JP3340307B2 - Manufacturing method of copper foil for printed wiring board - Google Patents

Manufacturing method of copper foil for printed wiring board

Info

Publication number
JP3340307B2
JP3340307B2 JP08045996A JP8045996A JP3340307B2 JP 3340307 B2 JP3340307 B2 JP 3340307B2 JP 08045996 A JP08045996 A JP 08045996A JP 8045996 A JP8045996 A JP 8045996A JP 3340307 B2 JP3340307 B2 JP 3340307B2
Authority
JP
Japan
Prior art keywords
copper foil
additive
electrolytic
concentration
activated carbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP08045996A
Other languages
Japanese (ja)
Other versions
JPH09241882A (en
Inventor
一好 鍋倉
裕 平沢
行雄 児玉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP08045996A priority Critical patent/JP3340307B2/en
Publication of JPH09241882A publication Critical patent/JPH09241882A/en
Application granted granted Critical
Publication of JP3340307B2 publication Critical patent/JP3340307B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、プリント配線板用
銅箔の製造方法に関するものであり、特に、銅イオンを
含む電解液が供給される電解槽中で回転する陰極ドラム
上に銅を電着させ、陰極ドラムを電解槽中で回転させつ
つ銅箔を陰極ドラムから剥離させてプリント配線板用銅
箔を連続的に製造する連続電解式製造方法に関するもの
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a copper foil for a printed wiring board, and more particularly, to a method of depositing copper on a rotating cathode drum in an electrolytic cell supplied with an electrolytic solution containing copper ions. The present invention relates to a continuous electrolytic production method for continuously producing copper foil for a printed wiring board by detaching the copper foil from the cathode drum while rotating the cathode drum in an electrolytic cell.

【従来の技術】[Prior art]

【0002】近年、プリント配線板は多層化が促進され
ており、これに伴ってプリント配線板用の銅箔中におけ
るホイルクラックの発生防止が問題となっている。この
ような観点から、特に、180℃での熱間の伸び率(以
下、「熱間伸び率」と言う)の高い銅箔が要望されるに
至っている。そして、熱間伸び率を高めるため、従来よ
り、電解液中に各種添加剤を添加することが提案されて
いる。
In recent years, multilayered printed wiring boards have been promoted, and accordingly, prevention of occurrence of foil cracks in copper foil for printed wiring boards has become a problem. From such a viewpoint, in particular, a copper foil having a high hot elongation at 180 ° C. (hereinafter, referred to as “hot elongation”) has been demanded. In order to increase the hot elongation, it has been conventionally proposed to add various additives to the electrolyte.

【0003】例えば、特開昭63−310989号公報
および同63−310990号公報には、トリイソアミ
ルアミンやヒドロキシウキルアミンと塩化物およびゼラ
チンを組み合わせてなる添加剤を電解液中に添加するこ
とが記載されている。特公平2−25995号公報にも
同様なトリイソプロパノールアミンとゼラチンを組み合
わせて添加剤とすることが記載されている。特開平2−
182890号公報には水溶性セルロースエーテルを添
加液とすることが記載されている。さらに、特開平7−
278866号公報にはニカワ濃度が0.55ppm以
下で塩化物イオン20〜100ppm、硫酸濃度20〜
200g/l、電解液温20〜70℃の条件下で銅箔を
得る方法が、また、特開平7−278867号公報には
電解液中に0.1μg/l〜250mg/lのタングス
テンまたはタングステン化合物を添加する方法がそれぞ
れ記載されている。
[0003] For example, JP-A-63-31089 and JP-A-63-310990 disclose that an additive obtained by combining triisoamylamine or hydroxyalkylamine with chloride and gelatin is added to an electrolytic solution. Has been described. Japanese Patent Publication No. 2-25995 discloses that a similar combination of triisopropanolamine and gelatin is used as an additive. JP-A-2-
182890 describes that a water-soluble cellulose ether is used as an additive liquid. Further, Japanese Unexamined Patent Publication No.
No. 278866 discloses a glue concentration of 0.55 ppm or less, a chloride ion of 20 to 100 ppm, and a sulfuric acid concentration of 20 to 100 ppm.
A method for obtaining a copper foil under the conditions of 200 g / l and an electrolyte temperature of 20 to 70 ° C., and Japanese Patent Application Laid-Open No. 7-278867 discloses that 0.1 μg / l to 250 mg / l tungsten or tungsten Each of the methods of adding compounds is described.

【0004】このような従来技術においては、上述した
ように特殊な添加剤を使用することが多く、必然的にコ
スト増となるのみならず、例えばアミンと塩化物および
ゼラチン等、複数の添加物の濃度管理が必要とされ、さ
らには、これら添加剤の分解生成物の蓄積が生じるため
に電解液の管理が繁雑となる。また、前記特開平7−2
78867号公報に記載された方法では、タングステン
の沈殿生成を抑制するために亜燐酸、燐酸ピロリン酸、
ポリリン酸、亜ヒ酸、メタバナジン酸のいずれか一種を
添加する必要があるが、これらの物質はいずれも毒物で
あり、かつ、多量に添加すると銅箔の物性に悪影響を及
ぼす等の問題がある。
In such prior art, as described above, special additives are often used, which not only inevitably increases the cost, but also results in a plurality of additives such as amine and chloride and gelatin. , And the decomposition products of these additives accumulate, which complicates the management of the electrolyte. In addition, Japanese Patent Application Laid-Open No. 7-2
In the method described in Japanese Patent No. 78867, phosphorous acid, pyrophosphoric acid phosphate,
It is necessary to add any one of polyphosphoric acid, arsenous acid, and metavanadic acid, but all of these substances are poisons, and when added in large amounts, there are problems such as adversely affecting the physical properties of the copper foil. .

【0005】さらに、プリント配線板用の銅箔として、
一般的には前述したように熱間伸び率の高い銅箔が要望
されている反面、熱間伸び率が過度に高い銅箔は加工工
程に際しての熱処理に起因して引張強度が低下する傾向
があるため、用途に応じて熱間伸び率レベルの異なる銅
箔が要望されている。しかるに従来技術では熱間伸び率
レベルの異なる銅箔を作り分けるのが困難であり、か
つ、得られた銅箔は熱間伸び率のバラツキが大きいため
に加工時に問題となっている。
Further, as a copper foil for a printed wiring board,
Generally, as described above, a copper foil having a high hot elongation rate is desired, but a copper foil having an excessively high hot elongation rate tends to have a decreased tensile strength due to heat treatment in the processing step. Therefore, there is a demand for copper foils having different levels of hot elongation depending on applications. However, it is difficult to separately produce copper foils having different levels of hot elongation in the prior art, and the obtained copper foil has a large variation in hot elongation, which is a problem during processing.

【0006】[0006]

【発明が解決しようとする課題】本発明は、上述した各
種問題点に鑑み、従来技術よりも熱間伸び率のレベルの
異なる銅箔の作り分けが容易で、しかも熱間伸び率のバ
ラツキが小さい電解銅箔を製造することのできる新規な
製造方法を提案することを主要な課題とする。特に本発
明は、特殊な添加剤を必要とせず、かつ、添加剤の濃度
管理が容易となるのみならず、添加剤濃度を調整するこ
とにより任意の熱間伸び率を容易に達成することがで
き、しかも熱間伸び率のバラツキを小さくすることが可
能となるとの着想に立脚している。
DISCLOSURE OF THE INVENTION In view of the above-mentioned various problems, the present invention makes it easy to separately form copper foils having different levels of hot elongation than the prior art, and furthermore, the variation in hot elongation is reduced. A main object is to propose a new manufacturing method capable of manufacturing a small electrolytic copper foil. In particular, the present invention does not require a special additive, and not only facilitates the concentration control of the additive, but also easily achieves an arbitrary hot elongation by adjusting the additive concentration. It is based on the idea of making it possible to reduce the variation of the hot elongation rate.

【0007】[0007]

【課題を解決するための手段】そして、上記課題の解決
手段として本発明は、電解液が供給される電解槽中で回
転する陰極ドラム上に銅を電着させ、陰極ドラムを回転
させつつ銅箔を陰極ドラムから剥離させてプリント配線
板用銅箔を製造する連続電解方法において、電解槽中に
供給される電解液を活性炭処理し、活性炭処理後の電解
補給液に添加剤の添加量を制御して所望範囲の180℃
熱間の伸び率の銅箔を得ることを特徴とするプリント配
線板用銅箔の製造方法を提案するものである。
Means for Solving the Problems As a means for solving the above-mentioned problems, the present invention provides an electrodeposition of copper on a rotating cathode drum in an electrolytic cell to which an electrolytic solution is supplied. In a continuous electrolysis method in which a foil is peeled from a cathode drum to produce a copper foil for a printed wiring board, an electrolytic solution supplied into an electrolytic cell is treated with activated carbon , and the amount of the additive added to the electrolytic replenisher after the activated carbon treatment is reduced. Control to the desired range of 180 ° C
The present invention proposes a method for producing a copper foil for a printed wiring board, wherein a copper foil having a hot elongation rate is obtained .

【0008】本発明によれば、電解槽中に供給される電
解液を活性炭処理して電解液中の残留添加剤を一旦完全
に取り除いた後、新たに所定量の添加剤を添加すること
により電解補給液中の添加剤濃度を所望の値に精密に制
御することが可能となる。したがって、銅箔物性を容易
に制御することができる。また添加剤の添加量を調整し
て熱間伸び率のレベルの異なる銅箔の作り分けが可能で
ある。
According to the present invention, the electrolytic solution supplied into the electrolytic cell is treated with activated carbon to completely remove the residual additive from the electrolytic solution, and then a predetermined amount of additive is newly added. It is possible to precisely control the additive concentration in the electrolytic replenisher to a desired value. Therefore, the physical properties of the copper foil can be easily controlled. In addition, it is possible to selectively produce copper foils having different levels of hot elongation by adjusting the amount of the additive.

【0009】本発明の方法を実施するにあたり、活性炭
処理は、例えば30cm/sec以下の空塔速度で行うのが望
ましい。
In carrying out the method of the present invention, the activated carbon treatment is desirably performed at a superficial velocity of, for example, 30 cm / sec or less.

【0010】活性炭処理後の電解補給液に添加する添加
剤は、活性炭により吸着除去可能なものであれば種類を
問わず、また複数の添加剤を組み合わせることも可能で
ある。したがって、活性炭により容易に吸着されるもの
であれば従来より銅の電解に用いられている一般的およ
び特殊な添加剤でも良く、例えば、ブドウ糖、チオ尿
素、グリシン、ポリ塩化ビニル、ポリエチレングリコー
ル、トリエタノールアミン、ヒドラジン、酢酸ビニル等
を本発明においても添加剤として使用することができ
る。しかし、実用上の観点からは、比較的安価に入手可
能なニカワ又はゼラチンを添加剤として使用するのが望
ましい。
The additive to be added to the electrolytic replenishing solution after the activated carbon treatment is not particularly limited as long as it can be adsorbed and removed by activated carbon, and a plurality of additives can be combined. Therefore, general and special additives conventionally used for copper electrolysis may be used as long as they are easily adsorbed by activated carbon. For example, glucose, thiourea, glycine, polyvinyl chloride, polyethylene glycol, triglyceride, etc. Ethanolamine, hydrazine, vinyl acetate and the like can also be used as additives in the present invention. However, from a practical point of view, it is desirable to use glue or gelatin, which can be obtained relatively inexpensively, as an additive.

【0011】[0011]

【実施の形態】以下、本発明を添付図面に基づいて詳述
する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the accompanying drawings.

【0012】図1は従来方法を実施するための電解設備
の概要を示すフローチャート、図2は本発明方法を実施
するための電解設備の概要を示す同様なフローチャー
ト、図3は添加剤としてのゼラチンの濃度と電解銅箔の
熱間伸び率との関係を示すグラフ、図4は従来方法によ
り電解液の循環サイクル毎に残留添加剤及び分解生成物
が蓄積される状況を示す説明図、図5は本発明方法によ
り電解液の循環サイクル毎に残留添加剤及び分解生成物
が取り除かれる状況を示す説明図である。
FIG. 1 is a flowchart showing an outline of an electrolytic facility for carrying out a conventional method, FIG. 2 is a similar flowchart showing an outline of an electrolytic facility for carrying out the method of the present invention, and FIG. 3 is gelatin as an additive. 4 is a graph showing the relationship between the concentration of copper and the hot elongation of the electrolytic copper foil. FIG. 4 is an explanatory view showing the state in which the residual additive and decomposition products are accumulated in each circulation cycle of the electrolytic solution by the conventional method, and FIG. FIG. 3 is an explanatory view showing a situation in which a residual additive and decomposition products are removed in each circulation cycle of an electrolytic solution by the method of the present invention.

【0013】図1および図2において、参照数字1は陰
極ドラムが回転可能に配置された電解槽、2は尾液槽、
3は溶解塔、4,4’は補給液貯槽、5は活性炭塔、6
は添加剤槽であって所定濃度に調合された添加剤水溶液
が蓄えられている。また、符号pは定量ポンプを表して
いる。銅箔の連続電解設備においては、銅イオンを含有
する電解液を循環させて陰極ドラムとこれに対向する陽
極(図示せず)との間に通液しながら電解を行い、陰極
ドラム上に銅を電着させ、陰極ドラムを連続回転させつ
つ銅箔を陰極ドラムから剥離させて巻き取りドラムd上
に巻き取るものである。
1 and 2, reference numeral 1 denotes an electrolytic cell in which a cathode drum is rotatably arranged, 2 denotes a tail liquid tank,
3 is a dissolving tower, 4 and 4 'are replenisher tanks, 5 is an activated carbon tower, 6
Is an additive tank in which an aqueous additive solution adjusted to a predetermined concentration is stored. The symbol p represents a metering pump. In a continuous electrolysis facility for copper foil, electrolysis is performed while circulating an electrolytic solution containing copper ions and passing the solution between a cathode drum and an anode (not shown) facing the cathode drum. And the copper foil is peeled off from the cathode drum while the cathode drum is continuously rotated, and wound on the winding drum d.

【0014】ところで、従来技術においては、図1に示
すとおり、添加剤槽6内の添加剤を濃度が所定範囲内に
収まるよう定量ポンプpにより補給液貯槽4に連続的に
添加している。この場合、添加剤の添加量は自然分解お
よび電解によって消費される添加物の量と同等とすべき
ことは言うまでもない。しかし、自然分解による添加物
消費量および電解による添加物消費量がいずれも正確に
測定できないため、もっぱら作業者の経験や勘と得られ
た銅箔の物性等に基づいて管理されているのが実状であ
り、また電解補給液中の添加剤の濃度が一定せず、その
結果として銅箔物性のバラツキが増大する等の問題が不
可避的となっている。
In the prior art, as shown in FIG. 1, the additive in the additive tank 6 is continuously added to the replenishing liquid storage tank 4 by the metering pump p so that the concentration falls within a predetermined range. In this case, it goes without saying that the amount of the additive to be added should be equal to the amount of the additive consumed by spontaneous decomposition and electrolysis. However, since the amount of additive consumption due to spontaneous decomposition and the amount of additive consumption due to electrolysis cannot be accurately measured, it is managed based solely on the experience and intuition of the worker and the physical properties of the obtained copper foil. In reality, the concentration of the additive in the electrolytic replenishing solution is not constant, and as a result, problems such as an increase in the dispersion of the physical properties of the copper foil have become inevitable.

【0015】これに対して本発明においては、補給液貯
槽4’の下流側に活性炭塔5を配設して補給液貯槽4’
内の補給液を活性炭塔5に通すことにより、補給液に含
まれていた古い添加剤を吸着除去した後、新たに必要量
の添加剤を定量ポンプpで添加・混合された補給液を電
解槽1に供給する。そのために、補給液中の添加剤の濃
度を、添加される添加剤の量と電解補給液の流量によっ
て容易に管理することが可能である。
On the other hand, in the present invention, the activated carbon tower 5 is disposed downstream of the replenishing liquid storage tank 4 'so that the replenishing liquid storage tank 4'
After the old additive contained in the replenishing solution is adsorbed and removed by passing the replenishing solution inside the activated carbon tower 5, the required amount of additive is newly added and mixed by the metering pump p, and the replenished solution mixed is electrolyzed. Supply to tank 1. Therefore, the concentration of the additive in the replenishing solution can be easily controlled by the amount of the additive to be added and the flow rate of the electrolytic replenishing solution.

【0016】図2に示した電解設備において、活性炭処
理は例えば30cm/sec以下の空塔速度で行うことができ
る。なお、添加剤溶液は活性炭塔5の出口配管に直接圧
入しても良く、この場合には補給液貯槽4’を省略でき
る。
In the electrolytic facility shown in FIG. 2, the activated carbon treatment can be performed at a superficial velocity of, for example, 30 cm / sec or less. The additive solution may be directly injected into the outlet pipe of the activated carbon tower 5, and in this case, the replenisher tank 4 'can be omitted.

【0017】本発明によれば、電解補給液中の添加剤濃
度を制御することにより銅箔の物性を容易に制御するこ
とが可能である。前述したとおり、添加剤としては活性
炭により容易に吸着除去可能な有機物、好適にはニカワ
又はゼラチンを使用する。そして、目標とする熱間伸び
率等の物性を得るために好適な添加剤濃度は、使用する
添加剤に応じて異なることは言うまでもない。例えば、
添加剤としてゼラチンを使用する場合には、図3に示す
ように、供給液中の添加剤濃度を0〜10ppmの間で
調整することにより熱間伸び率が2%〜30%の範囲内
で添加剤濃度に対応した熱間伸び率の銅箔を容易に得る
ことができる。
According to the present invention, the physical properties of the copper foil can be easily controlled by controlling the additive concentration in the electrolytic replenisher. As described above, as an additive, an organic substance which can be easily adsorbed and removed by activated carbon, preferably glue or gelatin is used. Needless to say, the additive concentration suitable for obtaining the target properties such as the hot elongation varies depending on the additive used. For example,
When gelatin is used as an additive, as shown in FIG. 3, by adjusting the additive concentration in the feed solution between 0 and 10 ppm, the hot elongation can be controlled within the range of 2% to 30%. A copper foil having a hot elongation rate corresponding to the additive concentration can be easily obtained.

【0018】電解銅箔の製造設備における工程保有液量
は規模にもよるが通常は数百m3 である。この電解液は
工程内を循環して電解槽に供給される。その際、電解供
給液中の添加剤の種類と濃度が銅箔の物性を決定する重
要な因子である。
The amount of liquid held in the process in the electrolytic copper foil manufacturing equipment is usually several hundred m 3 , though it depends on the scale. This electrolytic solution is circulated in the process and supplied to the electrolytic cell. At that time, the type and concentration of the additive in the electrolytic supply solution are important factors that determine the physical properties of the copper foil.

【0019】従来方法では、電解液中に古い残存添加剤
およびその分解生成物と新たな添加剤とが混在してお
り、電解液の循環サイクル毎に残存添加剤および分解生
成物が図4に示すように蓄積していくことと相俟って、
それぞれの濃度を管理することが困難であるのみなら
ず、添加剤によってはその分解生成物が銅箔の物性(引
張強度や伸び率)に悪影響を及ぼすことがある。
In the conventional method, old residual additives and their decomposition products and new additives are mixed in the electrolyte, and the residual additives and decomposition products are shown in FIG. Along with accumulating as shown,
Not only is it difficult to control the respective concentrations, but also the decomposition products of some additives may adversely affect the physical properties (tensile strength and elongation) of the copper foil depending on the additive.

【0020】これに対して本発明方法では、図5に示す
ように、電解液の循環サイクル毎に電解液中の古い残存
添加剤およびその分解生成を活性炭処理により除去する
ため、新たな添加剤の濃度のみを管理すれば良く、古い
添加剤等による箔物性のバラツキを低減し、物性の安定
化を容易に達成し得る利点がある。
On the other hand, in the method of the present invention, as shown in FIG. 5, the old additive and the decomposition product thereof in the electrolyte are removed by activated carbon treatment at every circulation cycle of the electrolyte. It is only necessary to control the concentration of, and there is an advantage that variations in foil properties due to old additives and the like can be reduced and the properties can be easily stabilized.

【0021】[0021]

【実施例】以下、実施例及び比較例に基づき本発明をさ
らに具体的に説明する。 [実施例1]図2に示す銅箔の製造設備において、銅イ
オン濃度85g/l、硫酸濃度150g/l、塩素イオ
ン濃度30mg/lに調整した電解液を用いて電流密度
60A/dm2 で連続電解を行い、35μm厚さの電解
銅箔を作成した。その際、補給液貯槽4’と電解槽1と
の間に設置された活性炭槽5に30cm/secの空塔
速度で補給液を通液し、その後に新田ゼラチン(株)製
の食品添加物用の水溶性ゼラチンを、補給液中の濃度が
5ppmとなるよう定量ポンプで連続的に補給した。
EXAMPLES The present invention will be described below more specifically based on examples and comparative examples. Example 1 In a copper foil production facility shown in FIG. 2, a current density of 60 A / dm 2 was obtained using an electrolytic solution adjusted to a copper ion concentration of 85 g / l, a sulfuric acid concentration of 150 g / l, and a chloride ion concentration of 30 mg / l. Continuous electrolysis was performed to prepare an electrolytic copper foil having a thickness of 35 μm. At this time, the replenishing solution is passed through the activated carbon tank 5 installed between the replenishing solution storage tank 4 'and the electrolytic cell 1 at an empty tower speed of 30 cm / sec, and thereafter, a food additive manufactured by Nitta Gelatin Co., Ltd. Water-soluble gelatin for products was continuously replenished with a metering pump so that the concentration in the replenishing solution was 5 ppm.

【0022】[実施例2]図2に示す銅箔の製造設備に
おいて、銅イオン濃度85g/l、硫酸濃度150g/
l、塩素イオン濃度30mg/lに調整した電解液を用
いて電流密度60A/dm2 で連続電解を行い、35μ
m厚さの電解銅箔を作成した。その際、活性炭槽5に3
0cm/secの空塔速度で補給液を通液し、その後に
新田ゼラチン(株)製の食品添加物用の水溶性ゼラチン
を、補給液中の濃度が2ppmとなるよう定量ポンプで
連続的に補給した。
Example 2 In a copper foil production facility shown in FIG. 2, a copper ion concentration of 85 g / l and a sulfuric acid concentration of 150 g / l
1, continuous electrolysis at a current density of 60 A / dm 2 using an electrolytic solution adjusted to a chloride ion concentration of 30 mg / l,
An m-thick electrolytic copper foil was prepared. At that time, 3 in activated carbon tank 5
The replenishing solution is passed at a superficial velocity of 0 cm / sec, and thereafter, a water-soluble gelatin for food additives manufactured by Nitta Gelatin Co., Ltd. is continuously supplied with a metering pump so that the concentration in the replenishing solution becomes 2 ppm. Replenished.

【0023】[実施例3]図2に示す銅箔の製造設備に
おいて、銅イオン濃度85g/l、硫酸濃度150g/
l、塩素イオン濃度30mg/lに調整した電解液を用
いて電流密度60A/dm2 で連続電解を行い、35μ
m厚さの電解銅箔を作成した。その際、活性炭槽5に3
0cm/secの空塔速度で補給液を通液し、その後に
新田ゼラチン(株)製の食品添加物用の水溶性ゼラチン
を、補給液中の濃度が0.2ppmとなるよう定量ポン
プで連続的に補給した。
Example 3 In a copper foil manufacturing facility shown in FIG. 2, a copper ion concentration of 85 g / l and a sulfuric acid concentration of 150 g /
1, continuous electrolysis at a current density of 60 A / dm 2 using an electrolytic solution adjusted to a chloride ion concentration of 30 mg / l,
An m-thick electrolytic copper foil was prepared. At that time, 3 in activated carbon tank 5
The replenishing solution was passed at a superficial velocity of 0 cm / sec, and then a water-soluble gelatin for food additives manufactured by Nitta Gelatin Co., Ltd. was pumped by a metering pump so that the concentration in the replenishing solution was 0.2 ppm. Replenished continuously.

【0024】[実施例4]図2に示す銅箔の製造設備に
おいて、銅イオン濃度85g/l、硫酸濃度150g/
l、塩素イオン濃度30mg/lに調整した電解液を用
いて電流密度60A/dm2 で連続電解を行い、35μ
m厚さの電解銅箔を作成した。その際、活性炭槽5に3
0cm/secの空塔速度で補給液を通液し、その後に
昭和電工(株)製の食品添加物に用いられるグリシン
を、補給液中の濃度が15ppmとなるよう定量ポンプ
で連続的に補給した。
Example 4 In a copper foil manufacturing facility shown in FIG. 2, a copper ion concentration of 85 g / l and a sulfuric acid concentration of 150 g / l were used.
1, continuous electrolysis at a current density of 60 A / dm 2 using an electrolytic solution adjusted to a chloride ion concentration of 30 mg / l,
An m-thick electrolytic copper foil was prepared. At that time, 3 in activated carbon tank 5
The replenisher is passed at a superficial velocity of 0 cm / sec, and then glycine used for a food additive manufactured by Showa Denko KK is continuously replenished by a metering pump so that the concentration in the replenisher becomes 15 ppm. did.

【0025】[実施例5]図2に示す銅箔の製造設備に
おいて、銅イオン濃度85g/l、硫酸濃度150g/
l、塩素イオン濃度30mg/lに調整した電解液を用
いて電流密度60A/dm2 で連続電解を行い、35μ
m厚さの電解銅箔を作成した。その際、活性炭槽5に3
0cm/secの空塔速度で補給液を通液し、その後に
昭和電工(株)製の食品添加物に用いられるグリシン
を、補給液中の濃度が10ppmとなるよう定量ポンプ
で連続的に補給した。
Example 5 In the copper foil manufacturing facility shown in FIG. 2, a copper ion concentration of 85 g / l and a sulfuric acid concentration of 150 g / l
1 and continuous electrolysis at a current density of 60 A / dm2 using an electrolytic solution adjusted to a chlorine ion concentration of 30 mg / l,
An m-thick electrolytic copper foil was prepared. At that time, 3 in activated carbon tank 5
The replenishing solution is passed at a superficial velocity of 0 cm / sec, and thereafter glycine used for a food additive manufactured by Showa Denko KK is continuously replenished with a metering pump so that the concentration in the replenishing solution becomes 10 ppm. did.

【0026】[実施例6]図2に示す銅箔の製造設備に
おいて、銅イオン濃度85g/l、硫酸濃度150g/
l、塩素イオン濃度30mg/lに調整した電解液を用
いて電流密度60A/dm2 で連続電解を行い、35μ
m厚さの電解銅箔を作成した。その際、活性炭槽5に3
0cm/secの空塔速度で補給液を通液し、その後に
昭和電工(株)製の食品添加物に用いられるグリシン
を、補給液中の濃度が5ppmとなるよう定量ポンプで
連続的に補給した。
Example 6 In a copper foil manufacturing facility shown in FIG. 2, a copper ion concentration of 85 g / l and a sulfuric acid concentration of 150 g / l
1 and continuous electrolysis at a current density of 60 A / dm2 using an electrolytic solution adjusted to a chlorine ion concentration of 30 mg / l,
An m-thick electrolytic copper foil was prepared. At that time, 3 in activated carbon tank 5
The replenisher is passed at a superficial velocity of 0 cm / sec, and then glycine used for a food additive manufactured by Showa Denko KK is continuously replenished by a metering pump so that the concentration in the replenisher becomes 5 ppm. did.

【0027】[実施例7]図2に示す銅箔の製造設備に
おいて、銅イオン濃度85g/l、硫酸濃度150g/
l、塩素イオン濃度30mg/lに調整した電解液を用
いて電流密度60A/dm2 で連続電解を行い、35μ
m厚さの電解銅箔を作成した。その際、活性炭槽5に3
0cm/secの空塔速度で補給液を通液し、その後に
クラレ(株)製の化粧品等に用いられるポリビニルアル
コール(PVA)の鹸化度98.5%品を、補給液中の
濃度が20ppmとなるよう定量ポンプで連続的に補給
した。
Example 7 In a copper foil manufacturing facility shown in FIG. 2, a copper ion concentration of 85 g / l and a sulfuric acid concentration of 150 g / l
1 and continuous electrolysis at a current density of 60 A / dm2 using an electrolytic solution adjusted to a chlorine ion concentration of 30 mg / l,
An m-thick electrolytic copper foil was prepared. At that time, 3 in activated carbon tank 5
The replenishing solution was passed at a superficial velocity of 0 cm / sec, and then a polyvinyl alcohol (PVA) having a saponification degree of 98.5% used for cosmetics and the like manufactured by Kuraray Co., Ltd. was supplied at a concentration of 20 ppm in the replenishing solution. Was continuously replenished with a metering pump.

【0028】[実施例8]図2に示す銅箔の製造設備に
おいて、銅イオン濃度85g/l、硫酸濃度150g/
l、塩素イオン濃度30mg/lに調整した電解液を用
いて電流密度60A/dm2 で連続電解を行い、35μ
m厚さの電解銅箔を作成した。その際、活性炭槽5に3
0cm/secの空塔速度で補給液を通液し、その後に
クラレ(株)製の化粧品等に用いられるポリビニルアル
コールの鹸化度98.5%品を、補給液中の濃度が10
ppmとなるよう定量ポンプで連続的に補給した。
Example 8 In the copper foil manufacturing facility shown in FIG. 2, a copper ion concentration of 85 g / l and a sulfuric acid concentration of 150 g / l
1 and continuous electrolysis at a current density of 60 A / dm2 using an electrolytic solution adjusted to a chlorine ion concentration of 30 mg / l,
An m-thick electrolytic copper foil was prepared. At that time, 3 in activated carbon tank 5
The replenishing solution is passed at a superficial velocity of 0 cm / sec, and then a polyvinyl alcohol having a saponification degree of 98.5%, which is used for cosmetics and the like manufactured by Kuraray Co., Ltd., has a concentration of 10%.
It was continuously replenished with a metering pump so as to become ppm.

【0029】[実施例9]図2に示す銅箔の製造設備に
おいて、銅イオン濃度85g/l、硫酸濃度150g/
l、塩素イオン濃度30mg/lに調整した電解液を用
いて電流密度60A/dm2 で連続電解を行い、35μ
m厚さの電解銅箔を作成した。その際、活性炭槽5に3
0cm/secの空塔速度で補給液を通液し、その後に
クラレ(株)製の化粧品等に用いられるポリビニルアル
コールの鹸化度98.5%品を、補給液中の濃度が5p
pmとなるよう定量ポンプで連続的に補給した。
Example 9 In the copper foil manufacturing facility shown in FIG. 2, a copper ion concentration of 85 g / l and a sulfuric acid concentration of 150 g / l
1 and continuous electrolysis at a current density of 60 A / dm2 using an electrolytic solution adjusted to a chlorine ion concentration of 30 mg / l,
An m-thick electrolytic copper foil was prepared. At that time, 3 in activated carbon tank 5
The replenishing solution is passed at a superficial velocity of 0 cm / sec, and then a polyvinyl alcohol having a saponification degree of 98.5%, which is used for cosmetics and the like manufactured by Kuraray Co., Ltd., has a concentration of 5 p.
pm with a metering pump.

【0030】[比較例1]図1に示す銅箔の製造設備に
おいて、銅イオン濃度85g/l、硫酸濃度150g/
l、塩素イオン濃度30mg/lに調整した電解液を用
いて電流密度60A/dm2 で連続電解を行い、35μ
m厚さの電解銅箔を作成した。その際、新田ゼラチン
(株)製の食品添加物用の水溶性ゼラチンを、予め補給
液中の濃度が5ppmとなるよう調整しておいた電解液
を使用し、電解中は補給液槽4の添加剤槽6から定量ポ
ンプpを用いて、経験的観点から得られる消費量相当よ
り若干多いと思われる添加濃度3.75ppmで連続添
加しながら銅箔を作成した。
Comparative Example 1 In the copper foil manufacturing facility shown in FIG. 1, a copper ion concentration of 85 g / l and a sulfuric acid concentration of 150 g /
1 and continuous electrolysis at a current density of 60 A / dm2 using an electrolytic solution adjusted to a chlorine ion concentration of 30 mg / l,
An m-thick electrolytic copper foil was prepared. At that time, a water-soluble gelatin for food additives manufactured by Nitta Gelatin Co., Ltd., which was previously adjusted to a concentration of 5 ppm in the replenishing solution, was used. A copper foil was prepared using a metering pump p from the additive tank 6 of Example 1 while continuously adding at an additive concentration of 3.75 ppm, which is considered to be slightly higher than the consumption amount obtained from an empirical viewpoint.

【0031】[比較例2]図1に示す銅箔の製造設備に
おいて、銅イオン濃度85g/l、硫酸濃度150g/
l、塩素イオン濃度30mg/lに調整した電解液を用
いて電流密度60A/dm2 で連続電解を行い、35μ
m厚さの電解銅箔を作成した。その際、新田ゼラチン
(株)製の食品添加物用の水溶性ゼラチンを、予め補給
液中の濃度が5ppmとなるよう調整しておいた電解液
を使用し、電解中は補給液槽4の添加剤槽6から定量ポ
ンプpを用いて経験的観点から得られる消費量相当より
若干少ないと思われる添加濃度2.5ppmで連続添加
しながら銅箔を作成した。
Comparative Example 2 In the copper foil manufacturing facility shown in FIG. 1, a copper ion concentration of 85 g / l and a sulfuric acid concentration of 150 g /
1 and continuous electrolysis at a current density of 60 A / dm2 using an electrolytic solution adjusted to a chlorine ion concentration of 30 mg / l,
An m-thick electrolytic copper foil was prepared. At that time, a water-soluble gelatin for food additives manufactured by Nitta Gelatin Co., Ltd., which was previously adjusted to a concentration of 5 ppm in the replenishing solution, was used. A copper foil was prepared from the additive tank 6 by continuous addition at an addition concentration of 2.5 ppm, which is considered to be slightly less than the consumption equivalent obtained from an empirical viewpoint, using a metering pump p.

【0032】表1は、上記の実施例1〜9および比較例
1〜2において10日間連続使用された電解液で得られ
た銅箔の物性を示すものである。実施例1〜9における
添加物の添加に際しては、添加量を補給液流量と添加濃
度から計算によって算出した。表1から明らかなとお
り、本発明におけるように予め活性炭処理を施した電解
液を用いて電解すれば、添加剤の量に応じて熱間伸び率
が2%〜30%の範囲内で添加剤濃度に応じた伸び率の
銅箔を長期間にわたり安定に製造することができる。
Table 1 shows the physical properties of the copper foils obtained from the electrolytes used in Examples 1 to 9 and Comparative Examples 1 and 2 for 10 days. When adding the additives in Examples 1 to 9, the amount of addition was calculated from the replenisher flow rate and the addition concentration. As is clear from Table 1, when the electrolysis is performed using the electrolytic solution which has been previously subjected to the activated carbon treatment as in the present invention, the additive has a hot elongation within the range of 2% to 30% depending on the amount of the additive. A copper foil having an elongation percentage according to the concentration can be stably manufactured over a long period of time.

【0034】[0034]

【表1】 [Table 1]

【0035】実施例1および比較例1、2における電解
液を30日間にわたって連続使用し、それぞれ10日
目、20日目および30日目の添加剤濃度を分析し、各
時点における銅箔について物性評価を行った。その結果
を表2に示す。表2から明らかなとおり、本発明方法に
よれば長期の連続電解による添加剤の分解物の蓄積や濃
度のバラツキによる銅箔物性の劣化(例えば表面粗さの
上昇等)を防止することができる。
The electrolyte solutions in Example 1 and Comparative Examples 1 and 2 were continuously used for 30 days, and the additive concentrations on the 10th, 20th and 30th days were analyzed, respectively. An evaluation was performed. Table 2 shows the results. As is clear from Table 2, according to the method of the present invention, it is possible to prevent degradation of the copper foil properties (for example, an increase in surface roughness, etc.) due to accumulation of decomposition products of the additive due to long-term continuous electrolysis and variation in concentration. .

【0036】[0036]

【表2】 [Table 2]

【0037】以上詳述したところから明らかなとおり、
本発明によれば、電解槽中に供給される電解液を活性炭
処理して電解液中の残留添加剤を一旦完全に取り除いた
後、新たに所定量の添加剤を添加するために電解補給液
中の添加剤濃度を所望の値に精密に制御することが可能
となる。したがって、銅箔の物性を容易に制御すること
ができる。また添加剤の添加量を調整して熱間伸び率の
レベルの異なる銅箔の作り分けが可能である。
As is clear from the above detailed description,
According to the present invention, the electrolytic solution supplied to the electrolytic cell is treated with activated carbon to completely remove the residual additive in the electrolytic solution once, and then the electrolytic replenishing solution is added to newly add a predetermined amount of the additive. It becomes possible to precisely control the concentration of the additive therein to a desired value. Therefore, the physical properties of the copper foil can be easily controlled. In addition, it is possible to selectively produce copper foils having different levels of hot elongation by adjusting the amount of the additive.

【0038】さらに本発明によれば、多量に添加すると
銅箔の物性に悪影響を及ぼすことがあり、毒性の強い特
殊な添加剤を使用する必要がなく、ニカワやゼラチン等
の安価に入手可能な物質を添加剤として使用することが
でき、かつ、電解浴中に余分な成分を必要としないため
に、添加剤の濃度管理が容易となる利点も達成し得るも
のである。従来一つの製造ラインで物性値の異なる銅箔
を作り分けることは電解液中の残留添加物の影響が大き
く、切り替え及び立上げに1〜2週間程度必要であり、
実用上別々のラインで製造していたが、本発明では残留
添加物の影響を受けないので、一つの製造ラインで物性
値の異なる銅箔を容易に製造できる。
Further, according to the present invention, when added in a large amount, the physical properties of the copper foil may be adversely affected, and it is not necessary to use a highly toxic special additive. Since the substance can be used as an additive and no extra component is required in the electrolytic bath, an advantage that the concentration of the additive can be easily controlled can be achieved. Conventionally, making different copper foils with different physical property values in one production line is greatly affected by residual additives in the electrolyte, and it takes about 1 to 2 weeks for switching and startup,
Although practically manufactured on separate lines, the present invention is not affected by residual additives, so that copper foils having different physical properties can be easily manufactured on a single manufacturing line.

【0039】なお、本発明の上記実施形態は単なる例示
に過ぎず、本発明の範囲内で種々の変更が可能であるこ
とは言うまでもない。
The above embodiment of the present invention is merely an example, and it goes without saying that various modifications are possible within the scope of the present invention.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 従来方法を実施するための電解設備の概要を
示すフローチャートである。
FIG. 1 is a flowchart showing an outline of an electrolytic facility for implementing a conventional method.

【図2】 本発明方法を実施するための電解設備の概要
を示す同様なフローチャートである。
FIG. 2 is a similar flowchart showing an outline of an electrolytic facility for carrying out the method of the present invention.

【図3】 添加剤としてのゼラチンの濃度と電解銅の熱
間伸び率との関係を示すグラフである。
FIG. 3 is a graph showing the relationship between the concentration of gelatin as an additive and the hot elongation of electrolytic copper.

【図4】 従来方法により電解液の循環サイクル毎に残
留添加剤及び分解生成物が蓄積される状況を示す説明図
である。
FIG. 4 is an explanatory view showing a state in which a residual additive and decomposition products accumulate in each circulation cycle of an electrolytic solution according to a conventional method.

【図5】 本発明方法により電解液の循環サイクル毎に
残留添加剤及び分解生成物が取り除かれる状況を示す説
明図である。
FIG. 5 is an explanatory view showing a situation in which a residual additive and a decomposition product are removed in each circulation cycle of an electrolytic solution according to the method of the present invention.

【符号の説明】[Explanation of symbols]

1 電解槽 2 尾液槽 3 溶解塔 4,4’ 補給液貯槽 5 活性炭塔 6 添加剤槽 p 定量ポンプ DESCRIPTION OF SYMBOLS 1 Electrolysis tank 2 Tail liquid tank 3 Dissolution tower 4, 4 'Replenishment liquid storage tank 5 Activated carbon tower 6 Additive tank p Metering pump

フロントページの続き (58)調査した分野(Int.Cl.7,DB名) C25D 1/04 Continuation of front page (58) Field surveyed (Int.Cl. 7 , DB name) C25D 1/04

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 電解液が供給される電解槽中で回転する
陰極ドラム上に銅を電着させ、陰極ドラムを回転させつ
つ銅箔を陰極ドラムから剥離させてプリント配線板用銅
箔を製造する連続電解方法において、溶解塔から供給さ
れた補給液を貯めるための補給液貯槽と活性炭処理液を
貯めるための補給液貯槽との間に活性炭塔を配置し、電
解槽中に供給される電解液を30cm/sec以下の空塔速度
活性炭処理し、活性炭処理後の電解補給液中に添加剤
の添加量を制御して所望範囲の180℃熱間の伸び率の
銅箔を得ることを特徴とする、プリント配線板用銅箔の
製造方法。
1. A copper foil for a printed wiring board is manufactured by electrodepositing copper on a rotating cathode drum in an electrolytic cell to which an electrolytic solution is supplied, and peeling the copper foil from the cathode drum while rotating the cathode drum. in a continuous electrolytic process for the supply of the dissolving tower
Replenisher tank for storing replenished replenisher and activated carbon treatment liquid.
An activated carbon tower is placed between the tank and the replenishing solution storage tank, and the electrolyte supplied into the electrolytic tank is emptied at a speed of 30 cm / sec or less.
In treated with activated carbon, the additive in the electrolyte replenishing solution after charcoal treatment
To control the elongation at 180 ° C.
A method for producing a copper foil for a printed wiring board, comprising obtaining a copper foil.
【請求項2】 前記添加剤が活性炭により吸着される有
機物であることを特徴とする請求項1に記載の方法。
2. A method according to claim 1, wherein the additive is an organic material which is adsorbed by the activated carbon.
【請求項3】 前記添加剤がニカワ又はゼラチンである
ことを特徴とする請求項2記載の方法。
3. The method according to claim 2, wherein said additive is glue or gelatin.
JP08045996A 1996-03-11 1996-03-11 Manufacturing method of copper foil for printed wiring board Expired - Fee Related JP3340307B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP08045996A JP3340307B2 (en) 1996-03-11 1996-03-11 Manufacturing method of copper foil for printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08045996A JP3340307B2 (en) 1996-03-11 1996-03-11 Manufacturing method of copper foil for printed wiring board

Publications (2)

Publication Number Publication Date
JPH09241882A JPH09241882A (en) 1997-09-16
JP3340307B2 true JP3340307B2 (en) 2002-11-05

Family

ID=13718851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP08045996A Expired - Fee Related JP3340307B2 (en) 1996-03-11 1996-03-11 Manufacturing method of copper foil for printed wiring board

Country Status (1)

Country Link
JP (1) JP3340307B2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3521074B2 (en) * 2000-01-06 2004-04-19 三井金属鉱業株式会社 Method for testing physical properties of electrolytic copper foil
JP4770271B2 (en) * 2005-05-27 2011-09-14 凸版印刷株式会社 Method for managing copper plating bath and method for producing copper plating film
JP4770272B2 (en) * 2005-05-27 2011-09-14 凸版印刷株式会社 Method for managing copper plating bath and method for producing copper plating film
JP5132744B2 (en) * 2010-09-29 2013-01-30 パンパシフィック・カッパー株式会社 Nikakawa supply apparatus and method
JP6650923B2 (en) 2015-03-24 2020-02-19 三井金属鉱業株式会社 Ultra-thin copper foil with carrier, method for producing the same, copper-clad laminate and printed wiring board
KR20210056073A (en) * 2019-11-08 2021-05-18 에스케이넥실리스 주식회사 Electrolytic Copper Foil Capable of Preventing Defects of Tear or Wrinkle Thereof, Electrode Comprising The Same, Secondary Battery Comprising The Same, and Method for Manufacturing The Same
CN117916553A (en) 2021-12-22 2024-04-19 三井金属矿业株式会社 Method for measuring surface parameters of copper foil, method for screening copper foil, and method for producing surface-treated copper foil
CN114990642A (en) * 2022-06-15 2022-09-02 云南润久科技有限公司 Electrolyte rapid liquid making method and circulating system in electrolytic copper foil production

Also Published As

Publication number Publication date
JPH09241882A (en) 1997-09-16

Similar Documents

Publication Publication Date Title
JP4996409B2 (en) Method for producing chemical conversion coated steel sheet
JP3340307B2 (en) Manufacturing method of copper foil for printed wiring board
JP2009079247A (en) Electroplating method
JP2006316328A (en) Method for manufacturing two-layer flexible copper-clad laminate
DE112015005823T5 (en) WASHING SOLUTION FOR THE SURFACE OF A CURRENT ZIN PLATE COATING, ADDITIONAL SOLUTION FOR THE WASHING SOLUTION AND METHOD FOR PRODUCING A PLATED PLATING LAYER
TWI683931B (en) Anode for electrolytic copper plating and electrolytic copper plating device using the same
WO2015008564A1 (en) Continuous manufacturing method for electrolytic metal foil and continuous manufacturing device for electrolytic metal foil
IL204627A (en) System and method of plating metal alloys and product produced thereby
JP2006206961A (en) Apparatus and method for continuous copper plating to film-like object
JP2000256898A (en) Copper plating method of wafer
JP5948112B2 (en) Electroless metal plating equipment
EP0746640B1 (en) Method of electrolytically depositing metals from electrolytes containing organic additives
US11946152B2 (en) Method and system for depositing a zinc-nickel alloy on a substrate
WO2001092604A2 (en) Electrolysis cell for restoring the concentration of metal ions in processes of electroplating
KR100934729B1 (en) Electroless Tin Plating Solution Impurity Removal Apparatus and Method
JP6081224B2 (en) Manufacturing method of surface-treated steel sheet
JP3046301B1 (en) Method for producing electrolytic copper foil, electrolytic copper foil, copper-clad laminate and printed wiring board
KR20210131832A (en) Metal plate manufacturing method including alloy plating layer
JP5859072B1 (en) Manufacturing method of surface-treated steel sheet
JPH05222599A (en) Method and device for aluminum fused-salt plating
CN219861639U (en) Electroplating system with increased metal ion concentration
JP2001295090A (en) Method for manufacturing electrolytic copper foil, electrolytic copper foil, copper-clad laminate and printed circuit board
JP4765426B2 (en) Method for producing electrotinned steel strip
JP2003321777A (en) Method and apparatus for electroless copper plating, and method and device for preparing copper-replenishing solution
JP2005226139A (en) Surface-smoothened copper foil, and its production method

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080816

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080816

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090816

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100816

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100816

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110816

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120816

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120816

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130816

Year of fee payment: 11

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140816

Year of fee payment: 12

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees