MY183238A - Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board - Google Patents

Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board

Info

Publication number
MY183238A
MY183238A MYPI2017703386A MYPI2017703386A MY183238A MY 183238 A MY183238 A MY 183238A MY PI2017703386 A MYPI2017703386 A MY PI2017703386A MY PI2017703386 A MYPI2017703386 A MY PI2017703386A MY 183238 A MY183238 A MY 183238A
Authority
MY
Malaysia
Prior art keywords
copper foil
thin copper
carrier
extremely thin
wiring board
Prior art date
Application number
MYPI2017703386A
Inventor
Daisuke Nakajima
Toru Hanada
Kazuhiro Yoshikawa
Yoshinori Shimizu
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY183238A publication Critical patent/MY183238A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Provided is an extremely thin copper foil with a carrier which can achieve the compatibility between laser drillability and microcircuit formability in the processing of a copper-clad laminate or the production of a printed wiring board. The extremely thin copper foil with a carrier of the present invention includes a carrier foil, a release layer, and an extremely thin copper foil disposed in this order. The surface of the extremely thin copper foil on the side adjacent to the release layer has an average distance between surface peaks (peak spacing) of 2.5 to 20.0 ?m and a level difference in a core part (core roughness depth) Rk of 1.5 to 3.0 ?m. the surface of the extremely thin copper foil on the side away from the release layer has a maximum height difference of waviness (Wmax) of 4.0 ?m or less.
MYPI2017703386A 2015-03-24 2016-02-29 Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board MY183238A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015060816 2015-03-24
PCT/JP2016/056014 WO2016152390A1 (en) 2015-03-24 2016-02-29 Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board

Publications (1)

Publication Number Publication Date
MY183238A true MY183238A (en) 2021-02-18

Family

ID=56978004

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017703386A MY183238A (en) 2015-03-24 2016-02-29 Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board

Country Status (6)

Country Link
JP (1) JP6650923B2 (en)
KR (1) KR102531073B1 (en)
CN (1) CN107428129B (en)
MY (1) MY183238A (en)
TW (1) TWI617436B (en)
WO (1) WO2016152390A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220106199A (en) * 2020-02-04 2022-07-28 미쓰이금속광업주식회사 Roughening process copper foil, copper foil provided with a carrier, copper clad laminated board, and printed wiring board
WO2023189565A1 (en) * 2022-03-29 2023-10-05 三井金属鉱業株式会社 Carrier-attached metal foil, metal-clad laminate, and printed wiring board
WO2023189566A1 (en) * 2022-03-29 2023-10-05 三井金属鉱業株式会社 Metal foil with carrier, metal-clad laminate, and printed wiring board

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3340307B2 (en) 1996-03-11 2002-11-05 三井金属鉱業株式会社 Manufacturing method of copper foil for printed wiring board
JP3142270B2 (en) 1998-04-01 2001-03-07 三井金属鉱業株式会社 Manufacturing method of printed wiring board
IL145153A (en) * 1999-03-23 2005-05-17 Circuit Foil Luxembourg Trading Sarl Method for manufacturing a multilayer printed circuit board and composite foil for use therein
JP2001068816A (en) * 1999-08-24 2001-03-16 Mitsui Mining & Smelting Co Ltd Copper plated laminated board and laser processing method used therefor
LU90532B1 (en) * 2000-02-24 2001-08-27 Circuit Foil Luxembourg Trading Sarl Comosite copper foil and manufacturing method thereof
JP3261119B2 (en) 2000-05-16 2002-02-25 三井金属鉱業株式会社 Manufacturing method of printed wiring board
JP2002026475A (en) * 2000-07-07 2002-01-25 Mitsui Mining & Smelting Co Ltd Copper foil circuit with carrier foil, method of manufacturing printed wiring board, using the same, and printed wiring board
US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
EP1481796B1 (en) * 2002-03-05 2015-08-19 Hitachi Chemical Co., Ltd. Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
JP2004263296A (en) * 2003-02-12 2004-09-24 Furukawa Techno Research Kk Copper foil for fine pattern printed circuit and manufacturing method therefor
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
JP5256747B2 (en) * 2008-01-21 2013-08-07 宇部興産株式会社 Manufacturing method of copper wiring insulating film by semi-additive method, and copper wiring insulating film manufactured therefrom
JP5242710B2 (en) * 2010-01-22 2013-07-24 古河電気工業株式会社 Roughening copper foil, copper clad laminate and printed wiring board
CN101892499B (en) * 2010-07-24 2011-11-09 江西理工大学 Peel-able ultra-thin copper foil using copper foil as carrier and preparation method thereof
WO2012101985A1 (en) * 2011-01-26 2012-08-02 住友ベークライト株式会社 Printed wiring board and method for manufacturing printed wiring board
CN103314652A (en) * 2012-01-17 2013-09-18 松下电器产业株式会社 Wiring substrate and production method therefor
JP5858849B2 (en) * 2012-03-30 2016-02-10 Jx日鉱日石金属株式会社 Metal foil
JP2014208482A (en) * 2013-03-29 2014-11-06 Jx日鉱日石金属株式会社 Copper foil with a carrier, printed wiring board, copper-clad laminate, electronic apparatus and method for producing printed wiring board
JP5503789B2 (en) * 2013-08-30 2014-05-28 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil and copper-clad laminate obtained using the electrolytic copper foil with carrier foil
JP6027296B1 (en) * 2015-01-30 2016-11-16 株式会社フジクラ Wiring body, wiring board, and touch sensor

Also Published As

Publication number Publication date
CN107428129B (en) 2019-06-18
KR20170131832A (en) 2017-11-30
WO2016152390A1 (en) 2016-09-29
CN107428129A (en) 2017-12-01
JPWO2016152390A1 (en) 2018-01-11
JP6650923B2 (en) 2020-02-19
KR102531073B1 (en) 2023-05-09
TW201710077A (en) 2017-03-16
TWI617436B (en) 2018-03-11

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