WO2009035014A1 - 多層プリント配線板の製造方法 - Google Patents

多層プリント配線板の製造方法 Download PDF

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Publication number
WO2009035014A1
WO2009035014A1 PCT/JP2008/066374 JP2008066374W WO2009035014A1 WO 2009035014 A1 WO2009035014 A1 WO 2009035014A1 JP 2008066374 W JP2008066374 W JP 2008066374W WO 2009035014 A1 WO2009035014 A1 WO 2009035014A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive sheet
circuit board
printed wiring
multilayer printed
wiring board
Prior art date
Application number
PCT/JP2008/066374
Other languages
English (en)
French (fr)
Inventor
Shigeo Nakamura
Seiichiro Ohashi
Eiichi Hayashi
Tadahiko Yokota
Original Assignee
Ajinomoto Co., Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40452021&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2009035014(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ajinomoto Co., Inc. filed Critical Ajinomoto Co., Inc.
Priority to CN200880106528XA priority Critical patent/CN101803483B/zh
Priority to JP2009532204A priority patent/JP5465530B2/ja
Priority to KR1020147023756A priority patent/KR101530874B1/ko
Priority to KR1020107007739A priority patent/KR101530868B1/ko
Publication of WO2009035014A1 publication Critical patent/WO2009035014A1/ja
Priority to US12/721,891 priority patent/US8337655B2/en
Priority to US13/618,168 priority patent/US8992713B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1054—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing and simultaneously bonding [e.g., cut-seaming]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

　プリプレグで多層プリント配線板の絶縁層を形成する場合に、枚葉によらずに、連続的生産を可能とする、多層プリント配線板の製造方法を提供する。 　下記（１）～（５）の工程を含む多層プリント配線板の製造方法。 （１）支持体フィルム上にプリプレグが形成された接着シートがロール状に巻き取られたロール状接着シートから接着シートを搬送し、プリプレグ面が回路基板の両面又は片面に接するように接着シートを配置する、仮付け準備工程。 （２）接着シートの一部を支持体フィルム側から加熱および加圧することで部分的に接着シートを回路基板に接着した後、接着シートを回路基板のサイズに応じてカッターでカットすることにより、接着シートを回路基板に仮付けする、仮付け工程。 （３）減圧下で、仮付けされた接着シートを加熱および加圧し、回路基板に接着シートをラミネートする、ラミネート工程。 （４）プリプレグを熱硬化し、絶縁層を形成する、熱硬化工程。 （５）熱硬化工程の後に支持体フィルムを剥離する、剥離工程。
PCT/JP2008/066374 2007-09-11 2008-09-11 多層プリント配線板の製造方法 WO2009035014A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN200880106528XA CN101803483B (zh) 2007-09-11 2008-09-11 多层印刷电路板的制造方法
JP2009532204A JP5465530B2 (ja) 2007-09-11 2008-09-11 多層プリント配線板の製造方法
KR1020147023756A KR101530874B1 (ko) 2007-09-11 2008-09-11 다층 프린트 배선판의 제조 방법
KR1020107007739A KR101530868B1 (ko) 2007-09-11 2008-09-11 다층 프린트 배선판의 제조 방법
US12/721,891 US8337655B2 (en) 2007-09-11 2010-03-11 Process for producing multilayer printed wiring board
US13/618,168 US8992713B2 (en) 2007-09-11 2012-09-14 Process for producing multilayer printed wiring board

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-235621 2007-09-11
JP2007235621 2007-09-11
JP2007239671 2007-09-14
JP2007-239671 2007-09-14

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/721,891 Continuation US8337655B2 (en) 2007-09-11 2010-03-11 Process for producing multilayer printed wiring board

Publications (1)

Publication Number Publication Date
WO2009035014A1 true WO2009035014A1 (ja) 2009-03-19

Family

ID=40452021

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066374 WO2009035014A1 (ja) 2007-09-11 2008-09-11 多層プリント配線板の製造方法

Country Status (6)

Country Link
US (2) US8337655B2 (ja)
JP (5) JP5465530B2 (ja)
KR (2) KR101530868B1 (ja)
CN (1) CN101803483B (ja)
TW (2) TWI548320B (ja)
WO (1) WO2009035014A1 (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011171719A (ja) * 2010-01-22 2011-09-01 Sumitomo Bakelite Co Ltd プリプレグの積層方法、プリント配線板の製造方法およびプリプレグのロール
JP2012191108A (ja) * 2011-03-14 2012-10-04 Sumitomo Bakelite Co Ltd ビルドアップ用プリプレグ
JP2012191109A (ja) * 2011-03-14 2012-10-04 Sumitomo Bakelite Co Ltd ビルドアップ用プリプレグ
JP2014024961A (ja) * 2012-07-26 2014-02-06 Ajinomoto Co Inc 保護フィルム付き接着シート、積層体の製造方法、及びプリント配線板の製造方法
JP2014082436A (ja) * 2012-10-15 2014-05-08 Zhuhai Advanced Chip Carriers & Electronic Substrates Solutions Technologies Co Ltd 誘電厚の向上された制御を備えた多層電子構造体
JP2014091270A (ja) * 2012-11-05 2014-05-19 Ajinomoto Co Inc 離型フィルム、接着フィルム、及びプリント配線板の製造方法
KR20150016105A (ko) 2013-08-02 2015-02-11 아지노모토 가부시키가이샤 다층 프린트 배선판의 제조 방법
JP2017052952A (ja) * 2016-09-20 2017-03-16 味の素株式会社 保護フィルム付き接着シート、積層体の製造方法、及びプリント配線板の製造方法
JP2017100401A (ja) * 2015-12-03 2017-06-08 日立化成株式会社 積層フィルム、積層体及びその製造方法、並びに、プリント配線板の製造方法
JP2018123331A (ja) * 2018-03-22 2018-08-09 味の素株式会社 保護フィルム付き接着シート、積層体の製造方法、及びプリント配線板の製造方法
KR101907713B1 (ko) * 2011-03-14 2018-10-12 스미토모 베이클리트 컴퍼니 리미티드 빌드업용 프리프레그

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TWI548320B (zh) * 2007-09-11 2016-09-01 Ajinomoto Kk Manufacturing method of multilayer printed circuit board
US20120174394A1 (en) * 2011-01-11 2012-07-12 Samsung Electro Mechanics Co., Ltd. Method for manufacturing multilayer circuit board
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TWI576034B (zh) * 2012-10-04 2017-03-21 Jx Nippon Mining & Metals Corp Method for manufacturing multilayer printed wiring board and base substrate
CN103732010A (zh) * 2014-01-17 2014-04-16 杨秀英 一种柔性线路板卷制孔的方法
CN106793535A (zh) * 2015-11-20 2017-05-31 富泰华工业（深圳）有限公司 电路板丝网印刷方法
TWI609382B (zh) * 2016-07-26 2017-12-21 台灣太陽油墨股份有限公司 介電材料組成物及含其之絕緣膜及電路板
JP6969574B2 (ja) * 2016-11-09 2021-11-24 昭和電工マテリアルズ株式会社 Ｆｒｐ前駆体の製造方法、積層体の製造方法、プリント配線板の製造方法及び半導体パッケージの製造方法
JP7095224B2 (ja) * 2017-03-28 2022-07-05 昭和電工マテリアルズ株式会社 コアレス基板用プリプレグ、コアレス基板用プリプレグの製造方法及び製造装置、並びにコアレス基板及びその製造方法
US10892671B2 (en) * 2017-07-25 2021-01-12 GM Global Technology Operations LLC Electrically conductive copper components and joining processes therefor
JP6604369B2 (ja) * 2017-10-05 2019-11-13 Ｄｉｃ株式会社 フレキシブルプリント配線板補強用硬化性接着シート、補強部付フレキシブルプリント配線板、その製造方法及び電子機器
WO2019069895A1 (ja) * 2017-10-05 2019-04-11 Dic株式会社 フレキシブルプリント配線板補強用硬化性接着シート、補強部付フレキシブルプリント配線板、その製造方法及び電子機器
KR102298165B1 (ko) 2018-03-14 2021-09-06 주식회사 엘지화학 매립형 투명 전극 기판 및 이의 제조방법

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US8337655B2 (en) 2012-12-25
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US20130067742A1 (en) 2013-03-21

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