TWI349681B - A heat-curable epoxyresin composition and a transparent material - Google Patents

A heat-curable epoxyresin composition and a transparent material

Info

Publication number
TWI349681B
TWI349681B TW093125426A TW93125426A TWI349681B TW I349681 B TWI349681 B TW I349681B TW 093125426 A TW093125426 A TW 093125426A TW 93125426 A TW93125426 A TW 93125426A TW I349681 B TWI349681 B TW I349681B
Authority
TW
Taiwan
Prior art keywords
epoxyresin
curable
composition
heat
transparent material
Prior art date
Application number
TW093125426A
Other languages
English (en)
Other versions
TW200519155A (en
Inventor
Hideyuki Takai
Hisashi Maeshima
Original Assignee
Daicel Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chem filed Critical Daicel Chem
Publication of TW200519155A publication Critical patent/TW200519155A/zh
Application granted granted Critical
Publication of TWI349681B publication Critical patent/TWI349681B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW093125426A 2003-08-25 2004-08-25 A heat-curable epoxyresin composition and a transparent material TWI349681B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003300473A JP3973611B2 (ja) 2003-08-25 2003-08-25 熱硬化型エポキシ樹脂組成物および透明材料

Publications (2)

Publication Number Publication Date
TW200519155A TW200519155A (en) 2005-06-16
TWI349681B true TWI349681B (en) 2011-10-01

Family

ID=34213828

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093125426A TWI349681B (en) 2003-08-25 2004-08-25 A heat-curable epoxyresin composition and a transparent material

Country Status (8)

Country Link
US (1) US20060194933A1 (zh)
EP (1) EP1659141B1 (zh)
JP (1) JP3973611B2 (zh)
KR (1) KR101073797B1 (zh)
CN (1) CN100445311C (zh)
DE (1) DE602004026740D1 (zh)
TW (1) TWI349681B (zh)
WO (1) WO2005019298A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5360470B2 (ja) * 2006-10-11 2013-12-04 住友ベークライト株式会社 透明複合シート
JP5664220B2 (ja) * 2010-12-24 2015-02-04 日本ゼオン株式会社 半導体封止材料及び半導体装置
KR101899800B1 (ko) * 2011-04-08 2018-09-20 제이엑스티지 에네루기 가부시키가이샤 수지 조성물, 이의 경화물 및 이를 사용한 광반도체 장치
JP5899226B2 (ja) * 2011-09-14 2016-04-06 株式会社ダイセル トリエポキシ化合物、及びその製造方法
JP6117547B2 (ja) * 2012-12-21 2017-04-19 新日鉄住金化学株式会社 熱硬化性組成物、硬化膜及びカラーフィルター
WO2014129343A1 (ja) * 2013-02-19 2014-08-28 株式会社ダイセル 硬化性組成物及びその硬化物、光学部材、並びに光学装置
CN104995230B (zh) * 2013-02-19 2019-05-07 株式会社大赛璐 晶片级透镜用固化性组合物、晶片级透镜的制造方法及晶片级透镜、以及光学装置
CN114716648A (zh) * 2016-08-08 2022-07-08 积水化学工业株式会社 有机电致发光显示元件用密封剂

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3278456A (en) * 1960-12-27 1966-10-11 Union Carbide Corp Diepoxide compositions
JPS61213204A (ja) * 1985-03-19 1986-09-22 Sanyo Kokusaku Pulp Co Ltd 紫外線硬化樹脂組成物
JPH04325519A (ja) * 1991-04-25 1992-11-13 Nippon Paint Co Ltd 尿素系触媒性硬化剤およびそれを含む樹脂組成物
JP3841858B2 (ja) * 1995-11-01 2006-11-08 凸版印刷株式会社 多層プリント配線板用絶縁層樹脂組成物
JP3409648B2 (ja) * 1997-06-16 2003-05-26 東洋インキ製造株式会社 紫外線硬化型樹脂組成物
WO1999041296A1 (en) * 1998-02-11 1999-08-19 Rensselaer Polytechnic Institute Photopolymerizable compositions containing cycloaliphatic epoxyalcohol monomers
JP2886853B1 (ja) * 1998-06-08 1999-04-26 関西ペイント株式会社 カチオン重合性塗料組成物
US6210790B1 (en) * 1998-07-15 2001-04-03 Rensselaer Polytechnic Institute Glass-like composites comprising a surface-modified colloidal silica and method of making thereof
JP2000109780A (ja) * 1998-10-07 2000-04-18 Dainippon Ink & Chem Inc 光学部材用紫外線硬化型接着剤組成物
DE10001228B4 (de) * 2000-01-13 2007-01-04 3M Espe Ag Polymerisierbare Zubereitungen auf der Basis von siliziumhaltigen Epoxiden
ATE252981T1 (de) * 2000-12-13 2003-11-15 Fuji Photo Film Co Ltd Flachdruckplattenvorläufer
JP4795570B2 (ja) * 2001-06-26 2011-10-19 ダイセル化学工業株式会社 紫外線硬化型缶用塗料組成物及び塗装金属缶の製造方法
US20030059618A1 (en) * 2001-03-23 2003-03-27 Hideyuke Takai Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can
JP4743736B2 (ja) * 2001-08-31 2011-08-10 株式会社Ａｄｅｋａ 光学的立体造形用樹脂組成物およびこれを用いた光学的立体造形方法
JP2004099467A (ja) * 2002-09-05 2004-04-02 Daicel Chem Ind Ltd 脂環式エポキシ化合物の製造方法
JP2004182648A (ja) * 2002-12-03 2004-07-02 Daicel Chem Ind Ltd 脂環式ジエポキシ化合物の製造方法
JP2004204228A (ja) * 2002-12-13 2004-07-22 Daicel Chem Ind Ltd 硬化性エポキシ樹脂組成物および硬化物
JP2004262874A (ja) * 2003-03-03 2004-09-24 Daicel Chem Ind Ltd ジエポキシシクロオクタン類の製造方法
JP4426324B2 (ja) * 2004-01-21 2010-03-03 ダイセル化学工業株式会社 非エステル型エポキシ樹脂および樹脂組成物

Also Published As

Publication number Publication date
EP1659141B1 (en) 2010-04-21
CN1842557A (zh) 2006-10-04
KR20060128826A (ko) 2006-12-14
JP3973611B2 (ja) 2007-09-12
TW200519155A (en) 2005-06-16
JP2005068303A (ja) 2005-03-17
WO2005019298A1 (ja) 2005-03-03
US20060194933A1 (en) 2006-08-31
CN100445311C (zh) 2008-12-24
KR101073797B1 (ko) 2011-10-13
DE602004026740D1 (de) 2010-06-02
EP1659141A1 (en) 2006-05-24
EP1659141A4 (en) 2006-11-08

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees