JPH05283821A - Metal base wiring board - Google Patents

Abstract

PURPOSE:To reduce the cost for forming grooves with no warping due to cutting and no generation of flaws, by providing V-cut grooves on the surface of a metal base wiring board in the etching process. CONSTITUTION:For providing V-cut grooves on the surface of a metal base wiring board in the etching process, a single metal plate such as aluminum or steel, alloyed plate, or a composite plate are used as the wiring board. It is desirable that the thickness of the metal plate to be used is 0.1-10mm. As for a resin layer, phenol resin or cresol resin is used in single, metamorphism, or mixture. Talc, clay, or silica can be used as filler to be added, if needed. It is desirable that the adding amount is 85-95wt.% of the whole resin. It is desirable as a metallic foil to use single a metallic foil of copper or aluminum, which has thickness of 0.018-0.07mm, an alloyed foil, or a composite foil, and to apply surface treatment on the bonding side. A general process is available for etching.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal-based wiring board used in electronic equipment, electric equipment, communication equipment, computing equipment and the like.

[0002]

2. Description of the Related Art Conventionally, when a V-cut groove is provided on a metal-based wiring board, it is mechanically cut by a V-cut machine, but it is liable to cause cutting burr and scratches, and a separate cutting cost is required. Was becoming. In the etching process, the film or resist ink is used for protection in order to prevent etching.

[0003]

As described in the prior art, the conventional metal-based wiring board has a problem that a cutting burr and a scratch are generated in the cutting process. The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide a metal base wiring board with a V-cut groove in which cutting burr and scratches are not generated.

[0004]

Since the present invention is a metal-based wiring board characterized in that a V-cut groove is provided on the surface in an etching process, it does not cause burring or scratches and requires additional cutting cost. The present invention will be described in detail below.

As the metal plate used in the present invention, there can be used aluminum, iron, copper, zinc, nickel and the like alone, alloys and composite plates. The thickness is preferably 0.1 to 10 mm, and the surface of the metal plate can be activated and roughened by physical treatment or chemical treatment to improve interlayer adhesion. As the resin layer, phenol resin, cresol resin, melamine resin, epoxy resin, unsaturated polyester resin, polyimide resin, isocyanate resin, polyurethane resin, polyamide resin, polyethylene terephthalate resin, polyphenylene oxide resin, polybutylene terephthalate resin, polyphenylene sulfide resin Etc. alone, modified products, and mixtures. As a filler added as necessary, use a filler such as talc, clay, silica, calcium carbonate, boron nitride, alumina, aluminum hydroxide, glass fiber, asbestos fiber, pulp fiber, synthetic fiber, ceramic fiber, etc. The amount of addition is preferably 85 to 95% by weight (hereinafter simply referred to as%) of the entire resin. That is, if it is less than 85%, it is difficult to improve the electric performance, and if it exceeds 95%, the interlayer adhesiveness tends to decrease. The average particle size of the filler is preferably 0.05 to 20 microns. The resin layer is a coating layer, a film layer, a sheet layer, a resin-impregnated base material layer, or the like, and is not particularly limited, and the thickness of the resin layer is not limited, but is 10 to 250 microns. preferable. As the metal foil, a single, alloy, or composite foil of copper, aluminum, nickel, iron, zinc or the like having a thickness of 0.018 to 0.07 mm is used, and the adhesive surface is subjected to surface treatment by physical treatment or chemical treatment, if necessary. It is preferable to set. The body forming means is not particularly limited as long as it can be formed into a body such as a press, a roll, a double belt or the like. A commonly used etching step can be used as the etching step, and the etching step is not particularly limited. The V-cut groove also includes a U-shaped groove similar to the V-shaped groove.

The present invention will be described below based on examples.

[0007]

EXAMPLE A curing agent-containing epoxy resin varnish containing 80% aluminum hydroxide having an average particle size of 5 microns was applied to an iron plate having a thickness of 1 mm so as to have a resin thickness of 0.1 mm after drying, and then a thickness of 0 mm was obtained. Etching processing was performed on the planned V-cut groove on the surface of the metal base wiring board, which was obtained by laminating a laminate having a copper foil of 0.038 mm at a molding pressure of 10 kg / cm ² and 165 ° C. for 90 minutes, without performing anticorrosion treatment. Then, a metal base wiring board with a V-cut groove was obtained.

[0008]

[Comparative Example] A metal base wiring board was obtained in the same manner as in Example except that a V-cut groove was formed by a V-cut machine on the surface of the metal base wiring board obtained by the lamination molding of the example.

Table 1 shows the performance of the metal-based wiring boards of Examples and Comparative Examples.

[0010]

[Table 1] * This is the ratio when the conventional cost is 100.

[0011]

The present invention is constructed as described above.
It has been confirmed that the metal-based wiring board having the structure described in the claims has no cutting burr and scratches, and the groove processing cost is reduced, so that the present invention is excellent.

Claims (1)

[Claims] 1. A metal-based wiring substrate having a V-cut groove formed on the surface by an etching process.