WO2023109048A1 - Pcb及其制作方法 - Google Patents

Pcb及其制作方法 Download PDF

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Publication number
WO2023109048A1
WO2023109048A1 PCT/CN2022/099072 CN2022099072W WO2023109048A1 WO 2023109048 A1 WO2023109048 A1 WO 2023109048A1 CN 2022099072 W CN2022099072 W CN 2022099072W WO 2023109048 A1 WO2023109048 A1 WO 2023109048A1
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WIPO (PCT)
Prior art keywords
graphic
metal pattern
component
motherboard
metal
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PCT/CN2022/099072
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English (en)
French (fr)
Inventor
王小平
陈长平
袁继旺
杜红兵
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生益电子股份有限公司
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Publication of WO2023109048A1 publication Critical patent/WO2023109048A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits

Definitions

  • This application relates to the technical field of PCB (Printed Circuit Boards, printed circuit boards), for example, relates to a PCB and a manufacturing method thereof.
  • PCB Printed Circuit Boards, printed circuit boards
  • the pads are mainly divided into pin pads and surface mount pads.
  • the pin pads have solder holes and are mainly used for soldering pin components, while the surface mount pads have no solder holes and are mainly used for surface mounting. paste components.
  • the density of components on the corresponding PCB substrate is getting higher and higher, and the pad setting area on the surface of the traditional PCB is getting tighter and tighter. Therefore, how to increase the mounting area of the PCB to meet the needs of terminal electronic products
  • the miniaturization and high-density design requirements are urgent problems to be solved at present.
  • the present application provides a PCB and a manufacturing method thereof, so as to solve the problem that the wiring area on the surface of the PCB substrate is increasingly tight in the related art.
  • a PCB comprising: a motherboard made with at least one inner metal pattern, and a graphic component made with an outer metal pattern;
  • the motherboard includes a top wall, a bottom wall, and a side wall enclosed between the top wall and the bottom wall, and the inner metal pattern is partially exposed on the side wall;
  • the graphic component is soldered to the exposed area of the inner metal graphic on the side wall, so that the outer metal graphic of the graphic component is electrically connected to the inner metal graphic of the motherboard.
  • the graphics component includes a double-sided copper-clad board with signal via holes, one side surface of the double-sided copper-clad board is made with the outer metal pattern, and the other side surface is made with a The wall is soldered to the pad, and the outer metal pattern is electrically connected to the pad through the signal via hole.
  • the outer metal pattern fabricated on the pattern component includes at least one of pads and lines.
  • the number of the inner layer metal graphics is at least two, arranged on different inner layers of the motherboard; the number of the graphic components is at least two, and each graphic component is associated with a corresponding inner layer
  • the layer metal pattern is electrically connected.
  • a method for manufacturing a PCB comprising the steps of:
  • the motherboard includes a top wall, a bottom wall, and a side wall enclosed between the top wall and the bottom wall, and The inner metal pattern is partially exposed on the side wall;
  • the graphic components provided with outer metal graphics include:
  • the number of the inner layer metal graphics is at least two, which are arranged on different inner layers of the motherboard; the number of the graphic components is at least two, and each graphic component is welded on the side wall corresponding to the bare area of the inner metal pattern.
  • the graphic components provided with outer metal graphics include:
  • the outer layer metal pattern corresponding to each graphic component is made in a sub-region, and the pad corresponding to each outer layer metal pattern is made in a sub-region on the other side surface.
  • a disc configured to be soldered to said motherboard;
  • the outer metal pattern includes at least one of pads and lines.
  • the PCB provided by the embodiment of the present application utilizes the side wall space of the motherboard, arranges a graphic component with an outer metal pattern on the side wall, and electrically connects the graphic component to the inner metal pattern of the motherboard to realize graphic The signaling function of the component.
  • the PCB effectively expands the limited space, expands the available space of the PCB, increases the wiring density or component patch density, and makes the PCB meet the development trend of miniaturization and high density of electronic products.
  • Fig. 1 is the structural representation of the PCB that the embodiment of the present application provides;
  • FIG. 2 is a flow chart of a method for manufacturing a PCB provided by an embodiment of the present application.
  • Motherboard 1 top wall 11 , bottom wall 12 , side wall 13 , graphic component 2 , double-sided copper clad laminate 21 , outer metal graphic 22 , and signal via hole 23 .
  • the embodiment of the present application provides a PCB, including: a motherboard 1 with at least one inner metal pattern, and a graphic component 2 with an outer metal pattern 22;
  • the motherboard 1 includes a top wall 11, a bottom wall 12, and a side wall 13 enclosed between the top wall 11 and the bottom wall 12, and the inner metal pattern is partially exposed on the side wall 13;
  • the graphics component 2 is soldered to the exposed area of the inner metal pattern on the side wall 13 , so that the outer metal pattern 22 of the graphics component 2 is electrically connected to the inner metal pattern of the motherboard 1 .
  • the PCB provided by the embodiment of the present application utilizes the space of the side wall 13 of the motherboard 1, and the side wall 13 is arranged with
  • the graphic component 2 of the outer metal graphic 22 is electrically connected to the inner metal graphic of the motherboard 1 to realize the signal transmission function of the graphic component 2 .
  • the PCB effectively expands the limited space, expands the available space of the PCB, increases the wiring density or component patch density, and makes the PCB meet the development trend of miniaturization and high density of electronic products.
  • the graphics component 2 includes a double-sided copper-clad board 21 provided with a signal via hole 23, one side surface of the double-sided copper-clad board 21 is made with an outer metal pattern 22, and the other side surface is made There is a pad used for welding with the side wall 13 , and the outer metal pattern 22 is electrically connected to the pad through a signal via hole 23 .
  • the graphics component 2 is made by using double-sided copper-clad laminates 21 commonly used in the field to complete the graphics, which is simple and efficient.
  • the outer metal pattern 22 fabricated on the pattern component 2 may include at least one of pads and lines, which can be designed according to actual requirements of the present application.
  • the number of inner metal patterns used for electrical connection with the pattern component 2 may be one, or at least two. When the number is more than one, these inner layer metal patterns can be arranged on different inner layers of the mother board 1 and exposed on different layers on the side wall 13; they can also be arranged on the same inner layer and on the same layer on the side wall 13 Nudity in various places.
  • the number of pattern components 2 may also be at least two, and each pattern component 2 is electrically connected to a corresponding inner metal pattern.
  • the embodiment of the present application also provides the manufacturing method of the above-mentioned PCB, including steps:
  • Step 101 provide the motherboard 1 with the metal pattern on the inner layer, and the graphics component 2 with the metal pattern 22 on the outer layer.
  • the motherboard 1 includes a top wall 11 , a bottom wall 12 and a side wall 13 enclosed between the top wall 11 and the bottom wall 12 , and the inner metal pattern is partially exposed on the side wall 13 .
  • the mother board 1 can be formed by laminating a plurality of core boards according to a conventional process.
  • Step 102 solder the graphics component 2 to the exposed area of the inner metal pattern on the side wall 13 , so that the outer metal pattern 22 of the graphics component 2 is electrically connected to the inner metal pattern of the motherboard 1 .
  • the motherboard 1 and the graphics component 2 are manufactured separately, and then the graphics component 2 is welded to the side wall 13 of the motherboard 1, which effectively expands the surface space of the motherboard 1, and can greatly improve the wiring density or component placement. Density, the production method is simple and efficient.
  • a double-sided copper-clad board 21 is provided; an outer metal pattern 22 is made on one side surface of the double-sided copper-clad board 21, and the other side surface is made for matching with The solder pads of the motherboard 1; the signal via holes 23 are made on the double-sided copper-clad board 21, so that the outer metal pattern 22 and the pads are electrically connected through the signal via holes 23, that is, the graphic component 2 is obtained.
  • double-sided copper clad board 21 is provided; one side surface of double-sided copper clad board 21 is divided into regions Make the outer layer metal pattern 22 corresponding to each graphic component 2, and make the pad corresponding to each outer layer metal pattern 22 on the other side surface, and the pad is used for welding with the motherboard 1; on the double-sided copper clad board 21 Make signal via holes 23 by area, so that each outer metal pattern 22 is electrically connected to the corresponding pad through the signal via hole 23; cut the double-sided copper clad board 21 by area, that is, at least two graphic components 2 are obtained.
  • a plurality of graphic components 2 are uniformly produced on the same double-sided copper-clad laminate 21, and then each graphic component 2 is divided into independent components, which can effectively improve processing efficiency.
  • each graphic component 2 is made uniformly according to the welding position on the side wall 13, then these graphic components 2 may be integrally welded to the side wall 13 directly without division.
  • the outer metal pattern 22 on each pattern component 2 may include at least one of pads and lines, wherein the pads can be used for soldering components, so as to increase the arrangement density of components.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

本申请公开了一种PCB及其制作方法，PCB包括：制作有至少一内层金属图形的母板，以及制作有外层金属图形的图形组件；母板，包括顶壁、底壁以及围设于顶壁和底壁之间的侧壁，且内层金属图形部分裸露于侧壁；图形组件焊接于侧壁上的内层金属图形的裸露区域，使得图形组件的外层金属图形与母板的内层金属图形电连接。

Description

PCB及其制作方法
本申请要求在2021年12月14日提交中国专利局、申请号为202111528994.0的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及PCB(Printed Circuit Boards，印制电路板)技术领域，例如涉及一种PCB及其制作方法。
背景技术
在印制电路板当中，焊盘主要分为插针焊盘以及表贴焊盘，插针焊盘有焊孔，主要用于焊接插脚元件，而表贴焊盘没有焊孔，主要用于表贴元件。随着半导体设计小型化，对应的PCB基板的上元件密度也越来越高，传统PCB表面上的焊盘设置区域越来越紧张，因此，如何提高PCB的贴件面积，以满足终端电子产品的小型化、高密化的设计需求，是目前亟待解决的问题。
发明内容
本申请提供一种PCB及其制作方法，以解决相关技术中PCB基板表面布线区域越来越紧张的问题。
本申请采用以下技术方案：
一种PCB，包括：制作有至少一内层金属图形的母板，以及制作有外层金属图形的图形组件；
所述母板，包括顶壁、底壁以及围设于顶壁和底壁之间的侧壁，且所述内层金属图形部分裸露于所述侧壁；
所述图形组件焊接于所述侧壁上的所述内层金属图形的裸露区域，使得所述图形组件的外层金属图形与所述母板的内层金属图形实现电连接。
可选的，所述图形组件包括开设有信号过孔的双面覆铜板，所述双面覆铜板的一侧表面制作有所述外层金属图形、另一侧表面制作有用于与所述侧壁焊接的焊盘，所述外层金属图形与所述焊盘通过所述信号过孔实现电连接。
可选的，所述图形组件上制作的外层金属图形包括焊盘和线路中至少之一。
可选的，所述内层金属图形的数量为至少两个，布置于所述母板的不同内层；所述图形组件的数量为至少两个，每个图形组件与对应的一个所述内层金 属图形电连接。
一种PCB的制作方法，包括步骤：
提供制作有内层金属图形的母板，以及制作有外层金属图形的图形组件；其中，所述母板包括顶壁、底壁以及围设于顶壁和底壁之间的侧壁，且所述内层金属图形部分裸露于所述侧壁；
将所述图形组件焊接于所述侧壁上的所述内层金属图形的裸露区域，使得所述图形组件的外层金属图形与所述母板的内层金属图形实现电连接。
可选的，所述提供制作有外层金属图形的图形组件，包括：
提供双面覆铜板；
在所述双面覆铜板的一侧表面制作所述外层金属图形、另一侧表面制作用于与所述母板焊接的焊盘；
在所述双面覆铜板上制作信号过孔，使得所述外层金属图形与所述焊盘通过所述信号过孔实现电连接，获得所述图形组件。
可选的，所述内层金属图形的数量为至少两个，布置于所述母板的不同内层；所述图形组件的数量为至少两个，每个图形组件焊接于所述侧壁上的对应所述内层金属图形的裸露区域。
可选的，所述提供制作有外层金属图形的图形组件，包括：
提供双面覆铜板；
在所述双面覆铜板的一侧表面分区域制作每个图形组件对应的所述外层金属图形、另一侧表面分区域制作每个所述外层金属图形对应的焊盘，所述焊盘被设置为与所述母板焊接；
在所述双面覆铜板上分区域制作信号过孔，使得每个所述外层金属图形与对应的所述焊盘通过信号过孔实现电连接；
对所述双面覆铜板按区域切割，得到至少两个所述图形组件。
可选的，所述外层金属图形包括焊盘和线路中至少之一。
本申请实施例提供的PCB对母板的侧壁空间进行利用，在侧壁布置制作有外层金属图形的图形组件，并将该图形组件与母板的内层金属图形电连接，以实现图形组件的信号传输功能。该PCB对有限空间进行了有效拓展，扩大了PCB的可利用空间，提高布线密度或者元件贴片密度，使得PCB满足电子产品日趋小型化和高密化的发展趋势。
附图说明
下面将对实施例或相关技术描述中所需要使用的附图作简单地介绍，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1为本申请实施例提供的PCB的结构示意图；
图2为本申请实施例提供的PCB的制作方法流程图。
图示说明：
母板1、顶壁11、底壁12、侧壁13、图形组件2、双面覆铜板21、外层金属图形22、信号过孔23。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，下面所描述的实施例仅仅是本申请一部分实施例，而非全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
请参阅图1，本申请实施例提供了一种PCB，包括：制作有至少一内层金属图形的母板1，以及制作有外层金属图形22的图形组件2；
母板1，包括顶壁11、底壁12以及围设于顶壁11和底壁12之间的侧壁13，且内层金属图形部分裸露于侧壁13；
图形组件2焊接于侧壁13上的内层金属图形的裸露区域，使得图形组件2的外层金属图形22与母板1的内层金属图形实现电连接。
不同于常规的的仅在表面(包括顶壁11和底壁12)布置金属图形的PCB，本申请实施例提供的PCB对母板1的侧壁13空间进行利用，在侧壁13布置制作有外层金属图形22的图形组件2，并将该图形组件2与母板1的内层金属图形电连接，以实现图形组件2的信号传输功能。该PCB对有限空间进行了有效拓展，扩大了PCB的可利用空间，提高布线密度或者元件贴片密度，使得PCB满足电子产品日趋小型化和高密化的发展趋势。
在一种可选的实施方式中，图形组件2，包括开设有信号过孔23的双面覆铜板21，双面覆铜板21的一侧表面制作有外层金属图形22、另一侧表面制作有用于与侧壁13焊接的焊盘，外层金属图形22与焊盘通过信号过孔23实现电连接。本实施方式中，图形组件2利用本领域常用的双面覆铜板21完成图形制作而成，简单高效。
图形组件2上制作的外层金属图形22可以包括焊盘和线路中至少之一，本申请可根据实际的需求来进行设计。
需要说明的是，本实施例中用于与图形组件2电连接的内层金属图形的数量可以为一个，也可以为至少两个。在数量超过一个时，这些内层金属图形可以布置于母板1的不同内层，于侧壁13上的不同层位置裸露；也可以布置于同一内层，并于侧壁13上同层的不同位置裸露。
相应的，图形组件2的数量也可以为至少两个，每个图形组件2与对应的一个内层金属图形电连接。
请参阅图2，本申请实施例还提供了上述PCB的制作方法，包括步骤：
步骤101、提供制作有内层金属图形的母板1，以及制作有外层金属图形22的图形组件2。
其中，母板1包括顶壁11、底壁12以及围设于顶壁11和底壁12之间的侧壁13，且内层金属图形部分裸露于侧壁13。
需要说明的是，母板1可以为多张芯板按照常规工艺压合而成。
步骤102、将图形组件2焊接于侧壁13上的内层金属图形的裸露区域，使得图形组件2的外层金属图形22与母板1的内层金属图形实现电连接。
该方法将母板1与图形组件2分别单独制作，再将图形组件2焊接于母板1的侧壁13，对母板1的表面空间进行了有效拓展，能够大大提升布线密度或者元件贴片密度，制作方法简单高效。
在图形组件2的数量仅为一个时，可以采用以下单独制作方法：提供双面覆铜板21；在双面覆铜板21的一侧表面制作外层金属图形22、另一侧表面制作用于与母板1焊接的焊盘；在双面覆铜板21上制作信号过孔23，使得外层金属图形22与焊盘通过信号过孔23实现电连接，即获得图形组件2。
在图形组件2的数量为至少两个时，既可以采用上述的单独制作方法，也可以采用下述的统一制作方法：提供双面覆铜板21；在双面覆铜板21的一侧表面分区域制作每个图形组件2对应的外层金属图形22、另一侧表面分区域制作每个外层金属图形22对应的焊盘，焊盘用于与母板1焊接；在双面覆铜板21上分区域制作信号过孔23，使得每个外层金属图形22与对应的焊盘通过信号过孔23实现电连接；对双面覆铜板21按区域切割，即得到至少两个图形组件2。
该方法采用了在同一张双面覆铜板21上统一制作多个图形组件2、再将每个图形组件2分割成独立组件的方式，这样可以有效提高加工效率。
在另一种可能的实施方式中，如果完全按照于侧壁13上的焊接位置来统一 制作每个图形组件2，则也可以不进行分割，直接将这些图形组件2整体焊接至侧壁13。
另外，每个图形组件2上的外层金属图形22可以包括焊盘和线路中至少之一，其中的焊盘可用于焊接元件，以增加元件的布置密度。

Claims (9)

  1. 一种PCB，包括：制作有至少一内层金属图形的母板，以及制作有外层金属图形的图形组件；
    所述母板，包括顶壁、底壁以及围设于顶壁和底壁之间的侧壁，且所述内层金属图形部分裸露于所述侧壁；
    所述图形组件焊接于所述侧壁上的所述内层金属图形的裸露区域，使得所述图形组件的外层金属图形与所述母板的内层金属图形实现电连接。
  2. 根据权利要求1所述的PCB，其中，所述图形组件包括开设有信号过孔的双面覆铜板，所述双面覆铜板的一侧表面制作有所述外层金属图形、另一侧表面制作有用于与所述侧壁焊接的焊盘，所述外层金属图形与所述焊盘通过所述信号过孔实现电连接。
  3. 根据权利要求1所述的PCB，其中，所述图形组件上制作的外层金属图形包括焊盘和线路中至少之一。
  4. 根据权利要求1所述的PCB，其中，所述内层金属图形的数量为至少两个，布置于所述母板的不同内层；所述图形组件的数量为至少两个，每个图形组件与对应的一个所述内层金属图形电连接。
  5. 一种PCB的制作方法，包括步骤：
    提供制作有内层金属图形的母板，以及制作有外层金属图形的图形组件；其中，所述母板包括顶壁、底壁以及围设于顶壁和底壁之间的侧壁，且所述内层金属图形部分裸露于所述侧壁；
    将所述图形组件焊接于所述侧壁上的所述内层金属图形的裸露区域，使得所述图形组件的外层金属图形与所述母板的内层金属图形实现电连接。
  6. 根据权利要求5所述的PCB的制作方法，其中，所述提供制作有外层金属图形的图形组件，包括：
    提供双面覆铜板；
    在所述双面覆铜板的一侧表面制作所述外层金属图形、另一侧表面制作用于与所述母板焊接的焊盘；
    在所述双面覆铜板上制作信号过孔，使得所述外层金属图形与所述焊盘通过所述信号过孔实现电连接，获得所述图形组件。
  7. 根据权利要求5所述的PCB的制作方法，其中，所述内层金属图形的数量为至少两个，布置于所述母板的不同内层；所述图形组件的数量为至少两个，每个图形组件焊接于所述侧壁上的对应所述内层金属图形的裸露区域。
  8. 根据权利要求7所述的PCB的制作方法，其中，所述提供制作有外层金属图形的图形组件，包括：
    在双面覆铜板的一侧表面分区域制作每个图形组件对应的所述外层金属图形、另一侧表面分区域制作每个所述外层金属图形对应的焊盘，所述焊盘被设置为与所述母板焊接；
    在所述双面覆铜板上分区域制作信号过孔，使得每个所述外层金属图形与对应的所述焊盘通过信号过孔实现电连接；
    对所述双面覆铜板按区域切割，得到至少两个所述图形组件。
  9. 根据权利要求5所述的PCB的制作方法，其中，所述外层金属图形包括焊盘和线路中至少之一。
PCT/CN2022/099072 2021-12-14 2022-06-16 Pcb及其制作方法 WO2023109048A1 (zh)

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