CN104703390A - 电路板及其制作方法 - Google Patents
电路板及其制作方法 Download PDFInfo
- Publication number
- CN104703390A CN104703390A CN201310649398.7A CN201310649398A CN104703390A CN 104703390 A CN104703390 A CN 104703390A CN 201310649398 A CN201310649398 A CN 201310649398A CN 104703390 A CN104703390 A CN 104703390A
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- Prior art keywords
- copper foil
- district
- foil layer
- weld parts
- pad
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
柔性电路板 | 10 |
双面覆铜基板 | 100 |
柔性电路基板 | 11 |
零件焊接区 | 101 |
信号线路区 | 102 |
挠折区 | 103 |
聚酰亚胺层 | 110 |
第一铜箔层 | 111 |
第二铜箔层 | 112 |
镀铜层 | 120 |
第一干膜 | 121 |
第一遮光区 | 1211 |
第一透光区 | 1212 |
阻焊层 | 1210 |
第二干膜 | 122 |
第二遮光区 | 1221 |
第二透光区 | 1222 |
抗镀膜 | 1220 |
第一通孔 | 131 |
第二通孔 | 132 |
第一焊盘 | 141 |
第二焊盘 | 142 |
第一导电线路层 | 151 |
第二导电线路层 | 152 |
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310649398.7A CN104703390B (zh) | 2013-12-06 | 2013-12-06 | 电路板及其制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310649398.7A CN104703390B (zh) | 2013-12-06 | 2013-12-06 | 电路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
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CN104703390A true CN104703390A (zh) | 2015-06-10 |
CN104703390B CN104703390B (zh) | 2017-12-26 |
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Family Applications (1)
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CN201310649398.7A Active CN104703390B (zh) | 2013-12-06 | 2013-12-06 | 电路板及其制作方法 |
Country Status (1)
Country | Link |
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CN (1) | CN104703390B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106340581A (zh) * | 2016-08-25 | 2017-01-18 | 深圳市晶仕德光电有限公司 | 一种csp灯珠封装的方法 |
CN106711096A (zh) * | 2015-11-18 | 2017-05-24 | 深南电路股份有限公司 | 一种铜柱结构封装基板及其加工方法 |
CN109890134A (zh) * | 2019-02-11 | 2019-06-14 | 武汉电信器件有限公司 | 一种柔性电路板 |
WO2021258303A1 (zh) * | 2020-06-23 | 2021-12-30 | 庆鼎精密电子(淮安)有限公司 | 相机模组及其制备方法 |
CN114885514A (zh) * | 2021-02-05 | 2022-08-09 | 深南电路股份有限公司 | 印制线路板的制作方法及印制线路板 |
US11997799B2 (en) | 2021-02-05 | 2024-05-28 | Shennan Circuits Co., Ltd. | Method for manufacturing printed circuit board |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1578590A (zh) * | 2003-07-02 | 2005-02-09 | 株式会社东芝 | 印刷线路板、电子元件安装方法和电子装置 |
US20070069360A1 (en) * | 2005-09-27 | 2007-03-29 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same |
KR100754061B1 (ko) * | 2006-06-27 | 2007-08-31 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
CN102065643A (zh) * | 2009-11-17 | 2011-05-18 | 富葵精密组件(深圳)有限公司 | 电路板制作方法 |
-
2013
- 2013-12-06 CN CN201310649398.7A patent/CN104703390B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1578590A (zh) * | 2003-07-02 | 2005-02-09 | 株式会社东芝 | 印刷线路板、电子元件安装方法和电子装置 |
US20070069360A1 (en) * | 2005-09-27 | 2007-03-29 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same |
KR100754061B1 (ko) * | 2006-06-27 | 2007-08-31 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
CN102065643A (zh) * | 2009-11-17 | 2011-05-18 | 富葵精密组件(深圳)有限公司 | 电路板制作方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106711096A (zh) * | 2015-11-18 | 2017-05-24 | 深南电路股份有限公司 | 一种铜柱结构封装基板及其加工方法 |
CN106711096B (zh) * | 2015-11-18 | 2019-07-26 | 深南电路股份有限公司 | 一种铜柱结构封装基板及其加工方法 |
CN106340581A (zh) * | 2016-08-25 | 2017-01-18 | 深圳市晶仕德光电有限公司 | 一种csp灯珠封装的方法 |
CN109890134A (zh) * | 2019-02-11 | 2019-06-14 | 武汉电信器件有限公司 | 一种柔性电路板 |
WO2021258303A1 (zh) * | 2020-06-23 | 2021-12-30 | 庆鼎精密电子(淮安)有限公司 | 相机模组及其制备方法 |
CN114885514A (zh) * | 2021-02-05 | 2022-08-09 | 深南电路股份有限公司 | 印制线路板的制作方法及印制线路板 |
WO2022166215A1 (zh) * | 2021-02-05 | 2022-08-11 | 深南电路股份有限公司 | 印制线路板的制作方法及印制线路板 |
US11997799B2 (en) | 2021-02-05 | 2024-05-28 | Shennan Circuits Co., Ltd. | Method for manufacturing printed circuit board |
Also Published As
Publication number | Publication date |
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CN104703390B (zh) | 2017-12-26 |
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Effective date of registration: 20170307 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
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Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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