WO2005019298A1 - 熱硬化型エポキシ樹脂組成物および透明材料 - Google Patents
熱硬化型エポキシ樹脂組成物および透明材料 Download PDFInfo
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- WO2005019298A1 WO2005019298A1 PCT/JP2004/012426 JP2004012426W WO2005019298A1 WO 2005019298 A1 WO2005019298 A1 WO 2005019298A1 JP 2004012426 W JP2004012426 W JP 2004012426W WO 2005019298 A1 WO2005019298 A1 WO 2005019298A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
Definitions
- the present invention relates to a thermosetting epoxy resin composition that forms a cured product having excellent transparency, dimensional stability, and heat resistance, and a transparent material using the composition.
- Japanese Patent Application Laid-Open No. 2-1696920 discloses a technique for manufacturing a transparent substrate for a liquid crystal panel using a cured product of an alicyclic acid anhydride and an epoxy resin. Was inadequate.
- An object of the present invention is to provide a thermosetting resin composition which is excellent in heat resistance, dimensional stability, and transparency and is a substitute for a glass substrate or the like. Disclosure of the invention
- the present inventors have conducted intensive studies and found that an alicyclic epoxy compound has an ester bond.
- the inventors have found that by removing the above, the heat resistance and dimensional stability of the epoxy resin are improved while the transparency is maintained, and the present invention has been achieved. That is, the first of the present invention is (A) a non-ester type alicyclic epoxy compound having two alicyclic epoxy groups in a molecule and having no ester bond, 10 to 99% by weight, and ,
- thermosetting resin composition comprising (C) 0.01 to 20 parts by weight of a force-thione polymerization initiator.
- a second aspect of the present invention is that (D) 50 parts by weight or less of an acrylic resin having an epoxy group other than (A) and (B) is added to 100 parts by weight of the epoxy composition (E).
- a thermosetting resin composition according to the first aspect of the present invention is provided.
- thermosetting resin composition according to the second aspect of the present invention, wherein the (D) acrylic resin having an epoxy group has a hydroxyl group in addition to the epoxy group. provide.
- a fourth aspect of the present invention is the composition according to any one of the first to third aspects, wherein (A) the non-ester type alicyclic epoxy compound is an epoxy compound represented by a structural formula (1).
- the present invention provides a thermosetting resin composition as described above.
- R 1 to R 18 are the same or different and each represents a hydrogen atom, a halogen atom, a hydrocarbon group which may contain an oxygen atom or a halogen atom, or an alkoxy group which may have a substituent. )
- a fifth aspect of the present invention is that (A) the non-ester type alicyclic epoxy compound is represented by the structural formula (3):
- the present invention provides the thermosetting resin composition according to any one of the first to third aspects of the present invention, which is an epoxy compound.
- R 1 to R 12 are the same or different and each represents a hydrogen atom, a halogen atom, a hydrocarbon group which may contain an oxygen atom or a halogen atom, or an alkoxy group which may have a substituent. )
- a sixth aspect of the present invention is described in any one of the first to third aspects of the present invention, wherein (A) the non-ester type alicyclic epoxy compound is an epoxy compound represented by a structural formula (5).
- the present invention provides a thermosetting resin composition.
- R 1 to R 12 are the same or different and each represents a hydrogen atom, a halogen atom, a hydrocarbon group which may contain an oxygen atom or a halogen atom, or an alkoxy group which may have a substituent. )
- a seventh aspect of the present invention provides a transparent material obtained by curing the thermosetting resin composition according to any one of the first to sixth aspects of the present invention by heating.
- thermosetting resin composition according to the present invention is a resin composition that undergoes cationic polymerization to be cured by heating.
- A Non-ester type alicyclic epoxy compound
- E 100 to 100 parts by weight of an epoxy composition (E) comprising (B) 90 to 1% by weight of an epoxy compound different from (A) above, and (A) and (B) being 100% by weight.
- the (A) non-ester type alicyclic epoxy compound in the present invention is a compound having two alicyclic epoxy groups in the molecule and having no ester bond, and specific examples thereof include the following formula ( The compounds represented by 1), (3) and (5) can be mentioned.
- R1 to R18 each have a hydrogen atom, a halogen atom, a hydrocarbon group (having 1 to 6 carbon atoms) which may contain an oxygen atom or a halogen atom, or a substituent. And represents an alkoxy group (having 1 to 6 carbon atoms) which may be the same or different.
- the non-ester-type alicyclic epoxy compound of the formula (1) is, for example, an unsaturated compound represented by the following formula (2) having a bicyclohexyl_3,3'-gen skeleton represented by an organic percarboxylic acid or aqueous hydrogen peroxide. Can be produced by oxidation.
- Rl to Rl2 are a hydrogen atom, a halogen atom, a hydrocarbon group which may contain an oxygen atom or a halogen atom. (C 1-6) or an alkoxy group (C 1-6) which may have a substituent, which may be the same or different.
- the non-ester type alicyclic epoxy compound of the formula (3) is obtained, for example, by oxidizing an unsaturated compound represented by the following formula (4) having a cyclohexene skeleton with an organic percarboxylic acid or aqueous hydrogen peroxide. It can be manufactured by doing.
- R1 to R12 represent a hydrogen atom, a halogen atom, an oxygen atom or a hydrocarbon group which may contain a halogen atom.
- the non-ester type alicyclic epoxy compound of the formula (5) is obtained by, for example, oxidizing an unsaturated compound having an alicyclic indene skeleton represented by the following formula (6) with an organic percarboxylic acid or aqueous hydrogen peroxide. Can be manufactured.
- the epoxy compound different from (A) in the present invention is a compound having one or more, preferably one or two epoxy groups in the molecule.
- This epoxy group may be an alicyclic epoxy group or an epoxy group other than an alicyclic epoxy group.
- component (B) Specific examples of the compound having an alicyclic epoxy group in the molecule as the component (B) include:
- the component (B) may be an ester-type alicyclic epoxy compound.
- component (A) which is a non-ester type alicyclic epoxy compound, is high, transparency is maintained even if an ester type alicyclic epoxy compound is used for component (B).
- (E) the content of the compound having an ester bond in the epoxy composition is less than 50% by weight.
- the compound having an epoxy group other than the alicyclic epoxy group in the molecule as the component (B) there are various bisphenol-type diglycidyl ethers represented by bisphenol A-type and F-type (a commercially available product).
- bisphenol A-type and F-type a commercially available product
- Epikoto 828, 806 manufactured by Japan Epoxy Resin
- YD-128 manufactured by Toto Kasei
- nuclear hydrogenated bisphenol type epoxy resin commercially available products include HBE-100 (manufactured by Shin Nippon Rika) — 4000 (manufactured by Japan Epoxy Resin) and YX—8000 (manufactured by Japan Epoxy Resin).
- glycidyl ethers having a cyclic aliphatic skeleton such as diglycidyl ether of cyclohexane dimethanol (commercially available products such as DME-100 (manufactured by Shin Nihon Rika)), glycidyl ether of nopolak type phenol resin Glycidyl ether of nopolak type phenolic resin copolymerized with DCPD (dicyclopentadiene), polycyclic aromatic glycidyl ether such as naphthylene, epoxy resin with epoxy terminal on alicyclic skeleton (as a commercial product) Are EHPE-3150, EHPE-3150CE (manufactured by Daicel Chemical Industries), etc.) Concrete resins (commercially available products such as A-186 (manufactured by Nippon Tunicer), KBM303, KB M403, and KBM42 (manufactured by Shin-Etsu Chemical Co., Ltd.) are also included.
- the (D) acrylic resin having an epoxy group in the present invention is an acrylic resin having, if necessary, a hydroxyl group in addition to the epoxy group, and is obtained by polymerizing a monomer containing an epoxy group, or It is a compound that can be obtained by copolymerizing a monomer containing a hydroxyl group, and is an epoxy compound other than the above-mentioned components (A) and (B).
- Examples of the monomer containing an epoxy group include a compound having a glycidyl group or a similar terminal epoxy group, and a (meth) acrylate having an alicyclic epoxy. Specific examples include glycidyl (meth) acrylate, 2-methyl-glycidyl (meth) acrylate, epoxidized isoprenyl (meth) acrylate, and an epoxy group-containing (meth) acrylate CYM M-100 of the following structural formula: CYM A-200 (manufactured by Daicel Chemical Industries).
- the hydroxyl-containing monomers include hydroxyethyl (meth) acrylate and monomers obtained by modifying the hydroxyl groups of these hydroxyl-containing (meth) acrylates with force-prolactone (trade names FM-1, FM-3, FM-10, FA-1 and FA-3 are commercially available from Daicel Chemical Industries.)
- a normal alkyl (meth) acrylate monomer can be used in addition to a monomer having an epoxy group and a monomer having a hydroxyl group.
- a typical alkyl (meth) acrylate monomer is methyl (meth) acrylate —T, ethyl (meth) acrylate, n_, i— or t-butyl (meth) acrylate, hexyl (meth) acrylate, octyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate Alkyl or cycloalkyl esters of (meth) acrylic acid having 1 to 24 carbon atoms, such as cyclohexyl (meth) acrylate; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate (C) hydroxyalkyl esters of 1 to 8 carbon atoms of (meth) acrylic acid such as 4-hydroxybutyl (meth) acrylate; a, j3-ethylene such as acrylic acid, maleic acid, itaconic acid, and crotonic acid Uns
- Thyraplane FM0711, FM0721, FM0721 All above, all manufactured by Chisso, polydimethylsiloxane macromonomer having methacryloyl group at terminal
- Pinyl monomers can be mentioned.
- a polymerization initiator In producing the acrylic resin (D) having an epoxy group in the present invention from the above monomer, a polymerization initiator can be used.
- the polymerization initiator include potassium persulfate, ammonium persulfate, benzoyl peroxide, hydrogen peroxide, di-tert-butyl peroxide, dicumyl peroxide, 2,4-dichlorobenzoyl peroxide, decanoy.
- the amount of the polymerization initiator to be used is 1 to 10 parts by weight, preferably 3 to 6 parts by weight, based on 100 parts by weight of the monomer.
- the polymerization initiator may be partially charged in the reactor in advance, may be added to the monomer, or may be added separately without being added. Further, after the monomer is charged, an initiator may be additionally charged.
- the polymerization temperature is from 90 to 130 ° C, preferably from 100 to 120 ° C. If the temperature is higher than 13 Ot, polymerization becomes unstable and a large amount of high molecular weight compounds are formed, which is not preferable. On the other hand, if it is less than 901, the polymerization time is undesirably long.
- the amount of the epoxy group in the (D) epoxy resin having an epoxy group in the present invention is 4 to 12%, preferably 5.5 to 11.5% as an oxysilane oxygen concentration.
- the amount of the hydroxyl group in the acrylic resin having a hydroxyl group in addition to the epoxy group is preferably 1 to 300 (unit: mg-KOH / g) as a hydroxyl value, and more preferably 1.5 to 250 (unit: : mg-K0H / g) is more preferable.
- the cationic polymerization initiator (C) in the present invention is a compound that initiates polymerization by generating a cationic species by heating, and for example, hexafluoroantimonone represented by the following formulas (I) to (XV). And hexafluorofluoroantimonate salt, hexafluorophosphate salt, hexafluoroarsenate salt and other cationic polymerization initiators.
- Ar represents an aryl group, for example, a phenyl group
- X— represents PF S b F 6 or As F 6 —.
- R20 represents an alkyl group or an alkoxy group having 1 to 12 carbon atoms
- r represents an integer of 0 to 3
- X- represents PF S bF 6 — or As F 6 —
- Y- represents PF 6 —, SbF 6 —, As F 6 — or SbF 5 (OH) —.
- X- represents PF 6 —, S bF 6 — or As F 6 —.
- X- represents PF S bF 6 — or As F 6 —.
- R21 represents an aralkyl group having 7 to 15 carbon atoms or an alkenyl group having 3 to 9 carbon atoms
- R22 represents a hydrocarbon group having 1 to 7 carbon atoms or a hydroxyphenyl group
- R23 represents Table eagle alkyl group oxygen atom or a sulfur atom carbon atoms, which may contain. 1 to 5
- X- is PF S b F 6 - represents or As F).
- R24 and R25 each independently represent an alkyl group or an alkoxy group having 2 carbon atoms.
- R24 and R25 each independently represent an alkyl group or an alkoxy group having 1 to 12 carbon atoms.
- Rl is any one of a hydrogen atom, a C0C3 ⁇ 4 group, and a C00C group;
- R2 and R3 are each a hydrogen atom, a halogen, or an alkyl group having 1 to 4 carbon atoms;
- R4 is a hydrogen atom or a methyl represents either)
- - gamma is SbFf, AsFf, PF 6 one, BF 4; group, a methoxy group, or a halogen atom;
- R5 is an alkyl group having 1 to 4 carbon atoms.
- R1 is a hydrogen atom, an acetyl group, a methoxycarbonyl group, a methyl, an epoxycarbonyl group, a t-butoxycarbyl group, a benzoyl group, a phenoxycaprolyl group, a benzyloxycarbonyl group, 9
- R2 and R3 are each a hydrogen atom, a halogen atom, or an alkyl group having 1 to 4 carbon atoms
- R4 and R5 are hydrogen Any of an atom, a methyl group, a methoxy group, and a halogen atom
- X— represents any of SbF, AsF 6— , and PF BF.
- R1 is any one of an ethoxy group, a phenyl group, a phenoxy group, a benzyloxy group, a chloromethyl group, a dichloromethyl group, a trichloromethyl group, and a trifluoromethyl group
- R2 and R3 are a hydrogen atom and a halogen atom, respectively.
- R4 is any of hydrogen, methyl, methoxy, and halogen atoms;
- R5 is any of alkyl groups having 1 to 4 carbon atoms;
- ⁇ is SbF 6 —, AsF PF BF 4
- R1 is a hydrogen atom, an acetyl group, a methoxycarbonyl group, a methyl group, an epoxycarbonyl group, a t-butoxycarbonyl group, a benzoyl group, a phenoxycarbonyl group, a benzyloxycarbonyl group, a 9-fluoro
- R2 and R3 are each a hydrogen atom, a halogen atom, or an alkyl group having 1 to 4 carbon atoms;
- R4 and R5 are a methyl group or ethyl.
- X— represents either SbF 6 — or AsF PF 6 —.
- cationic polymerization initiator (C) As the cationic polymerization initiator (C), a commercially available product can also be used. Commercially available products include, for example, sulfonium salt-based cationic polymerization initiators SI—100 L, SI—60 L (manufactured by Sanshin Chemical Industries), CP—66 (Asahi Denka Kogyo Co., Ltd.) Manufactured).
- thermosetting resin composition of the present invention may further comprise a pigment such as a coloring pigment or an extender pigment in addition to the component (A), the component (B), the component (C), and the component (D) added as necessary.
- a modified resin such as a polyester resin, a phenol resin, an acrylic resin, a polyester resin, a polyolefin resin, or an epoxidized polybutadiene resin, fine particles of an inorganic or organic resin, a solvent, or a dye.
- the amount of the modified resin is 0.1 to 20 parts by weight, preferably 5 to 10 parts by weight, per 100 parts by weight of the epoxy composition (E).
- the thermosetting resin composition of the present invention can be prepared by stirring the above-mentioned components until they become uniform using a conventionally known method, for example, a stirrer such as a dissolver. The temperature during stirring is preferably in the range of 10 T to 60.
- the component (A) is 10 to 99% by weight, preferably 30 to 98% by weight, more preferably 50 to 97% by weight
- the component (B) is 90 to 1% by weight, preferably 70 to 2% by weight, more preferably 50 to 3% by weight.
- the proportion of the component (C) in the thermosetting resin composition of the present invention is 0.01 to 20 parts by weight, preferably 0.1 to L, based on 100 parts by weight of the epoxy composition (E). 0 parts by weight, More preferably, it is 1 to 5 parts by weight.
- the component (D) is further added to 100 parts by weight of the epoxy composition (E). By adding the component (D), the transparency and toughness of the cured product are further improved. (D) The ratio of adding the components
- (E) 1 to 50 parts by weight, preferably 2 to 30 parts by weight, more preferably 5 to 20 parts by weight, based on 100 parts by weight of the epoxy composition. If the amount of the component (D) is less than 1 part by weight, the effect of the addition of the component (D) is ineffective, while if the amount of the component (D) exceeds 50 parts by weight, the dimensional stability of the obtained cured product is reduced. Heat resistance decreases.
- thermosetting resin composition of the present invention can be cured by heating at a temperature of 40 to 250 ° C, preferably 45 to 240 for 3 to 12 hours.
- a reactor 406 g of bicyclohexyl-3,3′-gene, which is an example of the compound of the formula (2), and 1217 g of ethyl acetate are charged into a reactor. While maintaining the temperature at 37.5 ° C., 457 g of a 30 wt% peracetic acid solution in ethyl acetate (water content: 0.41 wt%) was added dropwise over about 3 hours. After the addition, the mixture was stirred at 40 for 1 hour to complete the epoxidation reaction. Subsequently, the reactor was cooled to 30 ° C, and the reaction crude liquid was washed with water.
- A-1 was analyzed by 1 H-NMR. (A peak derived from an internal double bond at around 54.5 to 5 ppm disappeared, and a peak around 52.9 to 3.1 ppm. It was confirmed that a peak of a proton derived from the thio group was generated, which confirmed that A-1 was a non-ester type alicyclic epoxy compound having the structure of the above formula (1).
- a reactor is charged with 108 g of cyclooctane, an example of the compound of the formula (4), and 108 g of ethyl acetate, and the temperature in the reactor is reduced to 30 while flowing nitrogen into the gas phase.
- 532 g of a 30% by weight peracetic acid solution in ethyl acetate (water content: 0.41% by weight) was added dropwise over about 3 hours. After completion of the dropwise addition, the mixture was stirred at 30 ° C. for 5 hours to complete the epoxidation reaction.
- the reactor was cooled to 20 and 86.9 g of sodium carbonate was added to the stirred reaction crude liquid.After that, 219 g of a 10% Na ⁇ H aqueous solution was further added, and the mixture was allowed to stand. The aqueous phase was withdrawn. After this operation was repeated three times, 250 g of deionized water was added to the remaining organic phase, and the remaining neutralized salt was washed twice. Thereafter, low boiling components were removed from the crude reaction solution at 60 ° C / 20 mmHg (2660 Pa) to obtain 12.3 g of a diepoxy compound (cyclooctane-1,2,5,6-diepoxide). The resulting diepoxy compound is designated as A-2. The yield of A-2 was 80.2%.
- the reactor was cooled down to 20, and 398 g of sodium carbonate was added to the stirred reaction crude liquid, and then a further 10% NaOH aqueous solution (1500 g) was added and allowed to stand, and the lower aqueous phase was extracted. . Then left The remaining neutralized salt was washed by adding 1000 g of deionized water to the organic phase. Thereafter, low boiling components were removed from the reaction crude liquid at 40 ° C / 10 mmHg (1330 Pa) to obtain 243 g of a epoxy compound (3a, 4, 7, 7a-diepoxy compound of tetrahydroindene). The obtained diepoxy compound is designated as A-3. The yield of A-3 was 80%.
- n-BMA n-butyl methacrylate
- HEM A hydroxyethyl methacrylate
- thermosetting resin composition each of the components shown in Tables 2 and 3 was added to a 500 ml flask equipped with a stirrer and a thermometer, and stirred at 30 ° C. for 20 minutes to obtain a thermosetting resin composition.
- the thermosetting resin composition thus obtained is poured into a Teflon (registered trademark) mold having a depth of 1 mm on a glass plate on which a release film is stretched, and the release film is placed thereon. was placed on a glass plate, and the resin composition was cured under the following conditions to obtain a test piece.
- Teflon registered trademark
- Measurement of glass transition point Measurement was performed using TMA SS 6100 (manufactured by Seiko Instruments Inc.) at a load of 50 g and a heating rate of 5 ° CZ.
- thermal decomposition temperature was measured using TG-DTA. The temperature at which the weight was reduced by 3% was defined as the pyrolysis temperature.
- Measurement of volume expansion as dimensional stability Measure the specific gravity of the resin composition with a specific gravity bottle, measure the specific gravity of the test specimen as a cured product by the water displacement method, and calculate the volume expansion from the following formula did. The closer the volume expansion coefficient is to 0, the better the dimensional stability during curing.
- thermosetting resin composition of the present invention can be efficiently cured in the presence of a cationic polymerization initiator, and the cured product has excellent transparency, heat resistance, and dimensional stability.
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Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/567,253 US20060194933A1 (en) | 2003-08-25 | 2004-08-23 | Thermosetting epoxy resin composition and transparent material |
EP04772382A EP1659141B1 (en) | 2003-08-25 | 2004-08-23 | Thermosetting epoxy resin composition and transparent material |
DE602004026740T DE602004026740D1 (de) | 2003-08-25 | 2004-08-23 | Wärmehärtbare epoxidharzzusammensetzung und transparentes material |
KR1020067003824A KR101073797B1 (ko) | 2003-08-25 | 2006-02-24 | 열경화형 에폭시 수지 조성물 및 투명 재료 |
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JP2003-300473 | 2003-08-25 | ||
JP2003300473A JP3973611B2 (ja) | 2003-08-25 | 2003-08-25 | 熱硬化型エポキシ樹脂組成物および透明材料 |
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WO2005019298A1 true WO2005019298A1 (ja) | 2005-03-03 |
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PCT/JP2004/012426 WO2005019298A1 (ja) | 2003-08-25 | 2004-08-23 | 熱硬化型エポキシ樹脂組成物および透明材料 |
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US (1) | US20060194933A1 (ja) |
EP (1) | EP1659141B1 (ja) |
JP (1) | JP3973611B2 (ja) |
KR (1) | KR101073797B1 (ja) |
CN (1) | CN100445311C (ja) |
DE (1) | DE602004026740D1 (ja) |
TW (1) | TWI349681B (ja) |
WO (1) | WO2005019298A1 (ja) |
Cited By (1)
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WO2018030232A1 (ja) * | 2016-08-08 | 2018-02-15 | 積水化学工業株式会社 | 硬化性樹脂組成物及び有機エレクトロルミネッセンス表示素子用封止剤 |
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EP2077288B1 (en) * | 2006-10-11 | 2013-11-06 | Sumitomo Bakelite Co., Ltd. | Transparent composite sheet |
JP5664220B2 (ja) * | 2010-12-24 | 2015-02-04 | 日本ゼオン株式会社 | 半導体封止材料及び半導体装置 |
WO2012137880A1 (ja) * | 2011-04-08 | 2012-10-11 | Jx日鉱日石エネルギー株式会社 | 樹脂組成物、その硬化物及びそれを用いた光半導体装置 |
CN103781772B (zh) * | 2011-09-14 | 2016-02-03 | 株式会社大赛璐 | 三环氧化合物及其制备方法 |
JP6117547B2 (ja) * | 2012-12-21 | 2017-04-19 | 新日鉄住金化学株式会社 | 熱硬化性組成物、硬化膜及びカラーフィルター |
JP6474719B2 (ja) * | 2013-02-19 | 2019-02-27 | 株式会社ダイセル | 硬化性組成物及びその硬化物、光学部材、並びに光学装置 |
JP6382180B2 (ja) * | 2013-02-19 | 2018-08-29 | 株式会社ダイセル | ウェハレベルレンズ用硬化性組成物、ウェハレベルレンズの製造方法及びウェハレベルレンズ、並びに光学装置 |
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- 2004-08-23 EP EP04772382A patent/EP1659141B1/en not_active Expired - Fee Related
- 2004-08-23 WO PCT/JP2004/012426 patent/WO2005019298A1/ja active Application Filing
- 2004-08-23 US US10/567,253 patent/US20060194933A1/en not_active Abandoned
- 2004-08-23 CN CNB2004800242700A patent/CN100445311C/zh not_active Expired - Fee Related
- 2004-08-23 DE DE602004026740T patent/DE602004026740D1/de active Active
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018030232A1 (ja) * | 2016-08-08 | 2018-02-15 | 積水化学工業株式会社 | 硬化性樹脂組成物及び有機エレクトロルミネッセンス表示素子用封止剤 |
KR20190035599A (ko) * | 2016-08-08 | 2019-04-03 | 세키스이가가쿠 고교가부시키가이샤 | 경화성 수지 조성물 및 유기 일렉트로 루미네선스 표시 소자용 봉지제 |
JPWO2018030232A1 (ja) * | 2016-08-08 | 2019-06-06 | 積水化学工業株式会社 | 硬化性樹脂組成物及び有機エレクトロルミネッセンス表示素子用封止剤 |
JP7025209B2 (ja) | 2016-08-08 | 2022-02-24 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子用封止剤 |
KR102417305B1 (ko) | 2016-08-08 | 2022-07-05 | 세키스이가가쿠 고교가부시키가이샤 | 경화성 수지 조성물 및 유기 일렉트로 루미네선스 표시 소자용 봉지제 |
Also Published As
Publication number | Publication date |
---|---|
DE602004026740D1 (de) | 2010-06-02 |
TWI349681B (en) | 2011-10-01 |
EP1659141B1 (en) | 2010-04-21 |
KR101073797B1 (ko) | 2011-10-13 |
KR20060128826A (ko) | 2006-12-14 |
JP3973611B2 (ja) | 2007-09-12 |
TW200519155A (en) | 2005-06-16 |
CN100445311C (zh) | 2008-12-24 |
EP1659141A1 (en) | 2006-05-24 |
JP2005068303A (ja) | 2005-03-17 |
CN1842557A (zh) | 2006-10-04 |
US20060194933A1 (en) | 2006-08-31 |
EP1659141A4 (en) | 2006-11-08 |
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