WO2003074268A1 - Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof - Google Patents

Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof Download PDF

Info

Publication number
WO2003074268A1
WO2003074268A1 PCT/JP2003/002572 JP0302572W WO03074268A1 WO 2003074268 A1 WO2003074268 A1 WO 2003074268A1 JP 0302572 W JP0302572 W JP 0302572W WO 03074268 A1 WO03074268 A1 WO 03074268A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
wiring board
printed wiring
resin
clad laminate
Prior art date
Application number
PCT/JP2003/002572
Other languages
English (en)
French (fr)
Inventor
Kenji Takai
Takayuki Sueyoshi
Original Assignee
Hitachi Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co., Ltd. filed Critical Hitachi Chemical Co., Ltd.
Priority to AU2003211704A priority Critical patent/AU2003211704A1/en
Priority to KR1020047013826A priority patent/KR100618511B1/ko
Priority to EP03743610.2A priority patent/EP1481796B1/en
Priority to US10/506,529 priority patent/US7473458B2/en
Publication of WO2003074268A1 publication Critical patent/WO2003074268A1/ja
Priority to US11/775,536 priority patent/US7955689B2/en
Priority to US12/173,900 priority patent/US7749612B2/en
Priority to US12/173,885 priority patent/US7749605B2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/24—Organic non-macromolecular coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/24—Aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2369/00—Polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2377/00—Polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12472—Microscopic interfacial wave or roughness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31605—Next to free metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
PCT/JP2003/002572 2002-03-05 2003-03-05 Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof WO2003074268A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
AU2003211704A AU2003211704A1 (en) 2002-03-05 2003-03-05 Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
KR1020047013826A KR100618511B1 (ko) 2002-03-05 2003-03-05 수지 부착 금속박, 금속 피복 적층판, 그를 이용한 프린트배선판 및 그의 제조 방법
EP03743610.2A EP1481796B1 (en) 2002-03-05 2003-03-05 Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
US10/506,529 US7473458B2 (en) 2002-03-05 2003-03-05 Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
US11/775,536 US7955689B2 (en) 2002-03-05 2007-07-10 Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof
US12/173,900 US7749612B2 (en) 2002-03-05 2008-07-16 Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof
US12/173,885 US7749605B2 (en) 2002-03-05 2008-07-16 Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2002058162 2002-03-05
JP2002-058162 2002-03-05
JP2002-091885 2002-03-28
JP2002091885 2002-03-28
JP2002-136052 2002-05-10
JP2002136052 2002-05-10

Related Child Applications (4)

Application Number Title Priority Date Filing Date
US10506529 A-371-Of-International 2003-03-05
US11/775,536 Continuation US7955689B2 (en) 2002-03-05 2007-07-10 Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof
US12/173,885 Division US7749605B2 (en) 2002-03-05 2008-07-16 Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof
US12/173,900 Division US7749612B2 (en) 2002-03-05 2008-07-16 Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof

Publications (1)

Publication Number Publication Date
WO2003074268A1 true WO2003074268A1 (en) 2003-09-12

Family

ID=27792039

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/002572 WO2003074268A1 (en) 2002-03-05 2003-03-05 Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof

Country Status (8)

Country Link
US (4) US7473458B2 (ja)
EP (1) EP1481796B1 (ja)
JP (3) JP4656209B2 (ja)
KR (7) KR101001429B1 (ja)
CN (1) CN100488766C (ja)
AU (1) AU2003211704A1 (ja)
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100710119B1 (ko) * 2003-11-14 2007-04-23 히다치 가세고교 가부시끼가이샤 금속층의 수지층에의 형성 방법, 인쇄 배선판 및 그의제조 방법
JP2009188429A (ja) * 2003-11-14 2009-08-20 Hitachi Chem Co Ltd プリント配線板及びその製造方法

Families Citing this family (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101001429B1 (ko) 2002-03-05 2010-12-14 히다치 가세고교 가부시끼가이샤 수지 부착 금속박, 그를 이용한 프린트 배선판 및 그의 제조 방법
US7816430B2 (en) * 2002-09-30 2010-10-19 Hitachi Chemical Company, Ltd. Composition of polycyanate ester and biphenyl epoxy resin
TWI268012B (en) * 2003-08-07 2006-12-01 Phoenix Prec Technology Corp Electrically conductive structure formed between neighboring layers of circuit board and method for fabricating the same
TWI251455B (en) * 2004-07-06 2006-03-11 Advanced Semiconductor Eng A manufacturing method of a multi-layer circuit board with embedded passive components
TWI252721B (en) * 2004-09-10 2006-04-01 Nan Ya Printed Circuit Board C Method of manufacturing double-sided printed circuit board
TWI395668B (zh) * 2004-11-10 2013-05-11 A metal foil with an adhesion aid and a printed circuit board using the same
TWI307308B (en) * 2005-01-31 2009-03-11 Ps Japan Corp Material of backup board for drilling and cutting operation, and its molded product
JP2006287034A (ja) * 2005-04-01 2006-10-19 Shinko Electric Ind Co Ltd 電解めっきを利用した配線基板の製造方法
US20090025966A1 (en) * 2005-04-19 2009-01-29 Kanji Shimoosako Fiber-resin composite, laminate, printed wiring board, and method for manufacturing printed wiring board
US20070062730A1 (en) * 2005-08-22 2007-03-22 Litton Systems, Inc. Controlled depth etched vias
JP4972728B2 (ja) * 2005-08-30 2012-07-11 日本電信電話株式会社 有機材料層形成方法
KR100717909B1 (ko) * 2006-02-24 2007-05-14 삼성전기주식회사 니켈층을 포함하는 기판 및 이의 제조방법
TW200810637A (en) * 2006-08-10 2008-02-16 Nan Ya Printed Circuit Board Corp Method for forming micro blind via on a copper clad laminate substrate utilizing laser drilling technique
EP2070963B1 (en) * 2006-09-14 2013-04-03 Panasonic Corporation Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring board
KR100835782B1 (ko) 2007-06-26 2008-06-09 주식회사 두산 인쇄회로기판용 수지 조성물, 이를 이용한 복합기재 및동박 적층판
CN101842856B (zh) * 2007-08-31 2013-10-09 埃托特克德国有限公司 处理表面以促进感兴趣的分子结合的方法、由其形成的涂层和器件
CN101466205B (zh) 2007-12-19 2010-06-16 富葵精密组件(深圳)有限公司 电路板的制作方法
US8318292B2 (en) * 2008-03-26 2012-11-27 Sumitomo Bakelite Co., Ltd. Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device
JP2009283739A (ja) * 2008-05-23 2009-12-03 Shinko Electric Ind Co Ltd 配線基板および配線基板の製造方法
CN101808473B (zh) * 2009-02-13 2012-06-06 南亚电路板股份有限公司 精细线路结合力改善装置及其制造方法
US9306358B2 (en) 2009-03-09 2016-04-05 Nucurrent, Inc. Method for manufacture of multi-layer wire structure for high efficiency wireless communication
US11476566B2 (en) 2009-03-09 2022-10-18 Nucurrent, Inc. Multi-layer-multi-turn structure for high efficiency wireless communication
US9439287B2 (en) 2009-03-09 2016-09-06 Nucurrent, Inc. Multi-layer wire structure for high efficiency wireless communication
US9232893B2 (en) 2009-03-09 2016-01-12 Nucurrent, Inc. Method of operation of a multi-layer-multi-turn structure for high efficiency wireless communication
US9444213B2 (en) 2009-03-09 2016-09-13 Nucurrent, Inc. Method for manufacture of multi-layer wire structure for high efficiency wireless communication
US9300046B2 (en) 2009-03-09 2016-03-29 Nucurrent, Inc. Method for manufacture of multi-layer-multi-turn high efficiency inductors
US9208942B2 (en) 2009-03-09 2015-12-08 Nucurrent, Inc. Multi-layer-multi-turn structure for high efficiency wireless communication
JP5339974B2 (ja) * 2009-03-11 2013-11-13 新光電気工業株式会社 インダクタ装置及びその製造方法
CN201438787U (zh) * 2009-06-02 2010-04-14 国基电子（上海）有限公司 电路板
JPWO2011078077A1 (ja) * 2009-12-24 2013-05-09 Jx日鉱日石金属株式会社 表面処理銅箔
KR101016443B1 (ko) * 2010-09-27 2011-03-04 주식회사 조양이에스 알루미늄 박막의 패턴 형성 방법
JP5683516B2 (ja) * 2011-03-30 2015-03-11 富士フイルム株式会社 プリント配線基板およびその製造方法、並びに、金属表面処理液
US20130068499A1 (en) * 2011-09-15 2013-03-21 Nucurrent Inc. Method for Operation of Multi-Layer Wire Structure for High Efficiency Wireless Communication
CN103140060B (zh) * 2011-11-28 2015-06-17 广东成德电路股份有限公司 一种多层印制电路板制备方法
CN103379726A (zh) * 2012-04-17 2013-10-30 景硕科技股份有限公司 线路积层板的复层线路结构
KR101436360B1 (ko) * 2012-05-25 2014-09-01 일진머티리얼즈 주식회사 표면처리동박, 상기 동박을 포함하는 프린트배선판용 동부착적층판, 상기 프린트배선판의 제조방법, 및 상기 표면처리동박의 제조방법
JP5470487B1 (ja) * 2013-05-29 2014-04-16 Ｊｘ日鉱日石金属株式会社 銅箔、それを用いた半導体パッケージ用銅張積層体、プリント配線板、プリント回路板、樹脂基材、回路の形成方法、セミアディティブ工法、半導体パッケージ用回路形成基板及び半導体パッケージ
US10383215B2 (en) * 2013-05-31 2019-08-13 Sumitomo Electric Industries, Ltd. Radio-frequency printed circuit board and wiring material
JP6310193B2 (ja) * 2013-07-02 2018-04-11 Ｊｘ金属株式会社 キャリア付銅箔、その製造方法、銅張積層板の製造方法及びプリント配線板の製造方法
JP6310192B2 (ja) * 2013-07-02 2018-04-11 Ｊｘ金属株式会社 キャリア付銅箔及びその製造方法、銅張積層板の製造方法及びプリント配線板の製造方法
JP6310191B2 (ja) * 2013-07-02 2018-04-11 Ｊｘ金属株式会社 キャリア付銅箔及びその製造方法、銅張積層板の製造方法及びプリント配線板の製造方法
CN104349609A (zh) * 2013-08-08 2015-02-11 北大方正集团有限公司 印刷线路板及其制作方法
CN103501580B (zh) * 2013-10-09 2016-04-27 北京科技大学 一种表面处理铜箔及其制备方法
CN103971835A (zh) * 2014-05-12 2014-08-06 飞龙精工科技(苏州)有限公司 一种尼龙线缆
WO2016009611A1 (ja) * 2014-07-16 2016-01-21 パナソニックＩｐマネジメント株式会社 金属張積層板とその製造方法、樹脂付き金属箔、及びプリント配線板
MY183238A (en) * 2015-03-24 2021-02-18 Mitsui Mining & Smelting Co Ltd Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board
JP6782561B2 (ja) * 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP2017031276A (ja) * 2015-07-30 2017-02-09 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、並びに、それを用いた樹脂ワニス、樹脂付金属箔、樹脂フィルム、金属張積層板及びプリント配線板
US11205848B2 (en) 2015-08-07 2021-12-21 Nucurrent, Inc. Method of providing a single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling
US10063100B2 (en) 2015-08-07 2018-08-28 Nucurrent, Inc. Electrical system incorporating a single structure multimode antenna for wireless power transmission using magnetic field coupling
US9960628B2 (en) 2015-08-07 2018-05-01 Nucurrent, Inc. Single structure multi mode antenna having a single layer structure with coils on opposing sides for wireless power transmission using magnetic field coupling
US9941729B2 (en) 2015-08-07 2018-04-10 Nucurrent, Inc. Single layer multi mode antenna for wireless power transmission using magnetic field coupling
US10658847B2 (en) 2015-08-07 2020-05-19 Nucurrent, Inc. Method of providing a single structure multi mode antenna for wireless power transmission using magnetic field coupling
US9941590B2 (en) 2015-08-07 2018-04-10 Nucurrent, Inc. Single structure multi mode antenna for wireless power transmission using magnetic field coupling having magnetic shielding
US9948129B2 (en) 2015-08-07 2018-04-17 Nucurrent, Inc. Single structure multi mode antenna for wireless power transmission using magnetic field coupling having an internal switch circuit
US9941743B2 (en) 2015-08-07 2018-04-10 Nucurrent, Inc. Single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling
US10636563B2 (en) 2015-08-07 2020-04-28 Nucurrent, Inc. Method of fabricating a single structure multi mode antenna for wireless power transmission using magnetic field coupling
US9960629B2 (en) 2015-08-07 2018-05-01 Nucurrent, Inc. Method of operating a single structure multi mode antenna for wireless power transmission using magnetic field coupling
US10985465B2 (en) 2015-08-19 2021-04-20 Nucurrent, Inc. Multi-mode wireless antenna configurations
CN107852828B (zh) * 2015-08-21 2020-03-17 住友电气工业株式会社 印刷线路板用基板、印刷线路板以及印刷线路板用基板的制造方法
US9709348B2 (en) * 2015-10-27 2017-07-18 Chang Chun Petrochemical Co., Ltd. Heat-dissipating copper foil and graphene composite
JP6601675B2 (ja) * 2016-01-14 2019-11-06 パナソニックＩｐマネジメント株式会社 金属張積層板および樹脂付金属箔
JP6631834B2 (ja) * 2016-01-26 2020-01-15 パナソニックＩｐマネジメント株式会社 金属張積層板、樹脂付き金属部材、及び配線板
DE112017000516B4 (de) 2016-01-27 2020-08-20 Advanced Technologies, Inc. Kupferlegierungsgegenstand, Harzelement, Kupferlegierungselement und deren Herstellung
CN105611753B (zh) * 2016-02-24 2018-05-04 北京梦之墨科技有限公司 一种液态金属多层电路制作方法及装置
JP2017199854A (ja) * 2016-04-28 2017-11-02 Tdk株式会社 貫通配線基板
US11011915B2 (en) 2016-08-26 2021-05-18 Nucurrent, Inc. Method of making a wireless connector transmitter module
WO2018061736A1 (ja) * 2016-09-27 2018-04-05 パナソニックＩｐマネジメント株式会社 金属張積層板、プリント配線板および樹脂付金属箔
TWI614600B (zh) * 2016-11-18 2018-02-11 廣達電腦股份有限公司 可動態決定提供給外部裝置之電流量之電子裝置以及動態控制電流之方法
US10424969B2 (en) 2016-12-09 2019-09-24 Nucurrent, Inc. Substrate configured to facilitate through-metal energy transfer via near field magnetic coupling
JP6462961B2 (ja) * 2016-12-14 2019-01-30 古河電気工業株式会社 表面処理銅箔および銅張積層板
US11177695B2 (en) 2017-02-13 2021-11-16 Nucurrent, Inc. Transmitting base with magnetic shielding and flexible transmitting antenna
US11277028B2 (en) 2017-05-26 2022-03-15 Nucurrent, Inc. Wireless electrical energy transmission system for flexible device orientation
WO2019012953A1 (ja) * 2017-07-12 2019-01-17 パナソニックＩｐマネジメント株式会社 金属張積層板、樹脂付き金属箔、及び配線板
US10892671B2 (en) * 2017-07-25 2021-01-12 GM Global Technology Operations LLC Electrically conductive copper components and joining processes therefor
JP6511614B2 (ja) 2017-08-02 2019-05-15 株式会社新技術研究所 金属と樹脂の複合材
JP6967953B2 (ja) * 2017-11-30 2021-11-17 日本パーカライジング株式会社 少なくとも表面の全部又は一部がアルミニウム又はアルミニウム合金からなる基材の表面を粗面化するためのエッチング剤、粗面化基材の製造方法、粗面化基材、基材−樹脂硬化物の接合体の製造方法、及び基材−樹脂硬化物の接合体
US10827627B2 (en) * 2019-03-21 2020-11-03 Intel Corporation Reduction of insertion loss in printed circuit board signal traces
US11227712B2 (en) 2019-07-19 2022-01-18 Nucurrent, Inc. Preemptive thermal mitigation for wireless power systems
US11271430B2 (en) 2019-07-19 2022-03-08 Nucurrent, Inc. Wireless power transfer system with extended wireless charging range
US11056922B1 (en) 2020-01-03 2021-07-06 Nucurrent, Inc. Wireless power transfer system for simultaneous transfer to multiple devices
US11839024B2 (en) * 2020-07-15 2023-12-05 Dupont Electronics, Inc. Composite and copper clad laminate made therefrom
US11283303B2 (en) 2020-07-24 2022-03-22 Nucurrent, Inc. Area-apportioned wireless power antenna for maximized charging volume
US11876386B2 (en) 2020-12-22 2024-01-16 Nucurrent, Inc. Detection of foreign objects in large charging volume applications
US11881716B2 (en) 2020-12-22 2024-01-23 Nucurrent, Inc. Ruggedized communication for wireless power systems in multi-device environments
US11695302B2 (en) 2021-02-01 2023-07-04 Nucurrent, Inc. Segmented shielding for wide area wireless power transmitter
US11831174B2 (en) 2022-03-01 2023-11-28 Nucurrent, Inc. Cross talk and interference mitigation in dual wireless power transmitter
US12003116B2 (en) 2022-03-01 2024-06-04 Nucurrent, Inc. Wireless power transfer system for simultaneous transfer to multiple devices with cross talk and interference mitigation

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6451934A (en) * 1987-08-24 1989-02-28 Matsushita Electric Works Ltd Metallic base laminated sheet
JPH05229060A (ja) * 1992-02-25 1993-09-07 Matsushita Electric Works Ltd 銅張り積層板の製造方法
EP0637902A1 (en) * 1993-08-06 1995-02-08 Gould Electronics Inc. Metallic foil with adhesion promoting layer
JPH08309918A (ja) * 1995-05-22 1996-11-26 Nippon Denkai Kk 銅張積層板とそれを用いたプリント回路板およびこれらの製法
JPH10341066A (ja) * 1997-06-10 1998-12-22 Furukawa Electric Co Ltd:The 印刷回路用銅箔、前記銅箔を用いた印刷回路用樹脂接着剤付銅箔、および前記銅箔を用いた印刷回路用銅張り積層板
JPH11107494A (ja) * 1997-10-06 1999-04-20 Masashiro Kimura 二重床支持・補強用支持脚及び二重床支持・補強方法
EP1006763A2 (en) * 1998-11-30 2000-06-07 Mitsui Mining & Smelting Co., Ltd. Copper foil for printed wiring board having excellent chemical resistance and heat resistance
JP2000286531A (ja) * 1999-03-31 2000-10-13 Matsushita Electric Works Ltd プリント配線板の製造方法
WO2002007485A1 (en) * 2000-07-18 2002-01-24 Matsushita Electric Industrial Co., Ltd. Circuit board and method for manufacturing the same, and electronic apparatus comprising it

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4455181A (en) * 1980-09-22 1984-06-19 General Electric Company Method of transfer lamination of copper thin sheets and films
JPS63229897A (ja) * 1987-03-19 1988-09-26 古河電気工業株式会社 リジツド型多層プリント回路板の製造方法
JPS6451934U (ja) 1987-09-25 1989-03-30
US5071520A (en) * 1989-10-30 1991-12-10 Olin Corporation Method of treating metal foil to improve peel strength
US5235139A (en) * 1990-09-12 1993-08-10 Macdermid, Incorprated Method for fabricating printed circuits
JPH06260741A (ja) * 1993-03-08 1994-09-16 Denki Kagaku Kogyo Kk 金属ベース回路基板の製造方法
JPH06310830A (ja) 1993-04-27 1994-11-04 C Uyemura & Co Ltd プリント配線板の銅回路パターン上への無電解めっき方法
JPH08193188A (ja) 1995-01-18 1996-07-30 Mitsui Mining & Smelting Co Ltd 銅箔用接着剤および該接着剤付き銅箔
JP2927968B2 (ja) 1995-02-16 1999-07-28 三井金属鉱業株式会社 高密度多層プリント回路内層用銅箔および該銅箔を内層回路用に用いた高密度多層プリント回路基板
EP0768334B1 (en) 1995-10-16 2004-02-18 Sumitomo Chemical Company Limited Prepreg, process for producing the same and printed circuit substrate using the same
US5829124A (en) * 1995-12-29 1998-11-03 International Business Machines Corporation Method for forming metallized patterns on the top surface of a printed circuit board
WO1997047165A1 (fr) 1996-06-07 1997-12-11 Asahi Kasei Kogyo Kabushiki Kaisha Feuille de metal porteuse de resine pour tableau de cablage multicouche, procede de fabrication de cette feuille, tableau de cablage multicouche, et dispositif electronique
ID19337A (id) 1996-12-26 1998-07-02 Ajinomoto Kk Film perekat antar-pelapis untuk papan pembuat kabel cetakan berlapis-banyak dan papan kabel cetakan berlapis-banyak memakai film ini
JP3689518B2 (ja) 1997-02-18 2005-08-31 新日鐵化学株式会社 電子材料用樹脂溶液組成物
JPH10256724A (ja) 1997-03-06 1998-09-25 Ibiden Co Ltd 多層プリント配線板
JPH1110794A (ja) 1997-06-27 1999-01-19 Nippon Denkai Kk 銅張積層板用銅箔およびそれを用いた銅張積層板
JP3315630B2 (ja) 1997-10-23 2002-08-19 日立化成工業株式会社 難燃性変性シアネートエステル系樹脂フィルム及びその製造方法
JPH11186716A (ja) 1997-10-14 1999-07-09 Fujitsu Ltd 金属層の形成方法
JP2973358B2 (ja) 1997-10-24 1999-11-08 ▲蔭▼山株式会社 熱圧着テープ部材及びステッチレスキルト布団
JP3911797B2 (ja) 1997-10-28 2007-05-09 日立化成工業株式会社 多層プリント配線板の製造方法
JP3688133B2 (ja) * 1998-09-25 2005-08-24 日立化成工業株式会社 Ｃｓｐ基板用耐熱性接着シート及びそれを用いるｃｓｐ基板の製造方法
JPH11140275A (ja) 1997-11-11 1999-05-25 Sumitomo Chem Co Ltd 多官能シアン酸エステル樹脂組成物およびプリント配線板
JP3392066B2 (ja) 1998-01-19 2003-03-31 三井金属鉱業株式会社 複合銅箔およびその製造方法並びに該複合銅箔を用いた銅張り積層板およびプリント配線板
JPH11214828A (ja) * 1998-01-28 1999-08-06 Ibiden Co Ltd プリント配線板およびその製造方法
US6565954B2 (en) * 1998-05-14 2003-05-20 Matsushita Electric Industrial Co., Ltd. Circuit board and method of manufacturing the same
JP3735485B2 (ja) 1998-09-09 2006-01-18 古河電気工業株式会社 樹脂フィルム付き銅箔、およびそれを用いた樹脂付き銅箔
US6132589A (en) 1998-09-10 2000-10-17 Ga-Tek Inc. Treated copper foil and process for making treated copper foil
GB2348087B (en) 1999-03-13 2003-08-13 Nec Technologies Detection of unreliable frames in digital data transmission systems
JP2000269637A (ja) 1999-03-18 2000-09-29 Furukawa Circuit Foil Kk 高密度超微細配線板用銅箔
US6451441B1 (en) * 1999-03-30 2002-09-17 Kyocera Corporation Film with metal foil
JP2001007468A (ja) * 1999-06-24 2001-01-12 Nec Kansai Ltd 配線基板，多層配線基板およびその製造方法
JP2001015911A (ja) * 1999-06-28 2001-01-19 Nec Kansai Ltd 配線基板およびその製造方法
JP2001089892A (ja) 1999-09-21 2001-04-03 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びその製造方法並びにそのキャリア箔付電解銅箔を用いた銅張積層板
JP3676152B2 (ja) 1999-11-11 2005-07-27 三井金属鉱業株式会社 キャリア箔付電解銅箔及びその製造方法
JP4370490B2 (ja) 2000-01-20 2009-11-25 日立化成工業株式会社 ビルドアップ多層プリント配線板及びその製造方法
JP3670186B2 (ja) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3258308B2 (ja) * 2000-02-03 2002-02-18 株式会社日鉱マテリアルズ レーザー穴開け性に優れた銅箔及びその製造方法
JP4370074B2 (ja) * 2002-02-04 2009-11-25 日本電解株式会社 プリント配線板用銅箔とその製造方法
JP4241098B2 (ja) 2002-03-05 2009-03-18 日立化成工業株式会社 金属張積層板、これを用いたプリント配線板およびその製造方法
KR101001429B1 (ko) 2002-03-05 2010-12-14 히다치 가세고교 가부시끼가이샤 수지 부착 금속박, 그를 이용한 프린트 배선판 및 그의 제조 방법
JP4015067B2 (ja) * 2003-06-17 2007-11-28 伸生 田中 屋内用のスポット照明手摺り
JP3949676B2 (ja) 2003-07-22 2007-07-25 三井金属鉱業株式会社 極薄接着剤層付銅箔及びその極薄接着剤層付銅箔の製造方法
US6994918B2 (en) * 2003-08-12 2006-02-07 Johnson Morgan T Selective application of conductive material to circuit boards by pick and place
US20090011612A1 (en) * 2007-07-05 2009-01-08 United Microelectronics Corp. Method of shortening photoresist coating process

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6451934A (en) * 1987-08-24 1989-02-28 Matsushita Electric Works Ltd Metallic base laminated sheet
JPH05229060A (ja) * 1992-02-25 1993-09-07 Matsushita Electric Works Ltd 銅張り積層板の製造方法
EP0637902A1 (en) * 1993-08-06 1995-02-08 Gould Electronics Inc. Metallic foil with adhesion promoting layer
JPH08309918A (ja) * 1995-05-22 1996-11-26 Nippon Denkai Kk 銅張積層板とそれを用いたプリント回路板およびこれらの製法
JPH10341066A (ja) * 1997-06-10 1998-12-22 Furukawa Electric Co Ltd:The 印刷回路用銅箔、前記銅箔を用いた印刷回路用樹脂接着剤付銅箔、および前記銅箔を用いた印刷回路用銅張り積層板
JPH11107494A (ja) * 1997-10-06 1999-04-20 Masashiro Kimura 二重床支持・補強用支持脚及び二重床支持・補強方法
EP1006763A2 (en) * 1998-11-30 2000-06-07 Mitsui Mining & Smelting Co., Ltd. Copper foil for printed wiring board having excellent chemical resistance and heat resistance
JP2000286531A (ja) * 1999-03-31 2000-10-13 Matsushita Electric Works Ltd プリント配線板の製造方法
WO2002007485A1 (en) * 2000-07-18 2002-01-24 Matsushita Electric Industrial Co., Ltd. Circuit board and method for manufacturing the same, and electronic apparatus comprising it

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1481796A4 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100710119B1 (ko) * 2003-11-14 2007-04-23 히다치 가세고교 가부시끼가이샤 금속층의 수지층에의 형성 방법, 인쇄 배선판 및 그의제조 방법
JP2009188429A (ja) * 2003-11-14 2009-08-20 Hitachi Chem Co Ltd プリント配線板及びその製造方法
US7615277B2 (en) 2003-11-14 2009-11-10 Hitachi Chemical Company, Ltd. Formation method of metal layer on resin layer, printed wiring board, and production method thereof
US7818877B2 (en) 2003-11-14 2010-10-26 Hitachi Chemical Company, Ltd. Formation method of metal layer on resin layer
US7964289B2 (en) 2003-11-14 2011-06-21 Hitachi Chemical Company, Ltd. Formation method of metal layer on resin layer, printed wiring board, and production method thereof

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JP2009018588A (ja) 2009-01-29
US7473458B2 (en) 2009-01-06
TW200304349A (en) 2003-09-16
JP4656209B2 (ja) 2011-03-23
KR20040088578A (ko) 2004-10-16
AU2003211704A1 (en) 2003-09-16
US20090032287A1 (en) 2009-02-05
US7749612B2 (en) 2010-07-06
KR20070073999A (ko) 2007-07-10
TW573451B (en) 2004-01-21
EP1481796A1 (en) 2004-12-01
CN100488766C (zh) 2009-05-20
KR20060064699A (ko) 2006-06-13
KR20070074001A (ko) 2007-07-10
JP2009239295A (ja) 2009-10-15
US7749605B2 (en) 2010-07-06
CN1638957A (zh) 2005-07-13
US20050121229A1 (en) 2005-06-09
EP1481796B1 (en) 2015-08-19
KR20070073998A (ko) 2007-07-10
US7955689B2 (en) 2011-06-07
KR101001429B1 (ko) 2010-12-14
EP1481796A4 (en) 2012-09-12
JP2009006720A (ja) 2009-01-15
KR20080094967A (ko) 2008-10-27
KR100618511B1 (ko) 2006-08-31
US20080277143A1 (en) 2008-11-13
KR20070074000A (ko) 2007-07-10
US20080011612A1 (en) 2008-01-17

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