卤素阻燃剂为乙撑二五溴苯、乙撑双四溴酰亚胺、十溴二苯醚、十四溴二苯氧基苯以及双(三溴苯氧基)乙烷等。该组合物中,聚苯醚与环氧树脂、氰酸酯的相容性差,在板材的树脂中易产生分相等。上述阻燃剂可以满足树脂组合物在电路基板中阻燃性的要求,但对聚苯醚与其他组分树脂之间的相容性没有帮助。
CN103842397A中公开了一种树脂组合物,其含有:具有聚苯醚骨架的2官能性苯醚低聚物、芳烷基型氰酸酯化合物、双酚型氰酸酯化合物、环氧树脂、溴化碳酸酯低聚物、无机填充材料、烷氧基萘酚系阻聚剂和/或硫醚系阻聚剂。该组合物中使用了带有官能团的聚苯醚,但该类聚苯醚与环氧树脂等不进行反应,而且2官能性对聚苯醚与其他组分之间的相容性没有改善,其板材韧性相对较差。
因此,如何改善聚苯醚与其它组分之间的相容性,并保持覆铜板优异的综合性能已成为目前研究的重点。
发明内容
基于此,本发明的目的之一在于提供一种聚苯醚树脂组合物,其不仅可以有效改善聚苯醚与环氧树脂等的相容性,而且还可满足阻燃的要求,并起到降低介电常数(Dk)和介电损耗(Df)的作用。
发明人为实现上述目的,进行了反复深入的研究,结果发现:通过采用含磷低分子量聚苯醚树脂,将其与环氧树脂、氰酸酯等复合使用时意外地改善了体系的相容性,其分相区域减少,板材粘合力增大,韧性增强;采用可溶解性卤素阻燃剂,进一步增强了树脂体系的均一性,板材均一性较好,粘结性增加,介电常数和介电损耗较低。
为了实现上述目的,本发明采用了如下技术方案:
一种树脂组合物,其按重量百分含量包含:
(A)数均分子量为1000~6000的含磷聚苯醚树脂:10%~45%;
(B)环氧树脂组合物:10%~50%;
(C)氰酸酯树脂:10%~50%;
(D)可溶解性卤素阻燃剂:10%~30%。
其中(A)、(B)、(C)、(D)各组分的百分含量为不含溶剂的含量。
本发明采用含磷低分子量聚苯醚树脂,将其与环氧树脂、氰酸酯等复合使用,有效改善了体系的相容性,其分相区域减少,板材粘合力增大,韧性增强;同时采用可溶解性卤素阻燃剂,进一步增强了树脂体系的均一性,板材均一性较好,粘结性增加,介电常数和介电损耗较低。
根据本发明,以(A)、(B)、(C)和(D)的总量计,其中所述含磷聚苯醚树脂的重量百分含量为10%~45%,例如10%、12%、14%、15%、16%、18%、19%、20%、22%、25%、28%、30%、35%、38%、40%、42%或45%,以及上述数值之间的具体点值,限于篇幅及出于简明的考虑,本发明不再穷尽列举所述范围包括的具体点值。
本发明中的含磷聚苯醚树脂为含磷低分子量聚苯醚树脂,其数均分子量控制在1000~6000范围内,例如1000、1200、1500、1800、2000、2500、3000、3500、4000、4500、5000、5500或6000,以及上述数值之间的具体点值,限于篇幅及出于简明的考虑,本发明不再穷尽列举所述范围包括的具体点值。
本发明中,所述含磷聚苯醚树脂是由含磷酚类化合物与聚苯醚合成的,具体地,其是在引发剂的存在下,将数均分子量2000~40000的原料聚苯醚与悬浮于其溶液中的含磷酚类化合物进行再分配反应得到的数均分子量为1000~6000的含磷聚苯醚树脂。
其中,以原料聚苯醚为100重量份计算,所述含磷酚类化合物的用量为4~50份,例如4份、5份、6份、8份、9份、10份、12份、15份、18份、20份、25份、30份、35份、40份、45份、48份或50份,以及上述数值之间的具体点值,限于篇幅及出于简明的考虑,本发明不再穷尽列举所述范围包括的具体点值。
优选地,所述含磷酚类化合物为含有一个或两个及以上酚羟基的9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物的衍生物;优选含有9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物分别与苯醌、1,4-萘醌、对羟基苯马来酰亚胺或玫红酸的加成物中的任意一种或至少两种的组合,其中典型但非限制性的组合为:9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物与苯醌的加成物和9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物与的1,4-萘醌的加成物,9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物与苯醌的加成物和9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物与对羟基苯马来酰亚胺的加成物。
所述9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物与苯醌的加成物,即DOPO-HQ的结构式如下所示:
所述9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物与1,4-萘醌的加成物,即DOPO-NQ的结构式如下所示:
所述9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物与对羟基苯马来酰亚胺的加成物,即DOPO-HPM的结构式如下所示:
所述9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物与玫红酸的加成物,即DOPO-triol的结构式如下所示:
本发明中除了含有上述含磷酚类化合物以外,还可含有其它种类的含磷酚类化合物,对于其它种类的含磷酚类化合物在此不做特殊限定。
本发明中,以原料聚苯醚为100重量份计算,所述引发剂的用量为4~30份,例如4份、5份、6份、8份、10份、12份、15份、18份、20份、25份、26份、28份或30份,以及上述数值之间的具体点值,限于篇幅及出于简明的考虑,本发明不再穷尽列举所述范围包括的具体点值。
优选地,所述引发剂为过氧化二枯基、叔丁基过氧化枯基、过氧化二叔丁基、过氧化异丙基碳酸叔丁酯、2,5-二甲基-2,5-二叔丁基枯基过氧基己炔-3、2,5-二甲基2,5-二叔丁基过氧化己烷、过氧化对孟烷,1,1-双(叔戊基过氧)环己烷、过氧化氢二异丙基苯、过氧化苯甲酰或过氧化苯甲酰衍生物中的任意一种或至少两种的组合,其中典型但非限制性的组合为过氧化二枯基和叔丁基过氧化枯基,过氧化二叔丁基和过氧化异丙基碳酸叔丁酯,过氧化异丙基碳酸叔丁酯和2,5-二甲基-2,5-二叔丁基枯基过氧基己炔-3、2,5-二甲基2,5-二叔丁基过氧化己烷。
本发明在制备所述含磷聚苯醚树脂的再分配反应中可以进一步使用催化剂,以促进引发剂的效率。
优选地,所述催化剂为环烷酸的金属盐、五氧化钒、苯胺、胺化合物、季铵盐、咪唑或鏻盐等中的任意一种或至少两种的组合,其中典型但非限制性的组合为金属盐和五氧化钒,五氧化钒和苯胺。
根据本发明,以(A)、(B)、(C)和(D)的总量计,其中所述环氧树脂组合物的重量百分含量为10%~50%,例如10%、12%、15%、18%、20%、25%、28%、30%、32%、35%、38%、40%、42%、44%、45%、48%或50%,以及上述数值之间的具体点值,限于篇幅及出于简明的考虑,本发明不再穷尽列举所述范围包括的具体点值。
本发明中,所述环氧树脂组合物可以选自双酚A型、双酚F型、双酚S型或含有双环戊二烯、苯、萘、芴、联苯、脂环、甲酚酚醛、异氰酸酯或乙内酰脲结构的环氧树脂中的任意一种或至少两种的组合,其中典型但非限制性的组合为双酚A型和双酚F型环氧树脂,双酚S型和含有双环戊二烯环氧树脂。
根据本发明,以(A)、(B)、(C)和(D)的总量计,其中所述氰酸酯的重量百分含量为10%~50%,例如10%、12%、15%、18%、20%、25%、28%、30%、32%、35%、38%、40%、42%、44%、45%、48%或50%,以及上述数值之间的具体点值,限于篇幅及出于简明的考虑,本发明不再穷尽列举所述范围包括的具体点值。
本发明中,所述氰酸酯树脂可以选自2,2-双(4-氰酸苯基)丙烷、双(3,5-二甲基-4-氰酸苯基)甲烷、2,2-双(4-氰酸苯基)乙烷或其衍生物的芳香族氰酸酯化合物中的任意一种或至少两种的组合,其中典型但非限制性的组合为:2,2-双(4-氰酸苯基)丙烷和双(3,5-二甲基-4-氰酸苯基)甲烷,双(3,5-二甲基-4-氰酸苯基)甲烷和2,2-双(4-氰酸苯基)乙烷。
根据本发明,以(A)、(B)、(C)和(D)的总量计,其中所述可溶解性卤素阻燃剂的重量百分含量为10%~30%,例如10%、12%、15%、18%、20%、25%、28%或30%,以及上述数值之间的具体点值,限于篇幅及出于简明的考虑,本发明不再穷尽列举所述范围包括的具体点值。
本发明中,所述可溶解性卤素阻燃剂是指在丁酮中的溶解度大于30g/100g丁酮,在甲苯中的溶解度大于10g/100g甲苯的一类卤素阻燃剂。
本发明中采用可溶解性的卤素阻燃剂,可进一步增强树脂体系的均一性,板材均一性较好,粘结性增加,介电常数和介电损耗较低,提高板材的综合性能。
本发明中所述可溶解性卤素阻燃剂可以选自溴化聚碳酸酯、溴化聚苯乙烯、聚溴化苯乙烯或聚溴化基丙烯酸酯中的任意一种或至少两种的组合,其中典型但非限制性的组合为溴化聚碳酸酯和溴化聚苯乙烯,溴化聚苯乙烯和聚溴化苯乙烯。
本发明所述树脂组合物中还可以进一步含有促进剂,其能够催化环氧基团与氰酸酯或聚苯醚发生反应。
根据本发明,所述促进剂可以选自2-甲基咪唑、2-苯基咪唑、2-乙基-4-甲基咪唑、三正丁胺、三苯基磷、季磷化合物、硫脲及其衍生物、三氟化硼络合物、辛酸金属盐、乙酰丙酮金属盐、环烷酸金属盐、水杨酸金属盐或硬脂酸金属盐中的任意一种或者至少两种的组合,其中,所述金属选自锌、铜、铁、锡、钴或铝中的任意一种或者至少两种的组合。
本发明所述树脂组合物中还可以进一步含有填料,具体可以选自二氧化硅、氮化硼、氢氧化铝、勃姆石、滑石、粘土、云母、高岭土、硫酸钡、碳酸钙、氢氧化镁或硼酸锌的任意一种或者至少两种的组合;以有机固形物为100重量份计,所述填料的添加量为1~40重量份。
本发明所述的“包含”,意指其除所述组份外,还可以包括其他组份,这些其他组份赋予所述树脂组合物不同的特性。除此之外,本发明所述的“包含”,还可以替换为封闭式的“为”或“由……组成”。
例如,所述树脂组合物还可以含有各种添加剂或助剂,作为具体例,可以举出硅烷偶联剂、填料分散剂、消泡剂、抗氧剂、热稳定剂、抗静电剂、紫外线吸收剂、颜料、着色剂或润滑剂等。这些添加剂或助剂可以单独使用,也可以两种或者两种以上混合使用。
本发明的树脂组合物的制备方法为本领域的常规技术手段,其具体方法为:先将固形物放入,然后加入液态溶剂,搅拌至固形物完全溶解后,再加入液态树脂和促进剂,继续搅拌均匀即可。
作为本发明中的溶剂,没有特别的限定,作为具体例,可以列举出甲醇、乙醇、丁醇等醇类,乙基溶纤剂、丁基溶纤剂、乙二醇甲醚、卡必醇、丁基卡必醇等醚类,丙酮、丁酮、甲基乙基甲酮、环己酮等酮类;甲苯、二甲苯等芳香烃类;醋酸乙酯、乙氧基乙基乙酸酯等酯类;N,N-二甲基甲酰胺、N,N-二甲基乙酰胺等含氮类溶剂。以上溶剂可单独使用,也可两种或两种以上混合使用。优选丙酮、丁酮、甲基乙基甲酮、环己酮等酮类。所述溶剂的添加量由本领域技术人员根据自己经验来选择,使得树脂胶液达到适合使用的粘度即可。
本发明提供了一种树脂胶液,其是将前所述的树脂组合物溶解或分散在溶剂中得到。
本发明还提供了一种半固化片,其是将基料浸润如前所述的树脂胶液后,干燥得到。
本发明的预浸料包括增强材料及含浸干燥后附着在增强材料上的如上所述的树脂组合物,所使用的增强材料无特别的限定,可以为有机纤维、无机纤维编织布或无纺布。所述的有机纤维可以选择芳纶无纺布,所述的无机纤维编织布可以为E-玻纤布、D-玻纤布、S-玻纤布、T玻纤布、NE-玻纤布或石英布。所述增强材料的厚度无特别限定,处于层压板有良好的尺寸稳定性的考虑,所述编织布及无纺布厚度优选0.01~0.2mm,且最好是经过开纤处理及硅烷偶联剂表面处理的,为了提供良好的耐水性和耐热性,所述硅烷偶联剂优选为环氧硅烷偶联剂、氨基硅烷偶联剂或乙烯基硅烷偶联剂中的任意一种或至少两种的混合物。将增强材料通过含浸上述的树脂组合物,在100~250℃条件下,烘烤1~15分钟得到所述预浸料。
本发明的印刷电路板用覆铜箔层压板包括通过加热和加压,使两片或两片以上的粘结片粘合在一起而制成的层压板、粘合在层压板的一面或两面以上的铜箔;所述的覆铜箔层压板是使用上述的粘结片8片和两片一盎司(35μm厚)的铜箔叠合在一起,通过热压机中层压,从而压制成双面覆铜箔层压板;所述的覆铜箔层压需满足以下要求:1、层压的升温速率通常在料温80~160℃时的升温速度应控制在1.0~3.0℃/min;2、层压的压力设置,外层料温在80~100℃时施加满压,满压压力为300psi左右;3、固化时,控制料温在185℃,并保温90min;所覆盖的金属箔除铜箔外,还可以是镍箔、铝箔及SUS箔等,其材质不限。
与现有技术相比,本发明至少具有以下有益效果:
本发明通过采用含磷低分子量聚苯醚树脂,将其与环氧树脂、氰酸酯等复合使用时改善了体系的相容性,其分相区域减少,通过测量最大分相“海岛”尺寸,其在5μm以下;板材粘合力增大,韧性增强;采用可溶解性的卤素阻燃剂,进一步增强了树脂体系的均一性,板材均一性较好,粘结性增加,介电常数和介电损耗较低,介电常数可控制在3.6~3.8,介电损耗角正切值在0.006~0.008,提升了板材的介电性能。
具体实施方式
为便于理解本发明,本发明列举实施例如下。本领域技术人员应该明了,所述实施例仅仅是帮助理解本发明,不应视为对本发明的具体限制。
下面通过具体实施方式来进一步说明本发明的技术方案。
以下所述是本发明实施例的具体实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明实施例原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本发明实施例的保护范围。
下面分多个实施例对本发明实施例进行进一步的说明。本发明实施例不限定于以下的具体实施例。在不改变权利要求的范围内,可以适当的进行变更实施。
下文中如无特别说明,其份代表重量份,其%代表“重量%”。
制备例1~7,对比制备例1
将100份聚苯醚粉末、200份甲苯和特定份数的含磷酚类化合物(种类和份数见表1)加入带有搅拌、加热和回流装置的反应釜中,搅拌并加热至95℃,保温搅拌使其完全溶解。将特定份数的过氧化物分为十份,依次投入反应釜中,保温8h,得到低分子化改性的聚苯醚树脂的甲苯溶液,其配方如表1所示。
将上述甲苯溶液在旋转蒸发仪中浓缩,然后在甲醇中滴加,过滤得到沉淀物,在鼓风烘箱内,以100℃烘干沉淀物,即得到低分子化改性的聚苯醚树脂。以甲苯为流动相,测定树脂的数均分子量(Mn),结果如表1所示。
表1
实施例1~8,对比例1~9
将制备例所得的改性聚苯醚、环氧树脂、氰酸酯树脂以及可溶解性卤素阻燃剂在甲苯中充分溶解,然后与不可溶解的卤素阻燃剂、填料以及2乙基-4甲基咪唑和异辛酸锌等促进剂(种类和份数见表2和表3)混合均匀,得到聚苯醚树脂组合物的甲苯溶液。
将NE型玻璃纤维布(日东纺株式会社,NEA2116)浸渍该树脂组合物,并于155℃烘干2~10min,除去溶剂,使挥发份小于1%,树脂的凝胶时间为150~200s,得到树脂含量在55%左右的半固化片。
在四张重叠的半固化片的两面各覆一张HOz的反转铜箔,在200℃的温度和3.0MPa的压力下热压90min,得到双面覆铜箔层压板。
表2
表3
以上特性的测试方法如下:
1)挥发性:将制备好的半固化片在155℃下烘烤10min,测量半固化片的质量损失,损失超过2%说明有挥发;
2)凝胶时间:采用凝胶测试仪,测试温度171℃;
3)介电常数(Dk)和介电损耗因数(Df):使用谐振腔法(SPDR)测定;
4)玻璃化转变温度(Tg):使用动态热机械分析(DMA)测试,升温速率为20℃/min;
5)热失重温度(Td):使用热失重分析仪(TGA)测试,升温速率为10℃/min,取5%失重时的温度;
6)剥离强度(PS):指在室温下将每毫米铜箔剥离覆铜板所需的拉力;
7)阻燃:按照UL94“50W(20mm)垂直燃烧试验:V-0、V-1和V-2”测试方法测试,认定V-0为阻燃;
8)落锤冲击:使用漆膜冲击器测试,取冲击后出现裂纹的面积;
9)最大分相“海岛”尺寸:采用扫描电子显微镜(SEM)观测板材横截面,取最大分相区域“海岛”的直径;
10)低分子化后的聚苯醚数均分子量Mn:使用GPC测试制备例所得改性聚苯醚,取GPC谱图主峰位置的数均分子量(Mn),测试流动相为甲苯。
通过上述结果可以看出,制备例1~7采用了含磷酚类化合物,其低分子化后的聚苯醚数均分子量与对比制备例1相差不大,而且通过调节酚类化合物的比例,可以得到不同Mn的产物。
实施例1~8通过采用本发明的含磷低分子量聚苯醚树脂所得树脂组合物,其最大分相“海岛”尺寸的结果均显示<5μm,从而说明本发明的聚苯醚树脂与其它树脂之间具有较好的相容性;实施例8的树脂组合物中加入了熔融二氧化硅作为填料,其Dk相对于实施例1有所升高,但综合性能较优;而对比例1中未采用可溶解性卤素阻燃剂所得树脂组合物,其最大分相“海岛”尺寸的结果显示达到20μm,远远大于实施例1的“海岛”尺寸;对比例2~3采用可溶解性卤素阻燃剂,但未采用本发明的聚苯醚树脂,其最大分相“海岛”尺寸的结果显示均在20~30μm,而且分别与实施例3和实施例1相比其落锤冲击面积较大,即耐冲击性明显较差;对比例4中采用低分子量聚苯醚SA120所得树脂组合物,其最大分相“海岛”尺寸的结果显示至少达到50μm,从而说明其与其它树脂之间的相容性较差,大于实施例3采用本发明的聚苯醚树脂的“海岛”尺寸;对比例5中采用低分子量聚苯醚SA90所得树脂组合物,其最大分相“海岛”尺寸的结果较小,显示为5μm,但是与实施例3相比其玻璃化转变温度太低,介电常数和损耗较高;对比例6中采用了过量的含磷低分子量聚苯醚树脂,其最大分相“海岛”尺寸的结果显示至少达到50μm,而且剥离强度过低;对比例7采用了过少的含磷低分子量聚苯醚树脂,对应的“海岛”尺寸很小,但介电性能明显较差;对比例8中没有采用氰酸酯,其板材玻璃化转变温度明显偏低,而且“海岛”尺寸偏大;对比例9中没有采用氰酸酯,并且环氧树脂含量较低,其所制得的板材易碎,无法测试。
另外,通过实施例1~8可以看出,其得到的板材的Dk值在3.6~3.8,Df值在0.006~0.008之间,明显低于对比例1~5和7~8中的Dk值3.9~4.2和Df值0.009~0.012,表明其介电性能要优于对比例1~5和7~8,而对比例6的Dk和Df虽然较低,但其他性能较差,不能满足应用。
上述结果显示,本发明所得树脂组合物在覆铜板中的应用,有效地改善了板材的介电性能,并提高了板材的剥离强度和耐冲击性能,提高了板材的热分解温度Td,并且对树脂体系的分相“海岛”现象有明显的改善,而且保持了板材的玻璃化转变温度Tg等耐热性能。
通过以上所述,本领域的普通技术人员可以根据本发明的技术方案和技术构思作出其他种类的相应改变和变形,但所有这些改变和变形都应属于本发明权利要求的保护范围。
申请人声明,本发明通过上述实施例来说明本发明的详细组成,但本发明并不局限于上述详细组成,即不意味着本发明必须依赖上述详细组成才能实施。所属技术领域的技术人员应该明了,对本发明的任何改进,对本发明产品各原料的等效替换及辅助成分的添加、具体方式的选择等,均落在本发明的保护范围和公开范围之内。

Claims (24)

1.一种树脂组合物,其特征在于,按重量百分含量包含:
(A)数均分子量为1000~6000的含磷聚苯醚树脂:10%~45%;
(B)环氧树脂组合物:10%~50%;
(C)氰酸酯树脂:10%~50%;
(D)可溶解性卤素阻燃剂:10%~30%;
所述可溶解性卤素阻燃剂在丁酮中的溶解度大于30g/100g丁酮,在甲苯中的溶解度大于10g/100g甲苯;
所述可溶解性卤素阻燃剂为溴化聚碳酸酯、溴化聚苯乙烯、聚溴化苯乙烯或聚溴化基丙烯酸酯中的任意一种或至少两种的组合。
2.如权利要求1所述的树脂组合物,其特征在于,所述含磷聚苯醚树脂是由含磷酚类化合物与聚苯醚合成的。
3.如权利要求2所述的树脂组合物,其特征在于,所述含磷聚苯醚树脂是在引发剂的存在下,将数均分子量2000~40000的原料聚苯醚与悬浮于其溶液中的含磷酚类化合物进行再分配反应得到的数均分子量为1000~6000的含磷聚苯醚树脂。
4.如权利要求2所述的树脂组合物,其特征在于,以原料聚苯醚为100重量份计算,所述含磷酚类化合物的用量为4~50份。
5.如权利要求4所述的树脂组合物,其特征在于,所述含磷酚类化合物为含有一个或两个及以上酚羟基的9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物的衍生物。
6.如权利要求5所述的树脂组合物,其特征在于,所述含磷酚类化合物为含有9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物分别与苯醌、1,4-萘醌、对羟基苯马来酰亚胺或玫红酸的加成物中的任意一种或至少两种的组合。
7.如权利要求6所述的树脂组合物,其特征在于,所述9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物与苯醌的加成物结构式如下所示:
8.如权利要求6所述的树脂组合物,其特征在于,所述9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物与1,4-萘醌的加成物结构式如下所示:
9.如权利要求6所述的树脂组合物,其特征在于,所述9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物与对羟基苯马来酰亚胺的加成物结构式如下所示:
10.如权利要求6所述的树脂组合物,其特征在于,所述9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物与玫红酸的加成物结构式如下所示:
11.如权利要求3所述的树脂组合物,其特征在于,以原料聚苯醚为100重量份计算,所述引发剂的用量为4~30份。
12.如权利要求11所述的树脂组合物,其特征在于,所述引发剂为过氧化二枯基、叔丁基过氧化枯基、过氧化二叔丁基、过氧化异丙基碳酸叔丁酯、2,5-二甲基-2,5-二叔丁基枯基过氧基-3-己炔、2,5-二甲基2,5-二叔丁基过氧化己烷、过氧化氢对孟烷,1,1-双(叔戊基过氧)环己烷、过氧化氢二异丙基苯、过氧化苯甲酰或过氧化苯甲酰衍生物中的任意一种或至少两种的组合。
13.如权利要求2所述的树脂组合物,其特征在于,制备所述含磷聚苯醚树脂的再分配反应中使用催化剂。
14.如权利要求13所述的树脂组合物,其特征在于,所述催化剂为环烷酸的金属盐、五氧化钒、苯胺、胺化合物、季铵盐、咪唑或鏻盐中的任意一种或至少两种的组合。
15.如权利要求1所述的树脂组合物,其特征在于,所述环氧树脂组合物为双酚A型、双酚F型、双酚S型或含有双环戊二烯、苯、萘、芴、联苯、脂环、甲酚酚醛、异氰酸酯或乙内酰脲结构的环氧树脂中的任意一种或至少两种的组合。
16.如权利要求1所述的树脂组合物,其特征在于,所述氰酸酯树脂为2,2-双(4-氰酸苯基)丙烷、双(3,5-二甲基-4-氰酸苯基)甲烷、2,2-双(4-氰酸苯基)乙烷或其衍生物的芳香族氰酸酯化合物中的任意一种或至少两种的组合。
17.如权利要求1所述的树脂组合物,其特征在于,所述树脂组合物还含有促进剂。
18.如权利要求17所述的树脂组合物,其特征在于,所述促进剂为2-甲基咪唑、2-苯基咪唑、2-乙基-4-甲基咪唑、三正丁胺、三苯基磷、季磷化合物、硫脲及其衍生物、三氟化硼络合物、辛酸金属盐、乙酰丙酮金属盐、环烷酸金属盐、水杨酸金属盐或硬脂酸金属盐中的任意一种或者至少两种的组合,其中,所述金属选自锌、铜、铁、锡、钴或铝中的任意一种或者至少两种的组合。
19.如权利要求1所述的树脂组合物,其特征在于,所述树脂组合物还含有填料。
20.如权利要求19所述的树脂组合物,其特征在于,所述填料为二氧化硅、氮化硼、氢氧化铝、勃姆石、滑石、粘土、云母、高岭土、硫酸钡、碳酸钙、氢氧化镁或硼酸锌的任意一种或者至少两种的组合。
21.一种树脂胶液,其特征在于,其是将如权利要求1所述的树脂组合物溶解或分散在溶剂中得到。
22.一种半固化片,其特征在于,其是将基料浸润如权利要求21所述的树脂胶液后,干燥得到。
23.一种层压板,其特征在于,包含至少一张如权利要求22所述的半固化片,进行层压成型制备得到。
24.一种印制电路板,其特征在于,包含至少一张如权利要求23所述的层压板。
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Families Citing this family (13)

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Publication number Priority date Publication date Assignee Title
CN108164751B (zh) * 2017-12-27 2020-01-17 浙江万马泰科新材料有限公司 一种适用于tpv的反应型无卤阻燃剂及其制备方法和应用
JP2019172912A (ja) * 2018-03-29 2019-10-10 旭化成株式会社 ポリフェニレンエーテル、ポリフェニレンエーテル組成物、硬化性組成物、硬化物、及びポリフェニレンエーテルの製造方法
CN109777123B (zh) * 2018-12-25 2021-07-30 广东生益科技股份有限公司 树脂组合物、印刷电路用预浸片及覆金属层压板
CN109825078A (zh) * 2019-01-16 2019-05-31 浙江工业大学之江学院 一种聚苯醚改性氰酸酯树脂覆铜板及其制备方法
CN110951235B (zh) * 2019-12-02 2022-12-20 珠海宏昌电子材料有限公司 一种甲基丙烯酸酯聚苯醚树脂及其制备方法和应用
CN113061395B (zh) * 2021-03-24 2023-04-07 深圳市纽菲斯新材料科技有限公司 一种热固性树脂组合物及其制备方法和应用
CN113214630B (zh) * 2021-05-17 2023-04-21 常州中英科技股份有限公司 一种阻燃型聚芳醚基组合物及其制备的半固化片和热固型高频覆铜板
CN113292718B (zh) * 2021-05-17 2023-06-13 常州中英科技股份有限公司 一种阻燃型聚芳醚基组合物
CN113292824B (zh) * 2021-06-07 2022-03-11 珠海宏昌电子材料有限公司 长链烷基聚苯醚树脂组合物及其应用
CN114752205B (zh) * 2022-05-05 2024-09-06 江苏富比亚化学品有限公司 一种本征无卤阻燃的聚苯醚树脂组合物及其应用
WO2024075629A1 (ja) * 2022-10-03 2024-04-11 パナソニックIpマネジメント株式会社 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板
WO2024101056A1 (ja) * 2022-11-11 2024-05-16 パナソニックIpマネジメント株式会社 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板
CN116512702B (zh) * 2023-05-06 2024-01-23 江苏耀鸿电子有限公司 一种高频高速ppo树脂基覆铜板及其制备工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102051022A (zh) * 2010-12-09 2011-05-11 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的半固化片与层压板
CN102532520A (zh) * 2011-12-29 2012-07-04 广东生益科技股份有限公司 含磷低分子量聚苯醚树脂的制备方法
CN102585480A (zh) * 2011-12-29 2012-07-18 广东生益科技股份有限公司 热固性树脂组合物以及使用其制作的预浸料与印刷电路板用层压板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100094586A (ko) * 2002-09-30 2010-08-26 히다치 가세고교 가부시끼가이샤 인쇄 배선판용 수지 조성물, 및 이것을 사용한 와니스, 프리프레그 및 금속 피복 적층판
WO2009040921A1 (ja) * 2007-09-27 2009-04-02 Panasonic Electric Works Co., Ltd. エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板
JP5233710B2 (ja) * 2008-02-12 2013-07-10 三菱瓦斯化学株式会社 樹脂組成物、プリプレグおよび金属箔張り積層板
CN102762663B (zh) * 2010-01-08 2014-10-22 三菱瓦斯化学株式会社 树脂组合物、预浸料、以及覆金属箔层压板
JP5757039B2 (ja) * 2010-08-30 2015-07-29 株式会社伏見製薬所 オリゴ(フェニレンオキシ)基含有環状ホスフィネート化合物およびその製造方法
JP5846396B2 (ja) * 2011-03-24 2016-01-20 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び樹脂シート並びに金属箔張り積層板
KR101934137B1 (ko) 2011-09-30 2018-12-31 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그 및 금속박 피복 적층판
US9670362B2 (en) * 2011-12-29 2017-06-06 Shengyi Technology Co., Ltd. Thermoset resin composition, and prepreg and laminate for printed circuit board manufactured therefrom
CN103342895B (zh) * 2013-07-29 2015-11-18 苏州生益科技有限公司 一种热固性树脂组合物及使用其制作的半固化片及层压板
CN104892902B (zh) * 2014-03-03 2018-01-05 广东生益科技股份有限公司 一种热固性树脂组合物及其用途
AU2014411037B2 (en) * 2014-11-11 2018-10-25 Shengyi Technology Co., Ltd. Thermosetting resin composition and prepreg and laminated board prepared therefrom

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102051022A (zh) * 2010-12-09 2011-05-11 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的半固化片与层压板
CN102532520A (zh) * 2011-12-29 2012-07-04 广东生益科技股份有限公司 含磷低分子量聚苯醚树脂的制备方法
CN102585480A (zh) * 2011-12-29 2012-07-18 广东生益科技股份有限公司 热固性树脂组合物以及使用其制作的预浸料与印刷电路板用层压板

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