WO2005086331A2 - Process device with improved power generation - Google Patents

Process device with improved power generation Download PDF

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Publication number
WO2005086331A2
WO2005086331A2 PCT/US2005/006596 US2005006596W WO2005086331A2 WO 2005086331 A2 WO2005086331 A2 WO 2005086331A2 US 2005006596 W US2005006596 W US 2005006596W WO 2005086331 A2 WO2005086331 A2 WO 2005086331A2
Authority
WO
WIPO (PCT)
Prior art keywords
field device
coupled
conversion module
energy conversion
field
Prior art date
Application number
PCT/US2005/006596
Other languages
English (en)
French (fr)
Other versions
WO2005086331A3 (en
Inventor
Robert J. Karschnia
Marcos Peluso
Adrian C. Toy
Original Assignee
Rosemount, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34919521&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2005086331(A2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Rosemount, Inc. filed Critical Rosemount, Inc.
Priority to CN200580006438XA priority Critical patent/CN1954138B/zh
Priority to JP2007501903A priority patent/JP5058785B2/ja
Priority to CA2552615A priority patent/CA2552615C/en
Priority to EP05724190A priority patent/EP1721067B1/en
Priority to DE602005018749T priority patent/DE602005018749D1/de
Publication of WO2005086331A2 publication Critical patent/WO2005086331A2/en
Publication of WO2005086331A3 publication Critical patent/WO2005086331A3/en

Links

Classifications

    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E70/00—Other energy conversion or management systems reducing GHG emissions
    • Y02E70/30—Systems combining energy storage with energy generation of non-fossil origin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/10—Internal combustion engine [ICE] based vehicles
    • Y02T10/12—Improving ICE efficiencies

Definitions

  • the present invention relates to .industrial process control and monitoring systems. More specifically, the present invention relates to the generation of electrical power for field devices within such systems .
  • control systems are used to monitor and control inventories of industrial and chemical processes, and the like.
  • the control system performs these functions using field devices distributed at key locations in the industrial process and coupled to the control circuitry in the control room by a process control loop.
  • field device refers to any device that performs a function in a distributed control or process monitoring system, including all devices used .in the measurement, control and monitoring of industrial processes. Field devices are used by the process control . and measurement industry for a variety of purposes.
  • transducer is understood to mean either a device that generates an output signal based on a physical input or that generates a physical output based on an input signal. Typically, a transducer transforms an input into an output having a different form.
  • each field device also includes communication circuitry that is used for communicating with a process control room, or other circuitry, over a process control loop.
  • the process control loop is also used to deliver a regulated current and/or voltage to the field device for powering the field device.
  • analog field devices have been connected to the control room by two-wire process control current loops, with each device connected to the control room by a single two-wire control loop.
  • a voltage differential is maintained between the two wires within a range of voltages from 12-45 volts for analog mode and 9-50 volts for digital mode.
  • Some analog field devices transmit a signal to the control room by modulating the current running through the current loop to a current ' proportional to the sensed process variable.
  • Other analog field devices can perform an action under the control of the control room by controlling the magnitude of the current through the loop.
  • the process control loop can carry digital signals used for communication with field devices. Digital communication allows a much larger degree of communication than analog communication. Moreover, digital devices also do not require separate wiring for each field device. Field devices that communicate digitally can respond to and communicate selectively with the control room and/or ' other field devices.
  • Wireless technologies have begun to be used to communicate with field devices.
  • Wireless operation simplifies field device wiring and setup.
  • Wireless installations are currently used in which the field device is manufactured to include an • internal battery, potentially charged by a solar cell without any sort of wired connection.
  • Problems exist in using an internal battery as the energy demands of wireless devices may vary greatly depending on numerous factors such as the device reporting rate, device elements, et cetera. Difficulties also arise in installations where solar power is not reliable. For example, it becomes problematic to use solar power in areas that experience full shade twenty-four hours a day, indoors seven days a week, or in parts of the world where solar insolation numbers are very small, such as in the Arctic Circle. Accordingly, in these installations, powering a wireless process device using solar power is not reliable. Accordingly, there is an ongoing significant need for wireless process devices that can operate using an abundant renewable source of power that is not dependent upon the sun.
  • a wireless field device includes a wireless communications module and an energy conversion module.
  • the wireless communications module is configured to wirelessly communicate process-related information with another device.
  • the energy conversion module is coupled to the wireless communications module.
  • the energy conversion module is configured to couple to a thermal source, and to generate electricity from thermal potential energy in the thermal source.
  • a field device includes a controller, a wireless communications module, and a power generation module.
  • the wireless communications module is coupled to the controller.
  • the power generation module is located within the field device, and is coupled to the controller and to the wireless communications module.
  • the power generation module is configured to interact with molecules proximate the exterior of the field device to generate electricity.
  • the power generation module is preferably a thermal generator that harvests energy from a temperature differential near the field device.
  • FIG. 1 is a diagrammatic view of an exemplary field device with which embodiments of the present invention is particularly useful.
  • FIG. 2 is a block diagram of the field device shown in FIG. 1.
  • FIG. 3 is a block diagram of a field device including wireless communication circuitry for communicating with a remote device.
  • FIG. 4 is a diagrammatic view of a wireless field device operating in accordance with an embodiment of the present invention.
  • FIGS. 5A and 5B are diagrammatic views of a temperature-sensing field device deriving power in accordance with embodiments of the present invention.
  • FIGS. 6A and 6B are diagrammatic views of a field device deriving power from a semiconductor thermoelectric generator in accordance with embodiments of the present invention.
  • FIG. 7 is diagrammatic view of a field device deriving power from a semiconductor thermoelectric generator in accordance with an embodiment of the present invention.
  • FIGS. 1 and 2 are diagrammatic and block diagram views of an exemplary field device with which embodiments of the present invention are useful.
  • Process control or monitoring system 10 includes a control room or control system 12 that couples to one or more field devices 14 over a two-wire process control loop 16.
  • Examples of process control loop 16 include analog 4-20 mA communication, hybrid protocols which include both analog and digital communication such as the Highway Addressable Remote Transducer (HART®) standard, as well as all-digital protocols such as the FOUNDATIONTM Fieldbus standard.
  • HART® Highway Addressable Remote Transducer
  • FOUNDATIONTM Fieldbus all-digital protocols
  • process control loop protocols can both power the field device and allow communication between the field device and other devices.
  • field device 14 includes circuitry 18 coupled to actuator/transducer 20 and to process control loop 16 via terminal board 21 in housing 23.
  • Field device 14 is illustrated as a process variable (PV) generator in that it couples to a process and senses an aspect, such as temperature, pressure, pH, flow, et cetera of the process and provides an indication thereof.
  • Other examples of field devices include valves, actuators, controllers, and displays.
  • field devices are characterized by their ability to operate in the "field” which may expose them to environmental stresses, such as temperature, humidity and pressure. In addition to environmental stresses, field devices must often withstand exposure to corrosive, hazardous and/or even explosive atmospheres. Further, such devices must also operate in the presence of vibration and/or electromagnetic interference.
  • Field device 34 includes power conversion module 38, controller 35, wireless communications module 32, and actuator/transducer 20.
  • Conversion module 38 can be any device that is able to convert thermal potential energy from the process into electrical energy.
  • Conversion module 38 can be any device, known or later developed, that translates thermal potential energy available from molecules proximate field device 34 into electricity.
  • module 38 can employ known thermopile devices to generate electricity from disparate temperatures using the Peltier Effect.
  • Other temperature-based conversion devices can be used for module • 38.
  • Such devices include thermoelectric diodes; solid state thermogenerators; and semiconductor thermoelectric generators.
  • Conversion module 38 can provide power for wireless communications module 32 alone, other portions of field device 34, or even all of the components within field device 34.
  • Wireless communication module 32 is coupled to controller 35 and interacts with external wireless devices via antenna 26 based upon commands and/or data from controller 35.
  • Wireless communication 32 can communicate process-related information as well as device-related information.
  • wireless communication module 32 may be adapted to communicate in accordance with any suitable wireless communication protocol including, but not limited to: wireless networking technologies (such as IEEE 802.11b wireless access points and wireless networking devices built by Linksys of
  • GSM Global System for Mobile Communications
  • Wireless communication module 32 can also include transducers for a plurality of wireless communication methods. For example, primary wireless communication could be performed using relatively long distance communication methods, such as GSM or GPRS, while a secondary, or additional communication method could be provided for technicians, or operators near the unit, using for example, IEEE 802.11b or Bluetooth.
  • Some wireless communications modules may include circuitry that can interact with the Global Positioning System (GPS) .
  • GPS can be advantageously employed in device 34 for mobile devices to allow finding the individual device 34 in a remote location.
  • location sensing based upon other techniques can be used as well.
  • Memory 37 is illustrated in FIG. 3 as being separate from controller 35, but may, in fact, be part of controller 35.
  • Memory 37 can be any suitable type of memory including volatile memory (such as Random Access Memory) , non-volatile memory (such as flash memory, EEPROM memory, ' etc.) and any combination thereof.
  • Memory 37 may contain program instructions for controller 35 as well as any suitable administrative overhead data for device 34.
  • Memory 37 ' may contain a unique identifier for device 34, such that device 34 can distinguish wireless communications meant for it among other wireless communications.
  • FIG. 4 is a diagrammatic view of a wireless field device operably coupled to energy conversion module 38 in accordance with an embodiment of the present invention. In the embodiment illustrated in FIG. 4, module 38 is disposed external to field device 34.
  • module 38 is disposed external to field device 34.
  • transducer 20 is illustrated in FIG. 4 as being a sensor.
  • the sensor or sensor tap 20 and wireless field device 34 are, by virtue of the process to which they are coupled, maintained at a differential temperature.
  • sensor 20 may be coupled to process fluid that is at a higher temperature than the ambient temperature to which device 34 is exposed.
  • Conversion module 38 is thermally coupled, illustrated by phantom lines 40, 42 to sensor 20 and field device 34, respectively.
  • the differential temperature coupled to conversion module 38 generates electricity within conversion module 38 that is provided to wireless field device 34 via line 44.
  • field device 34 When so powered, field device 34 generates and transmits wireless information to one or more remote transceivers 46, which may, in fact, be part of control system 12.
  • sensor 20 is a temperature sensor, such as a thermocouple, thermistor, or resistance temperature device (RTD) . While embodiments of the present invention will be described with respect to a temperature-sensing field device, embodiments of the present invention are practicable with any field device.
  • FIGS. 5A and 5B are diagrammatic views of field devices deriving power from thermal energy in accordance with embodiments of the present invention.
  • FIG. 5A illustrates a temperature-sensing .
  • thermowell 54 having an electronics compartment 52 coupled to a thermowell 54 which is shaped, or otherwise configured, to engage a process fluid.
  • a temperature sensor 56 provides an indication of process fluid temperature' proximate end 58 of thermowell 54.
  • a portion of conversion module 38 (shown in FIG 4) is disposed proximate end 58.
  • device 60 is disposed proximate end 58 and electrically coupled to electronics compartment 52 via power lines 62, 64.
  • Device 60 is preferably any suitable device that converts thermal energy into electricity.
  • device 60 may be a thermopile, thermodiode (thermoelectric diode) , a solid state thermogenerator, a semiconductor thermoelectric generator, or any combination thereof.
  • Temperature sensing of field device 50 is accomplished via temperature sensor 56 providing a signal on signal lines 66 and 68 to electronics compartment 52.
  • FIG. 5B illustrates field device 70 having an electronics compartment 52 and a thermowell 54.
  • field device 70 employs device 72 that generates electricity related to the temperature to which it is exposed.
  • suitable devices for device 72 include a thermopile or a thermoelectric diode. Such devices are suitable because they do not require a heat flow through the device, but instead generate electricity based upon exposure to a specific thermal source.
  • Technology advancements are currently increasing the feasibility of a field device such as that illustrated in FIGS. 5A and 5B. On the power generation side, solid state thermogenerators are becoming more and more efficient.
  • FIGS. 6A and 6B illustrate field devices that employ a semiconductor thermoelectric generator for thermoenergy scavenging in accordance with embodiments of the present invention.
  • field device 80 includes electronics compartment 52 and thermowell 54 having a semiconductor thermoelectric generator device 82 'disposed proximate distal end 58 of thermowell 54.
  • a thermal conductor 84 such as a heat conducting member, is coupled to cold side 86 of device 82 and conveys heat in the direction of arrow 88 to one or more optional cooling fins 90 that, in some embodiments, may be disposed within electronics compartment 52.
  • Conductor 84 may be any arrangement that conveys heat efficiently.
  • FIG. 6B illustrates an alternate arrangement for generating electricity from thermoenergy.
  • Field device 91 includes electronics compartment 52 and thermowell 54.
  • semiconductor thermoelectric generator device 92 is disposed above thermowell 54 proximate electronics compartment 52. This allows device 92 to be relatively larger in comparison to device 82.
  • thermal conductor 84 is still coupled thermally to distal end 58 and conveys heat in the direction of arrow 88 to hot side 94 of device 92.
  • the cold side 96 of device 92 is coupled to one or more optional cooling fins 90 that may or may not be disposed within housing 52.
  • FIGS. 6A and 6B there are different ways to conceptually achieve thermal flow across a semiconductor thermoelectric element. While FIGS. 6A and 6B illustrate a pair of examples, other possibilities may be practiced in accordance with embodiments of the present invention. In fact, the thermoelectric power generation element, need not be disposed proximate the field device itself.
  • FIG. 7 illustrates a diagrammatic view of field device 100 having an electronics compartment 52 coupled to a thermowell 54 for sensing a process temperature.
  • a thermoelectric power-generating device 102 is disposed remote from field device 100 and coupled thereto via power conductors 104, 106.
  • thermoelectric generator device 110 An elevated process temperature is coupled to hot side 108 of semiconductor thermoelectric generator device 110, which has one or more optional fins 90 coupled to its cold side 112. Since device 102 is mounted remote from field device 100, the physical size of device 102 is not constrained at all by the design of field device 100. This is advantageous because typically only small thermoelectric generating devices will fit within thermowell 54. Commercially available thermoelectric generating devices having a size on the order of 2 mm by 4 mm by 2 mm thick are believed to be able to fit within the thermowell, and to generate approximately 48 milivolts and 80 miliamps with a 50° C temperature different across hot and cold sides. This generated voltage is generally low and preferably is stepped up with a step up voltage conversion circuit known in the art of field devices.
  • thermoelectric generator device Accordingly, approximately 0.22 watts of heat flow through the thermoelectric generator device under such conditions . Although the operating efficiency is relatively low (approximately 2%) the approximately 4 milliwatts of generated power is believed to be sufficient for wireless field device operation. However, if the thermoelectric generating device is disposed remote from the field device, it is reasonable that the thermoelectric generating device could be sized much larger than the example given above. Specifically, thermoelectric generating devices having a size of approximately 15 mm by 15 mm by 2 mm thick can be used. Such devices are commercially available and believed to generate 375 millivolts and 300 milliamps for the same 50° C difference.
  • the conversion module can include, or be coupled to, additional power circuitry to provide additional functions related to power generation and/or storage.
  • additional power circuitry such as a capacitor or rechargeable cell can be operably coupled to the conversion module to maintain power levels when the amount of power available from the conversion module (via the thermal source) drops below that which could minimally operate the field device, or portions thereof.
  • any known power conditioning circuitry can be used to step up the voltage, remove noise from the power signal, isolate the power signal, smooth and/or otherwise shape the power signal.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Control Of Eletrric Generators (AREA)
PCT/US2005/006596 2004-03-02 2005-03-02 Process device with improved power generation WO2005086331A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN200580006438XA CN1954138B (zh) 2004-03-02 2005-03-02 具有改进电能产生的过程设备
JP2007501903A JP5058785B2 (ja) 2004-03-02 2005-03-02 改良された発電を備えたプロセス装置
CA2552615A CA2552615C (en) 2004-03-02 2005-03-02 Process device with improved power generation
EP05724190A EP1721067B1 (en) 2004-03-02 2005-03-02 Process device with improved power generation
DE602005018749T DE602005018749D1 (US07906523-20110315-C00022.png) 2004-03-02 2005-03-02

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US54963704P 2004-03-02 2004-03-02
US60/549,637 2004-03-02

Publications (2)

Publication Number Publication Date
WO2005086331A2 true WO2005086331A2 (en) 2005-09-15
WO2005086331A3 WO2005086331A3 (en) 2006-09-21

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US (1) US7957708B2 (US07906523-20110315-C00022.png)
EP (1) EP1721067B1 (US07906523-20110315-C00022.png)
JP (1) JP5058785B2 (US07906523-20110315-C00022.png)
CN (1) CN1954138B (US07906523-20110315-C00022.png)
CA (1) CA2552615C (US07906523-20110315-C00022.png)
DE (1) DE602005018749D1 (US07906523-20110315-C00022.png)
RU (1) RU2347921C2 (US07906523-20110315-C00022.png)
WO (1) WO2005086331A2 (US07906523-20110315-C00022.png)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007037988A1 (en) * 2005-09-27 2007-04-05 Rosemount Inc. Improved power generation for process devices
DE102006014444A1 (de) * 2006-03-29 2007-10-04 Abb Patent Gmbh Einrichtung zur Energieversorgung von Feldgeräten
WO2009048531A1 (en) * 2007-10-05 2009-04-16 Rosemount Inc. Rf adapter for field device
JP2010505383A (ja) * 2006-09-28 2010-02-18 ローズマウント インコーポレイテッド フィールドプロセス装置のための熱電発電機アセンブリ
WO2010124665A1 (de) * 2009-04-30 2010-11-04 Siemens Aktiengesellschaft Vorrichtung und temperaturmesseinheit zum berührungslosen messen und übermitteln von temperaturen von temperaturen aufnehmenden teilen und verwendung einer solchen vorrichtung
US7852271B2 (en) 2006-09-28 2010-12-14 Rosemount Inc. Wireless field device with antenna for industrial locations
EP2887511A1 (en) * 2013-12-20 2015-06-24 ABB Technology AG Sensor assembly for measuring at least a temperature on a moving part of an electric machine
US9674976B2 (en) 2009-06-16 2017-06-06 Rosemount Inc. Wireless process communication adapter with improved encapsulation
US9921120B2 (en) 2008-04-22 2018-03-20 Rosemount Inc. Industrial process device utilizing piezoelectric transducer
US10281313B2 (en) 2017-05-09 2019-05-07 Vega Grieshaber Kg Radar fill level measurement device comprising a phase-locked loop
US10761524B2 (en) 2010-08-12 2020-09-01 Rosemount Inc. Wireless adapter with process diagnostics

Families Citing this family (362)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2347921C2 (ru) 2004-03-02 2009-02-27 Роузмаунт Инк. Технологическое устройство с усовершенствованным обеспечением электропитанием
US8538560B2 (en) 2004-04-29 2013-09-17 Rosemount Inc. Wireless power and communication unit for process field devices
US20060176660A1 (en) * 2005-02-07 2006-08-10 Ahmad Amiri Ultra mobile communicating computer
US9184364B2 (en) 2005-03-02 2015-11-10 Rosemount Inc. Pipeline thermoelectric generator assembly
DE102005043771A1 (de) * 2005-09-13 2007-03-15 Endress + Hauser Flowtec Ag Verfahren zur Energieversorgung eines Feldgerätes der Automatisierungstechnik
US7913566B2 (en) 2006-05-23 2011-03-29 Rosemount Inc. Industrial process device utilizing magnetic induction
US9373770B2 (en) * 2006-09-28 2016-06-21 Rosemount Inc. Industrial thermoelectric generator
US8217782B2 (en) * 2007-05-24 2012-07-10 Rosemount Inc. Industrial field device with reduced power consumption
US8694060B2 (en) 2008-06-17 2014-04-08 Rosemount Inc. Form factor and electromagnetic interference protection for process device wireless adapters
EP2310918B1 (en) 2008-06-17 2014-10-08 Rosemount, Inc. Rf adapter for field device with variable voltage drop
CN102084307B (zh) * 2008-06-17 2014-10-29 罗斯蒙特公司 用于具有低压本质安全钳的现场设备的rf适配器
US8929948B2 (en) 2008-06-17 2015-01-06 Rosemount Inc. Wireless communication adapter for field devices
US8362959B2 (en) 2008-10-13 2013-01-29 Rosemount Inc. Wireless field device with rugged antenna and rotation stop
US7977924B2 (en) 2008-11-03 2011-07-12 Rosemount Inc. Industrial process power scavenging device and method of deriving process device power from an industrial process
US10378106B2 (en) 2008-11-14 2019-08-13 Asm Ip Holding B.V. Method of forming insulation film by modified PEALD
US8262287B2 (en) 2008-12-08 2012-09-11 Asm America, Inc. Thermocouple
US9394608B2 (en) 2009-04-06 2016-07-19 Asm America, Inc. Semiconductor processing reactor and components thereof
US9297705B2 (en) * 2009-05-06 2016-03-29 Asm America, Inc. Smart temperature measuring device
US8382370B2 (en) 2009-05-06 2013-02-26 Asm America, Inc. Thermocouple assembly with guarded thermocouple junction
US20100318007A1 (en) * 2009-06-10 2010-12-16 O'brien Donald J Electromechanical tactile stimulation devices and methods
US8626087B2 (en) 2009-06-16 2014-01-07 Rosemount Inc. Wire harness for field devices used in a hazardous locations
US8802201B2 (en) 2009-08-14 2014-08-12 Asm America, Inc. Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
DE102009056699B4 (de) * 2009-12-02 2015-04-30 Abb Technology Ag Autonomer Temperaturtransmitter
EP2567436B1 (en) 2010-03-24 2022-04-20 Pepperl+Fuchs SE Power management circuit for a wireless communication device and process control system using same
DE102010022025B4 (de) * 2010-05-29 2021-03-04 Abb Schweiz Ag Stromversorgungseinrichtung für autonome Feldgeräte
US8276458B2 (en) 2010-07-12 2012-10-02 Rosemount Inc. Transmitter output with scalable rangeability
GB2483293A (en) * 2010-09-03 2012-03-07 Spirax Sarco Ltd Steam flow meter with thermoelectric power source
JP5640800B2 (ja) * 2011-02-21 2014-12-17 ソニー株式会社 無線電力供給装置及び無線電力供給方法
DE102011006638A1 (de) * 2011-04-01 2012-10-04 Robert Bosch Gmbh Vorrichtung und Verfahren zum Melden eines Ereignisses und Überwachungssystem
US9312155B2 (en) 2011-06-06 2016-04-12 Asm Japan K.K. High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules
JP5881979B2 (ja) * 2011-06-27 2016-03-09 セイコーインスツル株式会社 端末装置、及び通信システム
US10364496B2 (en) 2011-06-27 2019-07-30 Asm Ip Holding B.V. Dual section module having shared and unshared mass flow controllers
US20130005372A1 (en) 2011-06-29 2013-01-03 Rosemount Inc. Integral thermoelectric generator for wireless devices
US10854498B2 (en) 2011-07-15 2020-12-01 Asm Ip Holding B.V. Wafer-supporting device and method for producing same
US20130023129A1 (en) 2011-07-20 2013-01-24 Asm America, Inc. Pressure transmitter for a semiconductor processing environment
TWI474161B (zh) * 2011-10-17 2015-02-21 Finetek Co Ltd A process controller with a power regulation function
US9310794B2 (en) 2011-10-27 2016-04-12 Rosemount Inc. Power supply for industrial process field device
US9017481B1 (en) 2011-10-28 2015-04-28 Asm America, Inc. Process feed management for semiconductor substrate processing
JP5980591B2 (ja) * 2012-06-29 2016-08-31 ナブテスコ株式会社 色センサーおよび機械装置遠隔監視システム
CN202918218U (zh) * 2012-08-16 2013-05-01 中兴通讯股份有限公司 一种通信系统设备的节能环保装置
US9659799B2 (en) 2012-08-28 2017-05-23 Asm Ip Holding B.V. Systems and methods for dynamic semiconductor process scheduling
EP2898492B1 (en) * 2012-09-21 2019-01-16 Home Control Singapore Pte. Ltd. Handheld information processing device with remote control output mode
US10714315B2 (en) 2012-10-12 2020-07-14 Asm Ip Holdings B.V. Semiconductor reaction chamber showerhead
US10910962B2 (en) 2012-10-19 2021-02-02 University Of Southern California Pervasive power generation system
US20160376700A1 (en) 2013-02-01 2016-12-29 Asm Ip Holding B.V. System for treatment of deposition reactor
US9484191B2 (en) 2013-03-08 2016-11-01 Asm Ip Holding B.V. Pulsed remote plasma method and system
USD702188S1 (en) 2013-03-08 2014-04-08 Asm Ip Holding B.V. Thermocouple
US9589770B2 (en) 2013-03-08 2017-03-07 Asm Ip Holding B.V. Method and systems for in-situ formation of intermediate reactive species
US9240412B2 (en) 2013-09-27 2016-01-19 Asm Ip Holding B.V. Semiconductor structure and device and methods of forming same using selective epitaxial process
JP5772912B2 (ja) * 2013-09-30 2015-09-02 横河電機株式会社 無線機器
DE102013114195A1 (de) * 2013-12-17 2015-06-18 Endress + Hauser Flowtec Ag Feldgerät der Prozessautomatisierung
US10683571B2 (en) 2014-02-25 2020-06-16 Asm Ip Holding B.V. Gas supply manifold and method of supplying gases to chamber using same
CN103822667A (zh) * 2014-03-04 2014-05-28 上海理工大学 基于蓝牙技术的温湿度采集系统
US10167557B2 (en) 2014-03-18 2019-01-01 Asm Ip Holding B.V. Gas distribution system, reactor including the system, and methods of using the same
US11015245B2 (en) 2014-03-19 2021-05-25 Asm Ip Holding B.V. Gas-phase reactor and system having exhaust plenum and components thereof
US9704373B2 (en) * 2014-05-29 2017-07-11 Thomas & Betts International Llc Smart lug system
US10858737B2 (en) 2014-07-28 2020-12-08 Asm Ip Holding B.V. Showerhead assembly and components thereof
US9890456B2 (en) 2014-08-21 2018-02-13 Asm Ip Holding B.V. Method and system for in situ formation of gas-phase compounds
JP6398486B2 (ja) * 2014-09-03 2018-10-03 株式会社デンソー アクチュエータ装置
US9657845B2 (en) 2014-10-07 2017-05-23 Asm Ip Holding B.V. Variable conductance gas distribution apparatus and method
US10941490B2 (en) 2014-10-07 2021-03-09 Asm Ip Holding B.V. Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
US9885610B2 (en) 2014-12-22 2018-02-06 Rosemount Inc. Thermowell system with vibration detection
KR102263121B1 (ko) 2014-12-22 2021-06-09 에이에스엠 아이피 홀딩 비.브이. 반도체 소자 및 그 제조 방법
US10529542B2 (en) 2015-03-11 2020-01-07 Asm Ip Holdings B.V. Cross-flow reactor and method
US10276355B2 (en) 2015-03-12 2019-04-30 Asm Ip Holding B.V. Multi-zone reactor, system including the reactor, and method of using the same
DE102015004578A1 (de) * 2015-04-14 2016-10-20 Dräger Safety AG & Co. KGaA Verfahren zur Datenübertragung zwischen Messeinrichtungen und einer Datenverarbeitungseinrichtung in einem Messdatenerfassungssystem
US10458018B2 (en) 2015-06-26 2019-10-29 Asm Ip Holding B.V. Structures including metal carbide material, devices including the structures, and methods of forming same
US9891111B2 (en) * 2015-06-30 2018-02-13 Rosemount Inc. Thermowell with infrared sensor
US10600673B2 (en) 2015-07-07 2020-03-24 Asm Ip Holding B.V. Magnetic susceptor to baseplate seal
CN105069981A (zh) * 2015-07-15 2015-11-18 北京依米康科技发展有限公司 利用化合物溶于水吸热和/或放热的热电水灾报警装置
US9960072B2 (en) 2015-09-29 2018-05-01 Asm Ip Holding B.V. Variable adjustment for precise matching of multiple chamber cavity housings
US10211308B2 (en) 2015-10-21 2019-02-19 Asm Ip Holding B.V. NbMC layers
US10322384B2 (en) 2015-11-09 2019-06-18 Asm Ip Holding B.V. Counter flow mixer for process chamber
US11139308B2 (en) 2015-12-29 2021-10-05 Asm Ip Holding B.V. Atomic layer deposition of III-V compounds to form V-NAND devices
US10468251B2 (en) 2016-02-19 2019-11-05 Asm Ip Holding B.V. Method for forming spacers using silicon nitride film for spacer-defined multiple patterning
US10529554B2 (en) 2016-02-19 2020-01-07 Asm Ip Holding B.V. Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
US10501866B2 (en) 2016-03-09 2019-12-10 Asm Ip Holding B.V. Gas distribution apparatus for improved film uniformity in an epitaxial system
US10343920B2 (en) 2016-03-18 2019-07-09 Asm Ip Holding B.V. Aligned carbon nanotubes
US9892913B2 (en) 2016-03-24 2018-02-13 Asm Ip Holding B.V. Radial and thickness control via biased multi-port injection settings
US10865475B2 (en) 2016-04-21 2020-12-15 Asm Ip Holding B.V. Deposition of metal borides and silicides
US10190213B2 (en) 2016-04-21 2019-01-29 Asm Ip Holding B.V. Deposition of metal borides
US10032628B2 (en) 2016-05-02 2018-07-24 Asm Ip Holding B.V. Source/drain performance through conformal solid state doping
US10367080B2 (en) 2016-05-02 2019-07-30 Asm Ip Holding B.V. Method of forming a germanium oxynitride film
KR102592471B1 (ko) 2016-05-17 2023-10-20 에이에스엠 아이피 홀딩 비.브이. 금속 배선 형성 방법 및 이를 이용한 반도체 장치의 제조 방법
US11453943B2 (en) 2016-05-25 2022-09-27 Asm Ip Holding B.V. Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
US10388509B2 (en) 2016-06-28 2019-08-20 Asm Ip Holding B.V. Formation of epitaxial layers via dislocation filtering
US9859151B1 (en) 2016-07-08 2018-01-02 Asm Ip Holding B.V. Selective film deposition method to form air gaps
US10612137B2 (en) 2016-07-08 2020-04-07 Asm Ip Holdings B.V. Organic reactants for atomic layer deposition
US10714385B2 (en) 2016-07-19 2020-07-14 Asm Ip Holding B.V. Selective deposition of tungsten
JP6448093B2 (ja) * 2016-07-27 2019-01-09 ナブテスコ株式会社 センサー装置
KR102354490B1 (ko) 2016-07-27 2022-01-21 에이에스엠 아이피 홀딩 비.브이. 기판 처리 방법
KR102532607B1 (ko) 2016-07-28 2023-05-15 에이에스엠 아이피 홀딩 비.브이. 기판 가공 장치 및 그 동작 방법
US9812320B1 (en) 2016-07-28 2017-11-07 Asm Ip Holding B.V. Method and apparatus for filling a gap
US10395919B2 (en) 2016-07-28 2019-08-27 Asm Ip Holding B.V. Method and apparatus for filling a gap
US9887082B1 (en) 2016-07-28 2018-02-06 Asm Ip Holding B.V. Method and apparatus for filling a gap
KR102613349B1 (ko) 2016-08-25 2023-12-14 에이에스엠 아이피 홀딩 비.브이. 배기 장치 및 이를 이용한 기판 가공 장치와 박막 제조 방법
US10410943B2 (en) 2016-10-13 2019-09-10 Asm Ip Holding B.V. Method for passivating a surface of a semiconductor and related systems
US10643826B2 (en) 2016-10-26 2020-05-05 Asm Ip Holdings B.V. Methods for thermally calibrating reaction chambers
US11532757B2 (en) 2016-10-27 2022-12-20 Asm Ip Holding B.V. Deposition of charge trapping layers
US10229833B2 (en) 2016-11-01 2019-03-12 Asm Ip Holding B.V. Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures
US10435790B2 (en) 2016-11-01 2019-10-08 Asm Ip Holding B.V. Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap
US10643904B2 (en) 2016-11-01 2020-05-05 Asm Ip Holdings B.V. Methods for forming a semiconductor device and related semiconductor device structures
US10714350B2 (en) 2016-11-01 2020-07-14 ASM IP Holdings, B.V. Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
US10134757B2 (en) 2016-11-07 2018-11-20 Asm Ip Holding B.V. Method of processing a substrate and a device manufactured by using the method
KR102546317B1 (ko) 2016-11-15 2023-06-21 에이에스엠 아이피 홀딩 비.브이. 기체 공급 유닛 및 이를 포함하는 기판 처리 장치
US10340135B2 (en) 2016-11-28 2019-07-02 Asm Ip Holding B.V. Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride
KR20180068582A (ko) 2016-12-14 2018-06-22 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
US11581186B2 (en) 2016-12-15 2023-02-14 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus
US11447861B2 (en) 2016-12-15 2022-09-20 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus and a method of forming a patterned structure
KR102700194B1 (ko) 2016-12-19 2024-08-28 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
US10269558B2 (en) 2016-12-22 2019-04-23 Asm Ip Holding B.V. Method of forming a structure on a substrate
US10867788B2 (en) 2016-12-28 2020-12-15 Asm Ip Holding B.V. Method of forming a structure on a substrate
US11390950B2 (en) 2017-01-10 2022-07-19 Asm Ip Holding B.V. Reactor system and method to reduce residue buildup during a film deposition process
US10655221B2 (en) 2017-02-09 2020-05-19 Asm Ip Holding B.V. Method for depositing oxide film by thermal ALD and PEALD
US10468261B2 (en) 2017-02-15 2019-11-05 Asm Ip Holding B.V. Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
US10529563B2 (en) 2017-03-29 2020-01-07 Asm Ip Holdings B.V. Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
US10283353B2 (en) 2017-03-29 2019-05-07 Asm Ip Holding B.V. Method of reforming insulating film deposited on substrate with recess pattern
KR102457289B1 (ko) 2017-04-25 2022-10-21 에이에스엠 아이피 홀딩 비.브이. 박막 증착 방법 및 반도체 장치의 제조 방법
US10770286B2 (en) 2017-05-08 2020-09-08 Asm Ip Holdings B.V. Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
US10446393B2 (en) 2017-05-08 2019-10-15 Asm Ip Holding B.V. Methods for forming silicon-containing epitaxial layers and related semiconductor device structures
US10892156B2 (en) 2017-05-08 2021-01-12 Asm Ip Holding B.V. Methods for forming a silicon nitride film on a substrate and related semiconductor device structures
US10504742B2 (en) 2017-05-31 2019-12-10 Asm Ip Holding B.V. Method of atomic layer etching using hydrogen plasma
US10886123B2 (en) 2017-06-02 2021-01-05 Asm Ip Holding B.V. Methods for forming low temperature semiconductor layers and related semiconductor device structures
US12040200B2 (en) 2017-06-20 2024-07-16 Asm Ip Holding B.V. Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus
US11306395B2 (en) 2017-06-28 2022-04-19 Asm Ip Holding B.V. Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
US10685834B2 (en) 2017-07-05 2020-06-16 Asm Ip Holdings B.V. Methods for forming a silicon germanium tin layer and related semiconductor device structures
KR20190009245A (ko) 2017-07-18 2019-01-28 에이에스엠 아이피 홀딩 비.브이. 반도체 소자 구조물 형성 방법 및 관련된 반도체 소자 구조물
US10541333B2 (en) 2017-07-19 2020-01-21 Asm Ip Holding B.V. Method for depositing a group IV semiconductor and related semiconductor device structures
US11374112B2 (en) 2017-07-19 2022-06-28 Asm Ip Holding B.V. Method for depositing a group IV semiconductor and related semiconductor device structures
US11018002B2 (en) 2017-07-19 2021-05-25 Asm Ip Holding B.V. Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
US10605530B2 (en) 2017-07-26 2020-03-31 Asm Ip Holding B.V. Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace
US10590535B2 (en) 2017-07-26 2020-03-17 Asm Ip Holdings B.V. Chemical treatment, deposition and/or infiltration apparatus and method for using the same
US10312055B2 (en) 2017-07-26 2019-06-04 Asm Ip Holding B.V. Method of depositing film by PEALD using negative bias
US10692741B2 (en) 2017-08-08 2020-06-23 Asm Ip Holdings B.V. Radiation shield
US10770336B2 (en) 2017-08-08 2020-09-08 Asm Ip Holding B.V. Substrate lift mechanism and reactor including same
US11139191B2 (en) 2017-08-09 2021-10-05 Asm Ip Holding B.V. Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
US10249524B2 (en) 2017-08-09 2019-04-02 Asm Ip Holding B.V. Cassette holder assembly for a substrate cassette and holding member for use in such assembly
US11769682B2 (en) 2017-08-09 2023-09-26 Asm Ip Holding B.V. Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
USD900036S1 (en) 2017-08-24 2020-10-27 Asm Ip Holding B.V. Heater electrical connector and adapter
US11830730B2 (en) 2017-08-29 2023-11-28 Asm Ip Holding B.V. Layer forming method and apparatus
US11056344B2 (en) 2017-08-30 2021-07-06 Asm Ip Holding B.V. Layer forming method
US11295980B2 (en) 2017-08-30 2022-04-05 Asm Ip Holding B.V. Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
KR102491945B1 (ko) 2017-08-30 2023-01-26 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
KR102401446B1 (ko) 2017-08-31 2022-05-24 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
US10607895B2 (en) 2017-09-18 2020-03-31 Asm Ip Holdings B.V. Method for forming a semiconductor device structure comprising a gate fill metal
KR102630301B1 (ko) 2017-09-21 2024-01-29 에이에스엠 아이피 홀딩 비.브이. 침투성 재료의 순차 침투 합성 방법 처리 및 이를 이용하여 형성된 구조물 및 장치
US10844484B2 (en) 2017-09-22 2020-11-24 Asm Ip Holding B.V. Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
US10658205B2 (en) 2017-09-28 2020-05-19 Asm Ip Holdings B.V. Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
US10403504B2 (en) 2017-10-05 2019-09-03 Asm Ip Holding B.V. Method for selectively depositing a metallic film on a substrate
US10319588B2 (en) 2017-10-10 2019-06-11 Asm Ip Holding B.V. Method for depositing a metal chalcogenide on a substrate by cyclical deposition
US10923344B2 (en) 2017-10-30 2021-02-16 Asm Ip Holding B.V. Methods for forming a semiconductor structure and related semiconductor structures
KR102443047B1 (ko) 2017-11-16 2022-09-14 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치 방법 및 그에 의해 제조된 장치
US10910262B2 (en) 2017-11-16 2021-02-02 Asm Ip Holding B.V. Method of selectively depositing a capping layer structure on a semiconductor device structure
US11022879B2 (en) 2017-11-24 2021-06-01 Asm Ip Holding B.V. Method of forming an enhanced unexposed photoresist layer
JP7206265B2 (ja) 2017-11-27 2023-01-17 エーエスエム アイピー ホールディング ビー．ブイ． クリーン・ミニエンバイロメントを備える装置
CN111316417B (zh) 2017-11-27 2023-12-22 阿斯莫Ip控股公司 与批式炉偕同使用的用于储存晶圆匣的储存装置
US10290508B1 (en) 2017-12-05 2019-05-14 Asm Ip Holding B.V. Method for forming vertical spacers for spacer-defined patterning
US10872771B2 (en) 2018-01-16 2020-12-22 Asm Ip Holding B. V. Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
TWI799494B (zh) 2018-01-19 2023-04-21 荷蘭商Ａｓｍ 智慧財產控股公司 沈積方法
CN111630203A (zh) 2018-01-19 2020-09-04 Asm Ip私人控股有限公司 通过等离子体辅助沉积来沉积间隙填充层的方法
USD903477S1 (en) 2018-01-24 2020-12-01 Asm Ip Holdings B.V. Metal clamp
US11018047B2 (en) 2018-01-25 2021-05-25 Asm Ip Holding B.V. Hybrid lift pin
US10535516B2 (en) 2018-02-01 2020-01-14 Asm Ip Holdings B.V. Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures
USD880437S1 (en) 2018-02-01 2020-04-07 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
US11081345B2 (en) 2018-02-06 2021-08-03 Asm Ip Holding B.V. Method of post-deposition treatment for silicon oxide film
CN116732497A (zh) 2018-02-14 2023-09-12 Asm Ip私人控股有限公司 通过循环沉积工艺在衬底上沉积含钌膜的方法
US10896820B2 (en) 2018-02-14 2021-01-19 Asm Ip Holding B.V. Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
US10731249B2 (en) 2018-02-15 2020-08-04 Asm Ip Holding B.V. Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus
US10658181B2 (en) 2018-02-20 2020-05-19 Asm Ip Holding B.V. Method of spacer-defined direct patterning in semiconductor fabrication
KR102636427B1 (ko) 2018-02-20 2024-02-13 에이에스엠 아이피 홀딩 비.브이. 기판 처리 방법 및 장치
US10975470B2 (en) 2018-02-23 2021-04-13 Asm Ip Holding B.V. Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
US11473195B2 (en) 2018-03-01 2022-10-18 Asm Ip Holding B.V. Semiconductor processing apparatus and a method for processing a substrate
US11629406B2 (en) 2018-03-09 2023-04-18 Asm Ip Holding B.V. Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
US11114283B2 (en) 2018-03-16 2021-09-07 Asm Ip Holding B.V. Reactor, system including the reactor, and methods of manufacturing and using same
KR102646467B1 (ko) 2018-03-27 2024-03-11 에이에스엠 아이피 홀딩 비.브이. 기판 상에 전극을 형성하는 방법 및 전극을 포함하는 반도체 소자 구조
US11088002B2 (en) 2018-03-29 2021-08-10 Asm Ip Holding B.V. Substrate rack and a substrate processing system and method
US10510536B2 (en) 2018-03-29 2019-12-17 Asm Ip Holding B.V. Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber
US11230766B2 (en) 2018-03-29 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method
KR102501472B1 (ko) 2018-03-30 2023-02-20 에이에스엠 아이피 홀딩 비.브이. 기판 처리 방법
DE102018110165A1 (de) * 2018-04-27 2019-10-31 Gemü Gebr. Müller Apparatebau Gmbh & Co. Kommanditgesellschaft Vorrichtung zur Anordnung an einer Komponente einer Industrieanlage
US12025484B2 (en) 2018-05-08 2024-07-02 Asm Ip Holding B.V. Thin film forming method
KR102709511B1 (ko) 2018-05-08 2024-09-24 에이에스엠 아이피 홀딩 비.브이. 기판 상에 산화물 막을 주기적 증착 공정에 의해 증착하기 위한 방법 및 관련 소자 구조
TW202349473A (zh) 2018-05-11 2023-12-16 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 用於基板上形成摻雜金屬碳化物薄膜之方法及相關半導體元件結構
KR102596988B1 (ko) 2018-05-28 2023-10-31 에이에스엠 아이피 홀딩 비.브이. 기판 처리 방법 및 그에 의해 제조된 장치
TWI840362B (zh) 2018-06-04 2024-05-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 水氣降低的晶圓處置腔室
US11718913B2 (en) 2018-06-04 2023-08-08 Asm Ip Holding B.V. Gas distribution system and reactor system including same
US11286562B2 (en) 2018-06-08 2022-03-29 Asm Ip Holding B.V. Gas-phase chemical reactor and method of using same
US10797133B2 (en) 2018-06-21 2020-10-06 Asm Ip Holding B.V. Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
KR102568797B1 (ko) 2018-06-21 2023-08-21 에이에스엠 아이피 홀딩 비.브이. 기판 처리 시스템
JP2021529254A (ja) 2018-06-27 2021-10-28 エーエスエム・アイピー・ホールディング・ベー・フェー 金属含有材料ならびに金属含有材料を含む膜および構造体を形成するための周期的堆積方法
TW202405221A (zh) 2018-06-27 2024-02-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 用於形成含金屬材料及包含含金屬材料的膜及結構之循環沉積方法
US10612136B2 (en) 2018-06-29 2020-04-07 ASM IP Holding, B.V. Temperature-controlled flange and reactor system including same
KR102686758B1 (ko) 2018-06-29 2024-07-18 에이에스엠 아이피 홀딩 비.브이. 박막 증착 방법 및 반도체 장치의 제조 방법
US10755922B2 (en) 2018-07-03 2020-08-25 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
US10388513B1 (en) 2018-07-03 2019-08-20 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
US10767789B2 (en) 2018-07-16 2020-09-08 Asm Ip Holding B.V. Diaphragm valves, valve components, and methods for forming valve components
US10483099B1 (en) 2018-07-26 2019-11-19 Asm Ip Holding B.V. Method for forming thermally stable organosilicon polymer film
US11053591B2 (en) 2018-08-06 2021-07-06 Asm Ip Holding B.V. Multi-port gas injection system and reactor system including same
US10883175B2 (en) 2018-08-09 2021-01-05 Asm Ip Holding B.V. Vertical furnace for processing substrates and a liner for use therein
US10829852B2 (en) 2018-08-16 2020-11-10 Asm Ip Holding B.V. Gas distribution device for a wafer processing apparatus
US11430674B2 (en) 2018-08-22 2022-08-30 Asm Ip Holding B.V. Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
US11024523B2 (en) 2018-09-11 2021-06-01 Asm Ip Holding B.V. Substrate processing apparatus and method
KR102707956B1 (ko) 2018-09-11 2024-09-19 에이에스엠 아이피 홀딩 비.브이. 박막 증착 방법
US11049751B2 (en) 2018-09-14 2021-06-29 Asm Ip Holding B.V. Cassette supply system to store and handle cassettes and processing apparatus equipped therewith
CN110970344B (zh) 2018-10-01 2024-10-25 Asmip控股有限公司 衬底保持设备、包含所述设备的系统及其使用方法
US11232963B2 (en) 2018-10-03 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method
KR102592699B1 (ko) 2018-10-08 2023-10-23 에이에스엠 아이피 홀딩 비.브이. 기판 지지 유닛 및 이를 포함하는 박막 증착 장치와 기판 처리 장치
US10847365B2 (en) 2018-10-11 2020-11-24 Asm Ip Holding B.V. Method of forming conformal silicon carbide film by cyclic CVD
US10811256B2 (en) 2018-10-16 2020-10-20 Asm Ip Holding B.V. Method for etching a carbon-containing feature
KR102546322B1 (ko) 2018-10-19 2023-06-21 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치 및 기판 처리 방법
KR102605121B1 (ko) 2018-10-19 2023-11-23 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치 및 기판 처리 방법
USD948463S1 (en) 2018-10-24 2022-04-12 Asm Ip Holding B.V. Susceptor for semiconductor substrate supporting apparatus
US10381219B1 (en) 2018-10-25 2019-08-13 Asm Ip Holding B.V. Methods for forming a silicon nitride film
US11087997B2 (en) 2018-10-31 2021-08-10 Asm Ip Holding B.V. Substrate processing apparatus for processing substrates
KR20200051105A (ko) 2018-11-02 2020-05-13 에이에스엠 아이피 홀딩 비.브이. 기판 지지 유닛 및 이를 포함하는 기판 처리 장치
US11572620B2 (en) 2018-11-06 2023-02-07 Asm Ip Holding B.V. Methods for selectively depositing an amorphous silicon film on a substrate
US11031242B2 (en) 2018-11-07 2021-06-08 Asm Ip Holding B.V. Methods for depositing a boron doped silicon germanium film
US10818758B2 (en) 2018-11-16 2020-10-27 Asm Ip Holding B.V. Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
US10847366B2 (en) 2018-11-16 2020-11-24 Asm Ip Holding B.V. Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
US10559458B1 (en) 2018-11-26 2020-02-11 Asm Ip Holding B.V. Method of forming oxynitride film
US12040199B2 (en) 2018-11-28 2024-07-16 Asm Ip Holding B.V. Substrate processing apparatus for processing substrates
US11217444B2 (en) 2018-11-30 2022-01-04 Asm Ip Holding B.V. Method for forming an ultraviolet radiation responsive metal oxide-containing film
KR102636428B1 (ko) 2018-12-04 2024-02-13 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치를 세정하는 방법
US11158513B2 (en) 2018-12-13 2021-10-26 Asm Ip Holding B.V. Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
JP7504584B2 (ja) 2018-12-14 2024-06-24 エーエスエム・アイピー・ホールディング・ベー・フェー 窒化ガリウムの選択的堆積を用いてデバイス構造体を形成する方法及びそのためのシステム
TW202405220A (zh) 2019-01-17 2024-02-01 荷蘭商Ａｓｍ Ｉｐ 私人控股有限公司 藉由循環沈積製程於基板上形成含過渡金屬膜之方法
TWI756590B (zh) 2019-01-22 2022-03-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 基板處理裝置
CN111524788B (zh) 2019-02-01 2023-11-24 Asm Ip私人控股有限公司 氧化硅的拓扑选择性膜形成的方法
TW202044325A (zh) 2019-02-20 2020-12-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 填充一基板之一表面內所形成的一凹槽的方法、根據其所形成之半導體結構、及半導體處理設備
US11482533B2 (en) 2019-02-20 2022-10-25 Asm Ip Holding B.V. Apparatus and methods for plug fill deposition in 3-D NAND applications
TWI845607B (zh) 2019-02-20 2024-06-21 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 用來填充形成於基材表面內之凹部的循環沉積方法及設備
KR102626263B1 (ko) 2019-02-20 2024-01-16 에이에스엠 아이피 홀딩 비.브이. 처리 단계를 포함하는 주기적 증착 방법 및 이를 위한 장치
TWI842826B (zh) 2019-02-22 2024-05-21 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 基材處理設備及處理基材之方法
KR20200108243A (ko) 2019-03-08 2020-09-17 에이에스엠 아이피 홀딩 비.브이. SiOC 층을 포함한 구조체 및 이의 형성 방법
KR20200108242A (ko) 2019-03-08 2020-09-17 에이에스엠 아이피 홀딩 비.브이. 실리콘 질화물 층을 선택적으로 증착하는 방법, 및 선택적으로 증착된 실리콘 질화물 층을 포함하는 구조체
KR20200108248A (ko) 2019-03-08 2020-09-17 에이에스엠 아이피 홀딩 비.브이. SiOCN 층을 포함한 구조체 및 이의 형성 방법
JP2020167398A (ja) 2019-03-28 2020-10-08 エーエスエム・アイピー・ホールディング・ベー・フェー ドアオープナーおよびドアオープナーが提供される基材処理装置
KR20200116855A (ko) 2019-04-01 2020-10-13 에이에스엠 아이피 홀딩 비.브이. 반도체 소자를 제조하는 방법
US11447864B2 (en) 2019-04-19 2022-09-20 Asm Ip Holding B.V. Layer forming method and apparatus
KR20200125453A (ko) 2019-04-24 2020-11-04 에이에스엠 아이피 홀딩 비.브이. 기상 반응기 시스템 및 이를 사용하는 방법
KR20200130121A (ko) 2019-05-07 2020-11-18 에이에스엠 아이피 홀딩 비.브이. 딥 튜브가 있는 화학물질 공급원 용기
KR20200130118A (ko) 2019-05-07 2020-11-18 에이에스엠 아이피 홀딩 비.브이. 비정질 탄소 중합체 막을 개질하는 방법
KR20200130652A (ko) 2019-05-10 2020-11-19 에이에스엠 아이피 홀딩 비.브이. 표면 상에 재료를 증착하는 방법 및 본 방법에 따라 형성된 구조
JP2020188254A (ja) 2019-05-16 2020-11-19 エーエスエム アイピー ホールディング ビー．ブイ． ウェハボートハンドリング装置、縦型バッチ炉および方法
JP2020188255A (ja) 2019-05-16 2020-11-19 エーエスエム アイピー ホールディング ビー．ブイ． ウェハボートハンドリング装置、縦型バッチ炉および方法
USD975665S1 (en) 2019-05-17 2023-01-17 Asm Ip Holding B.V. Susceptor shaft
USD947913S1 (en) 2019-05-17 2022-04-05 Asm Ip Holding B.V. Susceptor shaft
USD935572S1 (en) 2019-05-24 2021-11-09 Asm Ip Holding B.V. Gas channel plate
USD922229S1 (en) 2019-06-05 2021-06-15 Asm Ip Holding B.V. Device for controlling a temperature of a gas supply unit
KR20200141003A (ko) 2019-06-06 2020-12-17 에이에스엠 아이피 홀딩 비.브이. 가스 감지기를 포함하는 기상 반응기 시스템
KR20200143254A (ko) 2019-06-11 2020-12-23 에이에스엠 아이피 홀딩 비.브이. 개질 가스를 사용하여 전자 구조를 형성하는 방법, 상기 방법을 수행하기 위한 시스템, 및 상기 방법을 사용하여 형성되는 구조
USD944946S1 (en) 2019-06-14 2022-03-01 Asm Ip Holding B.V. Shower plate
USD931978S1 (en) 2019-06-27 2021-09-28 Asm Ip Holding B.V. Showerhead vacuum transport
KR20210005515A (ko) 2019-07-03 2021-01-14 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치용 온도 제어 조립체 및 이를 사용하는 방법
JP7499079B2 (ja) 2019-07-09 2024-06-13 エーエスエム・アイピー・ホールディング・ベー・フェー 同軸導波管を用いたプラズマ装置、基板処理方法
CN112216646A (zh) 2019-07-10 2021-01-12 Asm Ip私人控股有限公司 基板支撑组件及包括其的基板处理装置
KR20210010307A (ko) 2019-07-16 2021-01-27 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
KR20210010816A (ko) 2019-07-17 2021-01-28 에이에스엠 아이피 홀딩 비.브이. 라디칼 보조 점화 플라즈마 시스템 및 방법
KR20210010820A (ko) 2019-07-17 2021-01-28 에이에스엠 아이피 홀딩 비.브이. 실리콘 게르마늄 구조를 형성하는 방법
US11643724B2 (en) 2019-07-18 2023-05-09 Asm Ip Holding B.V. Method of forming structures using a neutral beam
KR20210010817A (ko) 2019-07-19 2021-01-28 에이에스엠 아이피 홀딩 비.브이. 토폴로지-제어된 비정질 탄소 중합체 막을 형성하는 방법
TWI839544B (zh) 2019-07-19 2024-04-21 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 形成形貌受控的非晶碳聚合物膜之方法
CN112309843A (zh) 2019-07-29 2021-02-02 Asm Ip私人控股有限公司 实现高掺杂剂掺入的选择性沉积方法
CN112309899A (zh) 2019-07-30 2021-02-02 Asm Ip私人控股有限公司 基板处理设备
CN112309900A (zh) 2019-07-30 2021-02-02 Asm Ip私人控股有限公司 基板处理设备
US11587815B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
US11227782B2 (en) 2019-07-31 2022-01-18 Asm Ip Holding B.V. Vertical batch furnace assembly
US11587814B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
CN112323048B (zh) 2019-08-05 2024-02-09 Asm Ip私人控股有限公司 用于化学源容器的液位传感器
USD965044S1 (en) 2019-08-19 2022-09-27 Asm Ip Holding B.V. Susceptor shaft
USD965524S1 (en) 2019-08-19 2022-10-04 Asm Ip Holding B.V. Susceptor support
JP2021031769A (ja) 2019-08-21 2021-03-01 エーエスエム アイピー ホールディング ビー．ブイ． 成膜原料混合ガス生成装置及び成膜装置
USD949319S1 (en) 2019-08-22 2022-04-19 Asm Ip Holding B.V. Exhaust duct
KR20210024423A (ko) 2019-08-22 2021-03-05 에이에스엠 아이피 홀딩 비.브이. 홀을 구비한 구조체를 형성하기 위한 방법
USD940837S1 (en) 2019-08-22 2022-01-11 Asm Ip Holding B.V. Electrode
USD979506S1 (en) 2019-08-22 2023-02-28 Asm Ip Holding B.V. Insulator
USD930782S1 (en) 2019-08-22 2021-09-14 Asm Ip Holding B.V. Gas distributor
US11286558B2 (en) 2019-08-23 2022-03-29 Asm Ip Holding B.V. Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film
KR20210024420A (ko) 2019-08-23 2021-03-05 에이에스엠 아이피 홀딩 비.브이. 비스(디에틸아미노)실란을 사용하여 peald에 의해 개선된 품질을 갖는 실리콘 산화물 막을 증착하기 위한 방법
KR20210029090A (ko) 2019-09-04 2021-03-15 에이에스엠 아이피 홀딩 비.브이. 희생 캡핑 층을 이용한 선택적 증착 방법
KR20210029663A (ko) 2019-09-05 2021-03-16 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
US11562901B2 (en) 2019-09-25 2023-01-24 Asm Ip Holding B.V. Substrate processing method
CN112593212B (zh) 2019-10-02 2023-12-22 Asm Ip私人控股有限公司 通过循环等离子体增强沉积工艺形成拓扑选择性氧化硅膜的方法
TWI846953B (zh) 2019-10-08 2024-07-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 基板處理裝置
KR20210042810A (ko) 2019-10-08 2021-04-20 에이에스엠 아이피 홀딩 비.브이. 활성 종을 이용하기 위한 가스 분배 어셈블리를 포함한 반응기 시스템 및 이를 사용하는 방법
KR20210043460A (ko) 2019-10-10 2021-04-21 에이에스엠 아이피 홀딩 비.브이. 포토레지스트 하부층을 형성하기 위한 방법 및 이를 포함한 구조체
US12009241B2 (en) 2019-10-14 2024-06-11 Asm Ip Holding B.V. Vertical batch furnace assembly with detector to detect cassette
TWI834919B (zh) 2019-10-16 2024-03-11 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 氧化矽之拓撲選擇性膜形成之方法
US11637014B2 (en) 2019-10-17 2023-04-25 Asm Ip Holding B.V. Methods for selective deposition of doped semiconductor material
KR20210047808A (ko) 2019-10-21 2021-04-30 에이에스엠 아이피 홀딩 비.브이. 막을 선택적으로 에칭하기 위한 장치 및 방법
KR20210050453A (ko) 2019-10-25 2021-05-07 에이에스엠 아이피 홀딩 비.브이. 기판 표면 상의 갭 피처를 충진하는 방법 및 이와 관련된 반도체 소자 구조
US11646205B2 (en) 2019-10-29 2023-05-09 Asm Ip Holding B.V. Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same
KR20210054983A (ko) 2019-11-05 2021-05-14 에이에스엠 아이피 홀딩 비.브이. 도핑된 반도체 층을 갖는 구조체 및 이를 형성하기 위한 방법 및 시스템
US11501968B2 (en) 2019-11-15 2022-11-15 Asm Ip Holding B.V. Method for providing a semiconductor device with silicon filled gaps
KR20210062561A (ko) 2019-11-20 2021-05-31 에이에스엠 아이피 홀딩 비.브이. 기판의 표면 상에 탄소 함유 물질을 증착하는 방법, 상기 방법을 사용하여 형성된 구조물, 및 상기 구조물을 형성하기 위한 시스템
US11450529B2 (en) 2019-11-26 2022-09-20 Asm Ip Holding B.V. Methods for selectively forming a target film on a substrate comprising a first dielectric surface and a second metallic surface
CN112951697A (zh) 2019-11-26 2021-06-11 Asm Ip私人控股有限公司 基板处理设备
CN112885692A (zh) 2019-11-29 2021-06-01 Asm Ip私人控股有限公司 基板处理设备
CN112885693A (zh) 2019-11-29 2021-06-01 Asm Ip私人控股有限公司 基板处理设备
JP7527928B2 (ja) 2019-12-02 2024-08-05 エーエスエム・アイピー・ホールディング・ベー・フェー 基板処理装置、基板処理方法
KR20210070898A (ko) 2019-12-04 2021-06-15 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
KR20210078405A (ko) 2019-12-17 2021-06-28 에이에스엠 아이피 홀딩 비.브이. 바나듐 나이트라이드 층을 형성하는 방법 및 바나듐 나이트라이드 층을 포함하는 구조
US11527403B2 (en) 2019-12-19 2022-12-13 Asm Ip Holding B.V. Methods for filling a gap feature on a substrate surface and related semiconductor structures
JP2021111783A (ja) 2020-01-06 2021-08-02 エーエスエム・アイピー・ホールディング・ベー・フェー チャネル付きリフトピン
JP2021109175A (ja) 2020-01-06 2021-08-02 エーエスエム・アイピー・ホールディング・ベー・フェー ガス供給アセンブリ、その構成要素、およびこれを含む反応器システム
US11993847B2 (en) 2020-01-08 2024-05-28 Asm Ip Holding B.V. Injector
KR20210093163A (ko) 2020-01-16 2021-07-27 에이에스엠 아이피 홀딩 비.브이. 고 종횡비 피처를 형성하는 방법
KR102675856B1 (ko) 2020-01-20 2024-06-17 에이에스엠 아이피 홀딩 비.브이. 박막 형성 방법 및 박막 표면 개질 방법
TW202130846A (zh) 2020-02-03 2021-08-16 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 形成包括釩或銦層的結構之方法
TW202146882A (zh) 2020-02-04 2021-12-16 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 驗證一物品之方法、用於驗證一物品之設備、及用於驗證一反應室之系統
US11776846B2 (en) 2020-02-07 2023-10-03 Asm Ip Holding B.V. Methods for depositing gap filling fluids and related systems and devices
US11781243B2 (en) 2020-02-17 2023-10-10 Asm Ip Holding B.V. Method for depositing low temperature phosphorous-doped silicon
TW202203344A (zh) 2020-02-28 2022-01-16 荷蘭商Ａｓｍ Ｉｐ控股公司 專用於零件清潔的系統
KR20210116240A (ko) 2020-03-11 2021-09-27 에이에스엠 아이피 홀딩 비.브이. 조절성 접합부를 갖는 기판 핸들링 장치
KR20210116249A (ko) 2020-03-11 2021-09-27 에이에스엠 아이피 홀딩 비.브이. 록아웃 태그아웃 어셈블리 및 시스템 그리고 이의 사용 방법
KR20210117157A (ko) 2020-03-12 2021-09-28 에이에스엠 아이피 홀딩 비.브이. 타겟 토폴로지 프로파일을 갖는 층 구조를 제조하기 위한 방법
KR20210124042A (ko) 2020-04-02 2021-10-14 에이에스엠 아이피 홀딩 비.브이. 박막 형성 방법
TW202146689A (zh) 2020-04-03 2021-12-16 荷蘭商Ａｓｍ Ｉｐ控股公司 阻障層形成方法及半導體裝置的製造方法
TW202145344A (zh) 2020-04-08 2021-12-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 用於選擇性蝕刻氧化矽膜之設備及方法
KR20210128343A (ko) 2020-04-15 2021-10-26 에이에스엠 아이피 홀딩 비.브이. 크롬 나이트라이드 층을 형성하는 방법 및 크롬 나이트라이드 층을 포함하는 구조
US11821078B2 (en) 2020-04-15 2023-11-21 Asm Ip Holding B.V. Method for forming precoat film and method for forming silicon-containing film
US11996289B2 (en) 2020-04-16 2024-05-28 Asm Ip Holding B.V. Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods
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JP2021172884A (ja) 2020-04-24 2021-11-01 エーエスエム・アイピー・ホールディング・ベー・フェー 窒化バナジウム含有層を形成する方法および窒化バナジウム含有層を含む構造体
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TW202146699A (zh) 2020-05-15 2021-12-16 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 形成矽鍺層之方法、半導體結構、半導體裝置、形成沉積層之方法、及沉積系統
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US12040177B2 (en) 2020-08-18 2024-07-16 Asm Ip Holding B.V. Methods for forming a laminate film by cyclical plasma-enhanced deposition processes
US11725280B2 (en) 2020-08-26 2023-08-15 Asm Ip Holding B.V. Method for forming metal silicon oxide and metal silicon oxynitride layers
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USD990534S1 (en) 2020-09-11 2023-06-27 Asm Ip Holding B.V. Weighted lift pin
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US12009224B2 (en) 2020-09-29 2024-06-11 Asm Ip Holding B.V. Apparatus and method for etching metal nitrides
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USD990441S1 (en) 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1397435A (en) * 1972-08-25 1975-06-11 Hull F R Regenerative vapour power plant
CH672368A5 (en) * 1987-08-20 1989-11-15 Rudolf Staempfli Solar thermal power plant with expansive heat engine - utilises pressure increase of working fluid in thermal storage heater transmitting energy between two closed circuits
RU2131934C1 (ru) * 1997-09-01 1999-06-20 Санков Олег Николаевич Нагревательная установка для обработки материалов
DE20107112U1 (de) * 2001-04-25 2001-07-05 Abb Patent Gmbh, 68309 Mannheim Einrichtung zur Energieversorgung von Feldgeräten

Family Cites Families (198)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2883489A (en) * 1954-12-06 1959-04-21 Daystrom Inc Encased electrical instrument
US3232712A (en) * 1962-08-16 1966-02-01 Continental Lab Inc Gas detector and analyzer
GB1027719A (US07906523-20110315-C00022.png) * 1963-12-02
US3568762A (en) * 1967-05-23 1971-03-09 Rca Corp Heat pipe
US3612851A (en) 1970-04-17 1971-10-12 Lewis Eng Co Rotatably adjustable indicator instrument
US3881962A (en) * 1971-07-29 1975-05-06 Gen Atomic Co Thermoelectric generator including catalytic burner and cylindrical jacket containing heat exchange fluid
US3931532A (en) * 1974-03-19 1976-01-06 The United States Of America As Represented By The United States National Aeronautics And Space Administration Thermoelectric power system
GB1525709A (en) 1975-04-10 1978-09-20 Chloride Silent Power Ltd Thermo-electric generators
US4125122A (en) 1975-08-11 1978-11-14 Stachurski John Z O Direct energy conversion device
US4026348A (en) * 1975-10-06 1977-05-31 Bell Telephone Laboratories, Incorporated Heat pipe switch
GR67600B (US07906523-20110315-C00022.png) * 1979-06-29 1981-08-31 Payot Jocelyne
US4370890A (en) * 1980-10-06 1983-02-01 Rosemount Inc. Capacitive pressure transducer with isolated sensing diaphragm
US4485670A (en) 1981-02-13 1984-12-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Heat pipe cooled probe
US4383801A (en) * 1981-03-02 1983-05-17 Pryor Dale H Wind turbine with adjustable air foils
US4389895A (en) * 1981-07-27 1983-06-28 Rosemount Inc. Capacitance pressure sensor
US4475047A (en) 1982-04-29 1984-10-02 At&T Bell Laboratories Uninterruptible power supplies
SE445389B (sv) * 1982-06-28 1986-06-16 Geotronics Ab Forfarande och anordning for att erhalla metdata fran en kemisk process
US4476853A (en) 1982-09-28 1984-10-16 Arbogast Clayton C Solar energy recovery system
GB2145876A (en) 1983-08-24 1985-04-03 Shlomo Beitner DC power generation for telemetry and like equipment from geothermal energy
DE3340834A1 (de) 1983-11-11 1985-05-23 Philips Patentverwaltung Gmbh, 2000 Hamburg Schaltungsanordnung zur konstanthaltung der temperaturabhaengigen empfindlichkeit eines differenzdruckmessgeraetes
US4639542A (en) * 1984-06-11 1987-01-27 Ga Technologies Inc. Modular thermoelectric conversion system
GB8426964D0 (en) 1984-10-25 1984-11-28 Sieger Ltd Adjusting circuit parameter
US4651019A (en) * 1984-11-16 1987-03-17 Pennsylvania Power & Light Company Dual fueled thermoelectric generator
DE3503347A1 (de) * 1985-02-01 1986-08-14 Dr.Ing.H.C. F. Porsche Ag, 7000 Stuttgart Vorrichtung zur drahtlosen messsignaluebertragung
US4860232A (en) 1987-04-22 1989-08-22 Massachusetts Institute Of Technology Digital technique for precise measurement of variable capacitance
US4878012A (en) 1988-06-10 1989-10-31 Rosemount Inc. Charge balanced feedback transmitter
US4977480A (en) 1988-09-14 1990-12-11 Fuji Koki Mfg. Co., Ltd. Variable-capacitance type sensor and variable-capacitance type sensor system using the same
DE3907209C1 (de) 1989-01-18 1990-03-01 Danfoss A/S, Nordborg Vorrichtung zum Überwachen eines Leitungssystems für Fluid auf Leckstellen
US4982412A (en) * 1989-03-13 1991-01-01 Moore Push-Pin Company Apparatus and method for counting a plurality of similar articles
JPH0769750B2 (ja) * 1989-09-08 1995-07-31 三菱電機株式会社 太陽電池電源系
SU1746056A1 (ru) 1990-02-21 1992-07-07 Рижский технический университет Ветроэнергетическа установка
USD331370S (en) 1990-11-15 1992-12-01 Titan Industries, Inc. Programmable additive controller
JP2753389B2 (ja) * 1990-11-28 1998-05-20 株式会社日立製作所 フィールドバス・システム
US5094109A (en) * 1990-12-06 1992-03-10 Rosemount Inc. Pressure transmitter with stress isolation depression
RU1813916C (ru) 1990-12-10 1993-05-07 Ч.-КАБудревич Ветродвигатель
DE4124662A1 (de) 1991-07-25 1993-01-28 Fibronix Sensoren Gmbh Relativdrucksensor
US5329818A (en) 1992-05-28 1994-07-19 Rosemount Inc. Correction of a pressure indication in a pressure transducer due to variations of an environmental condition
USD345107S (en) * 1992-06-01 1994-03-15 Titan Industries, Inc. Programmable additive controller
US5313831A (en) * 1992-07-31 1994-05-24 Paul Beckman Radial junction thermal flowmeter
JPH08557B2 (ja) * 1992-10-30 1996-01-10 川崎重工業株式会社 深海用耐圧殻入り熱機関発電システムの非常用排熱装置
US5506757A (en) * 1993-06-14 1996-04-09 Macsema, Inc. Compact electronic data module with nonvolatile memory
US5412535A (en) * 1993-08-24 1995-05-02 Convex Computer Corporation Apparatus and method for cooling electronic devices
BR9407400A (pt) * 1993-09-07 1996-11-05 Rosemount Inc Transmissor bifilar
US5606513A (en) * 1993-09-20 1997-02-25 Rosemount Inc. Transmitter having input for receiving a process variable from a remote sensor
JP3111816B2 (ja) 1993-10-08 2000-11-27 株式会社日立製作所 プロセス状態検出装置
US5642301A (en) * 1994-01-25 1997-06-24 Rosemount Inc. Transmitter with improved compensation
US5531936A (en) * 1994-08-31 1996-07-02 Board Of Trustees Operating Michigan State University Alkali metal quaternary chalcogenides and process for the preparation thereof
GB2293446A (en) 1994-09-17 1996-03-27 Liang Chung Lee Cooling assembly
EP0788627B1 (en) 1994-10-24 1999-12-15 Fisher-Rosemount Systems, Inc. Apparatus for providing access to field devices in a distributed control system
US5793963A (en) 1994-10-24 1998-08-11 Fisher Rosemount Systems, Inc. Apparatus for providing non-redundant secondary access to field devices in a distributed control system
US5656782A (en) 1994-12-06 1997-08-12 The Foxboro Company Pressure sealed housing apparatus and methods
US5637802A (en) * 1995-02-28 1997-06-10 Rosemount Inc. Capacitive pressure sensor for a pressure transmitted where electric field emanates substantially from back sides of plates
US5644185A (en) * 1995-06-19 1997-07-01 Miller; Joel V. Multi stage thermoelectric power generation using an ammonia absorption refrigeration cycle and thermoelectric elements at numerous locations in the cycle
US5705978A (en) * 1995-09-29 1998-01-06 Rosemount Inc. Process control transmitter
JPH09130289A (ja) 1995-10-31 1997-05-16 Mitsubishi Electric Corp アナログ携帯通信機
DE19608310C1 (de) 1996-02-22 1997-07-17 Hartmann & Braun Ag Differenzdruckmeßumformereinheit mit einem Überlastschutzsystem
US5665899A (en) 1996-02-23 1997-09-09 Rosemount Inc. Pressure sensor diagnostics in a process transmitter
US7949495B2 (en) * 1996-03-28 2011-05-24 Rosemount, Inc. Process variable transmitter with diagnostics
US6907383B2 (en) * 1996-03-28 2005-06-14 Rosemount Inc. Flow diagnostic system
FR2747238B1 (fr) 1996-04-04 1998-07-10 France Etat Generateur thermoelectrique
US5811201A (en) 1996-08-16 1998-09-22 Southern California Edison Company Power generation system utilizing turbine and fuel cell
ES2127122B1 (es) * 1996-09-02 1999-12-16 Blaquez Navarro Vicente Sistema mejorado electronico autonomo de monitorizacion para purgadores, valvulas e instalaciones en tiempo real.
US5803604A (en) * 1996-09-30 1998-09-08 Exergen Corporation Thermocouple transmitter
US5851083A (en) 1996-10-04 1998-12-22 Rosemount Inc. Microwave level gauge having an adapter with a thermal barrier
US5954526A (en) 1996-10-04 1999-09-21 Rosemount Inc. Process control transmitter with electrical feedthrough assembly
FR2758009B1 (fr) 1996-12-26 1999-03-19 France Etat Generateur thermoelectrique sous-marin a modules thermoelectriques disposes en manchons
PT960410E (pt) * 1997-02-12 2002-04-29 Siemens Ag Dispositivo e processo para a producao de sinais codificados de alta frequencia
JP3633180B2 (ja) * 1997-02-14 2005-03-30 株式会社日立製作所 遠隔監視システム
US6458319B1 (en) 1997-03-18 2002-10-01 California Institute Of Technology High performance P-type thermoelectric materials and methods of preparation
US6013204A (en) * 1997-03-28 2000-01-11 Board Of Trustees Operating Michigan State University Alkali metal chalcogenides of bismuth alone or with antimony
US6792259B1 (en) * 1997-05-09 2004-09-14 Ronald J. Parise Remote power communication system and method thereof
US7068991B2 (en) * 1997-05-09 2006-06-27 Parise Ronald J Remote power recharge for electronic equipment
US5872494A (en) * 1997-06-27 1999-02-16 Rosemount Inc. Level gage waveguide process seal having wavelength-based dimensions
US6282247B1 (en) * 1997-09-12 2001-08-28 Ericsson Inc. Method and apparatus for digital compensation of radio distortion over a wide range of temperatures
US6891838B1 (en) * 1998-06-22 2005-05-10 Statsignal Ipc, Llc System and method for monitoring and controlling residential devices
US6437692B1 (en) 1998-06-22 2002-08-20 Statsignal Systems, Inc. System and method for monitoring and controlling remote devices
AU755541B2 (en) * 1998-06-26 2002-12-12 Texaco Development Corporation Thermocouple for use in gasification process
US6360277B1 (en) * 1998-07-22 2002-03-19 Crydom Corporation Addressable intelligent relay
US6480699B1 (en) * 1998-08-28 2002-11-12 Woodtoga Holdings Company Stand-alone device for transmitting a wireless signal containing data from a memory or a sensor
US6405139B1 (en) * 1998-09-15 2002-06-11 Bently Nevada Corporation System for monitoring plant assets including machinery
US6312617B1 (en) 1998-10-13 2001-11-06 Board Of Trustees Operating Michigan State University Conductive isostructural compounds
US7640007B2 (en) 1999-02-12 2009-12-29 Fisher-Rosemount Systems, Inc. Wireless handheld communicator in a process control environment
US6127739A (en) 1999-03-22 2000-10-03 Appa; Kari Jet assisted counter rotating wind turbine
US6783167B2 (en) * 1999-03-24 2004-08-31 Donnelly Corporation Safety system for a closed compartment of a vehicle
FI111760B (fi) * 1999-04-16 2003-09-15 Metso Automation Oy Kenttälaitteen langaton ohjaus teollisuusprosessissa
JP2000321361A (ja) 1999-05-07 2000-11-24 Kubota Corp 通信装置
US6295875B1 (en) 1999-05-14 2001-10-02 Rosemount Inc. Process pressure measurement devices with improved error compensation
US6508131B2 (en) * 1999-05-14 2003-01-21 Rosemount Inc. Process sensor module having a single ungrounded input/output conductor
US7064671B2 (en) 2000-06-23 2006-06-20 Fisher Controls International Llc Low power regulator system and method
US6255010B1 (en) 1999-07-19 2001-07-03 Siemens Westinghouse Power Corporation Single module pressurized fuel cell turbine generator system
US6385972B1 (en) * 1999-08-30 2002-05-14 Oscar Lee Fellows Thermoacoustic resonator
US6667594B2 (en) 1999-11-23 2003-12-23 Honeywell International Inc. Determination of maximum travel of linear actuator
RU2168062C1 (ru) 1999-12-07 2001-05-27 Открытое акционерное общество "Всероссийский научно-исследовательский институт гидротехники им. Б.Е. Веденеева" Ветрогенератор
US6934862B2 (en) 2000-01-07 2005-08-23 Robertshaw Controls Company Appliance retrofit monitoring device with a memory storing an electronic signature
JP2001222787A (ja) 2000-02-07 2001-08-17 Mitsui Eng & Shipbuild Co Ltd 回転ドラム用計測システム
DE10014272B4 (de) * 2000-03-22 2008-06-05 Endress + Hauser Gmbh + Co. Kg Feldgerät, sowie Verfahren zum Umprogrammieren eines Feldgerätes
US6744814B1 (en) * 2000-03-31 2004-06-01 Agere Systems Inc. Method and apparatus for reduced state sequence estimation with tap-selectable decision-feedback
AT410041B (de) 2000-04-17 2003-01-27 Voest Alpine Ind Anlagen Verfahren und einrichtung zur aufnahme von messdaten in einem hüttenwerk
US6441747B1 (en) 2000-04-18 2002-08-27 Motorola, Inc. Wireless system protocol for telemetry monitoring
US6574515B1 (en) * 2000-05-12 2003-06-03 Rosemount Inc. Two-wire field-mounted process device
US6326764B1 (en) 2000-06-05 2001-12-04 Clement Virtudes Portable solar-powered CD player and electrical generator
FI114507B (fi) * 2000-07-07 2004-10-29 Metso Automation Oy Laitediagnostiikkajärjestelmä
JP3553001B2 (ja) 2000-08-04 2004-08-11 高圧ガス保安協会 ガス監視システム
EP1202145B1 (en) 2000-10-27 2005-02-09 Invensys Systems, Inc. Field device with a transmitter and/ or receiver for wireless data communication
DE50106624D1 (de) 2001-01-12 2005-08-04 Vector Informatik Gmbh Verfahren und Vorrichtung zur Relevanzprüfung eines Kennzeichners
US6686831B2 (en) 2001-01-23 2004-02-03 Invensys Systems, Inc. Variable power control for process control instruments
US6728603B2 (en) 2001-02-08 2004-04-27 Electronic Data Systems Corporation System and method for managing wireless vehicular communications
US6625990B2 (en) 2001-02-09 2003-09-30 Bsst Llc Thermoelectric power generation systems
JP3394996B2 (ja) 2001-03-09 2003-04-07 独立行政法人産業技術総合研究所 最大電力動作点追尾方法及びその装置
DE10125058B4 (de) * 2001-05-22 2014-02-27 Enocean Gmbh Thermisch speisbarer Sender und Sensorsystem
JP2002369554A (ja) 2001-06-06 2002-12-20 Nec Tokin Corp 標示装置
DE20122880U1 (de) 2001-06-12 2008-12-24 Abb Ag Elektropneumatischer Stellantrieb
US6564859B2 (en) * 2001-06-27 2003-05-20 Intel Corporation Efficient heat pumping from mobile platforms using on platform assembled heat pipe
US20030012563A1 (en) * 2001-07-10 2003-01-16 Darrell Neugebauer Space heater with remote control
JP2003051894A (ja) 2001-08-08 2003-02-21 Mitsubishi Electric Corp プラントの作業管理システム
US6781249B2 (en) * 2001-08-29 2004-08-24 Hewlett-Packard Development Company, L.P. Retrofittable power supply
EP1293853A1 (de) 2001-09-12 2003-03-19 ENDRESS + HAUSER WETZER GmbH + Co. KG Funkmodul für Feldgerät
US20030134161A1 (en) 2001-09-20 2003-07-17 Gore Makarand P. Protective container with preventative agent therein
US6995685B2 (en) * 2001-09-25 2006-02-07 Landis+Gyr, Inc. Utility meter power arrangements and methods
JP4114334B2 (ja) 2001-10-09 2008-07-09 株式会社ジェイテクト 転がり軸受
JP3815603B2 (ja) 2001-10-29 2006-08-30 横河電機株式会社 通信システム
JP2005507990A (ja) * 2001-11-01 2005-03-24 ザ ジョンズ ホプキンズ ユニバーシティ 流体を含む容器の状態を監視するための技術
JP2003149058A (ja) * 2001-11-14 2003-05-21 Toshiba Corp 温度センサ及びプラント温度計測装置
JP2003168182A (ja) * 2001-12-04 2003-06-13 Nsk Ltd ワイヤレスセンサ
JP4369236B2 (ja) * 2001-12-21 2009-11-18 ビ−エイイ− システムズ パブリック リミテッド カンパニ− センサシステム
US7002800B2 (en) * 2002-01-25 2006-02-21 Lockheed Martin Corporation Integrated power and cooling architecture
US7035773B2 (en) 2002-03-06 2006-04-25 Fisher-Rosemount Systems, Inc. Appendable system and devices for data acquisition, analysis and control
CA2478644A1 (en) 2002-03-06 2003-09-18 Automatika, Inc. Conduit network system
US6839546B2 (en) * 2002-04-22 2005-01-04 Rosemount Inc. Process transmitter with wireless communication link
AU2003225271A1 (en) 2002-04-30 2003-11-17 Chevron U.S.A. Inc. Temporary wireless sensor network system
US20040203984A1 (en) * 2002-06-11 2004-10-14 Tai-Her Yang Wireless information device with its transmission power lever adjustable
JP2004021877A (ja) 2002-06-20 2004-01-22 Yokogawa Electric Corp フィールド機器
US6843110B2 (en) * 2002-06-25 2005-01-18 Fluid Components International Llc Method and apparatus for validating the accuracy of a flowmeter
ES2554762T3 (es) 2002-06-28 2015-12-23 Boston Scientific Neuromodulation Corporation Microestimulador que tiene fuente de alimentación autónoma y sistema de telemetría direccional
US20040211456A1 (en) 2002-07-05 2004-10-28 Brown Jacob E. Apparatus, system, and method of diagnosing individual photovoltaic cells
AU2003261394A1 (en) * 2002-08-05 2004-02-23 Research Foundation Of The State University Of New York System and method for manufacturing embedded conformal electronics
US6838859B2 (en) * 2002-08-13 2005-01-04 Reza H. Shah Device for increasing power of extremely low DC voltage
US7063537B2 (en) * 2002-08-15 2006-06-20 Smar Research Corporation Rotatable assemblies and methods of securing such assemblies
EP1540758A1 (en) * 2002-09-13 2005-06-15 Proton Energy Systems, Inc. Method and system for balanced control of backup power
US6910332B2 (en) * 2002-10-15 2005-06-28 Oscar Lee Fellows Thermoacoustic engine-generator
US7440735B2 (en) 2002-10-23 2008-10-21 Rosemount Inc. Virtual wireless transmitter
US20040081872A1 (en) * 2002-10-28 2004-04-29 Herman Gregory S. Fuel cell stack with heat exchanger
US6926440B2 (en) * 2002-11-01 2005-08-09 The Boeing Company Infrared temperature sensors for solar panel
KR100666582B1 (ko) 2002-11-12 2007-01-09 미쓰비시덴키 가부시키가이샤 엘리베이터용 로프 및 엘리베이터 장치
JP2004208476A (ja) 2002-12-26 2004-07-22 Toyota Motor Corp 排熱発電装置
US20040159235A1 (en) * 2003-02-19 2004-08-19 Marganski Paul J. Low pressure drop canister for fixed bed scrubber applications and method of using same
WO2004082099A1 (de) * 2003-03-12 2004-09-23 Abb Research Ltd. Anordnung und verfahren zur drahtlosen versorgung eines feldgerätes in einer verfahrenstechnischen anlage mit elektrischer energie
US6904476B2 (en) 2003-04-04 2005-06-07 Rosemount Inc. Transmitter with dual protocol interface
US7326851B2 (en) 2003-04-11 2008-02-05 Basf Aktiengesellschaft Pb-Ge-Te-compounds for thermoelectric generators or Peltier arrangements
US6891477B2 (en) * 2003-04-23 2005-05-10 Baker Hughes Incorporated Apparatus and methods for remote monitoring of flow conduits
US20040214543A1 (en) * 2003-04-28 2004-10-28 Yasuo Osone Variable capacitor system, microswitch and transmitter-receiver
JP2004350479A (ja) 2003-05-26 2004-12-09 Hitachi Powdered Metals Co Ltd 熱電変換発電ユニットおよびこの熱電変換発電ユニットを備えるトンネル型炉
US7272454B2 (en) 2003-06-05 2007-09-18 Fisher-Rosemount Systems, Inc. Multiple-input/multiple-output control blocks with non-linear predictive capabilities
US7436797B2 (en) 2003-06-18 2008-10-14 Fisher-Rosemount Systems, Inc. Wireless architecture and support for process control systems
US7460865B2 (en) 2003-06-18 2008-12-02 Fisher-Rosemount Systems, Inc. Self-configuring communication networks for use with process control systems
US7275213B2 (en) * 2003-08-11 2007-09-25 Ricoh Company, Ltd. Configuring a graphical user interface on a multifunction peripheral
US20050046595A1 (en) * 2003-08-26 2005-03-03 Mr.John Blyth Solar powered sign annunciator
US8481843B2 (en) * 2003-09-12 2013-07-09 Board Of Trustees Operating Michigan State University Silver-containing p-type semiconductor
US7627441B2 (en) * 2003-09-30 2009-12-01 Rosemount Inc. Process device with vibration based diagnostics
US6932561B2 (en) * 2003-10-01 2005-08-23 Wafermasters, Inc. Power generation system
US7508671B2 (en) * 2003-10-10 2009-03-24 Intel Corporation Computer system having controlled cooling
US20050082949A1 (en) * 2003-10-21 2005-04-21 Michio Tsujiura Piezoelectric generator
US7655331B2 (en) * 2003-12-01 2010-02-02 Societe Bic Fuel cell supply including information storage device and control system
US20050139250A1 (en) * 2003-12-02 2005-06-30 Battelle Memorial Institute Thermoelectric devices and applications for the same
US8455751B2 (en) * 2003-12-02 2013-06-04 Battelle Memorial Institute Thermoelectric devices and applications for the same
US7330695B2 (en) * 2003-12-12 2008-02-12 Rosemount, Inc. Bus powered wireless transmitter
US7234084B2 (en) 2004-02-18 2007-06-19 Emerson Process Management System and method for associating a DLPDU received by an interface chip with a data measurement made by an external circuit
US6984899B1 (en) * 2004-03-01 2006-01-10 The United States Of America As Represented By The Secretary Of The Navy Wind dam electric generator and method
RU2347921C2 (ru) 2004-03-02 2009-02-27 Роузмаунт Инк. Технологическое устройство с усовершенствованным обеспечением электропитанием
US20050201349A1 (en) 2004-03-15 2005-09-15 Honeywell International Inc. Redundant wireless node network with coordinated receiver diversity
US7515977B2 (en) 2004-03-30 2009-04-07 Fisher-Rosemount Systems, Inc. Integrated configuration system for use in a process plant
US6971274B2 (en) * 2004-04-02 2005-12-06 Sierra Instruments, Inc. Immersible thermal mass flow meter
US8538560B2 (en) 2004-04-29 2013-09-17 Rosemount Inc. Wireless power and communication unit for process field devices
US7620409B2 (en) 2004-06-17 2009-11-17 Honeywell International Inc. Wireless communication system with channel hopping and redundant connectivity
US7262693B2 (en) 2004-06-28 2007-08-28 Rosemount Inc. Process field device with radio frequency communication
US8929228B2 (en) * 2004-07-01 2015-01-06 Honeywell International Inc. Latency controlled redundant routing
US20060063522A1 (en) * 2004-09-21 2006-03-23 Mcfarland Norman R Self-powering automated building control components
KR20060027578A (ko) * 2004-09-23 2006-03-28 삼성에스디아이 주식회사 이차 전지 모듈 온도 제어 시스템
US20060077917A1 (en) * 2004-10-07 2006-04-13 Honeywell International Inc. Architecture and method for enabling use of wireless devices in industrial control
JP4792851B2 (ja) * 2004-11-01 2011-10-12 横河電機株式会社 フィールド機器
NZ555318A (en) * 2004-11-24 2011-01-28 Abbott Lab Chromanylurea compounds that inhibit vanilloid receptor subtype 1 (VR1) receptor and uses thereof
US7680460B2 (en) 2005-01-03 2010-03-16 Rosemount Inc. Wireless process field device diagnostics
US7173343B2 (en) * 2005-01-28 2007-02-06 Moshe Kugel EMI energy harvester
US9184364B2 (en) * 2005-03-02 2015-11-10 Rosemount Inc. Pipeline thermoelectric generator assembly
US20060227729A1 (en) 2005-04-12 2006-10-12 Honeywell International Inc. Wireless communication system with collision avoidance protocol
US7649138B2 (en) 2005-05-25 2010-01-19 Hi-Z Technology, Inc. Thermoelectric device with surface conforming heat conductor
US7848223B2 (en) 2005-06-03 2010-12-07 Honeywell International Inc. Redundantly connected wireless sensor networking methods
US7742394B2 (en) 2005-06-03 2010-06-22 Honeywell International Inc. Redundantly connected wireless sensor networking methods
KR100635405B1 (ko) * 2005-06-10 2006-10-19 한국과학기술연구원 마이크로 발전기
US8463319B2 (en) 2005-06-17 2013-06-11 Honeywell International Inc. Wireless application installation, configuration and management tool
US7909899B2 (en) * 2005-06-28 2011-03-22 Community Power Corporation Method and apparatus for automated, modular, biomass power generation
US7271679B2 (en) 2005-06-30 2007-09-18 Intermec Ip Corp. Apparatus and method to facilitate wireless communications of automatic data collection devices in potentially hazardous environments
US20070030816A1 (en) * 2005-08-08 2007-02-08 Honeywell International Inc. Data compression and abnormal situation detection in a wireless sensor network
US7801094B2 (en) * 2005-08-08 2010-09-21 Honeywell International Inc. Integrated infrastructure supporting multiple wireless devices
US8204078B2 (en) 2006-03-31 2012-06-19 Honeywell International Inc. Apparatus, system, and method for integration of wireless devices with a distributed control system
US7848827B2 (en) 2006-03-31 2010-12-07 Honeywell International Inc. Apparatus, system, and method for wireless diagnostics
KR100744902B1 (ko) * 2006-05-24 2007-08-01 삼성전기주식회사 휴대 무선 조작기
US7644633B2 (en) * 2006-12-18 2010-01-12 Rosemount Inc. Vortex flowmeter with temperature compensation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1397435A (en) * 1972-08-25 1975-06-11 Hull F R Regenerative vapour power plant
CH672368A5 (en) * 1987-08-20 1989-11-15 Rudolf Staempfli Solar thermal power plant with expansive heat engine - utilises pressure increase of working fluid in thermal storage heater transmitting energy between two closed circuits
RU2131934C1 (ru) * 1997-09-01 1999-06-20 Санков Олег Николаевич Нагревательная установка для обработки материалов
DE20107112U1 (de) * 2001-04-25 2001-07-05 Abb Patent Gmbh, 68309 Mannheim Einrichtung zur Energieversorgung von Feldgeräten

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 018, no. 559 (M-1692), 25 October 1994 (1994-10-25) & JP 06 199284 A (KAWASAKI HEAVY IND LTD; others: 01), 19 July 1994 (1994-07-19) *

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4779018B2 (ja) * 2005-09-27 2011-09-21 ローズマウント インコーポレイテッド プロセス装置のための改良された発電
CN101273313B (zh) * 2005-09-27 2012-12-19 罗斯蒙德公司 用于过程设备的改进的电能产生
WO2007037988A1 (en) * 2005-09-27 2007-04-05 Rosemount Inc. Improved power generation for process devices
DE102006014444A1 (de) * 2006-03-29 2007-10-04 Abb Patent Gmbh Einrichtung zur Energieversorgung von Feldgeräten
JP2010505383A (ja) * 2006-09-28 2010-02-18 ローズマウント インコーポレイテッド フィールドプロセス装置のための熱電発電機アセンブリ
US7852271B2 (en) 2006-09-28 2010-12-14 Rosemount Inc. Wireless field device with antenna for industrial locations
WO2009048531A1 (en) * 2007-10-05 2009-04-16 Rosemount Inc. Rf adapter for field device
EP2527940A3 (en) * 2007-10-05 2013-02-13 Rosemount, Inc. RF adapter for field device
US9921120B2 (en) 2008-04-22 2018-03-20 Rosemount Inc. Industrial process device utilizing piezoelectric transducer
WO2010124665A1 (de) * 2009-04-30 2010-11-04 Siemens Aktiengesellschaft Vorrichtung und temperaturmesseinheit zum berührungslosen messen und übermitteln von temperaturen von temperaturen aufnehmenden teilen und verwendung einer solchen vorrichtung
US9674976B2 (en) 2009-06-16 2017-06-06 Rosemount Inc. Wireless process communication adapter with improved encapsulation
US10761524B2 (en) 2010-08-12 2020-09-01 Rosemount Inc. Wireless adapter with process diagnostics
EP2887511A1 (en) * 2013-12-20 2015-06-24 ABB Technology AG Sensor assembly for measuring at least a temperature on a moving part of an electric machine
US10281313B2 (en) 2017-05-09 2019-05-07 Vega Grieshaber Kg Radar fill level measurement device comprising a phase-locked loop

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