GB827526A - Improvements in or relating to methods of glueing metal foils and printed circuits obtained by such methods - Google Patents

Improvements in or relating to methods of glueing metal foils and printed circuits obtained by such methods

Info

Publication number
GB827526A
GB827526A GB36159/55A GB3615955A GB827526A GB 827526 A GB827526 A GB 827526A GB 36159/55 A GB36159/55 A GB 36159/55A GB 3615955 A GB3615955 A GB 3615955A GB 827526 A GB827526 A GB 827526A
Authority
GB
United Kingdom
Prior art keywords
foil
adhesive
methods
cresol
phenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB36159/55A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electrical Industries Ltd
Original Assignee
Philips Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electrical Industries Ltd filed Critical Philips Electrical Industries Ltd
Publication of GB827526A publication Critical patent/GB827526A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

827,526. Laminates. PHILIPS ELECTRICAL INDUSTRIES Ltd. Dec. 16, 1955 [Dec. 21, 1954], No. 36159/55. Class 140. A metal foil is attached to a laminated product by means of an adhesive foil, by impregnating a stack of paper sheets with a hardenable condensate of phenol or cresol and formaldehyde, placing an adhesive foil on the stack and after covering the foil with a metal foil, subjecting the assembly to heat and pressure until hardening occurs. The adhesive foil comprises a hardened condensate of phenol or cresol and formaldehyde filled with one or more paper sheets and coated with a layer of hardenable adhesive at least on the surface to which the metal foil is applied. The adhesive layer of the adhesive foil may consist of a mixture of from 50 to 70% by weight of polyvinyl butyral and from 30 to 50% by weight of a hardenable condensate of phenol or cresol and formaldehyde. Copper, brass and aluminium foils are specified. The laminate may be used in the production of printed circuits.
GB36159/55A 1954-12-21 1955-12-16 Improvements in or relating to methods of glueing metal foils and printed circuits obtained by such methods Expired GB827526A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL350060X 1954-12-21

Publications (1)

Publication Number Publication Date
GB827526A true GB827526A (en) 1960-02-03

Family

ID=19785005

Family Applications (1)

Application Number Title Priority Date Filing Date
GB36159/55A Expired GB827526A (en) 1954-12-21 1955-12-16 Improvements in or relating to methods of glueing metal foils and printed circuits obtained by such methods

Country Status (4)

Country Link
BE (1) BE543774A (en)
CH (1) CH350060A (en)
FR (1) FR1143281A (en)
GB (1) GB827526A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3436665A1 (en) * 1983-10-07 1985-05-09 Sanyo-Kokusaku Pulp Co., Ltd., Tokio/Tokyo METHOD FOR PRODUCING A LAMINATED SHEET

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2612438C2 (en) * 1976-03-24 1983-04-28 Aeg Isolier- Und Kunststoff Gmbh, 3500 Kassel Adhesion promoter layer for the production of printed circuit boards

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3436665A1 (en) * 1983-10-07 1985-05-09 Sanyo-Kokusaku Pulp Co., Ltd., Tokio/Tokyo METHOD FOR PRODUCING A LAMINATED SHEET

Also Published As

Publication number Publication date
CH350060A (en) 1960-11-15
BE543774A (en)
FR1143281A (en) 1957-09-27

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