WO2008114588A1 - スパッタリングターゲット、酸化物半導体膜及び半導体デバイス - Google Patents

スパッタリングターゲット、酸化物半導体膜及び半導体デバイス Download PDF

Info

Publication number
WO2008114588A1
WO2008114588A1 PCT/JP2008/053458 JP2008053458W WO2008114588A1 WO 2008114588 A1 WO2008114588 A1 WO 2008114588A1 JP 2008053458 W JP2008053458 W JP 2008053458W WO 2008114588 A1 WO2008114588 A1 WO 2008114588A1
Authority
WO
WIPO (PCT)
Prior art keywords
sputtering target
semiconductor device
oxide semiconductor
semiconductor film
oxide
Prior art date
Application number
PCT/JP2008/053458
Other languages
English (en)
French (fr)
Inventor
Kazuyoshi Inoue
Koki Yano
Masashi Kasami
Original Assignee
Idemitsu Kosan Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39765698&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2008114588(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Idemitsu Kosan Co., Ltd. filed Critical Idemitsu Kosan Co., Ltd.
Priority to US12/532,247 priority Critical patent/US8333913B2/en
Priority to CN200880016174XA priority patent/CN101680081B/zh
Priority to JP2009505113A priority patent/JP5306179B2/ja
Publication of WO2008114588A1 publication Critical patent/WO2008114588A1/ja
Priority to US13/468,119 priority patent/US8668849B2/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/086Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/26Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66969Multistep manufacturing processes of devices having semiconductor bodies not comprising group 14 or group 13/15 materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/7869Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3201Alkali metal oxides or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3201Alkali metal oxides or oxide-forming salts thereof
    • C04B2235/3203Lithium oxide or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3205Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
    • C04B2235/3206Magnesium oxides or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3217Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3224Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3224Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
    • C04B2235/3225Yttrium oxide or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3224Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
    • C04B2235/3229Cerium oxides or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3231Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3232Titanium oxides or titanates, e.g. rutile or anatase
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3231Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3244Zirconium oxides, zirconates, hafnium oxides, hafnates, or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3231Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3251Niobium oxides, niobates, tantalum oxides, tantalates, or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/327Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3275Cobalt oxides, cobaltates or cobaltites or oxide forming salts thereof, e.g. bismuth cobaltate, zinc cobaltite
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/327Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3279Nickel oxides, nickalates, or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3281Copper oxides, cuprates or oxide-forming salts thereof, e.g. CuO or Cu2O
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3284Zinc oxides, zincates, cadmium oxides, cadmiates, mercury oxides, mercurates or oxide forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3286Gallium oxides, gallates, indium oxides, indates, thallium oxides, thallates or oxide forming salts thereof, e.g. zinc gallate
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3287Germanium oxides, germanates or oxide forming salts thereof, e.g. copper germanate
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/34Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3409Boron oxide, borates, boric acids, or oxide forming salts thereof, e.g. borax
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/72Products characterised by the absence or the low content of specific components, e.g. alkali metal free alumina ceramics
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
    • C04B2235/77Density
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/80Phases present in the sintered or melt-cast ceramic products other than the main phase
    • C04B2235/81Materials characterised by the absence of phases other than the main phase, i.e. single phase materials

Abstract

 インジウム(In)、及びガドリニウム(Gd)、ジスプロシウム(Dy)、ホルミウム(Ho)、エルビウム(Er)及びイッテルビウム(Yb)から選ばれる元素を少なくとも1種以上を含む酸化物の焼結体からなるスパッタリングターゲットであって、前記酸化物の焼結体が実質的にビックスバイト構造からなるスパッタリングターゲット。
PCT/JP2008/053458 2007-03-20 2008-02-28 スパッタリングターゲット、酸化物半導体膜及び半導体デバイス WO2008114588A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/532,247 US8333913B2 (en) 2007-03-20 2008-02-28 Sputtering target, oxide semiconductor film and semiconductor device
CN200880016174XA CN101680081B (zh) 2007-03-20 2008-02-28 溅射靶、氧化物半导体膜及半导体器件
JP2009505113A JP5306179B2 (ja) 2007-03-20 2008-02-28 スパッタリングターゲット、酸化物半導体膜及び半導体デバイス
US13/468,119 US8668849B2 (en) 2007-03-20 2012-05-10 Sputtering target, oxide semiconductor film and semiconductor device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-072596 2007-03-20
JP2007072596 2007-03-20
JP2007076810 2007-03-23
JP2007-076810 2007-03-23

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/532,247 A-371-Of-International US8333913B2 (en) 2007-03-20 2008-02-28 Sputtering target, oxide semiconductor film and semiconductor device
US13/468,119 Division US8668849B2 (en) 2007-03-20 2012-05-10 Sputtering target, oxide semiconductor film and semiconductor device

Publications (1)

Publication Number Publication Date
WO2008114588A1 true WO2008114588A1 (ja) 2008-09-25

Family

ID=39765698

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053458 WO2008114588A1 (ja) 2007-03-20 2008-02-28 スパッタリングターゲット、酸化物半導体膜及び半導体デバイス

Country Status (6)

Country Link
US (2) US8333913B2 (ja)
JP (2) JP5306179B2 (ja)
KR (1) KR101612130B1 (ja)
CN (2) CN102593161B (ja)
TW (1) TWI429775B (ja)
WO (1) WO2008114588A1 (ja)

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010047063A1 (ja) * 2008-10-23 2010-04-29 出光興産株式会社 高純度結晶質酸化インジウム半導体膜を有する薄膜トランジスタ、及びその製造方法
JP2010165999A (ja) * 2009-01-19 2010-07-29 Fujifilm Corp 薄膜トランジスタの製造方法及び電気光学装置の製造方法
JP2010177431A (ja) * 2009-01-29 2010-08-12 Fujifilm Corp 薄膜トランジスタ、多結晶酸化物半導体薄膜の製造方法、及び薄膜トランジスタの製造方法
JP2010219214A (ja) * 2009-03-16 2010-09-30 Idemitsu Kosan Co Ltd 半導体薄膜の製造方法、及び該半導体薄膜を備える薄膜トランジスタ
WO2011061922A1 (ja) * 2009-11-19 2011-05-26 株式会社アルバック 透明導電膜の製造方法、透明導電膜の製造装置、スパッタリングターゲット及び透明導電膜
WO2011077978A1 (en) * 2009-12-25 2011-06-30 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing display device
JP2011176296A (ja) * 2010-01-29 2011-09-08 Semiconductor Energy Lab Co Ltd 半導体装置
JP2011181722A (ja) * 2010-03-02 2011-09-15 Idemitsu Kosan Co Ltd スパッタリングターゲット
US20110240998A1 (en) * 2010-03-30 2011-10-06 Sony Corporation Thin-film transistor, method of manufacturing the same, and display device
JP2011205089A (ja) * 2010-03-05 2011-10-13 Semiconductor Energy Lab Co Ltd 酸化物半導体膜の作製方法、およびトランジスタの作製方法
JP2011249570A (ja) * 2010-05-27 2011-12-08 Idemitsu Kosan Co Ltd 酸化物焼結体、それからなるターゲット及び酸化物半導体薄膜
JP2012012659A (ja) * 2010-06-30 2012-01-19 Idemitsu Kosan Co Ltd スパッタリングターゲット
JP2012031460A (ja) * 2010-07-29 2012-02-16 Sumitomo Metal Mining Co Ltd 酸化物蒸着材と透明導電膜および太陽電池
WO2012029612A1 (en) * 2010-09-03 2012-03-08 Semiconductor Energy Laboratory Co., Ltd. Sputtering target and method for manufacturing semiconductor device
JPWO2010047077A1 (ja) * 2008-10-23 2012-03-22 出光興産株式会社 薄膜トランジスタ及びその製造方法
JP2012129511A (ja) * 2010-11-26 2012-07-05 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
JP2012140706A (ja) * 2010-12-17 2012-07-26 Semiconductor Energy Lab Co Ltd スパッタリングターゲット、スパッタリングターゲットの作製方法および半導体装置の作製方法
EP2497111A1 (en) * 2009-11-06 2012-09-12 Semiconductor Energy Laboratory Co. Ltd. Semiconductor device
JP2012256033A (ja) * 2011-05-13 2012-12-27 Semiconductor Energy Lab Co Ltd 表示装置及び電子機器
JP2012256034A (ja) * 2011-05-13 2012-12-27 Semiconductor Energy Lab Co Ltd El表示装置および電子機器
WO2013035335A1 (ja) * 2011-09-06 2013-03-14 出光興産株式会社 スパッタリングターゲット
JP2013201211A (ja) * 2012-03-23 2013-10-03 Sony Corp 薄膜トランジスタ、薄膜トランジスタの製造方法および電子機器
JP2014152353A (ja) * 2013-02-06 2014-08-25 Sumitomo Metal Mining Co Ltd 酸化インジウム系の酸化物焼結体およびその製造方法
US8889477B2 (en) 2011-06-08 2014-11-18 Semiconductor Energy Laboratory Co., Ltd. Method for forming thin film utilizing sputtering target
JP2015072487A (ja) * 2010-02-26 2015-04-16 株式会社半導体エネルギー研究所 液晶表示装置
JP2015109452A (ja) * 2009-11-20 2015-06-11 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2015135977A (ja) * 2009-03-05 2015-07-27 株式会社半導体エネルギー研究所 半導体装置、表示装置、テレビジョン装置、及び半導体装置の作製方法
JP2015142047A (ja) * 2014-01-29 2015-08-03 出光興産株式会社 積層構造、その製造方法及び薄膜トランジスタ
JP2015165597A (ja) * 2009-12-18 2015-09-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
WO2015178430A1 (ja) * 2014-05-23 2015-11-26 住友金属鉱山株式会社 酸化物焼結体、スパッタリング用ターゲット、及びそれを用いて得られる酸化物半導体薄膜
US9267199B2 (en) 2013-02-28 2016-02-23 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing sputtering target, method for forming oxide film, and transistor
JP2016082198A (ja) * 2014-10-22 2016-05-16 日本放送協会 薄膜トランジスタおよびその製造方法
JP2016167608A (ja) * 2009-10-08 2016-09-15 株式会社半導体エネルギー研究所 酸化物半導体膜の作製方法
JP2016178324A (ja) * 2009-12-08 2016-10-06 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2017120919A (ja) * 2009-09-16 2017-07-06 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
JP2017168572A (ja) * 2016-03-15 2017-09-21 住友金属鉱山株式会社 酸化物半導体薄膜、酸化物焼結体、薄膜トランジスタ及び表示装置
JP2019003900A (ja) * 2017-06-19 2019-01-10 学校法人 工学院大学 透明導電膜、透明導電膜つき透明基板、透明導電膜つき透明基板の製造方法、タッチパネル
JP2021052191A (ja) * 2009-09-04 2021-04-01 株式会社半導体エネルギー研究所 表示装置

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2133907B1 (de) * 2008-06-09 2014-06-18 Dritte Patentportfolio Beteiligungsgesellschaft mbH & Co. KG Polykristalline Silizium Dünnschichten hergestellt durch Titan-unterstützten Metall-induzierten Schichtaustausch
JP4838827B2 (ja) * 2008-07-02 2011-12-14 シャープ株式会社 太陽電池モジュールおよびその製造方法
CN102159517B (zh) * 2008-09-19 2014-08-06 出光兴产株式会社 氧化物烧结体及溅射靶材
WO2011055644A1 (en) * 2009-11-06 2011-05-12 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP5596963B2 (ja) * 2009-11-19 2014-09-24 出光興産株式会社 スパッタリングターゲット及びそれを用いた薄膜トランジスタ
JP5437825B2 (ja) * 2010-01-15 2014-03-12 出光興産株式会社 In−Ga−O系酸化物焼結体、ターゲット、酸化物半導体薄膜及びこれらの製造方法
KR101805378B1 (ko) * 2010-01-24 2017-12-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치와 이의 제조 방법
JP5776192B2 (ja) * 2010-02-16 2015-09-09 株式会社リコー 電界効果型トランジスタ、表示素子、画像表示装置及びシステム
US8513720B2 (en) * 2010-07-14 2013-08-20 Sharp Laboratories Of America, Inc. Metal oxide semiconductor thin film transistors
WO2012032749A1 (ja) * 2010-09-09 2012-03-15 シャープ株式会社 薄膜トランジスタ基板及びその製造方法、表示装置
US9012993B2 (en) 2011-07-22 2015-04-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9178076B2 (en) * 2011-08-11 2015-11-03 Idemitsu Kosan Co., Ltd. Thin-film transistor
US20140021464A1 (en) * 2012-07-17 2014-01-23 National Chung Cheng University Yttrium-doped Indium Oxide Transparent Conductive Thin-Film Transistor and Method for Making Same
US9885108B2 (en) 2012-08-07 2018-02-06 Semiconductor Energy Laboratory Co., Ltd. Method for forming sputtering target
JP6107085B2 (ja) * 2012-11-22 2017-04-05 住友金属鉱山株式会社 酸化物半導体薄膜および薄膜トランジスタ
KR20140106977A (ko) * 2013-02-27 2014-09-04 삼성전자주식회사 고성능 금속 산화물 반도체 박막 트랜지스터 및 그 제조방법
CN105873881A (zh) * 2013-12-27 2016-08-17 出光兴产株式会社 氧化物烧结体、该烧结体的制造方法及溅射靶
CN111524967A (zh) * 2014-02-21 2020-08-11 株式会社半导体能源研究所 半导体膜、晶体管、半导体装置、显示装置以及电子设备
KR102450562B1 (ko) 2014-03-13 2022-10-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 촬상 장치
KR20160146665A (ko) * 2014-04-17 2016-12-21 스미토모 긴조쿠 고잔 가부시키가이샤 산화물 소결체, 스퍼터링용 타겟, 및 그것을 이용하여 얻어지는 산화물 반도체 박막
KR102380829B1 (ko) 2014-04-23 2022-03-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 촬상 장치
CN106033731B (zh) 2015-03-13 2019-11-05 联华电子股份有限公司 半导体元件及其制作方法
JP6464042B2 (ja) * 2015-06-23 2019-02-06 株式会社カネカ 透明電極付き基板およびその製造方法
WO2017165197A1 (en) * 2016-03-23 2017-09-28 IQE, plc Epitaxial metal oxide as buffer for epitaxial iii-v layers
CN106086797B (zh) * 2016-07-12 2018-12-11 京东方科技集团股份有限公司 氧化铟锡薄膜及其制备方法、含其的阵列基板、显示装置
KR102475939B1 (ko) * 2016-08-31 2022-12-08 이데미쓰 고산 가부시키가이샤 신규 가닛 화합물, 그것을 함유하는 소결체 및 스퍼터링 타깃
US10103282B2 (en) * 2016-09-16 2018-10-16 Nano And Advanced Materials Institute Limited Direct texture transparent conductive oxide served as electrode or intermediate layer for photovoltaic and display applications
JP7013902B2 (ja) * 2018-02-05 2022-02-01 凸版印刷株式会社 表示装置
WO2020027243A1 (ja) * 2018-08-01 2020-02-06 出光興産株式会社 結晶構造化合物、酸化物焼結体、スパッタリングターゲット、結晶質酸化物薄膜、アモルファス酸化物薄膜、薄膜トランジスタ、及び電子機器
CN113875022A (zh) * 2019-06-04 2021-12-31 堺显示器制品株式会社 薄膜晶体管及其制造方法以及显示装置
CN110767745A (zh) * 2019-09-18 2020-02-07 华南理工大学 复合金属氧化物半导体及薄膜晶体管与应用
CN110797395A (zh) * 2019-09-18 2020-02-14 华南理工大学 掺杂型金属氧化物半导体及薄膜晶体管与应用
US20230356104A1 (en) * 2020-08-05 2023-11-09 Dhf America Llc Crystallization system and method using thermal treatment
CN114163217A (zh) * 2021-12-15 2022-03-11 先导薄膜材料(广东)有限公司 一种氧化铟钽钇粉体及其制备方法
CN114163216A (zh) * 2021-12-15 2022-03-11 先导薄膜材料(广东)有限公司 一种氧化铟钛镱粉体及其制备方法与应用
CN114481054B (zh) * 2022-01-27 2022-12-27 华南理工大学 氧化物半导体靶材、薄膜、薄膜晶体管及提高其稳定性的方法
CN115893988B (zh) * 2022-12-07 2023-09-08 洛阳晶联光电材料有限责任公司 一种太阳能电池用蒸镀靶材及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05238807A (ja) * 1992-02-29 1993-09-17 Res Dev Corp Of Japan 透明電気伝導性酸化物
JP2000048966A (ja) * 1998-07-27 2000-02-18 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子
WO2004105054A1 (ja) * 2003-05-20 2004-12-02 Idemitsu Kosan Co. Ltd. 非晶質透明導電膜、及びその原料スパッタリングターゲット、及び非晶質透明電極基板、及びその製造方法、及び液晶ディスプレイ用カラーフィルタ
WO2005086179A1 (ja) * 2004-03-05 2005-09-15 Idemitsu Kosan Co., Ltd. 半透明・反射電極基板、及びその製造方法、及びその半透過・半反射電極基板を用いた液晶表示装置
JP2005292768A (ja) * 2004-03-09 2005-10-20 Idemitsu Kosan Co Ltd Tft基板及びスパッタリングターゲット及び液晶表示装置及び画素電極及び透明電極及びtft基板の製造方法
JP2006173580A (ja) * 2004-11-10 2006-06-29 Canon Inc 電界効果型トランジスタ

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5385400A (en) * 1977-01-06 1978-07-27 Tdk Corp Porcelain composite for voltage non-linear resistor
DK0769962T3 (da) * 1994-07-07 2003-06-23 Univ Washington Fremgangsmåde til afsvækkelse af arteriel stenose
US6056800A (en) 1997-09-15 2000-05-02 Carter, Iv; William J. Method of simultaneously composting anaerobic and aerobic material
WO2000067531A1 (fr) * 1999-04-30 2000-11-09 Idemitsu Kosan Co., Ltd. Dispositif organique electroluminescent et procede de fabrication
JP2004538371A (ja) * 2001-08-13 2004-12-24 ナムローゼ・フェンノートシャップ・ベーカート・ソシエテ・アノニム スパッタターゲット
JP2003298062A (ja) 2002-03-29 2003-10-17 Sharp Corp 薄膜トランジスタ及びその製造方法
JP4166105B2 (ja) 2003-03-06 2008-10-15 シャープ株式会社 半導体装置およびその製造方法
US20050167681A1 (en) * 2004-02-04 2005-08-04 Samsung Electronics Co., Ltd. Electrode layer, light emitting device including the same, and method of forming the electrode layer
KR101101456B1 (ko) * 2004-03-09 2012-01-03 이데미쓰 고산 가부시키가이샤 박막 트랜지스터, 박막 트랜지스터 기판, 이들의 제조방법, 이들을 사용한 액정 표시 장치, 관련된 장치 및방법, 및 스퍼터링 타깃, 이것을 사용하여 성막한 투명도전막, 투명 전극, 및 관련된 장치 및 방법
US7282782B2 (en) * 2004-03-12 2007-10-16 Hewlett-Packard Development Company, L.P. Combined binary oxide semiconductor device
JP5138163B2 (ja) * 2004-11-10 2013-02-06 キヤノン株式会社 電界効果型トランジスタ
JP2007041260A (ja) * 2005-08-03 2007-02-15 Fujifilm Holdings Corp 液晶表示素子
US20070215945A1 (en) * 2006-03-20 2007-09-20 Canon Kabushiki Kaisha Light control device and display
JP5063968B2 (ja) * 2006-09-21 2012-10-31 出光興産株式会社 酸化エルビウム含有酸化物ターゲット
WO2008018403A1 (fr) * 2006-08-10 2008-02-14 Idemitsu Kosan Co., Ltd. Cible d'oxyde contenant du lanthanide
JP5000231B2 (ja) * 2006-08-10 2012-08-15 出光興産株式会社 酸化ガドリニウム含有酸化物ターゲット
US20080107108A1 (en) 2006-11-03 2008-05-08 Nokia Corporation System and method for enabling fast switching between psse channels
TWI478347B (zh) * 2007-02-09 2015-03-21 Idemitsu Kosan Co A thin film transistor, a thin film transistor substrate, and an image display device, and an image display device, and a semiconductor device
WO2008099863A1 (ja) * 2007-02-16 2008-08-21 Idemitsu Kosan Co., Ltd. 半導体,半導体装置及び相補型トランジスタ回路装置
US8129714B2 (en) * 2007-02-16 2012-03-06 Idemitsu Kosan Co., Ltd. Semiconductor, semiconductor device, complementary transistor circuit device
WO2008117739A1 (ja) * 2007-03-23 2008-10-02 Idemitsu Kosan Co., Ltd. 半導体デバイス、多結晶半導体薄膜、多結晶半導体薄膜の製造方法、電界効果型トランジスタ、及び、電界効果型トランジスタの製造方法
WO2008126492A1 (ja) * 2007-04-05 2008-10-23 Idemitsu Kosan Co., Ltd. 電界効果型トランジスタ及び電界効果型トランジスタの製造方法
JPWO2008136505A1 (ja) * 2007-05-08 2010-07-29 出光興産株式会社 半導体デバイス及び薄膜トランジスタ、並びに、それらの製造方法
SE531337C2 (sv) 2007-07-03 2009-02-24 Atlas Copco Constr Tools Ab Bränsledriven brytmaskin
KR20090063946A (ko) * 2007-12-14 2009-06-18 삼성코닝정밀유리 주식회사 산화인듐주석 타겟 및 이를 이용한 투명 도전막의 제조방법
JP2011174134A (ja) * 2010-02-24 2011-09-08 Idemitsu Kosan Co Ltd In−Ga−Sn系酸化物焼結体、ターゲット、酸化物半導体膜、及び半導体素子
KR101774256B1 (ko) * 2010-11-15 2017-09-05 삼성디스플레이 주식회사 산화물 반도체 박막 트랜지스터 및 그 제조 방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05238807A (ja) * 1992-02-29 1993-09-17 Res Dev Corp Of Japan 透明電気伝導性酸化物
JP2000048966A (ja) * 1998-07-27 2000-02-18 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子
WO2004105054A1 (ja) * 2003-05-20 2004-12-02 Idemitsu Kosan Co. Ltd. 非晶質透明導電膜、及びその原料スパッタリングターゲット、及び非晶質透明電極基板、及びその製造方法、及び液晶ディスプレイ用カラーフィルタ
WO2005086179A1 (ja) * 2004-03-05 2005-09-15 Idemitsu Kosan Co., Ltd. 半透明・反射電極基板、及びその製造方法、及びその半透過・半反射電極基板を用いた液晶表示装置
JP2005292768A (ja) * 2004-03-09 2005-10-20 Idemitsu Kosan Co Ltd Tft基板及びスパッタリングターゲット及び液晶表示装置及び画素電極及び透明電極及びtft基板の製造方法
JP2006173580A (ja) * 2004-11-10 2006-06-29 Canon Inc 電界効果型トランジスタ

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
"Handotai Yogo Daijiten", 20 March 1999, THE NIKKAN KOGYO SHINBUN, LTD., pages: 795 *
"Tomei Dodenmaku no Gijutsu (2nd revised edition)", 20 December 2006, OHMSHA, LTD., pages: 113 - 119 *
NAKAZAWA H. ET AL.: "The electronic properties of amorphous and crystallized In2O3 films", JOURNAL OF APPLIED PHYSICS, vol. 100, 2006, pages 93706-1 - 93706-8, XP012090432 *

Cited By (101)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101612147B1 (ko) * 2008-10-23 2016-04-12 이데미쓰 고산 가부시키가이샤 박막 트랜지스터 및 그 제조방법
JPWO2010047063A1 (ja) * 2008-10-23 2012-03-22 出光興産株式会社 高純度結晶質酸化インジウム半導体膜を有する薄膜トランジスタ、及びその製造方法
JPWO2010047077A1 (ja) * 2008-10-23 2012-03-22 出光興産株式会社 薄膜トランジスタ及びその製造方法
TWI482275B (zh) * 2008-10-23 2015-04-21 Idemitsu Kosan Co Thin film transistor having a high purity crystalline indium oxide semiconductor film, and a method for manufacturing the same
WO2010047063A1 (ja) * 2008-10-23 2010-04-29 出光興産株式会社 高純度結晶質酸化インジウム半導体膜を有する薄膜トランジスタ、及びその製造方法
JP2010165999A (ja) * 2009-01-19 2010-07-29 Fujifilm Corp 薄膜トランジスタの製造方法及び電気光学装置の製造方法
JP2010177431A (ja) * 2009-01-29 2010-08-12 Fujifilm Corp 薄膜トランジスタ、多結晶酸化物半導体薄膜の製造方法、及び薄膜トランジスタの製造方法
JP2019159339A (ja) * 2009-03-05 2019-09-19 株式会社半導体エネルギー研究所 表示装置
US9941393B2 (en) 2009-03-05 2018-04-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US11955537B2 (en) 2009-03-05 2024-04-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US10326008B2 (en) 2009-03-05 2019-06-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2015135977A (ja) * 2009-03-05 2015-07-27 株式会社半導体エネルギー研究所 半導体装置、表示装置、テレビジョン装置、及び半導体装置の作製方法
US10686061B2 (en) 2009-03-05 2020-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2010219214A (ja) * 2009-03-16 2010-09-30 Idemitsu Kosan Co Ltd 半導体薄膜の製造方法、及び該半導体薄膜を備える薄膜トランジスタ
JP2021052191A (ja) * 2009-09-04 2021-04-01 株式会社半導体エネルギー研究所 表示装置
JP6994553B2 (ja) 2009-09-04 2022-01-14 株式会社半導体エネルギー研究所 表示装置
JP2017120919A (ja) * 2009-09-16 2017-07-06 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
JP2016167608A (ja) * 2009-10-08 2016-09-15 株式会社半導体エネルギー研究所 酸化物半導体膜の作製方法
EP2497111A1 (en) * 2009-11-06 2012-09-12 Semiconductor Energy Laboratory Co. Ltd. Semiconductor device
US9331112B2 (en) 2009-11-06 2016-05-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including an oxide semiconductor layer
US8916869B2 (en) 2009-11-06 2014-12-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including an oxide semiconductor layer
EP2497111A4 (en) * 2009-11-06 2014-02-12 Semiconductor Energy Lab SEMICONDUCTOR COMPONENT
US9773814B2 (en) 2009-11-06 2017-09-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
EP3051588A1 (en) * 2009-11-06 2016-08-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN102666909A (zh) * 2009-11-19 2012-09-12 株式会社爱发科 透明导电膜的制造方法、透明导电膜的制造装置、溅射靶及透明导电膜
WO2011061922A1 (ja) * 2009-11-19 2011-05-26 株式会社アルバック 透明導電膜の製造方法、透明導電膜の製造装置、スパッタリングターゲット及び透明導電膜
TWI500786B (zh) * 2009-11-19 2015-09-21 Ulvac Inc 透明導電膜之製造方法、透明導電膜之製造裝置、濺鍍靶及透明導電膜
JP5726752B2 (ja) * 2009-11-19 2015-06-03 株式会社アルバック 透明導電膜の製造方法、透明導電膜の製造装置、スパッタリングターゲット及び透明導電膜
CN102666909B (zh) * 2009-11-19 2016-06-22 株式会社爱发科 透明导电膜的制造方法、透明导电膜的制造装置、溅射靶及透明导电膜
US9461181B2 (en) 2009-11-20 2016-10-04 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US10186619B2 (en) 2009-11-20 2019-01-22 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2015109452A (ja) * 2009-11-20 2015-06-11 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2016178324A (ja) * 2009-12-08 2016-10-06 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2017135394A (ja) * 2009-12-08 2017-08-03 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2015165597A (ja) * 2009-12-18 2015-09-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
US8372664B2 (en) 2009-12-25 2013-02-12 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing display device
WO2011077978A1 (en) * 2009-12-25 2011-06-30 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing display device
JP2011176296A (ja) * 2010-01-29 2011-09-08 Semiconductor Energy Lab Co Ltd 半導体装置
JP2015065444A (ja) * 2010-01-29 2015-04-09 株式会社半導体エネルギー研究所 半導体装置
US8981518B2 (en) 2010-01-29 2015-03-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8816469B2 (en) 2010-01-29 2014-08-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising protection circuit with oxide semiconductor
US9819256B2 (en) 2010-01-29 2017-11-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2015072487A (ja) * 2010-02-26 2015-04-16 株式会社半導体エネルギー研究所 液晶表示装置
US9048325B2 (en) 2010-02-26 2015-06-02 Semiconductor Energy Laboratory Co., Ltd. Display device having an oxide semiconductor transistor
US10539845B2 (en) 2010-02-26 2020-01-21 Semiconductor Energy Laboratory Co., Ltd. Display device having an oxide semiconductor transistor
US9658506B2 (en) 2010-02-26 2017-05-23 Semiconductor Energy Laboratory Co., Ltd. Display device having an oxide semiconductor transistor
US11927862B2 (en) 2010-02-26 2024-03-12 Semiconductor Energy Laboratory Co., Ltd. Display device having an oxide semiconductor transistor
JP2015129975A (ja) * 2010-02-26 2015-07-16 株式会社半導体エネルギー研究所 表示装置
JP2011181722A (ja) * 2010-03-02 2011-09-15 Idemitsu Kosan Co Ltd スパッタリングターゲット
JP2021044559A (ja) * 2010-03-05 2021-03-18 株式会社半導体エネルギー研究所 酸化物半導体膜の作製方法
JP2011205089A (ja) * 2010-03-05 2011-10-13 Semiconductor Energy Lab Co Ltd 酸化物半導体膜の作製方法、およびトランジスタの作製方法
JP7101739B2 (ja) 2010-03-05 2022-07-15 株式会社半導体エネルギー研究所 酸化物半導体膜の作製方法及びトランジスタの作製方法
US9859437B2 (en) * 2010-03-30 2018-01-02 Joled Inc. Thin-film transistor, method of manufacturing the same, and display device
US10763371B2 (en) 2010-03-30 2020-09-01 Joled Inc. Thin-film transistor, method of manufacturing the same, and display device
US20110240998A1 (en) * 2010-03-30 2011-10-06 Sony Corporation Thin-film transistor, method of manufacturing the same, and display device
JP2011249570A (ja) * 2010-05-27 2011-12-08 Idemitsu Kosan Co Ltd 酸化物焼結体、それからなるターゲット及び酸化物半導体薄膜
US9153438B2 (en) 2010-05-27 2015-10-06 Idemitsu Kosan Co., Ltd. Sintered oxide body, target comprising the same, and oxide semiconductor thin film
JP2012012659A (ja) * 2010-06-30 2012-01-19 Idemitsu Kosan Co Ltd スパッタリングターゲット
JP2012031460A (ja) * 2010-07-29 2012-02-16 Sumitomo Metal Mining Co Ltd 酸化物蒸着材と透明導電膜および太陽電池
WO2012029612A1 (en) * 2010-09-03 2012-03-08 Semiconductor Energy Laboratory Co., Ltd. Sputtering target and method for manufacturing semiconductor device
JP2017103462A (ja) * 2010-09-03 2017-06-08 株式会社半導体エネルギー研究所 半導体装置の作製方法
US8980686B2 (en) 2010-09-03 2015-03-17 Semiconductor Energy Laboratory Co., Ltd. Sputtering target and method for manufacturing semiconductor device
US8835214B2 (en) 2010-09-03 2014-09-16 Semiconductor Energy Laboratory Co., Ltd. Sputtering target and method for manufacturing semiconductor device
JP2015187312A (ja) * 2010-09-03 2015-10-29 株式会社半導体エネルギー研究所 スパッタリングターゲット
US9410239B2 (en) * 2010-09-03 2016-08-09 Semiconductor Energy Laboratory Co., Ltd. Sputtering target and method for manufacturing semiconductor device
JP2012072493A (ja) * 2010-09-03 2012-04-12 Semiconductor Energy Lab Co Ltd スパッタリングターゲットおよび半導体装置の作製方法
US20150252465A1 (en) * 2010-09-03 2015-09-10 Semiconductor Energy Laboratory Co., Ltd. Sputtering target and method for manufacturing semiconductor device
JP2012129511A (ja) * 2010-11-26 2012-07-05 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
JP2012140706A (ja) * 2010-12-17 2012-07-26 Semiconductor Energy Lab Co Ltd スパッタリングターゲット、スパッタリングターゲットの作製方法および半導体装置の作製方法
US9865696B2 (en) 2010-12-17 2018-01-09 Semiconductor Energy Laboratory Co., Ltd. Sputtering target, method for manufacturing the same, and method for manufacturing semiconductor device
US9397222B2 (en) 2011-05-13 2016-07-19 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
US9954110B2 (en) 2011-05-13 2018-04-24 Semiconductor Energy Laboratory Co., Ltd. EL display device and electronic device
JP2012256033A (ja) * 2011-05-13 2012-12-27 Semiconductor Energy Lab Co Ltd 表示装置及び電子機器
JP2012256034A (ja) * 2011-05-13 2012-12-27 Semiconductor Energy Lab Co Ltd El表示装置および電子機器
US11959165B2 (en) 2011-06-08 2024-04-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising oxide semiconductor film
US11066739B2 (en) 2011-06-08 2021-07-20 Semiconductor Energy Laboratory Co., Ltd. Sputtering target, method for manufacturing sputtering target, and method for forming thin film
US8889477B2 (en) 2011-06-08 2014-11-18 Semiconductor Energy Laboratory Co., Ltd. Method for forming thin film utilizing sputtering target
US10889888B2 (en) 2011-06-08 2021-01-12 Semiconductor Energy Laboratory Co., Ltd. Sputtering target, method for manufacturing sputtering target, and method for forming thin film
US9382611B2 (en) 2011-06-08 2016-07-05 Semiconductor Energy Laboratory Co., Ltd. Sputtering target, method for manufacturing sputtering target, and method for forming thin film
JP2013067855A (ja) * 2011-09-06 2013-04-18 Idemitsu Kosan Co Ltd スパッタリングターゲット
KR102075904B1 (ko) * 2011-09-06 2020-02-11 이데미쓰 고산 가부시키가이샤 스퍼터링 타겟
WO2013035335A1 (ja) * 2011-09-06 2013-03-14 出光興産株式会社 スパッタリングターゲット
US9767998B2 (en) 2011-09-06 2017-09-19 Idemitsu Kosan Co., Ltd. Sputtering target
KR20140057318A (ko) * 2011-09-06 2014-05-12 이데미쓰 고산 가부시키가이샤 스퍼터링 타겟
JP2013201211A (ja) * 2012-03-23 2013-10-03 Sony Corp 薄膜トランジスタ、薄膜トランジスタの製造方法および電子機器
JP2014152353A (ja) * 2013-02-06 2014-08-25 Sumitomo Metal Mining Co Ltd 酸化インジウム系の酸化物焼結体およびその製造方法
US9267199B2 (en) 2013-02-28 2016-02-23 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing sputtering target, method for forming oxide film, and transistor
US11637015B2 (en) 2013-02-28 2023-04-25 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing sputtering target, method for forming oxide film, and transistor
US11967505B2 (en) 2013-02-28 2024-04-23 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing sputtering target, method for forming oxide film, and transistor
US10522347B2 (en) 2013-02-28 2019-12-31 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing sputtering target, method for forming oxide film, and transistor
US11139166B2 (en) 2013-02-28 2021-10-05 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing sputtering target, method for forming oxide film, and transistor
JP2015142047A (ja) * 2014-01-29 2015-08-03 出光興産株式会社 積層構造、その製造方法及び薄膜トランジスタ
WO2015178429A1 (ja) * 2014-05-23 2015-11-26 住友金属鉱山株式会社 酸化物焼結体、スパッタリング用ターゲット、及びそれを用いて得られる酸化物半導体薄膜
WO2015178430A1 (ja) * 2014-05-23 2015-11-26 住友金属鉱山株式会社 酸化物焼結体、スパッタリング用ターゲット、及びそれを用いて得られる酸化物半導体薄膜
JPWO2015178430A1 (ja) * 2014-05-23 2017-04-27 住友金属鉱山株式会社 酸化物焼結体、スパッタリング用ターゲット、及びそれを用いて得られる酸化物半導体薄膜
JPWO2015178429A1 (ja) * 2014-05-23 2017-04-20 住友金属鉱山株式会社 酸化物焼結体、スパッタリング用ターゲット、及びそれを用いて得られる酸化物半導体薄膜
US9941415B2 (en) 2014-05-23 2018-04-10 Sumitomo Metal Mining Co., Ltd. Oxide sintered body, sputtering target, and oxide semiconductor thin film obtained using sputtering target
CN106103380A (zh) * 2014-05-23 2016-11-09 住友金属矿山株式会社 氧化物烧结体、溅射用靶及使用该靶得到的氧化物半导体薄膜
JP2016082198A (ja) * 2014-10-22 2016-05-16 日本放送協会 薄膜トランジスタおよびその製造方法
JP2017168572A (ja) * 2016-03-15 2017-09-21 住友金属鉱山株式会社 酸化物半導体薄膜、酸化物焼結体、薄膜トランジスタ及び表示装置
JP2019003900A (ja) * 2017-06-19 2019-01-10 学校法人 工学院大学 透明導電膜、透明導電膜つき透明基板、透明導電膜つき透明基板の製造方法、タッチパネル

Also Published As

Publication number Publication date
US8333913B2 (en) 2012-12-18
KR101612130B1 (ko) 2016-04-12
TW200902740A (en) 2009-01-16
JP2013191850A (ja) 2013-09-26
JP5306179B2 (ja) 2013-10-02
CN101680081A (zh) 2010-03-24
TWI429775B (zh) 2014-03-11
US20120273777A1 (en) 2012-11-01
JPWO2008114588A1 (ja) 2010-07-01
US20110315936A1 (en) 2011-12-29
CN101680081B (zh) 2012-10-31
US8668849B2 (en) 2014-03-11
CN102593161A (zh) 2012-07-18
JP5775900B2 (ja) 2015-09-09
KR20090122391A (ko) 2009-11-27
CN102593161B (zh) 2014-11-05

Similar Documents

Publication Publication Date Title
WO2008114588A1 (ja) スパッタリングターゲット、酸化物半導体膜及び半導体デバイス
EP2096188A4 (en) SPUTTER TARGET AND OXID SEMICONDUCTOR FILM
IL243709A0 (en) Devices, systems and methods for drug administration
TW200943337A (en) A dielectric ceramic composition and an electronic component
WO2007023293A3 (en) Luminescent material compositions and structures incorporating the same
FI20075675A0 (fi) Järjestelmä, menetelmät ja laitteet komplementtimetallioksidipuolijohde(CMOS)antennikytkimiä varten käyttämällä runkokytkentää monipinoisessa rakenteessa
WO2008024477A3 (en) Polymeric/ceramic composite materials for use in medical devices
EP2025654A4 (en) OXIDIC INTERCODES, CONTAINING TRANSPARENT CONDUCTIVE FILM AND TRANSPARENT CONDUCTIVE BASE
EP1933930A4 (en) DEVICES, SYSTEMS AND CORRESPONDING METHODS FOR OUTPUTTING LIQUID MEDICAMENT STORED IN CRYOGENIC TEMPERATURES
WO2009129503A3 (en) Block copolymer comprising at least one polyester block and a poly(ethylene glycol) block
EP2076242B8 (en) Aerosolizable formulation comprising insulin for pulmonary delivery
IL179835A0 (en) Pharmaceutical compositions containing amphotericin b and delivery systems containing the same
GB0910105D0 (en) Devices, systems and methods for medicament delivery
TW200802889A (en) Semiconductor device and manufacturing method thereof
GB2451769B (en) Devices, systems, and methods for medicament delivery
WO2008005176A3 (en) Electroactive polymer radiopaque marker
WO2007101260A3 (en) Smart messages and alerts for an infusion delivery and management system
EP1877000A4 (en) LIGHT CROSSBREADABLE OLIGO (POLYETHYLENE GLYCOL FUMARATE) HYDROGELS FOR THE INTRODUCTION OF CELLS AND MEDICAMENTS
GB2452849B (en) Systems, methods, and apparatuses for high power complementary metal oxide semiconductor (cmos) antenna switches
EP1855750A4 (en) DEVICE FOR DELIVERING DRUG BY NEBULIZATION, WITH LATCH DETECTION AND TEMPERATURE PROTECTION
GB0816673D0 (en) Active matrix substrate, display device and television receiver
GB2446068B (en) Poly(vinyl alcohol) composition comprising polyol ester
GB2478085B (en) Devices, systems and methods for medicament delivery
WO2009044888A1 (ja) 酸化インジウム系ターゲット
WO2005120824A3 (en) Durable thermal barrier coating having low thermal conductivity

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880016174.X

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08720953

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009505113

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20097021643

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12532247

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 08720953

Country of ref document: EP

Kind code of ref document: A1