WO2016074289A1 - 一种热固性树脂组合物及用其制作的预浸料与层压板 - Google Patents

一种热固性树脂组合物及用其制作的预浸料与层压板 Download PDF

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Publication number
WO2016074289A1
WO2016074289A1 PCT/CN2014/092840 CN2014092840W WO2016074289A1 WO 2016074289 A1 WO2016074289 A1 WO 2016074289A1 CN 2014092840 W CN2014092840 W CN 2014092840W WO 2016074289 A1 WO2016074289 A1 WO 2016074289A1
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Prior art keywords
parts
epoxy resin
weight
bisphenol
resin composition
Prior art date
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PCT/CN2014/092840
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English (en)
French (fr)
Inventor
方克洪
李辉
Original Assignee
广东生益科技股份有限公司
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Priority claimed from CN201410633139.XA external-priority patent/CN104371320B/zh
Application filed by 广东生益科技股份有限公司 filed Critical 广东生益科技股份有限公司
Priority to JP2017525596A priority Critical patent/JP6546993B2/ja
Priority to EP14905775.4A priority patent/EP3219760B1/en
Priority to KR1020177015915A priority patent/KR101915919B1/ko
Priority to US15/525,900 priority patent/US20180304604A1/en
Priority to AU2014411038A priority patent/AU2014411038B2/en
Publication of WO2016074289A1 publication Critical patent/WO2016074289A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4028—Isocyanates; Thioisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4261—Macromolecular compounds obtained by reactions involving only unsaturated carbon-to-carbon bindings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
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    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
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    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L35/06—Copolymers with vinyl aromatic monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2335/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Derivatives of such polymers
    • C08J2335/06—Copolymers with vinyl aromatic monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08J2371/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/22—Halogen free composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Definitions

  • the present invention relates to the field of laminate technology, and in particular to a resin composition, and more particularly to a thermosetting resin composition and a prepreg, a laminate and a printed circuit board produced therefrom.
  • halogen-containing flame retardants especially bromine-based flame retardants
  • polymer flame retardant materials have a good flame retardant effect.
  • halogen-containing flame retardants especially bromine-based flame retardants
  • people have made in-depth research on the fire site and concluded that although the flame retardant effect of the halogen-containing flame retardant is good and the amount of addition is small, the polymer material using the halogen-containing flame retardant will generate a large amount of toxic during the combustion process. Corrosive gases and fumes cause suffocation and are more harmful than the fire itself.
  • CN101796132B proposes an epoxy resin, a low molecular weight phenol-modified polyphenylene ether and a cyanate ester composition, which have excellent dielectric properties and can maintain flame retardancy. Has high heat resistance.
  • the epoxy composition is flame retardant using a bromine-based flame retardant, and although it has excellent comprehensive properties, these flame retardants containing bromine components are easily contaminated by the environment when the product is manufactured, used, or even recycled or discarded. It is difficult to meet the requirements of green environmental protection.
  • CN103013110A proposes a cured product using cyanate ester, styrene-maleic anhydride, polyphenylene ether, bismaleimide, and a low dielectric constant and low dielectric loss using a phosphorus-nitrogen compound as a flame retardant.
  • An object of the present invention is to provide a resin composition, particularly a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board produced therefrom.
  • the present invention adopts the following technical solutions:
  • the present invention provides a thermosetting resin composition
  • a thermosetting resin composition comprising, by weight: 50-150 parts of cyanate ester; 30-120 parts of epoxy resin; phenyl propylene-maleic anhydride 20- 70 parts; 20-100 parts of polyphenylene ether; 30-100 parts of halogen-free flame retardant; 0.05-5 parts of curing accelerator; 50-200 parts of filler;
  • x is 1-4, 6, 8; n is 1-12; x, n are integers.
  • the styrene-maleic anhydride is contained in an amount of 20 to 70 parts by weight, and may be, for example, 20 parts by weight, 25 parts by weight, 30 parts by weight, 35 parts by weight, 40 parts by weight, 45 parts by weight, or 50 parts by weight. Parts by weight, 55 parts by weight, 60 parts by weight, 65 parts by weight, 70 parts by weight.
  • the invention adopts phenyl propylene-maleic anhydride, which not only makes the substrate have low dielectric constant and dielectric loss, but also increases the steric hindrance due to the presence of methyl groups, increases the rotational steric hindrance in the molecular chain, and the molecular chain rigidity of the polymer.
  • the increase is to improve the heat resistance of the substrate, and the hydrophobic property of the methyl group can significantly improve the moisture resistance of the substrate.
  • the cyanate ester used in the present invention is selected from at least one of the following chemical structural formulas:
  • X 1 and X 2 are each independently at least one R, Ar, SO 2 or O;
  • R is selected from -C(CH 3 ) 2 -, -CH(CH 3 )-, -CH 2 - or substituted or unsubstituted a substituted dicyclopentadienyl group;
  • Ar is selected from the group consisting of substituted or unsubstituted benzene, biphenyl, naphthalene, phenolic, bisphenol A, bisphenol A phenol, bisphenol F or bisphenol F phenolic;
  • n is an integer greater than or equal to 1;
  • Y is an aliphatic functional group or an aromatic functional group.
  • the content of the cyanate ester is 50 to 150 parts by weight, and may be, for example, 50 parts by weight, 60 parts by weight, 65 parts by weight, 70 parts by weight, 75 parts by weight, 80 parts by weight, 85 parts by weight, 90 parts by weight, 95 parts by weight, 100 parts by weight, 105 parts by weight, 110 parts by weight, 115 parts by weight, 120 parts by weight, 125 parts by weight, 130 parts by weight, 135 parts by weight, 140 parts by weight, 145 parts by weight, 150 parts by weight Share.
  • thermosetting resin composition of the present invention The heat resistance and dielectric properties of the system can be remarkably improved by the addition of cyanate ester in the thermosetting resin composition of the present invention.
  • the epoxy resin used in the present invention is bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, bisphenol Z type epoxy resin, bisphenol M type epoxy resin, double Phenolic AP type epoxy resin, bisphenol TMC type epoxy resin, biphenyl epoxy resin, alkyl novolac epoxy resin, dicyclopentadiene ring Oxygen resin, bisphenol A novolac epoxy resin, o-cresol novolac epoxy resin, phenol novolac epoxy resin, trifunctional epoxy resin, tetrafunctional epoxy resin, isocyanate modified epoxy resin or naphthalene ring Any one or a mixture of at least two of oxygen resins.
  • the epoxy resin is contained in an amount of 30 to 120 parts by weight, and may be, for example, 30 parts by weight, 35 parts by weight, 40 parts by weight, 45 parts by weight, 50 parts by weight, 55 parts by weight, 60 parts by weight, 65 parts by weight, 70 parts by weight, 75 parts by weight, 80 parts by weight, 85 parts by weight, 90 parts by weight, 95 parts by weight, 100 parts by weight, 110 parts by weight, and 120 parts by weight.
  • thermosetting resin composition of the present invention can greatly improve the processability due to the incorporation of an epoxy resin.
  • the polyphenylene ether used in the present invention is a low molecular weight polyphenylene ether having a number average molecular weight of from 1,000 to 4,000.
  • the polyphenylene ether is contained in an amount of 20 to 100 parts by weight, and may be, for example, 20 parts by weight, 25 parts by weight, 30 parts by weight, 35 parts by weight, 40 parts by weight, 45 parts by weight, 50 parts by weight, 55 parts by weight, 60 parts by weight, 65 parts by weight, 70 parts by weight, 75 parts by weight, 80 parts by weight, 85 parts by weight, 90 parts by weight, 95 parts by weight, 100 parts by weight.
  • thermosetting resin composition of the invention can greatly reduce the dielectric constant and dielectric loss of the sheet by adding polyphenylene ether, and the use of the polyphenylene ether can also improve the toughness of the sheet, and the use of the sheet in the high frequency multilayer circuit board is positive influence.
  • the halogen-free flame retardant used in the present invention is phosphazene, ammonium polyphosphate, tris(2-carboxyethyl)phosphine, tris(isopropylchloro)phosphate, trimethylphosphate, dimethyl-methyl Phosphate, resorcinol bis-xylyl phosphate, phosphorus-nitrogen compound, melamine polyphosphate, melamine cyanurate, tris-hydroxyethyl isocyanurate, 9,10-dihydro-9-oxygen Any one or a mixture of at least two of a hetero-10-phosphaphenanthrene-10-oxide or a DOPO-containing phenolic resin.
  • the halogen-free flame retardant is contained in an amount of 30 to 100 parts by weight, and may be, for example, 30 parts by weight, 35 parts by weight, 40 parts by weight, 45 parts by weight, 50 parts by weight, 60 parts by weight, 70 parts by weight. Share, 80 parts by weight, 90 parts by weight, 100 parts by weight.
  • the curing accelerator used in the present invention is any one or a mixture of at least two of an imidazole, a metal salt, a tertiary amine or a piperidine compound.
  • the curing accelerator is 2-methylimidazole, undecylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 1-cyanoethyl substituted imidazole, benzyl di Any one or a mixture of at least two of methylamine, cobalt acetylacetonate, copper acetylacetonate or zinc isooctanoate.
  • the curing accelerator is contained in an amount of 0.05 to 5 parts by weight, for example, 0.05 parts by weight, 1 part by weight, 1.5 parts by weight, 2 parts by weight, 2.5 parts by weight, 3 parts by weight, 3.5 parts by weight, 4 parts by weight, 4.5 parts by weight, and 5 parts by weight.
  • the filler used in the present invention is an inorganic or organic filler.
  • the filler is an inorganic filler
  • the inorganic filler is aluminum hydroxide, aluminum oxide, magnesium hydroxide, magnesium oxide, aluminum oxide, silicon dioxide, calcium carbonate, aluminum nitride, boron nitride. Any one or a mixture of at least two of silicon carbide, titanium dioxide, zinc oxide, zirconium oxide, mica, boehmite, calcined talc, talc, silicon nitride or calcined kaolin.
  • the filler is an organic filler
  • the organic filler is any one of a polytetrafluoroethylene powder, a polyphenylene sulfide or a polyethersulfone powder or a mixture of at least two.
  • the filler has a particle diameter of 0.01 to 50 ⁇ m, and may be, for example, 0.01 ⁇ m, 0.05 ⁇ m, 1 ⁇ m, 5 ⁇ m, 10 ⁇ m, 15 ⁇ m, 20 ⁇ m, 25 ⁇ m, 30 ⁇ m, 40 ⁇ m, 50 ⁇ m, preferably 1 to 15 ⁇ m, further preferably 1-5 ⁇ m.
  • a dispersing agent may be added, and the dispersing agent used is an aminosilane coupling agent or an epoxy silane coupling agent for improving inorganic and woven glass cloth.
  • the amount of use is 0.5-2% by weight of the inorganic filler, if the amount used is too high, Then the reaction is accelerated, affecting the storage time, and if the dosage is too small, the effect of improving the binding stability is not significantly improved.
  • the present invention also provides a prepreg produced using the thermosetting resin composition according to the first aspect of the invention, the prepreg comprising a base material; and thermosetting adhered thereto by dipping and drying Resin composition.
  • the matrix material of the present invention is a nonwoven or woven fiberglass cloth.
  • the present invention also provides a laminate comprising the prepreg according to the second aspect of the invention.
  • the invention also provides a printed circuit board comprising the laminate of the third aspect of the invention.
  • the present invention has the following beneficial effects:
  • the prepreg and the laminate prepared by using the thermosetting resin composition of the invention have low dielectric constant and low dielectric loss, and the dielectric constant can be controlled below 3.6, the dielectric loss is between 0.0040 and 0.0046, and the flame retardant is excellent.
  • Comprehensive properties such as heat resistance, heat resistance and moisture resistance, the flame retardancy can reach the V-0 standard in the flame retardancy test UL-94, and the PCT water absorption rate is 0.29-0.32, which is suitable for the halogen-free high-frequency multilayer circuit board. Used in.
  • the monomeric maleic anhydride and the initiator are added to the medium to dissolve, and when heated to 60-80 ° C, the monomer phenyl propylene and the molecular weight regulator are added dropwise, and stirring is continued after the dropwise addition is completed.
  • the reaction is carried out for 1-8h to obtain a dispersion system of low molecular weight phenylpropene/maleic anhydride polymer particles, and the dispersion system is obtained.
  • the initiator is an organic peroxide or an azo compound
  • the medium is a mixed solution of an organic acid alkyl ester and an alkane
  • the molecular weight modifier is vinyl acetate; the relationship between the amount of maleic anhydride and styrene, the molar ratio is 1:0.90-0.96; the sum of the mass concentrations of the two monomers maleic anhydride and styrene in the reaction system It is 2.0-7.5%; the mass concentration of the initiator in the reaction system is 0.05-0.35%; the mass concentration of the molecular weight regulator in the reaction system is 0.10-0.45%; the organic acid alkyl group in the mixed solution of the alkyl acid ester of the organic acid and the alkane
  • the ester has a volume fraction of 20-80%.
  • x is 1-4, 6, 8; n is 1-12; x, n are integers.
  • Embodiment preparation method of copper-clad laminate
  • the cyanate ester, the epoxy resin, the styrene-maleic anhydride, the polyphenylene ether, the halogen-free flame retardant, the curing accelerator, the filler and the solvent are placed in a container, stirred and uniformly mixed to form a glue.
  • the solvent is adjusted to a solid content of 60%-70% to prepare a glue, that is, a thermosetting resin composition glue is obtained, and the glue is impregnated with 2116 electronic grade glass fiber cloth, baked into a prepreg by an oven, and 6 sheets of 2116 prepreg are taken.
  • the double-sided double-coated 35 ⁇ m thick electrolytic copper foil was vacuum laminated on a hot press and cured at 190 ° C / 120 min to prepare a copper clad laminate.
  • Tg glass transition temperature
  • PS peel strength
  • Dk dielectric constant
  • Df dielectric loss tangent
  • test methods for each performance parameter are as follows:
  • Tg glass transition temperature
  • DSC differential scanning calorimetry
  • the peel strength of the metal cap layer was tested according to the "after thermal stress” experimental conditions in the IPC-TM-650 2.4.8 method;
  • the dielectric constant (Dk) at 1 GHz and the dielectric loss tangent (Df) are measured in accordance with IPC-TM-650 2.5.5.5;
  • the copper-clad laminate was immersed in a copper etching solution to remove the surface copper foil evaluation substrate; the substrate was placed in a pressure cooker, treated at 121 ° C, 2 atm for 2 h, and the water absorption rate was tested, and then immersed in a tin furnace at a temperature of 288 ° C In the case, when the substrate is foamed or split, the corresponding time is recorded. The evaluation was terminated when the substrate did not show foaming or delamination in the tin furnace for more than 5 min.
  • Example 3 and Comparative Example 4 It can be seen from Example 3 and Comparative Example 4 that the dielectric constant, dielectric loss, and PCT water absorption of Example 3 were both lower than Comparative Example 4, and Comparative Example 4 could not pass the 2-hour PCT test, thereby It can be seen that dielectric properties of Example 3 after addition of low molecular weight polyphenylene ether compared to Comparative Example 4, dielectric properties Significantly improved and able to pass the 2-hour PCT test. Comparing Example 3 with Comparative Example 5, although the overall performance of the two was comparable, the use of high molecular weight polyphenylene ether deteriorated workability.
  • the laminate prepared by using the thermosetting resin composition of the present invention has a dielectric constant of 3.6 or less, a dielectric loss of 0.0040 to 0.0046, and excellent flame retardancy. , heat resistance, moisture resistance and other comprehensive properties, its flame retardancy can reach the V-0 standard in the flame retardancy test UL-94, PCT water absorption rate is 0.29-0.32, suitable for halogen-free high-frequency multilayer circuit board use.
  • thermosetting resin composition provided by the present invention has low dielectric constant, low dielectric loss, excellent heat resistance, adhesion and the like while ensuring halogen-free flame retardant, and is suitable for halogen-free. Used in high frequency multilayer boards.

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Abstract

本发明涉及一种热固性树脂组合物及用其制作的预浸料与层压板，所述的热固性树脂组合物按重量份包括如下组分：氰酸酯50-150份；环氧树脂30-120份；苯丙烯-马来酸酐20-70份；聚苯醚20-100份；无卤阻燃剂30-100份；固化促进剂0.05-5份；填料50-200份。用所述热固性树脂组合物制作的预浸料与层压板，具有低介电常数、低介质损耗、优异的阻燃性、耐热性及耐湿性等综合性能，适合在无卤高频多层电路板中使用。

Description

一种热固性树脂组合物及用其制作的预浸料与层压板 技术领域
本发明涉及层压板技术领域，具体涉及一种树脂组合物，尤其涉及一种热固性树脂组合物及用其制作的预浸料，层压板与印刷电路板。
背景技术
随着电子工业的飞速发展，电子产品向轻、薄、短小、高密度化、安全化、高功能化发展，要求电子元件有更高的信号传播速度和传输效率，这样就对作为载体的印刷电路板提出了更高的性能要求，电子产品信息处理的高速化和多功能化，应用频率不断提高，3GHz以上将逐渐成为主流，除了保持对层压板材料的耐热性有更高的要求外，对其介电常数和介质损耗值要求会越来越低。
现有的传统FR-4很难满足电子产品的高频及高速发展的使用需求，同时基板材料不再是扮演传统意义下的机械支撑角色，而将与电子组件一起成为PCB和终端厂商设计者提升产品性能的一个重要途径。因为高Dk会使信号传递速率变慢，高Df会使信号部分转化为热能损耗在基板材料中，因此具有低介电常数，低介质损耗的高频传输，尤其是无卤高频板材的开发已成为覆铜箔层压板行业的重点。
目前，含卤阻燃剂(特别是溴系阻燃剂)被广泛用于高分子阻燃材料，并起到了较好的阻燃作用。然而人们对火灾现场深入研究后得出结论：虽然含卤阻燃剂的阻燃效果好，且添加量少，但是采用含卤阻燃剂的高分子材料在燃烧过程中会产生大量的有毒且具有腐蚀性的气体和烟雾，使人窒息而死，其危害性比大火本身更为严重。因此，随着欧盟《关于报废电气电子设备指令》和《关于在电气电子设备中限制使用有害物质指令》于2006年7月1日的正式实施， 无卤阻燃印制线路板的开发成为了业内开发工作的重点，各覆铜箔层压板的厂家都纷纷推出自己的无卤阻燃覆铜箔层压板。
为了解决上述问题，CN101796132B提出了使用环氧树脂、低分子化的苯酚改性聚苯醚及氰酸酯组合物，该环氧树脂组合物具备优异的介电特性，而且能够维持阻燃性并具有高耐热性。但该环氧组合物使用溴系阻燃剂阻燃，虽然具有较优异的综合性能，但这些含有溴成份的阻燃剂于产品制造、使用甚至回收或丢弃时都很容易对环境造成污染，难以满足绿色环保的使用要求。
CN103013110A提出了使用氰酸酯、苯丙烯-马来酸酐、聚苯醚、双马来酰亚胺的固化物，并使用磷氮基化合物作阻燃剂可达到低介电常数、低介电损耗、高耐热性及高耐燃性，但双马来酰亚胺固化温度高，且其固化物较脆，在加工及使用过程中有许多不足。
因此，如何生产一种具有低介电常数、低介质损耗，同时保证其耐化学性优良的预浸料及层压板是目前亟待解决的问题。
发明内容
本发明的目的在于提供一种树脂组合物，特别是一种热固性树脂组合物及用其制作的预浸料，层压板与印刷电路板。
为达到此发明目的，本发明采用以下技术方案：
第一方面，本发明提供了一种热固性树脂组合物，该组合物按重量份包括如下组分：氰酸酯50-150份；环氧树脂30-120份；苯丙烯-马来酸酐20-70份；聚苯醚20-100份；无卤阻燃剂30-100份；固化促进剂0.05-5份；填料50-200份；
本发明所采用的苯丙烯-马来酸酐的化学结构式为：
Figure PCTCN2014092840-appb-000001
其中，x为1-4，6，8；n为1-12；x，n均为整数。
在本发明中，所述苯丙烯-马来酸酐的含量为20-70重量份，例如可以是20重量份、25重量份、30重量份、35重量份、40重量份、45重量份、50重量份、55重量份、60重量份、65重量份、70重量份。
本发明采用苯丙烯-马来酸酐，不仅使基材具有低的介电常数及介质损耗，由于甲基的存在使空间位阻增大，分子链内旋转位阻增加，聚合物的分子链刚性增加，从而使基材的耐热性提高，同时甲基具有憎水性能可显著提升基材的耐湿性。
本发明所采用的氰酸酯选自具有下述化学结构式中的至少一种：
Figure PCTCN2014092840-appb-000002
Figure PCTCN2014092840-appb-000003
其中X1、X2各自独立为至少一个R、Ar、SO2或O；R选自-C(CH3)2-、-CH(CH3)-、-CH2-或经取代或未经取代的二环戊二烯基；Ar选自经取代或未经取代的苯、联苯、萘、酚醛、双酚A、双酚A酚醛、双酚F或双酚F酚醛的任意一种；n为大于或等于1的整数；Y为脂肪族官能基或芳香族官能基。
在本发明中，所述氰酸酯的含量为50-150重量份，例如可以是50重量份、60重量份、65重量份、70重量份、75重量份、80重量份、85重量份、90重量份、95重量份、100重量份、105重量份、110重量份、115重量份、120重量份、125重量份、130重量份、135重量份、140重量份、145重量份、150重量份。
本发明的热固性树脂组合物中通过添加氰酸酯能显著提升体系的耐热性及介电性能。
本发明所采用的环氧树脂为双酚A型环氧树脂、双酚F型环氧树脂、双酚AD型环氧树脂、双酚Z型环氧树脂、双酚M型环氧树脂、双酚AP型环氧树脂、双酚TMC型环氧树脂、联苯环氧树脂、烷基酚醛环氧树脂、双环戊二烯环 氧树脂、双酚A型酚醛环氧树脂、邻甲酚型酚醛环氧树脂、苯酚型酚醛环氧树脂、三官能环氧树脂、四官能环氧树脂、异氰酸酯改性环氧树脂或萘型环氧树脂中的任意一种或至少两种的混合物。
在本发明中，所述环氧树脂的含量为30-120重量份，例如可以是30重量份、35重量份、40重量份、45重量份、50重量份、55重量份、60重量份、65重量份、70重量份、75重量份、80重量份、85重量份、90重量份、95重量份、100重量份、110重量份、120重量份。
本发明的热固性树脂组合物中由于混入了环氧树脂，可大大改善加工性能。
本发明所采用的聚苯醚为低分子量聚苯醚，数均分子量在1000-4000。
在本发明中，所述聚苯醚的含量为20-100重量份，例如可以是20重量份、25重量份、30重量份、35重量份、40重量份、45重量份、50重量份、55重量份、60重量份、65重量份、70重量份、75重量份、80重量份、85重量份、90重量份、95重量份、100重量份。
本发明的热固性树脂组合物通过添加聚苯醚可大大降低板材的介电常数及介质损耗，另外聚苯醚的使用还可以改善板材的韧性，对板材在高频多层电路板中的使用有正面影响。
本发明所采用的无卤阻燃剂为磷腈、聚磷酸铵、三(2-羧乙基)膦、三(异丙基氯)磷酸盐、三甲基磷酸盐、二甲基-甲基磷酸盐、间苯二酚双二甲苯基磷酸盐、磷氮基化合物、聚磷酸三聚氰胺、三聚氰胺氰尿酸酯、三-羟乙基异氰尿酸酯、9，10-二氢-9-氧杂-10-磷杂菲-10-氧化物或含DOPO酚醛树脂中的任意一种或至少两种的混合物。
在本发明中，所述无卤阻燃剂的含量为30-100重量份，例如可以是30重量份、35重量份、40重量份、45重量份、50重量份、60重量份、70重量份、 80重量份、90重量份、100重量份。
本发明所采用的固化促进剂为咪唑、金属盐、三级胺或哌啶类化合物中的任意一种或至少两种的混合物。
优选地，所述的固化促进剂为2-甲基咪唑、十一烷基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、1-氰乙基取代咪唑、苄基二甲基胺、乙酰丙酮钴、乙酰丙酮铜或异辛酸锌中的任意一种或至少两种的混合物。
在本发明中，所述固化促进剂的含量为0.05-5重量份，例如可以是0.05重量份、1重量份、1.5重量份、2重量份、2.5重量份、3重量份、3.5重量份、4重量份、4.5重量份、5重量份。
本发明所采用的填料为无机或有机填料。
优选地，所述的填料为无机填料，所述的无机填料为氢氧化铝、氧化铝、氢氧化镁、氧化镁、三氧化二铝、二氧化硅、碳酸钙、氮化铝、氮化硼、碳化硅、二氧化钛、氧化锌、氧化锆、云母、勃姆石、煅烧滑石、滑石粉、氮化硅或煅烧高岭土中的任意一种或至少两种的混合物。
优选地，所述的填料为有机填料，所述的有机填料为聚四氟乙烯粉末、聚苯硫醚或聚醚砜粉末中的任意一种或至少两种的混合物。
优选地，所述填料的粒径为0.01-50μm，例如可以是0.01μm、0.05μm、1μm、5μm、10μm、15μm、20μm、25μm、30μm、40μm、50μm，优选为1-15μm，进一步优选为1-5μm。
为使所述的填料在本发明的树脂组合物中分散均匀，还可以加入分散剂，使用的分散剂为氨基硅烷偶联剂或环氧基硅烷偶联剂，用来改善无机以及织造玻璃布间的结合性能，从而达到分散均匀的目的，且这类偶联剂无重金属存在，不会对人体产生不良影响，使用量为无机填料的0.5-2％重量份，若使用量太高， 则加快反应，影响储存时间，用量太小，则无显著改善结合稳定性的效果。
第二方面，本发明还提供了一种使用如本发明第一方面所述的热固性树脂组合物制作的预浸料，该预浸料包括基体材料；和通过浸渍干燥后附着在其上的热固性树脂组合物。
本发明的基体材料为无纺或有纺玻璃纤维布。
第三方面，本发明还提供了一种层压板，该层压板包括如本发明第二方面所述的预浸料。
第四方面，本发明还提供了一种印刷电路板，其包括如本发明第三方面所述的层压板。
与现有技术相比，本发明具有以下有益效果：
采用本发明的热固性树脂组合物制作的预浸料及层压板具有低介电常数和低介质损耗，其介电常数可控制在3.6以下，介质损耗在0.0040-0.0046之间，同时具有优异的阻燃性、耐热性、耐湿性等综合性能，其阻燃性可达到阻燃性试验UL-94中的V-0标准，PCT吸水率为0.29-0.32，适合在无卤高频多层电路板中使用。
具体实施方式
下面通过具体实施方式来进一步说明本发明的技术方案。
本领域技术人员应该明了，所述实施例仅仅是帮助理解本发明，不应视为对本发明的具体限制。
制备例、苯丙烯-马来酸酐的合成
在氮气保护和搅拌的条件下，将单体马来酸酐和引发剂加入到介质中溶解，并加热至60-80℃时，滴加单体苯丙烯和分子量调节剂，滴加完毕后继续搅拌反应1-8h，得到低分子量苯丙烯/马来酸酐聚合物粒子的分散体系，将分散体系 离心分离、干燥，得到低分子量苯丙烯/马来酸酐交替共聚物；其中，所述的引发剂为有机过氧化物或偶氮化合物；所述的介质为有机酸烷基酯与烷烃的混合溶液；所述的分子量调节剂为乙酸乙烯酯；马来酸酐和苯丙烯的用量关系，按摩尔比为1∶0.90-0.96；反应体系中两种单体马来酸酐和苯丙烯的质量浓度之和为2.0-7.5％；反应体系中引发剂的质量浓度为0.05-0.35％；反应体系中分子量调节剂的质量浓度为0.10-0.45％；有机酸烷基酯与烷烃的混合溶液中有机酸烷基酯的体积分数为20-80％。
得到如下结构式的苯丙烯-马来酸酐：
Figure PCTCN2014092840-appb-000004
其中，x为1-4，6，8；n为1-12；x，n均为整数。
实施例、覆铜箔层压板的制备方法
将氰酸酯、环氧树脂、苯丙烯-马来酸酐、聚苯醚、无卤阻燃剂、固化促进剂、填料及溶剂等，放入容器中，搅拌使其混合均匀，制成胶水，用溶剂调整溶液固体含量至60％-70％而制成胶液，即得到热固性树脂组合物胶液，用2116电子级玻纤布浸渍胶水，经烘箱烘烤成半固化片，取6张2116半固化片，双面再覆上35μm厚电解铜箔，在热压机作真空层压，固化190℃/120min，制成覆铜板。
实施例1-6以及对比例1-5中所用的各组分及其含量(按重量份计)如表1 所示，各组分代号及其对应的组分名称如下所示：
(A)氰酸酯：HF-10(上海慧峰科贸商品名)
(B)环氧树脂
(B-1)联苯型环氧树脂：NC-3000-H(日本化药商品名)
(B-2)双环戊二烯型环氧树脂：HP-7200H(大日本油墨商品名)
(C-1)实施例1中合成的苯丙烯-马来酸酐
(C-2)苯乙烯-马来酸酐低聚物：SMA-EF40(美国Sartomer商品名)
(D-1)低分子量聚苯醚：MX90(SABIC Innovative Plastics商品名)，数均分子量1000-4000
(D-2)高分子量聚苯醚：Sabic640-111(SABIC Innovative Plastics商品名)数均分子量15000-20000
(E)无卤阻燃剂
(E-1)PX-200(日本大八化学株式会社商品名)
(E-2)SPB-100(大琢化学株式会社商品名)
(G)固化促进剂
(H)填料：熔融二氧化硅
实施例1-6和对比例1-5采用的覆铜箔层压板的制备方法与实施例相同。
采用以下方法对实施例1-6和对比例1-5制备的覆铜箔层压板的玻璃化转变温度(Tg)、剥离强度(PS)、介电常数(Dk)与介质损耗角正切值(Df)、阻燃性和PCT 2小时后耐浸焊性及吸水率进行测试，测试结果如表2所示。
各性能参数的测试方法如下：
A玻璃化转变温度(Tg)
根据差示扫描量热法(DSC)，按照IPC-TM-650 2.4.25所规定的DSC方法 进行测定；
B剥离强度(PS)
按照IPC-TM-650 2.4.8方法中的“热应力后”实验条件，测试金属盖层的剥离强度；
C介电常数(Dk)与介质损耗角正切值(Df)
使用条状线的共振法，按照IPC-TM-650 2.5.5.5测定1GHz下的介电常数(Dk)与介质损耗角正切值(Df)；
D阻燃性
按照UL-94标准进行测试；
E PCT 2小时后耐浸焊性及吸水率
将覆铜箔层压板浸渍在铜蚀刻液中，除去表面铜箔评价基板；将基板放置在压力锅中，在121℃，2atm下处理2h，测试吸水率后，浸渍在温度为288℃的锡炉中，当基材出现起泡或分裂时记录相应的时间。当基材在锡炉中超过5min还没有出现起泡或分层时结束评价。
表1
Figure PCTCN2014092840-appb-000005
表2
Figure PCTCN2014092840-appb-000006
从表1及表2的数据可以看出：
(1)通过实施例1-3可以看出，实施例1-3中随着苯丙烯-马来酸酐用量的提升，可以使基材的玻璃化转变温度明显提升，介电性能及PCT吸水率也得以改善；将实施例1和3与比较例1-2相比，实施例1和3的介电性能和吸水率明显低于比较例1-2，说明实施例1和3在添加本发明的苯丙烯-马来酸酐后相比比较例1-2中使用苯乙烯-马来酸酐时可以使介电性能和PCT吸水率都得以改善，并提高基材的玻璃化转变温度；
(2)通过实施例4-6和比较例3可以看出，所用组分需控制在一定重量份范围才能使基材具有较优异的综合性能，比较例3和实施例4相比苯丙烯-马来酸酐用量减少至5份时，其基材的介电性能明显变差，玻璃化转变温度明显降低，而且不能通过2小时PCT测试；
(3)通过实施例3和比较例4可以看出，实施例3的介电常数、介质损耗和PCT吸水率都低于比较例4，而且比较例4不能通过2小时PCT测试，由此可以看出，实施例3添加低分子量聚苯醚后相比比较例4未添加时，介电性能 明显改善，且能通过2小时PCT测试。将实施例3与对比例5相比可知，虽然两者的综合性能相当，但使用高分子量的聚苯醚导致加工性变差。
通过实施例1-6可以得出，采用本发明的热固性树脂组合物制备得到的层压板，其介电常数可控制在3.6以下，介质损耗在0.0040-0.0046之间，同时具有优异的阻燃性、耐热性、耐湿性等综合性能，其阻燃性可达到阻燃性试验UL-94中的V-0标准，PCT吸水率为0.29-0.32，适合在无卤高频多层电路板中使用。
综上所述，本发明所提供的热固性树脂组合物，在保证无卤阻燃的同时具有低介电常数、低介质损耗、优异的耐热性、粘结性等综合性能，适合在无卤高频多层电路板中使用。
当然，以上所述之实施例，只是本发明的较佳实例而已，并非用来限制本发明的实施范围，故凡依本发明申请专利范围所述的原理所做的等效变化或修饰，均包括于本发明申请专利范围内。

Claims (10)

  1. 一种热固性树脂组合物，其特征在于，按重量份包括如下组分：氰酸酯50-150份；环氧树脂30-120份；苯丙烯-马来酸酐20-70份；聚苯醚20-100份；无卤阻燃剂30-100份；固化促进剂0.05-5份；填料50-200份；
    所述的苯丙烯-马来酸酐的化学结构式为：
    Figure PCTCN2014092840-appb-100001
    其中，x为1-4，6，8；n为1-12；x，n均为整数。
  2. 如权利要求1所述的热固性树脂组合物，其特征在于，所述的氰酸酯选自具有下述化学结构式中的至少一种：
    Figure PCTCN2014092840-appb-100002
    Figure PCTCN2014092840-appb-100003
    其中X1、X2各自独立为至少一个R、Ar、SO2或O；R选自-C(CH3)2-、-CH(CH3)-、-CH2-或经取代或未经取代的二环戊二烯基；Ar选自经取代或未经取代的苯、联苯、萘、酚醛、双酚A、双酚A酚醛、双酚F或双酚F酚醛的任意一种；n为大于或等于1的整数；Y为脂肪族官能基或芳香族官能基。
  3. 如权利要求1所述的热固性树脂组合物，其特征在于，所述的环氧树脂为双酚A型环氧树脂、双酚F型环氧树脂、双酚AD型环氧树脂、双酚Z型环氧树脂、双酚M型环氧树脂、双酚AP型环氧树脂、双酚TMC型环氧树脂、联苯环氧树脂、烷基酚醛环氧树脂、双环戊二烯环氧树脂、双酚A型酚醛环氧树脂、邻甲酚型酚醛环氧树脂、苯酚型酚醛环氧树脂、三官能环氧树脂、四官能环氧树脂、异氰酸酯改性环氧树脂或萘型环氧树脂中的任意一种或至少两种的混合物。
  4. 如权利要求1所述的热固性树脂组合物，其特征在于，所述的聚苯醚数均分子量在1000-4000。
  5. 如权利要求1所述的热固性树脂组合物，其特征在于，所述的无卤阻燃剂为磷腈、聚磷酸铵、三(2-羧乙基)膦、三(异丙基氯)磷酸盐、三甲基磷酸盐、二甲基-甲基磷酸盐、间苯二酚双二甲苯基磷酸盐、磷氮基化合物、聚磷酸三聚氰胺、三聚氰胺氰尿酸酯、三-羟乙基异氰尿酸酯、9，10-二氢-9-氧杂-10-磷杂菲-10-氧化物或含DOPO酚醛树脂中的任意一种或至少两种的混合物。
  6. 如权利要求1所述的热固性树脂组合物，其特征在于，所述的固化促进剂为咪唑、金属盐、三级胺或哌啶类化合物中的任意一种或至少两种的混合物；
    优选地，所述的固化促进剂为2-甲基咪唑、十一烷基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、1-氰乙基取代咪唑、苄基二甲基胺、乙酰丙酮钴、乙酰丙酮铜或异辛酸锌中的任意一种或至少两种的混合物。
  7. 如权利要求1所述的热固性树脂组合物，其特征在于，所述的填料为无机或有机填料；
    优选地，所述的填料为无机填料，所述的无机填料为氢氧化铝、氧化铝、氢氧化镁、氧化镁、三氧化二铝、二氧化硅、碳酸钙、氮化铝、氮化硼、碳化硅、二氧化钛、氧化锌、氧化锆、云母、勃姆石、煅烧滑石、滑石粉、氮化硅或煅烧高岭土中的任意一种或至少两种的混合物；
    优选地，所述的填料为有机填料，所述的有机填料为聚四氟乙烯粉末、聚苯硫醚或聚醚砜粉末中的任意一种或至少两种的混合物；
    优选地，所述填料的粒径为0.01-50μm，优选为1-15μm，进一步优选为1-5μm。
  8. 一种使用如权利要求1-7之一所述的热固性树脂组合物制作的预浸料，其特征在于，所述预浸料包括基体材料；和通过浸渍干燥后附着在其上的热固性树脂组合物；
    优选地，所述基体材料为无纺或有纺玻璃纤维布。
  9. 一种层压板，其特征在于，包含如权利要求8所述的预浸料。
  10. 一种印刷电路板，其特征在于，其包含如权利要求9所述的层压板。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115505259A (zh) * 2022-08-17 2022-12-23 山东金宝电子有限公司 一种树脂组合物、树脂胶液、半固化片及其覆铜板

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201900686XA (en) * 2016-07-25 2019-02-27 Isola Usa Corp Improved sma resin formulation
US10759697B1 (en) 2019-06-11 2020-09-01 MSB Global, Inc. Curable formulations for structural and non-structural applications
CN112300538B (zh) * 2020-11-30 2023-08-11 西北师范大学 一种新型无机-有机杂化阻燃环氧树脂材料的制备方法
CN113667196A (zh) * 2021-07-28 2021-11-19 江门市宏儒电子科技有限公司 一种环氧型覆铜板基材及其制备方法和应用
CN116552074B (zh) * 2023-05-05 2023-12-19 江门建滔电子发展有限公司 一种高散热低介电覆铜板及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102181143A (zh) * 2011-04-08 2011-09-14 苏州生益科技有限公司 一种高频用热固性树脂组合物、半固化片及层压板
CN102585480A (zh) * 2011-12-29 2012-07-18 广东生益科技股份有限公司 热固性树脂组合物以及使用其制作的预浸料与印刷电路板用层压板
EP2194098B1 (en) * 2007-09-27 2012-08-15 Panasonic Corporation Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board
CN103013110A (zh) * 2011-09-27 2013-04-03 台光电子材料股份有限公司 无卤素树脂组成物及应用其的铜箔基板及印刷电路板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4034014A (en) * 1970-10-16 1977-07-05 Allied Chemical Corporation Production of polyanhydride epoxide prepolymer compositions
US3929738A (en) * 1970-10-16 1975-12-30 Allied Chem Production of low molecular weight polyanhydride compounds
KR100561070B1 (ko) * 2003-09-05 2006-03-15 주식회사 엘지화학 고속전송 회로기판용 열경화성 수지 조성물
US8709587B2 (en) * 2008-12-25 2014-04-29 Sumitomo Bakelite Company, Ltd. Resin composition, prepreg, resin sheet, metal-clad laminate, printed wiring board, multilayer printed wiring board and semiconductor device
CN102361903B (zh) * 2009-03-26 2013-08-28 松下电器产业株式会社 环氧树脂组合物、预浸料、树脂涂覆的金属箔、树脂片、层压板和多层板
CN102597089B (zh) * 2009-08-28 2015-08-19 帕克电气化学有限公司 热固性树脂组合物及物件
JP2014518296A (ja) * 2011-06-30 2014-07-28 ダウ グローバル テクノロジーズ エルエルシー 硬化性組成物
CN103717635B (zh) * 2011-07-19 2016-01-20 松下知识产权经营株式会社 树脂组合物、树脂清漆、预浸料、覆金属层压板及印刷线路板
US9422412B2 (en) * 2011-09-22 2016-08-23 Elite Material Co., Ltd. Halogen-free resin composition and copper clad laminate and printed circuit board using same
WO2013100024A1 (ja) * 2011-12-28 2013-07-04 日本ゼオン株式会社 プリプレグ、積層体及びプリプレグの製造方法
CN103421273B (zh) * 2012-05-22 2016-02-10 中山台光电子材料有限公司 无卤素树脂组成物
CN102964775B (zh) * 2012-10-16 2015-09-16 广东生益科技股份有限公司 一种热固性树脂组合物及其用途
CN104371273B (zh) * 2014-11-11 2017-05-24 广东生益科技股份有限公司 一种无卤树脂组合物及用其制作的预浸料与层压板
KR102350152B1 (ko) * 2016-04-19 2022-01-11 파나소닉 아이피 매니지먼트 가부시키가이샤 프리프레그, 금속 클래드 적층판 및 프린트 배선판
KR102337574B1 (ko) * 2016-07-12 2021-12-13 주식회사 두산 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2194098B1 (en) * 2007-09-27 2012-08-15 Panasonic Corporation Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board
CN102181143A (zh) * 2011-04-08 2011-09-14 苏州生益科技有限公司 一种高频用热固性树脂组合物、半固化片及层压板
CN103013110A (zh) * 2011-09-27 2013-04-03 台光电子材料股份有限公司 无卤素树脂组成物及应用其的铜箔基板及印刷电路板
CN102585480A (zh) * 2011-12-29 2012-07-18 广东生益科技股份有限公司 热固性树脂组合物以及使用其制作的预浸料与印刷电路板用层压板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115505259A (zh) * 2022-08-17 2022-12-23 山东金宝电子有限公司 一种树脂组合物、树脂胶液、半固化片及其覆铜板
CN115505259B (zh) * 2022-08-17 2023-08-18 山东金宝电子有限公司 一种树脂组合物、树脂胶液、半固化片及其覆铜板

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EP3219760A1 (en) 2017-09-20
CN104371320A (zh) 2015-02-25
KR20170085075A (ko) 2017-07-21
AU2014411038B2 (en) 2019-10-03
EP3219760B1 (en) 2019-10-09
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TWI555785B (zh) 2016-11-01
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