WO2008114588A1 - スパッタリングターゲット、酸化物半導体膜及び半導体デバイス - Google Patents
スパッタリングターゲット、酸化物半導体膜及び半導体デバイス Download PDFInfo
- Publication number
- WO2008114588A1 WO2008114588A1 PCT/JP2008/053458 JP2008053458W WO2008114588A1 WO 2008114588 A1 WO2008114588 A1 WO 2008114588A1 JP 2008053458 W JP2008053458 W JP 2008053458W WO 2008114588 A1 WO2008114588 A1 WO 2008114588A1
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- WIPO (PCT)
- Prior art keywords
- sputtering target
- semiconductor device
- oxide semiconductor
- semiconductor film
- oxide
- Prior art date
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- 238000005477 sputtering target Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title 2
- 229910052692 Dysprosium Inorganic materials 0.000 abstract 1
- 229910052691 Erbium Inorganic materials 0.000 abstract 1
- 229910052688 Gadolinium Inorganic materials 0.000 abstract 1
- 229910052689 Holmium Inorganic materials 0.000 abstract 1
- 229910052769 Ytterbium Inorganic materials 0.000 abstract 1
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 abstract 1
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 abstract 1
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 abstract 1
- KJZYNXUDTRRSPN-UHFFFAOYSA-N holmium atom Chemical compound [Ho] KJZYNXUDTRRSPN-UHFFFAOYSA-N 0.000 abstract 1
- 229910052738 indium Inorganic materials 0.000 abstract 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 abstract 1
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- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/80—Phases present in the sintered or melt-cast ceramic products other than the main phase
- C04B2235/81—Materials characterised by the absence of phases other than the main phase, i.e. single phase materials
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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US12/532,247 US8333913B2 (en) | 2007-03-20 | 2008-02-28 | Sputtering target, oxide semiconductor film and semiconductor device |
CN200880016174XA CN101680081B (zh) | 2007-03-20 | 2008-02-28 | 溅射靶、氧化物半导体膜及半导体器件 |
JP2009505113A JP5306179B2 (ja) | 2007-03-20 | 2008-02-28 | スパッタリングターゲット、酸化物半導体膜及び半導体デバイス |
US13/468,119 US8668849B2 (en) | 2007-03-20 | 2012-05-10 | Sputtering target, oxide semiconductor film and semiconductor device |
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JP2007-076810 | 2007-03-23 |
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US12/532,247 A-371-Of-International US8333913B2 (en) | 2007-03-20 | 2008-02-28 | Sputtering target, oxide semiconductor film and semiconductor device |
US13/468,119 Division US8668849B2 (en) | 2007-03-20 | 2012-05-10 | Sputtering target, oxide semiconductor film and semiconductor device |
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US (2) | US8333913B2 (ja) |
JP (2) | JP5306179B2 (ja) |
KR (1) | KR101612130B1 (ja) |
CN (2) | CN102593161B (ja) |
TW (1) | TWI429775B (ja) |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05238807A (ja) * | 1992-02-29 | 1993-09-17 | Res Dev Corp Of Japan | 透明電気伝導性酸化物 |
JP2000048966A (ja) * | 1998-07-27 | 2000-02-18 | Idemitsu Kosan Co Ltd | 有機エレクトロルミネッセンス素子 |
WO2004105054A1 (ja) * | 2003-05-20 | 2004-12-02 | Idemitsu Kosan Co. Ltd. | 非晶質透明導電膜、及びその原料スパッタリングターゲット、及び非晶質透明電極基板、及びその製造方法、及び液晶ディスプレイ用カラーフィルタ |
WO2005086179A1 (ja) * | 2004-03-05 | 2005-09-15 | Idemitsu Kosan Co., Ltd. | 半透明・反射電極基板、及びその製造方法、及びその半透過・半反射電極基板を用いた液晶表示装置 |
JP2005292768A (ja) * | 2004-03-09 | 2005-10-20 | Idemitsu Kosan Co Ltd | Tft基板及びスパッタリングターゲット及び液晶表示装置及び画素電極及び透明電極及びtft基板の製造方法 |
JP2006173580A (ja) * | 2004-11-10 | 2006-06-29 | Canon Inc | 電界効果型トランジスタ |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5385400A (en) * | 1977-01-06 | 1978-07-27 | Tdk Corp | Porcelain composite for voltage non-linear resistor |
DK0769962T3 (da) * | 1994-07-07 | 2003-06-23 | Univ Washington | Fremgangsmåde til afsvækkelse af arteriel stenose |
US6056800A (en) | 1997-09-15 | 2000-05-02 | Carter, Iv; William J. | Method of simultaneously composting anaerobic and aerobic material |
WO2000067531A1 (fr) * | 1999-04-30 | 2000-11-09 | Idemitsu Kosan Co., Ltd. | Dispositif organique electroluminescent et procede de fabrication |
JP2004538371A (ja) * | 2001-08-13 | 2004-12-24 | ナムローゼ・フェンノートシャップ・ベーカート・ソシエテ・アノニム | スパッタターゲット |
JP2003298062A (ja) | 2002-03-29 | 2003-10-17 | Sharp Corp | 薄膜トランジスタ及びその製造方法 |
JP4166105B2 (ja) | 2003-03-06 | 2008-10-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
US20050167681A1 (en) * | 2004-02-04 | 2005-08-04 | Samsung Electronics Co., Ltd. | Electrode layer, light emitting device including the same, and method of forming the electrode layer |
KR101101456B1 (ko) * | 2004-03-09 | 2012-01-03 | 이데미쓰 고산 가부시키가이샤 | 박막 트랜지스터, 박막 트랜지스터 기판, 이들의 제조방법, 이들을 사용한 액정 표시 장치, 관련된 장치 및방법, 및 스퍼터링 타깃, 이것을 사용하여 성막한 투명도전막, 투명 전극, 및 관련된 장치 및 방법 |
US7282782B2 (en) * | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
JP5138163B2 (ja) * | 2004-11-10 | 2013-02-06 | キヤノン株式会社 | 電界効果型トランジスタ |
JP2007041260A (ja) * | 2005-08-03 | 2007-02-15 | Fujifilm Holdings Corp | 液晶表示素子 |
US20070215945A1 (en) * | 2006-03-20 | 2007-09-20 | Canon Kabushiki Kaisha | Light control device and display |
JP5063968B2 (ja) * | 2006-09-21 | 2012-10-31 | 出光興産株式会社 | 酸化エルビウム含有酸化物ターゲット |
WO2008018403A1 (fr) * | 2006-08-10 | 2008-02-14 | Idemitsu Kosan Co., Ltd. | Cible d'oxyde contenant du lanthanide |
JP5000231B2 (ja) * | 2006-08-10 | 2012-08-15 | 出光興産株式会社 | 酸化ガドリニウム含有酸化物ターゲット |
US20080107108A1 (en) | 2006-11-03 | 2008-05-08 | Nokia Corporation | System and method for enabling fast switching between psse channels |
TWI478347B (zh) * | 2007-02-09 | 2015-03-21 | Idemitsu Kosan Co | A thin film transistor, a thin film transistor substrate, and an image display device, and an image display device, and a semiconductor device |
WO2008099863A1 (ja) * | 2007-02-16 | 2008-08-21 | Idemitsu Kosan Co., Ltd. | 半導体,半導体装置及び相補型トランジスタ回路装置 |
US8129714B2 (en) * | 2007-02-16 | 2012-03-06 | Idemitsu Kosan Co., Ltd. | Semiconductor, semiconductor device, complementary transistor circuit device |
WO2008117739A1 (ja) * | 2007-03-23 | 2008-10-02 | Idemitsu Kosan Co., Ltd. | 半導体デバイス、多結晶半導体薄膜、多結晶半導体薄膜の製造方法、電界効果型トランジスタ、及び、電界効果型トランジスタの製造方法 |
WO2008126492A1 (ja) * | 2007-04-05 | 2008-10-23 | Idemitsu Kosan Co., Ltd. | 電界効果型トランジスタ及び電界効果型トランジスタの製造方法 |
JPWO2008136505A1 (ja) * | 2007-05-08 | 2010-07-29 | 出光興産株式会社 | 半導体デバイス及び薄膜トランジスタ、並びに、それらの製造方法 |
SE531337C2 (sv) | 2007-07-03 | 2009-02-24 | Atlas Copco Constr Tools Ab | Bränsledriven brytmaskin |
KR20090063946A (ko) * | 2007-12-14 | 2009-06-18 | 삼성코닝정밀유리 주식회사 | 산화인듐주석 타겟 및 이를 이용한 투명 도전막의 제조방법 |
JP2011174134A (ja) * | 2010-02-24 | 2011-09-08 | Idemitsu Kosan Co Ltd | In−Ga−Sn系酸化物焼結体、ターゲット、酸化物半導体膜、及び半導体素子 |
KR101774256B1 (ko) * | 2010-11-15 | 2017-09-05 | 삼성디스플레이 주식회사 | 산화물 반도체 박막 트랜지스터 및 그 제조 방법 |
-
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-
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- 2013-04-08 JP JP2013080129A patent/JP5775900B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05238807A (ja) * | 1992-02-29 | 1993-09-17 | Res Dev Corp Of Japan | 透明電気伝導性酸化物 |
JP2000048966A (ja) * | 1998-07-27 | 2000-02-18 | Idemitsu Kosan Co Ltd | 有機エレクトロルミネッセンス素子 |
WO2004105054A1 (ja) * | 2003-05-20 | 2004-12-02 | Idemitsu Kosan Co. Ltd. | 非晶質透明導電膜、及びその原料スパッタリングターゲット、及び非晶質透明電極基板、及びその製造方法、及び液晶ディスプレイ用カラーフィルタ |
WO2005086179A1 (ja) * | 2004-03-05 | 2005-09-15 | Idemitsu Kosan Co., Ltd. | 半透明・反射電極基板、及びその製造方法、及びその半透過・半反射電極基板を用いた液晶表示装置 |
JP2005292768A (ja) * | 2004-03-09 | 2005-10-20 | Idemitsu Kosan Co Ltd | Tft基板及びスパッタリングターゲット及び液晶表示装置及び画素電極及び透明電極及びtft基板の製造方法 |
JP2006173580A (ja) * | 2004-11-10 | 2006-06-29 | Canon Inc | 電界効果型トランジスタ |
Non-Patent Citations (3)
Title |
---|
"Handotai Yogo Daijiten", 20 March 1999, THE NIKKAN KOGYO SHINBUN, LTD., pages: 795 * |
"Tomei Dodenmaku no Gijutsu (2nd revised edition)", 20 December 2006, OHMSHA, LTD., pages: 113 - 119 * |
NAKAZAWA H. ET AL.: "The electronic properties of amorphous and crystallized In2O3 films", JOURNAL OF APPLIED PHYSICS, vol. 100, 2006, pages 93706-1 - 93706-8, XP012090432 * |
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US8333913B2 (en) | 2012-12-18 |
KR101612130B1 (ko) | 2016-04-12 |
TW200902740A (en) | 2009-01-16 |
JP2013191850A (ja) | 2013-09-26 |
JP5306179B2 (ja) | 2013-10-02 |
CN101680081A (zh) | 2010-03-24 |
TWI429775B (zh) | 2014-03-11 |
US20120273777A1 (en) | 2012-11-01 |
JPWO2008114588A1 (ja) | 2010-07-01 |
US20110315936A1 (en) | 2011-12-29 |
CN101680081B (zh) | 2012-10-31 |
US8668849B2 (en) | 2014-03-11 |
CN102593161A (zh) | 2012-07-18 |
JP5775900B2 (ja) | 2015-09-09 |
KR20090122391A (ko) | 2009-11-27 |
CN102593161B (zh) | 2014-11-05 |
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