GB940417A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
GB940417A
GB940417A GB3015562A GB3015562A GB940417A GB 940417 A GB940417 A GB 940417A GB 3015562 A GB3015562 A GB 3015562A GB 3015562 A GB3015562 A GB 3015562A GB 940417 A GB940417 A GB 940417A
Authority
GB
United Kingdom
Prior art keywords
layers
aug
bonded
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3015562A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lord Manufacturing Co
Original Assignee
Lord Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lord Manufacturing Co filed Critical Lord Manufacturing Co
Publication of GB940417A publication Critical patent/GB940417A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

940,417. Laminates. LORD MANUFACTURING CO. Aug. 7, 1962 [Aug. 9, 1961], No. 30155/62. Heading B5N. [Also in Division H1] A vibration-damped printed circuit board comprises spaced layers 1, 2 of insulating material and an intermediate layer 3 of an elastomer sandwiched between and bonded throughout to the adjacent surfaces of the layers 1, 2, a metal foil, e.g. copper, adhering to the external face of at least one of layers 1, 2 and forming a wiring pattern. Layers 1, 2 may be of fibreglass bonded by epoxy resin, or of paper phenolic laminate, and layer 3 may be a butyl or silicone rubber. Holes 6 may be drilled or punched in the board to receive leads 7.
GB3015562A 1961-08-09 1962-08-07 Printed wiring board Expired GB940417A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13030861A 1961-08-09 1961-08-09

Publications (1)

Publication Number Publication Date
GB940417A true GB940417A (en) 1963-10-30

Family

ID=22444072

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3015562A Expired GB940417A (en) 1961-08-09 1962-08-07 Printed wiring board

Country Status (1)

Country Link
GB (1) GB940417A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2186431A (en) * 1986-02-07 1987-08-12 Sperry Sun Inc Assemblies for supporting electrical circuit boards within tubes
GB2209877A (en) * 1986-02-07 1989-05-24 Sperry Sun Inc Assemblies for supporting electrical circuit boards within tubes
WO1996004772A1 (en) * 1994-07-29 1996-02-15 Minnesota Mining And Manufacturing Company Internally damped circuit articles

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2186431A (en) * 1986-02-07 1987-08-12 Sperry Sun Inc Assemblies for supporting electrical circuit boards within tubes
US4694555A (en) * 1986-02-07 1987-09-22 Nl Industries, Inc. Assemblies for supporting electrical circuit boards within tubes and method of using same
GB2209877A (en) * 1986-02-07 1989-05-24 Sperry Sun Inc Assemblies for supporting electrical circuit boards within tubes
US4855870A (en) * 1986-02-07 1989-08-08 Nl Industries, Inc. Assemblies for supporting electrical circuit boards within tubes
GB2209877B (en) * 1986-02-07 1989-11-01 Sperry Sun Inc Assemblies for supporting electrical circuit boards within tubes
GB2186431B (en) * 1986-02-07 1989-11-01 Sperry Sun Inc Assemblies for supporting electrical circuit boards within tubes
WO1996004772A1 (en) * 1994-07-29 1996-02-15 Minnesota Mining And Manufacturing Company Internally damped circuit articles
US5552209A (en) * 1994-07-29 1996-09-03 Minnesota Mining And Manufacturing Company Internally damped circuit articles

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