JPS6451934A - Metallic base laminated sheet - Google Patents

Metallic base laminated sheet

Info

Publication number
JPS6451934A
JPS6451934A JP62209450A JP20945087A JPS6451934A JP S6451934 A JPS6451934 A JP S6451934A JP 62209450 A JP62209450 A JP 62209450A JP 20945087 A JP20945087 A JP 20945087A JP S6451934 A JPS6451934 A JP S6451934A
Authority
JP
Japan
Prior art keywords
metallic
sheet
adhesive
insulation
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62209450A
Other languages
Japanese (ja)
Inventor
Takeshi Kano
Munehiko Fukushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP62209450A priority Critical patent/JPS6451934A/en
Publication of JPS6451934A publication Critical patent/JPS6451934A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

Landscapes

  • Laminated Bodies (AREA)

Abstract

PURPOSE:To obtain a metallic base laminated sheet where adhesion between an adhesive insulation layer and a metallic sheet does not deteriorate at the time of moisture absorption, heat resistance is excellent and deterioration in insulation is controlled, by a method wherein an adhesive and insulation layer and metallic foil are arranged on a metallic sheet obtained by applying a coupling agent to the same after chemical treatment and dryness and they are integrated. CONSTITUTION:A metallic base laminated sheet 1 is formed by integrating an adhesive and insulating layer 3 and metallic foil 4 on a metallic sheet 2 as a board. Chromate treatment or phosphate treatment of an aluminum sheet or a zinc plated steel sheet as a metallic sheet 2 is performed, in this lamination. Then a coupling agent such as epoxy silane or zircoaluminate is applied to this chemical treatment surface 5 through printing and dried. Glass cloth into which thermosetting resin such as epoxy resin or polyimide resin is infiltrated is used for the adhesive and insulating layer 3 to be arranged on the metallic sheet 2. A metallic foil 4 of a metal such as copper or aluminum or iron or an alloy is arranged on the upper part of the insulating layer 3, pressurized and laminated. With this construction, a laminated sheet whose adhesion, heat resistance are excellent and deterioration in insulation is controlled is obtained.
JP62209450A 1987-08-24 1987-08-24 Metallic base laminated sheet Pending JPS6451934A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62209450A JPS6451934A (en) 1987-08-24 1987-08-24 Metallic base laminated sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62209450A JPS6451934A (en) 1987-08-24 1987-08-24 Metallic base laminated sheet

Publications (1)

Publication Number Publication Date
JPS6451934A true JPS6451934A (en) 1989-02-28

Family

ID=16573069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62209450A Pending JPS6451934A (en) 1987-08-24 1987-08-24 Metallic base laminated sheet

Country Status (1)

Country Link
JP (1) JPS6451934A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003074268A1 (en) * 2002-03-05 2003-09-12 Hitachi Chemical Co., Ltd. Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003074268A1 (en) * 2002-03-05 2003-09-12 Hitachi Chemical Co., Ltd. Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
US7955689B2 (en) 2002-03-05 2011-06-07 Hitachi Chemical Co, Ltd. Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof

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