CN201438787U - 电路板 - Google Patents

电路板 Download PDF

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Publication number
CN201438787U
CN201438787U CN2009203039192U CN200920303919U CN201438787U CN 201438787 U CN201438787 U CN 201438787U CN 2009203039192 U CN2009203039192 U CN 2009203039192U CN 200920303919 U CN200920303919 U CN 200920303919U CN 201438787 U CN201438787 U CN 201438787U
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China
Prior art keywords
circuit board
holes
hole
substrate
copper foil
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Expired - Fee Related
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CN2009203039192U
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English (en)
Inventor
廖昌德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ambit Microsystems Shanghai Ltd
Hon Hai Precision Industry Co Ltd
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Ambit Microsystems Shanghai Ltd
Hon Hai Precision Industry Co Ltd
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Application filed by Ambit Microsystems Shanghai Ltd, Hon Hai Precision Industry Co Ltd filed Critical Ambit Microsystems Shanghai Ltd
Priority to CN2009203039192U priority Critical patent/CN201438787U/zh
Priority to US12/542,824 priority patent/US20100300735A1/en
Application granted granted Critical
Publication of CN201438787U publication Critical patent/CN201438787U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

一种电路板，包括基板、铜箔、多个通孔及多个阻隔墙。基板包括第一表面，所述通孔贯穿基板。铜箔设置于基板第一表面及所述通孔内壁。所述阻隔墙凸设于所述基板的第一表面的通孔周围，以在焊接过程中阻隔焊锡流入相应的通孔中。因本实用新型的电路板，利用阻隔墙防止焊锡流进通孔，从而避免通孔被阻塞或空气躲藏于通孔中，进而增加产品的良率。

Description

电路板
技术领域
本实用新型涉及一种电路板，特别涉及一种防止焊锡流进通孔的电路板。
背景技术
随着电子产品向轻、薄、短、小方向发展，电路板也向高密度、小孔、多层、薄型方向发展。多层电路板上常设有多个通孔，以电性连接各层之间的线路。而且，电路板上常装设多个电子零件，如电阻、电容、电连接器等，所述电子零件需焊接在电路板上。在焊接过程中，焊锡极易掉进通孔而使空气躲藏于通孔中，在焊锡加热融化的过程中，空气膨胀向外施压，产生锡爆导致电子零件掉落。
实用新型内容
有鉴于此，需提供提供一种防止焊锡流进通孔的电路板。
本实用新型实施方式中的电路板，包括基板、铜箔、多个通孔及多个阻隔墙。基板包括第一表面，所述通孔贯穿基板。铜箔设置于基板第一表面及所述通孔内壁。所述阻隔墙凸设于所述基板的第一表面的通孔周围，以在焊接过程中阻隔焊锡流入相应的通孔中。
优选地，每一阻隔墙由防焊漆形成。
优选地，还包括多个金手指，所述金手指成排排列于所述基板的第一表面。
优选地，所述铜箔和所述金手指之间涂有防焊漆。
因本实用新型的电路板，利用阻隔墙防止焊锡流进通孔，从而避免通孔被阻塞或空气躲藏于通孔中，进而增加产品的良率。
附图说明
图1为本电路板的平面示意图。
图2为图1中沿直线II-II的剖视图。
图3为电子组件焊接于电路板上的示意图。
具体实施方式
图1为本实用新型的电路板100的平面示意图。本实用新型的电路板100包括基板10、多个金手指20、铜箔30、多个通孔(via)40及多个阻隔墙50。在本实施方式中，电路板100为多层板、单层板或双面板。
图2为图1中沿直线II-II的剖视图。基板10包括第一表面102和与第一表面102平行的第二表面104。基板10的第二表面104涂有防焊漆60。
所述金手指20成四排排列于基板10的第一表面102，并将铜箔30包围于其中。在其它实施方式中，所述金手指20可以只有一排，不包围铜箔30。
铜箔30设置于基板10及通孔40内壁，并裸露于第一表面102，以便电子组件200，如芯片，通过焊锡202(请参照图3)固定于铜箔30上。在铜箔30和所述金手指20之间涂有防焊漆60。在其它实施方式中，铜箔30可以裸露于基板10的第二表面104或第一表面102和第二表面104。
所述通孔40贯穿基板10，在本实施方式中，所述通孔40既可以是基板10中用于电性连接基板10中各层电路的贯孔，也可以是其它用途的孔。所述阻隔墙50设置于基板10的第一表面102，并环绕每一通孔40的孔缘，以阻隔焊锡202在焊接过程中溢流入相应的通孔40中。在本实施方式中，所述阻隔墙50为环状的防焊漆。在其它实施方式中，所述阻隔墙50可以设置于基板10的第二表面104或第一表面102和第二表面104。
图3为装有电子组件200的电路板100。电子组件200以焊接的方式，通过焊锡202固定于基板10上。
因每个通孔40的孔缘设有阻隔墙50，从而在焊接过程中，焊锡202不会流入基板100的第二表面102和所述通孔40中，并防止空气躲藏于通孔中40，进而防止了锡爆的产生，增加了产品的良率。

Claims (4)

1.一种电路板，其特征在于，包括：
基板，包括第一表面；
多个通孔，贯穿所述基板；
铜箔，设置于所述基板第一表面及所述通孔内壁；及
多个阻隔墙，凸设于所述基板第一表面之通孔周围，以在焊接过程中阻隔焊锡流入相应的通孔中。
2.如权利要求1所述的电路板，其特征在于，每一阻隔墙由防焊漆形成。
3.如权利要求2所述的电路板，其特征在于，还包括多个金手指，所述金手指成排排列于所述基板的第一表面。
4.如权利要求3所述的电路板，其特征在于，所述铜箔和所述金手指之间涂有防焊漆。
CN2009203039192U 2009-06-02 2009-06-02 电路板 Expired - Fee Related CN201438787U (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2009203039192U CN201438787U (zh) 2009-06-02 2009-06-02 电路板
US12/542,824 US20100300735A1 (en) 2009-06-02 2009-08-18 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009203039192U CN201438787U (zh) 2009-06-02 2009-06-02 电路板

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103857189A (zh) * 2013-12-10 2014-06-11 深圳市瑞丰光电子股份有限公司 绝缘基板上制作导电线路的方法以及该方法制作的电路板
CN107026141A (zh) * 2016-01-04 2017-08-08 英飞凌科技股份有限公司 包括焊料屏障的半导体器件
CN108391371A (zh) * 2018-04-26 2018-08-10 生益电子股份有限公司 一种pcb及pcba

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3813364A1 (de) * 1988-04-21 1989-11-02 Bodenseewerk Geraetetech Vorrichtung zur waermeabfuhr von bauelementen auf einer leiterplatte
US5270903A (en) * 1990-09-10 1993-12-14 Codex Corporation Printed circuit board manufacturing method accommodates wave soldering and press fitting of components
FI114942B (fi) * 2000-04-19 2005-01-31 Mg Innovations Corp Ilmastointilaite
JP3639505B2 (ja) * 2000-06-30 2005-04-20 インターナショナル・ビジネス・マシーンズ・コーポレーション プリント配線基板及び半導体装置
KR101001429B1 (ko) * 2002-03-05 2010-12-14 히다치 가세고교 가부시끼가이샤 수지 부착 금속박, 그를 이용한 프린트 배선판 및 그의 제조 방법
JP2005340684A (ja) * 2004-05-31 2005-12-08 Calsonic Kansei Corp 基板への電子素子の取付構造
TWI397358B (zh) * 2008-02-14 2013-05-21 Nan Ya Printed Circuit Board 打線基板及其製作方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103857189A (zh) * 2013-12-10 2014-06-11 深圳市瑞丰光电子股份有限公司 绝缘基板上制作导电线路的方法以及该方法制作的电路板
CN107026141A (zh) * 2016-01-04 2017-08-08 英飞凌科技股份有限公司 包括焊料屏障的半导体器件
CN108391371A (zh) * 2018-04-26 2018-08-10 生益电子股份有限公司 一种pcb及pcba

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Granted publication date: 20100414

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