JP2005068303A - 熱硬化型エポキシ樹脂組成物および透明材料 - Google Patents
熱硬化型エポキシ樹脂組成物および透明材料 Download PDFInfo
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- JP2005068303A JP2005068303A JP2003300473A JP2003300473A JP2005068303A JP 2005068303 A JP2005068303 A JP 2005068303A JP 2003300473 A JP2003300473 A JP 2003300473A JP 2003300473 A JP2003300473 A JP 2003300473A JP 2005068303 A JP2005068303 A JP 2005068303A
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- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
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- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- ZIWDVJPPVMGJGR-UHFFFAOYSA-N n-ethyl-2-methylprop-2-enamide Chemical compound CCNC(=O)C(C)=C ZIWDVJPPVMGJGR-UHFFFAOYSA-N 0.000 description 1
- YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
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- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- CABDEMAGSHRORS-UHFFFAOYSA-N oxirane;hydrate Chemical compound O.C1CO1 CABDEMAGSHRORS-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
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- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
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- 238000000926 separation method Methods 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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- 239000002904 solvent Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
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- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
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- 230000004580 weight loss Effects 0.000 description 1
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- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
【解決手段】 (A)非エステル型脂環エポキシ化合物10〜99重量%、及び、(B)上記(A)と異なるエポキシ化合物90〜1重量%、((A)と(B)の合計は100重量%)からなる組成物100重量部に対し、(C)カチオン重合開始剤0.01〜20重量部を配合してなる熱硬化型樹脂組成物、あるいは、上記にさらに、(D)エポキシ基を有するアクリル樹脂5〜20重量部を配合してなる熱硬化型樹脂組成物。
【選択図】 なし
Description
前記式(2)の化合物であるビシクロヘキシル−3,3'−ジエン406gと、酢酸エチル1217gを反応器に仕込み、窒素を気相部に流しながら、且つ、反応器内の温度を37.5℃に保ちながら約3時間かけて30重量%過酢酸の酢酸エチル溶液(水分率0.41重量%)457gを滴下した。過酢酸の酢酸エチル溶液滴下終了後、40℃で1時間攪拌を行い反応を終了した。続いて反応器を30℃まで冷却し、反応粗液を水洗した。その後70℃/20mmHgで反応粗液から低沸成分を除去し、エポキシ化合物415gを得た。得られたエポキシ化合物をA−1とする。A−1のオキシラン酸素濃度は14.7重量%で、収率は85%であった。
前記式(4)の化合物であるシクロオクタジエン108gと、酢酸エチル108gを反応器に仕込み、窒素を気相部に流しながら、且つ、反応器内の温度を30℃になるように保ちながら約3時間かけて30重量%過酢酸の酢酸エチル溶液532gを滴下した。過酢酸の酢酸エチル溶液滴下終了後、30℃で5時間攪拌を行い反応を終了した。続いて反応器を20℃まで冷却し、攪拌状態の反応粗液に86.9gの炭酸ソーダを加えた後、更に10%NaOH水溶液219gを加え、攪拌を止めて静置し、反応粗液が2相に分離したら、下相の水相を抜き出した。この操作を3回繰り返した後に、残った有機相に対して250gの脱イオン水を加えて、残存する中和塩の洗浄を二回行った。その後、60℃/20mmHgで反応粗液から低沸成分を除去し、ジエポキシ化合物112.3gを得た。得られたジエポキシ化合物をA−2とする。A−2の収率は80.2%であった。
前記式(6)の化合物であるテトラヒドロインデン240gと、酢酸エチル480gを反応器に仕込み、窒素を気相部に流しながら、且つ、反応器内の温度を30℃になるように保ちながら約3時間かけて30重量%過酢酸の酢酸エチル溶液1220gを滴下した。過酢酸の酢酸エチル溶液滴下終了後、30℃で6時間攪拌を行い反応を終了した。続いて反応器を20℃まで冷却し、攪拌状態の反応粗液に398gの炭酸ソーダを加えた後、更に10%NaOH水溶液1500gを加え、攪拌を止めて静置し、反応粗液が2相に分離したら、下相の水相を抜き出した。続いて、残った有機相に対して1000gの脱イオン水を加えて、残存する中和塩の洗浄を行った。その後、40℃/10mmHgで反応粗液から低沸成分を除去し、ジエポキシ化合物243gを得た。得られたジエポキシ化合物をA−3とする。A−3の収率は80%であった。
撹拌器、還流冷却管、滴下ろうと、温度計を備えたフラスコに表1に示される3,4−エポキシシクロヘキシルメチル−3,4−エポキシシクロヘキサンカルボキシレート(商品名CEL−2021)を233g仕込む。そして空気を吹き込みながら105〜110℃に昇温し、表1に示されるモノマーと開始剤を3時間かけて滴下した。滴下終了後、1時間攪拌を行い反応を終了した。合成例4で得られたエポキシ基の他に水酸基も有するアクリル樹脂をD−1、合成例5で得られたエポキシ基の他に水酸基も有するアクリル樹脂をD−2とする。
n−BMA:n−ブチルメタクリレート
HEMA:ヘキシルメタクリレート
GMA:グリシジルメタクリレート
AIBN:アゾビスイソブチロニトリル
MEHQ:パラメトキシフェノール
撹拌器、温度計を備えた500mlのフラスコに表2及び表3に示される各成分を加え、30℃で20分間攪拌して、熱硬化型樹脂組成物を得た。こうして得られた熱硬化型樹脂組成物を、離型フィルムを張ったガラス板上の厚さ1mmのテフロン(登録商標)製型枠の中に注型し、その上に離型フィルムを張ったガラス板を載せて下記の条件で樹脂組成物を硬化させ試験片とした。こうして得られた試験片について、ガラス転移点、熱分解温度、寸法安定性、透明性を測定した。結果を表4及び表5に示す。
実施例1、3、4、6、7、8、9及び比較例1、2・・・50℃で4時間加熱後、180℃で2時間加熱。
実施例2、5、10、11及び比較例3 ・・・70℃で3時間加熱後、180℃で2時間加熱。
・ガラス転移点の測定
TMA SS6100(セイコーインストルメント社製)を用いて、加重50g、昇温速度5℃/分で測定を行った。
・熱分解温度の測定
TG−DTAを用いて熱分解温度の測定を行った。3%重量減の温度を熱分解温度として表に記した。
・寸法安定性の測定
樹脂組成物の比重を比重瓶にて測定し、硬化物である試験片の比重は水中置換法にて測定し、下式から体積膨張率を算出した。
{1−(硬化物の比重/組成物の比重)}×100(%)
・透明性の測定
透過率測定装置を用いて、450nmの透過率を測定した。
Claims (7)
- (A)非エステル型脂環エポキシ化合物10〜99重量%、及び、(B)上記(A)と異なるエポキシ化合物90〜1重量%、((A)と(B)の合計は100重量%)からなる組成物100重量部に対し、(C)カチオン重合開始剤0.01〜20重量部を配合してなる熱硬化型樹脂組成物。
- さらに、(D)エポキシ基を有するアクリル樹脂5〜20重量部を配合してなる請求項1に記載の熱硬化型樹脂組成物。
- (D)エポキシ基を有するアクリル樹脂が、エポキシ基の他に水酸基も有するものであることを特徴とする請求項2に記載の熱硬化型樹脂組成物。
- 請求項1〜6のいずれか一項に記載の熱硬化型樹脂組成物を、加熱により硬化させた透明材料。
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JP2003300473A JP3973611B2 (ja) | 2003-08-25 | 2003-08-25 | 熱硬化型エポキシ樹脂組成物および透明材料 |
EP04772382A EP1659141B1 (en) | 2003-08-25 | 2004-08-23 | Thermosetting epoxy resin composition and transparent material |
DE602004026740T DE602004026740D1 (de) | 2003-08-25 | 2004-08-23 | Wärmehärtbare epoxidharzzusammensetzung und transparentes material |
US10/567,253 US20060194933A1 (en) | 2003-08-25 | 2004-08-23 | Thermosetting epoxy resin composition and transparent material |
CNB2004800242700A CN100445311C (zh) | 2003-08-25 | 2004-08-23 | 热固性环氧树脂组合物和光学透明材料 |
PCT/JP2004/012426 WO2005019298A1 (ja) | 2003-08-25 | 2004-08-23 | 熱硬化型エポキシ樹脂組成物および透明材料 |
TW093125426A TWI349681B (en) | 2003-08-25 | 2004-08-25 | A heat-curable epoxyresin composition and a transparent material |
KR1020067003824A KR101073797B1 (ko) | 2003-08-25 | 2006-02-24 | 열경화형 에폭시 수지 조성물 및 투명 재료 |
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CN (1) | CN100445311C (ja) |
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WO2013038945A1 (ja) * | 2011-09-14 | 2013-03-21 | 株式会社ダイセル | トリエポキシ化合物、及びその製造方法 |
WO2014129343A1 (ja) * | 2013-02-19 | 2014-08-28 | 株式会社ダイセル | 硬化性組成物及びその硬化物、光学部材、並びに光学装置 |
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JP2886853B1 (ja) * | 1998-06-08 | 1999-04-26 | 関西ペイント株式会社 | カチオン重合性塗料組成物 |
US6210790B1 (en) * | 1998-07-15 | 2001-04-03 | Rensselaer Polytechnic Institute | Glass-like composites comprising a surface-modified colloidal silica and method of making thereof |
JP2000109780A (ja) * | 1998-10-07 | 2000-04-18 | Dainippon Ink & Chem Inc | 光学部材用紫外線硬化型接着剤組成物 |
DE10001228B4 (de) * | 2000-01-13 | 2007-01-04 | 3M Espe Ag | Polymerisierbare Zubereitungen auf der Basis von siliziumhaltigen Epoxiden |
ATE252981T1 (de) * | 2000-12-13 | 2003-11-15 | Fuji Photo Film Co Ltd | Flachdruckplattenvorläufer |
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US20030059618A1 (en) * | 2001-03-23 | 2003-03-27 | Hideyuke Takai | Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can |
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JP2004099467A (ja) * | 2002-09-05 | 2004-04-02 | Daicel Chem Ind Ltd | 脂環式エポキシ化合物の製造方法 |
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JP2004262874A (ja) * | 2003-03-03 | 2004-09-24 | Daicel Chem Ind Ltd | ジエポキシシクロオクタン類の製造方法 |
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-
2003
- 2003-08-25 JP JP2003300473A patent/JP3973611B2/ja not_active Expired - Lifetime
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2004
- 2004-08-23 DE DE602004026740T patent/DE602004026740D1/de not_active Expired - Lifetime
- 2004-08-23 US US10/567,253 patent/US20060194933A1/en not_active Abandoned
- 2004-08-23 WO PCT/JP2004/012426 patent/WO2005019298A1/ja active Application Filing
- 2004-08-23 EP EP04772382A patent/EP1659141B1/en not_active Expired - Lifetime
- 2004-08-23 CN CNB2004800242700A patent/CN100445311C/zh not_active Expired - Fee Related
- 2004-08-25 TW TW093125426A patent/TWI349681B/zh not_active IP Right Cessation
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- 2006-02-24 KR KR1020067003824A patent/KR101073797B1/ko not_active IP Right Cessation
Cited By (10)
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JP2012136577A (ja) * | 2010-12-24 | 2012-07-19 | Nippon Zeon Co Ltd | 半導体封止材料及び半導体装置 |
US9464186B2 (en) | 2011-04-08 | 2016-10-11 | Jx Nippon Oil & Energy Corporation | Resin composition, hardened coating films therefrom, and photosemiconductor device using same |
WO2013038945A1 (ja) * | 2011-09-14 | 2013-03-21 | 株式会社ダイセル | トリエポキシ化合物、及びその製造方法 |
JPWO2013038945A1 (ja) * | 2011-09-14 | 2015-03-26 | 株式会社ダイセル | トリエポキシ化合物、及びその製造方法 |
US9249256B2 (en) | 2011-09-14 | 2016-02-02 | Daicel Corporation | Triepoxy compound and method for producing same |
WO2014129343A1 (ja) * | 2013-02-19 | 2014-08-28 | 株式会社ダイセル | 硬化性組成物及びその硬化物、光学部材、並びに光学装置 |
WO2014129342A1 (ja) * | 2013-02-19 | 2014-08-28 | 株式会社ダイセル | ウェハレベルレンズ用硬化性組成物、ウェハレベルレンズの製造方法及びウェハレベルレンズ、並びに光学装置 |
JPWO2014129343A1 (ja) * | 2013-02-19 | 2017-02-02 | 株式会社ダイセル | 硬化性組成物及びその硬化物、光学部材、並びに光学装置 |
JPWO2014129342A1 (ja) * | 2013-02-19 | 2017-02-02 | 株式会社ダイセル | ウェハレベルレンズ用硬化性組成物、ウェハレベルレンズの製造方法及びウェハレベルレンズ、並びに光学装置 |
JP2019008301A (ja) * | 2013-02-19 | 2019-01-17 | 株式会社ダイセル | ウェハレベルレンズ用硬化性組成物、ウェハレベルレンズの製造方法及びウェハレベルレンズ、並びに光学装置 |
Also Published As
Publication number | Publication date |
---|---|
EP1659141B1 (en) | 2010-04-21 |
KR20060128826A (ko) | 2006-12-14 |
TWI349681B (en) | 2011-10-01 |
EP1659141A4 (en) | 2006-11-08 |
EP1659141A1 (en) | 2006-05-24 |
US20060194933A1 (en) | 2006-08-31 |
KR101073797B1 (ko) | 2011-10-13 |
JP3973611B2 (ja) | 2007-09-12 |
WO2005019298A1 (ja) | 2005-03-03 |
TW200519155A (en) | 2005-06-16 |
DE602004026740D1 (de) | 2010-06-02 |
CN100445311C (zh) | 2008-12-24 |
CN1842557A (zh) | 2006-10-04 |
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