CN103965627B - 一种无卤树脂组合物及由其制备的预浸料和层压板 - Google Patents
一种无卤树脂组合物及由其制备的预浸料和层压板 Download PDFInfo
- Publication number
- CN103965627B CN103965627B CN201410230519.9A CN201410230519A CN103965627B CN 103965627 B CN103965627 B CN 103965627B CN 201410230519 A CN201410230519 A CN 201410230519A CN 103965627 B CN103965627 B CN 103965627B
- Authority
- CN
- China
- Prior art keywords
- halogen
- resin
- resin composition
- epoxy resin
- free
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 26
- -1 ester compound Chemical class 0.000 claims abstract description 48
- 229920005989 resin Polymers 0.000 claims abstract description 48
- 239000011347 resin Substances 0.000 claims abstract description 48
- 239000003822 epoxy resin Substances 0.000 claims abstract description 35
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 35
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 239000007787 solid Substances 0.000 claims abstract description 8
- 238000006243 chemical reaction Methods 0.000 claims abstract description 3
- 239000000203 mixture Substances 0.000 claims description 22
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 15
- 239000011574 phosphorus Substances 0.000 claims description 15
- 229910052698 phosphorus Inorganic materials 0.000 claims description 15
- 239000003292 glue Substances 0.000 claims description 13
- 239000011256 inorganic filler Substances 0.000 claims description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 7
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- 229920001568 phenolic resin Polymers 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- 239000012779 reinforcing material Substances 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 3
- 229930185605 Bisphenol Natural products 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 125000001624 naphthyl group Chemical group 0.000 claims description 3
- 239000004843 novolac epoxy resin Substances 0.000 claims description 3
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- KGSFMPRFQVLGTJ-UHFFFAOYSA-N 1,1,2-triphenylethylbenzene Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 KGSFMPRFQVLGTJ-UHFFFAOYSA-N 0.000 claims description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 2
- 239000005995 Aluminium silicate Substances 0.000 claims description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 2
- JXASPPWQHFOWPL-UHFFFAOYSA-N Tamarixin Natural products C1=C(O)C(OC)=CC=C1C1=C(OC2C(C(O)C(O)C(CO)O2)O)C(=O)C2=C(O)C=C(O)C=C2O1 JXASPPWQHFOWPL-UHFFFAOYSA-N 0.000 claims description 2
- 235000012211 aluminium silicate Nutrition 0.000 claims description 2
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 2
- 229940106691 bisphenol a Drugs 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 235000012241 calcium silicate Nutrition 0.000 claims description 2
- 230000008859 change Effects 0.000 claims description 2
- 239000004927 clay Substances 0.000 claims description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical group NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 2
- 239000000428 dust Substances 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 claims description 2
- 150000002460 imidazoles Chemical class 0.000 claims description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- 150000002790 naphthalenes Chemical class 0.000 claims description 2
- 239000013034 phenoxy resin Substances 0.000 claims description 2
- 229920006287 phenoxy resin Polymers 0.000 claims description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 2
- 239000010456 wollastonite Substances 0.000 claims description 2
- 229910052882 wollastonite Inorganic materials 0.000 claims description 2
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 claims description 2
- QIRNGVVZBINFMX-UHFFFAOYSA-N 2-allylphenol Chemical compound OC1=CC=CC=C1CC=C QIRNGVVZBINFMX-UHFFFAOYSA-N 0.000 claims 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims 1
- 229920001807 Urea-formaldehyde Polymers 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 238000002386 leaching Methods 0.000 claims 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzenecarboxaldehyde Natural products O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 150000002903 organophosphorus compounds Chemical class 0.000 abstract 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 abstract 1
- 238000000034 method Methods 0.000 description 16
- 238000003786 synthesis reaction Methods 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 239000003063 flame retardant Substances 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 239000004744 fabric Substances 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000005587 bubbling Effects 0.000 description 5
- 125000005842 heteroatom Chemical group 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000010992 reflux Methods 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000005711 Benzoic acid Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- DWSWCPPGLRSPIT-UHFFFAOYSA-N benzo[c][2,1]benzoxaphosphinin-6-ium 6-oxide Chemical class C1=CC=C2[P+](=O)OC3=CC=CC=C3C2=C1 DWSWCPPGLRSPIT-UHFFFAOYSA-N 0.000 description 3
- 235000010233 benzoic acid Nutrition 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 230000032050 esterification Effects 0.000 description 3
- 238000005886 esterification reaction Methods 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical group Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000003116 impacting effect Effects 0.000 description 2
- 229910001867 inorganic solvent Inorganic materials 0.000 description 2
- 239000003049 inorganic solvent Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229960003742 phenol Drugs 0.000 description 2
- 230000005070 ripening Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical group CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 229920001730 Moisture cure polyurethane Polymers 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical group [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002635 aromatic organic solvent Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- ZSTLPJLUQNQBDQ-UHFFFAOYSA-N azanylidyne(dihydroxy)-$l^{5}-phosphane Chemical compound OP(O)#N ZSTLPJLUQNQBDQ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- DATWNUNJGBZECY-UHFFFAOYSA-N formaldehyde;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;phenol Chemical compound O=C.OC1=CC=CC=C1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DATWNUNJGBZECY-UHFFFAOYSA-N 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000013521 mastic Substances 0.000 description 1
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000979 retarding effect Effects 0.000 description 1
- 150000003333 secondary alcohols Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
- C07F9/02—Phosphorus compounds
- C07F9/547—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom
- C07F9/6564—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms
- C07F9/6571—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms
- C07F9/657163—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms the ring phosphorus atom being bound to at least one carbon atom
- C07F9/657172—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms the ring phosphorus atom being bound to at least one carbon atom the ring phosphorus atom and one oxygen atom being part of a (thio)phosphinic acid ester: (X = O, S)
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
本发明公开了一种无卤树脂组合物及由其制备的预浸料和层压板。以固体重量总数为100份计,无卤树脂组合物包括:烯丙基改性双马来酰亚胺树脂预聚物:10‑60份;环氧树脂:10‑50份;含磷活性酯化合物:15‑50份;固化剂:0‑30份;固化促进剂:0‑3份。所述含磷活性酯化合物经由有机磷类化合物和苯甲醛化合物,在90~130℃下反应制得。本发明配置了一种具有良好的耐热性、低介电常数和低吸湿率的无卤树脂组合物,解决了现有技术中由于无卤阻燃导致的介电性能、吸湿性能下降的问题;应用该树脂组合物所制备的层压板适用于高密度互连集成电路封装用高性能印制线路板。
Description
技术领域
本发明属于电子材料技术领域,涉及一种无卤树脂组合物,以及采用该组合物制作的预浸料和层压板,应用于集成电路封装、高频高速及高密度互连等领域。
背景技术
信息技术日新月异的今天,电子产品不断地向轻薄化、高可靠性方向发展,高密度互连(HDI)技术的应用成了印刷电路板制作技术的主流,通孔微小化,导线精细化等核心技术的发展,要求制作印刷电路板的基材必须具有高的特性阻抗,即低的介电常数;从印刷电路的制程条件中看,无铅化焊接及多次压合技术的应用,也需要制作的基材具备高的玻璃化转变温度和良好的耐湿热性。因此,良好的耐热性、低的介电常数、优异的加工性成为覆铜板发展的基本性能要求。
双马来酰亚胺树脂是一种高性能的热固性树脂基体,具有优异的耐热性、耐湿热性、介电性能及良好的加工性等,是制作层压板时改性环氧树脂的常用树脂基体。然而,双马来酰亚胺单体具有较高的熔点、溶解性较差、固化后的树脂脆性较大等不足,成为了其应用的掣肘。目前,烯丙基化合物改性双马来酰亚胺树脂是较成熟的技术路线,所制得的改性双马来酰亚胺树脂具有高韧性,优异的溶解性(可溶于丙酮/丁酮等有机溶剂),高的玻璃化转变温度等优异性能。
欧盟的ROHS指令(即在电子电气设备中限制使用某些有害物质指令)提出后,覆铜板基材的无卤化,一直成为研发的重点,制备覆铜板的树脂基体中含磷化合物的引入,成为覆铜板无卤阻燃的主要技术路线。目前,覆铜板领域上广泛采用的磷系阻燃剂主要分为反应型与添加型两种。反应型主要为DOPO类化合物,以含磷环氧树脂、含磷酚醛树脂为主,磷含量在2-10%之间,然而,实际应用中发现,DOPO类化合物具有较大的吸水率和较高的介电常数,且其制成的板材的耐湿热性低;添加型主要为膦腈和磷酸酯类化合物,添加型阻燃剂的阻燃效率相对偏低,需要添加更多的量才能达到阻燃要求,同时,因其较低的熔点(一般低于150℃),在层压板的加工过程中,易“迁移”至板材的表面,影响板材性能。
含磷活性酯是一类新型的反应型阻燃剂,可作为环氧树脂的固化剂,因其固化过程中,不会与环氧基反应生成极性较高的羟基,因此,其固化后的树脂体系具有较低的吸水率与较低的介电常数。中国专利申请CN102838841A中公开了一种树脂组合物,其包含活性酯、含氮环氧树脂以及含磷无卤阻燃剂,具有较好的阻燃性能,但是其中的活性酯仅起到固化剂的作用,由于其采用了磷酸酯、含磷酚醛或磷腈等含磷阻燃剂,导致了电性能的下降,并增加了体系的吸湿率。
因此,需要研发一种新的含磷阻燃的化合物——含磷活性酯,使其在提高树脂组合物阻燃性的前提下,保持组合物具有较低的吸湿率、较好的耐湿热性及优异的介电性能。
发明内容
本发明的发明目的是提供一种无卤树脂组合物,以及使用其制作的预浸料及层压板,以改进层压板的阻燃性能、耐热性和介电性能。
为达到上述发明目的,本发明采用的技术方案是:
一种无卤树脂组合物,其特征在于:以固体重量总数为100份计,包括:
烯丙基改性双马来酰亚胺树脂预聚物 10-60份
环氧树脂 10-50份
含磷活性酯化合物 15-50份
固化剂 0-30份
固化促进剂 0-3份。
上述技术方案中,所述烯丙基改性双马来酰亚胺树脂预聚物由双马来酰亚胺树脂和烯丙基化合物以质量比100∶30~120,在120~170℃下反应30~120min制得;其中,所述双马来酰亚胺树脂选自4,4’- 二苯甲烷双马来酰亚胺树脂、4,4’- 二苯醚双马来酰亚胺树脂、4,4’-二苯异丙基双马来酰亚胺树脂及4,4’- 二苯砜双马来酰亚胺树脂中的一种或一种以上的混合物;
所述烯丙基化合物选自二烯丙基双酚A、二烯丙基双酚S、烯丙基酚氧树脂、烯丙基酚醛树脂及二烯丙基二苯醚中的一种或一种以上的混合物。
上述双马来酰亚胺树脂的单体结构为:
,其中R为:,或;
上述烯丙基化合物的结构为:
,其中R为:,或。烯丙基改性双马来酰亚胺树脂预聚物的含量优先为30-50份。
所述环氧树脂选自:双酚A环氧树脂、双酚F环氧树脂、邻甲酚醛环氧树脂、双酚A酚醛环氧树脂、苯酚酚醛环氧树脂、三官能酚型环氧树脂、四苯基乙烷环氧树脂、联苯型环氧树脂、萘环型环氧树脂、双环戊二烯型环氧树脂、芳烷基线型酚醛环氧树脂、缩水甘油胺型环氧树脂、缩水甘油酯型环氧树脂的一种或一种以上的混合物,其含量优先为20-40份。
所述含磷活性酯化合物的结构式为,
,
式中,R1为甲基、乙基或叔丁基;
Y为H或CH3;
Z为或,其中R为苯基、萘基或者C1~C5的烷基;
n为1~10的整数;
X为:
、、或。
上述活性酯化合物的制备方法,将磷化合物与对羟基苯甲醛,加入50~70%质量浓度的H2SO4中,在90~130℃下加热,冷凝回流3~8hr,再将反应产物通过3~10次醇洗,在95~105℃的真空条件下,干燥3~6hr,得到预产物;将上述所得预产物溶入芳香族有机溶液中,加入苯甲酸或萘基、苯烷基苯甲酸化合物,在100~120℃的温度条件下,加入催化剂,冷凝回流2~8hr,洗涤后在95~105℃的真空条件下干燥3~6hr,即得到所需的含磷活性酯化合物,酯化率为65~85%;其中,所述磷化合物选自9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物、10-(2,5-二羟基苯基)-10-氢-9-氧杂-10-磷杂菲-10-氧化物、10-(2,5-二羟基萘基)-10-氢-9-氧杂-10-磷杂菲-10-氧化物或10-(2,5-二羟基联苯基)-10-氢-9-氧杂-10-磷杂菲-10-氧化物等磷杂菲化合物中的一种或一种以上的混合物。
所述的芳香族有机溶剂可选自甲苯、二甲苯、乙苯、异丙苯。
所述催化剂为AlCl3。
进一步的技术方案,所述含磷活性酯化合物中,以质量计,磷含量为5.2~7.2%。
上述技术方案中,所述的含磷活性酯含量优先为15-40份。
上述技术方案中,所述的固化剂为双氰胺、线性酚醛树脂、二氨基二苯砜中的一种或一种以上的混合物,其含量为优先为0-25份。
上述技术方案中,所述的固化促进剂选自2-甲基咪唑、2-乙基-4-甲基咪唑及2-苯基咪唑或三苯基磷化合物中的一种或一种以上的混合物,其含量为优先0.01-1.5份。
优选的技术方案,所述树脂组合物还含有无机填料,所述无机填料的用量为无卤树脂组合物固体总质量的0~35%;所述无机填料为氢氧化铝、氢氧化镁、硅灰石、二氧化硅微粉、氧化镁、硅酸钙、碳酸钙、粘土、高岭土、玻璃粉、云母粉、二氧化钛、硼酸锌、钼酸锌中的一种或一种以上的混合物。粒径为0.3~20μm,优先选用0.5~5μm。上述无机填料可以直接投入或预先制备填料分散液或制成膏体投入树脂组合物中。
本发明的无卤树脂组合物制作的预浸料,将上述的无卤树脂组合物用溶剂溶解制成胶液,然后将增强材料浸渍在上述胶液中;将浸渍后的增强材料加热干燥,获得所述预浸料。
所述的溶剂选自丙酮、丁酮、甲基异丁酮、N、N-二甲基甲酰胺、N、N-二甲基乙酰胺、乙二醇甲醚、丙二醇甲醚中的一种或几种的混合物;所述的增强材料为天然纤维、有机合成纤维、有机织物或者无机织物;所述的预浸料的烘干温度为130~190℃,时间为3~20min。
本发明的层压板,在至少一张上述预浸料的单面或双面覆上金属箔,热压成形,得到所述层压板。
所述层压板压合时的压力条件为5~35kg/cm2,压合温度为180~210℃,压合时间为70~200min;所述预浸料的数量是根据客户要求的层压板厚度来确定,可用一张或多张;所述金属箔,可以是铜箔,也可以是铝箔,它们的厚度没有特别限制。
由于上述技术方案运用,本发明与现有技术相比具有下列优点:
1、本发明利用含磷活性酯化合物作为阻燃剂,其与环氧树脂反应时,不产生极性较大的羟基,赋予了树脂体系较好的介电性能,同时含磷活性酯化合物耐湿热性好,大大提高了树脂体系的耐湿热性能;
2、本发明的无卤树脂组合物所制成的胶液均一性好,制成的层压板基材具有无卤阻燃、优异的耐热性及低的介电常数。
附图说明
图1是合成例一产物的核磁共振谱图(13C);
图2是合成例一产物的核磁共振谱图(1H)。
具体实施方式
下面结合实施例对本发明作进一步描述:
先进行原料的合成。
合成例一:
含磷活性酯化合物的制备1:
称量0.6mol的10-(2,5-二羟基苯基)-10-氢-9-氧杂-10-磷杂菲-10-氧化物与0.6mol的对羟基苯甲醛,加入65%质量浓度的H2SO4,在100℃加热条件下冷凝回流3~5hr,再将该混合物通过4~6次醇洗,得到预产物;将上述所得预产物溶入甲苯溶液中,加入0.2mol苯甲酸,在120℃的温度条件下,加入0.05mol的催化剂(AlCl3),冷凝回流4hr,然后经过数次洗涤后,在105℃的真空条件下,干燥4hr,即得到所需的含磷活性酯化合物,酯化率为70~80%,磷含量为6.4%的含磷活性酯化合物,记为C1,具体结构如下:
X=,Y=H,Z=,R为苯基,R1=CH3,n为3~5。
上述产物的核磁共振谱图(13C)如图1所示,165ppm处峰位较强,表明树脂中含有具有活性的酯成分,核磁共振谱图(1H)如图2所示,7-8ppm主要为苯环上所对应的峰位,3-4ppm主要为DOPO与CH2相连接对应的峰位,以上说明此合成化合物符合含磷活性酯化合物的结构特征。
含磷活性酯化合物的制备2:
称量0.6mol的9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物与0.6mol的对羟基苯甲醛,加入65%质量浓度的H2SO4,在105℃加热条件下冷凝回流3~5hr,再将该混合物通过4~8次醇洗,得到预产物;将上述所得预产物溶入甲苯溶液中,加入0.2mol苯甲酸,在120℃的温度条件下,加入0.05mol的催化剂(AlCl3),冷凝回流4hr,然后经过数次洗涤后,在105℃的真空条件下,干燥4hr,即得到所需的含磷活性酯化合物,酯化率为75~85%,磷含量为7.2%的含磷活性酯化合物,记为C2,具体结构如下:
X=,Y=H,Z=,R为苯基,R1=CH3,n为3~5。
合成例二:
烯丙基改性双马来酰亚胺预聚物的合成
将100份4,4’-二苯甲烷双马来酰亚胺树脂与50份二烯丙基双酚A化合物,在135℃温度下,反应80min,然后冷却至室温,即得到所需的烯丙基改性双马来酰亚胺树脂预聚物A1,其分子量为2000~4000g/mol;
将100份4,4’-二苯醚双马来酰亚胺树脂与100份二烯丙基双酚A烯丙基化合物,在155℃温度下,反应50min,然后冷却至室温,即得到所需的烯丙基改性双马来酰亚胺树脂预聚物A2,其分子量为4001~6000g/mol。
实施例:
按照表1所示重量比将烯丙基改性双马来酰亚胺预聚物、环氧树脂物、含磷活性酯化合物、固化剂、固化促进剂及无机填料和溶剂加入到混胶釜中,控制胶液固体含量为65%,搅拌均匀,并熟化8hr,制成树脂组合物胶液;继而将玻璃布浸渍在上述树脂组合物胶液中;然后将浸渍后的玻璃布经155~175℃烘烤4~7min后形成预浸料;将预浸料裁剪至一定尺寸后将8张预浸料叠加形成叠构,在叠构上下各放置一张电解铜箔,送入真空压机中压合,程序为150℃/60min+200℃/120min,制得层压板。
对比例
按照表1所示重量比将烯丙基改性双马来酰亚胺预聚物、环氧树脂、含磷阻燃剂、固化剂、固化促进剂及无机填料和溶剂加入到混胶釜中,控制胶液固体含量为65%,搅拌均匀,并熟化8hr,制成树脂组合物胶液;继而将玻璃布浸渍在上述树脂组合物胶液中;然后将浸渍后的玻璃布经165℃烘烤5min后形成预浸料;将预浸料裁剪至一定尺寸后将8张预浸料叠加形成叠构,在叠构上下各放置一张电解铜箔,送入真空压机中压合,程序为150℃/60min+200℃/120min,制得层压板。
表1无卤树脂组合物配方
注:A表示烯丙基改性双马来酰亚胺树脂预聚物,见合成例二;
B表示环氧树脂,B1:联苯型环氧树脂、B2:双环戊二烯型环氧树脂;
C表示含磷活性酯化合物,见合成例一;
D表示现有含磷阻燃剂,D1:含磷环氧树脂,CHIN YEE,DPE 325,磷含量为3.4%wt、D2:含磷酚醛树脂,Dow 92741,磷含量为9.4%wt、D3:磷腈化合物,惠州盛世达科技有限公司,SPB 100,磷含量为13.4%wt;
E表示固化剂,线性酚醛树脂,圣泉化工,PF8020;
F表示固化促进剂,2-乙基-4-甲基咪唑;
G表示无机填料,二氧化硅,粒径0.5~5μm。
上述实施例以及对比例制备的层压板特性的测试方法如下:
(1)玻璃化转变温度(Tg):
根据差示扫描量热法,按照IPC-TM-650 2.4.25所规定的DSC方法进行测定;
(2)剥离强度(PS):
按照IPC-TM-650 2.4.8方法中的“热应力后”实验条件,测试金属盖层的剥离强度;
(3)浸锡耐热性:
使用50×50mm的两面带铜样品,浸入288℃的焊锡中,记录样品分层气泡的时间;
(4)潮湿处理后浸锡耐热性及吸水率:
将3块100×100mm的基材试样在121℃、105Kpa的加压蒸煮处理装置内保持2hr后,浸入288℃的焊锡槽中2min,观察试样是否发生分层鼓泡等现象,3块均未发生分层鼓泡记为3/3,2块未发生分层鼓泡记为2/3,1块未发生分层鼓泡记为1/3,0块未发生分层鼓泡记为0/3;同时,称取做潮湿处理前后的质量,计算板材经过处理前后增加的质量比,即为吸水率;
(5)热分解温度Td:
按照IPC-TM-650 2.4.26方法进行测定;
(6)介电常数:
按照IPC-TM-650 2.5.5.9使用平板法,测定1GHz下的介电常数;
(7)介质损耗角正切:
按照IPC-TM-650 2.5.5.9使用平板法,测定1GHz下的介电损耗因子;
(8)落锤冲击韧性(层压板脆性):
使用冲击仪,冲击仪落锤高度45cm,下落重锤重量1kg;
韧性好与差的评判:十字架清晰,说明产品的韧性越好,以字符☆表示;十字架模糊,说明产品的韧性差、脆性大,以字符◎表示;十字架清晰程度介于清晰与模糊之间说明产品韧性一般,以字符◇表示;
(9)热分层时间T-300:
按照IPC-TM-650 2.4.24方法进行测定;
(10)热膨胀系数Z轴CTE(TMA):
按照IPC-TM-650 2.4.24 方法进行测定;
(11)耐燃烧性(难燃性):
依据UL94法测定。
表2为实施例一至五和对比例一至四中层压板的测试结果,如表中数据所示,在无卤树脂组合物中引入含磷活性酯化合物,可与树脂组合物中的环氧树脂反应,作为树脂组合物中固化剂的一部分;由本发明的无卤树脂组合物制备的层压板具有较低的介电常数值、较低的吸水率以及较好的耐湿热性能;避免了现有技术中含磷树脂(对比例一、二和三)的存在而导致的吸水率增大,耐湿热性下降,且介电常数较高的问题。
综上,含磷活性酯化合物的引入,可以保持无卤树脂组合物在符合阻燃要求时,具有较低的介电常数、较低的吸水率、优异的耐湿热性以及良好的机械性能。
表2 无卤树脂组合物配方
Claims (9)
1.一种无卤树脂组合物,其特征在于:以固体重量总数为100份计,包括:
烯丙基改性双马来酰亚胺树脂预聚物 10-60份
环氧树脂 10-50份
含磷活性酯化合物 15-50份
固化剂 0-30份
固化促进剂 0-3份;
所述含磷活性酯化合物的结构式为,
,
式中,R1为甲基、乙基或叔丁基;
Y为H或CH3;
Z为或,其中R为苯基、萘基或者C1~C5的烷基;
n为1;
X为:、、或。
2.根据权利要求1所述的无卤树脂组合物,其特征在于:所述烯丙基改性双马来酰亚胺树脂预聚物由双马来酰亚胺树脂和烯丙基化合物以质量比100∶30~120,在120~170℃下反应30~120min制得;其中,所述双马来酰亚胺树脂选自4,4’- 二苯甲烷双马来酰亚胺树脂、4,4’- 二苯醚双马来酰亚胺树脂、4,4’-二苯异丙基双马来酰亚胺树脂及4,4’- 二苯砜双马来酰亚胺树脂中的一种或一种以上的混合物;所述烯丙基化合物选自二烯丙基双酚A、二烯丙基双酚S、烯丙基酚氧树脂、烯丙基酚醛树脂及二烯丙基二苯醚中的一种或一种以上的混合物。
3.根据权利要求1中所述的无卤树脂组合物,其特征在于:所述环氧树脂选自:双酚A环氧树脂、双酚F环氧树脂、邻甲酚醛环氧树脂、双酚A酚醛环氧树脂、苯酚酚醛环氧树脂、三官能酚型环氧树脂、四苯基乙烷环氧树脂、联苯型环氧树脂、萘环型环氧树脂、双环戊二烯型环氧树脂、缩水甘油胺型环氧树脂、缩水甘油酯型环氧树脂的一种或一种以上的混合物。
4.根据权利要求1中所述的无卤树脂组合物,其特征在于:所述含磷活性酯化合物中,以质量计,磷含量为5.2~7.2%。
5.根据权利要求1中所述的无卤树脂组合物,其特征在于:所述的固化剂为双氰胺、线性酚醛树脂、二氨基二苯砜中的一种或一种以上的混合物。
6.根据权利要求1中所述的无卤树脂组合物,其特征在于:所述的固化促进剂选自2-甲基咪唑、2-乙基-4-甲基咪唑及2-苯基咪唑或三苯基磷化合物中的一种或一种以上的混合物。
7.根据权利要求1中所述的无卤树脂组合物,其特征在于:所述树脂组合物还含有无机填料,所述无机填料的用量为无卤树脂组合物固体总质量的0~35%;所述无机填料为氢氧化铝、氢氧化镁、硅灰石、二氧化硅微粉、氧化镁、硅酸钙、碳酸钙、粘土、高岭土、玻璃粉、云母粉、二氧化钛、硼酸锌、钼酸锌中的一种或一种以上的混合物。
8.一种采用如权利要求1所述的无卤树脂组合物制作的预浸料,其特征在于:将权利要求1所述的无卤树脂组合物用溶剂溶解制成胶液,然后将增强材料浸渍在上述胶液中;将浸渍后的增强材料加热干燥,获得所述预浸料。
9.一种采用如权利要求1所述的无卤树脂组合物制作的层压板,其特征在于:在至少一张由权利要求8得到的预浸料的单面或双面覆上金属箔,热压成形,得到所述层压板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410230519.9A CN103965627B (zh) | 2014-05-28 | 2014-05-28 | 一种无卤树脂组合物及由其制备的预浸料和层压板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410230519.9A CN103965627B (zh) | 2014-05-28 | 2014-05-28 | 一种无卤树脂组合物及由其制备的预浸料和层压板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103965627A CN103965627A (zh) | 2014-08-06 |
CN103965627B true CN103965627B (zh) | 2016-08-31 |
Family
ID=51235650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410230519.9A Active CN103965627B (zh) | 2014-05-28 | 2014-05-28 | 一种无卤树脂组合物及由其制备的预浸料和层压板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103965627B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105778413B (zh) * | 2014-12-26 | 2018-11-27 | 广东生益科技股份有限公司 | 一种无卤环氧树脂组合物以及使用它的预浸料和层压板 |
CN110561856A (zh) * | 2019-09-24 | 2019-12-13 | 苏州益可泰电子材料有限公司 | 电子材料及其应用 |
CN114605780B (zh) * | 2020-12-09 | 2023-09-12 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及包含其的预浸料、层压板、电路基板和印刷电路板 |
CN114634708B (zh) * | 2020-12-16 | 2024-03-29 | 广东生益科技股份有限公司 | 一种树脂组合物、使用其的半固化片与覆铜箔层压板 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1200970C (zh) * | 2003-08-19 | 2005-05-11 | 梁国正 | 改性双马来酰亚胺树脂与制备方法及在覆铜板中的应用 |
JP2009019171A (ja) * | 2007-07-13 | 2009-01-29 | Kyocera Chemical Corp | ダイボンディングペースト |
CN101735456A (zh) * | 2009-11-24 | 2010-06-16 | 广东生益科技股份有限公司 | 高耐热的热固性树脂组合物及采用其制作的半固化片及覆铜箔层压板 |
CN101735611B (zh) * | 2009-11-24 | 2011-11-16 | 广东生益科技股份有限公司 | 高导热的热固性树脂组合物及采用其制作的半固化片及覆铜箔层压板 |
JP5557033B2 (ja) * | 2010-10-22 | 2014-07-23 | Dic株式会社 | リン原子含有オリゴマー、その製造方法、硬化性樹脂組成物、その硬化物、及びプリント配線基板 |
CN103265791B (zh) * | 2013-05-29 | 2015-04-08 | 苏州生益科技有限公司 | 一种用于集成电路的热固性树脂组合物及使用其制作的半固化片及层压板 |
-
2014
- 2014-05-28 CN CN201410230519.9A patent/CN103965627B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN103965627A (zh) | 2014-08-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103965624B (zh) | 一种无卤树脂组合物、由其制备的预浸料及层压板 | |
CN103980708B (zh) | 用于集成电路的无卤阻燃热固性树脂组合物、半固化片及层压板 | |
CN103980704B (zh) | 用于高频高速基板的无卤树脂组合物、半固化片及层压板 | |
CN103834168B (zh) | 一种无卤阻燃型树脂组合物 | |
CN103265791B (zh) | 一种用于集成电路的热固性树脂组合物及使用其制作的半固化片及层压板 | |
JP6129277B2 (ja) | 低誘電のリン含有ポリエステル化合物の組成及びその調製方法 | |
CN103992641B (zh) | 热固性树脂组合物及使用其制作的半固化片和层压板 | |
JP6470400B2 (ja) | 銅張板用高ctiハロゲンフリーエポキシ樹脂組成物及びその使用方法 | |
CN102838864B (zh) | 一种树脂组合物及使用其制作的半固化片及层压板 | |
CN103265810B (zh) | 一种用于高频高速基板的树脂组合物及使用其制作的半固化片及层压板 | |
CN104109347B (zh) | 一种无卤热固性树脂组合物、半固化片及层压板 | |
CN103980667B (zh) | 集成电路用热固性树脂组合物、半固化片及层压板 | |
CN105315615B (zh) | 一种环氧树脂组合物以及使用其制作的半固化片与覆铜箔层压板 | |
CN102174242B (zh) | 一种无卤树脂组合物及使用其制作的半固化片及层压板 | |
CN105778430A (zh) | 一种环氧树脂组合物以及使用它的预浸料和层压板 | |
CN108219371A (zh) | 环氧树脂组合物、预浸料、层压板和印刷电路板 | |
CN103965627B (zh) | 一种无卤树脂组合物及由其制备的预浸料和层压板 | |
CN103435973A (zh) | 一种无卤环氧树脂组合物及使用其制作的半固化片及层压板 | |
CN103342894B (zh) | 热固性树脂组合物及使用其制作的半固化片及层压板 | |
TWI548690B (zh) | 用於電用層板、高密度互連件以及互連基板應用之高性能熱固性樹脂 | |
CN109851997A (zh) | 一种热固性树脂组合物及使用其的预浸料、层压板和覆金属箔层压板 | |
CN107227001B (zh) | 一种无卤热固性树脂组合物以及含有它的预浸料、层压板和印制电路板 | |
CN109651763A (zh) | 一种热固性树脂组合物及使用其的预浸料、层压板和覆金属箔层压板 | |
CN103965588A (zh) | 无卤热固性树脂组合物、半固化片及层压板 | |
CN105801814B (zh) | 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |