WO2000011237A1 - Dispositif a depression et mecanisme d'entrainement a cet effet - Google Patents
Dispositif a depression et mecanisme d'entrainement a cet effet Download PDFInfo
- Publication number
- WO2000011237A1 WO2000011237A1 PCT/JP1999/004434 JP9904434W WO0011237A1 WO 2000011237 A1 WO2000011237 A1 WO 2000011237A1 JP 9904434 W JP9904434 W JP 9904434W WO 0011237 A1 WO0011237 A1 WO 0011237A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- airbag
- vacuum
- storage container
- transfer chamber
- vacuum device
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
- B01J3/006—Processes utilising sub-atmospheric pressure; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
- B01J3/02—Feed or outlet devices therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Vacuum Packaging (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Manipulator (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Glass Compositions (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99938509A EP1029942B9 (en) | 1998-08-19 | 1999-08-18 | Vacuum device |
US09/529,664 US6337003B1 (en) | 1998-08-19 | 1999-08-18 | Vacuum apparatus and driving mechanism therefor |
DE69937483T DE69937483T2 (de) | 1998-08-19 | 1999-08-18 | Vakuumvorrichtung |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23265598 | 1998-08-19 | ||
JP10/232655 | 1998-08-19 | ||
JP11094041A JP2000133693A (ja) | 1998-08-19 | 1999-03-31 | 真空装置用駆動機構および真空装置 |
JP11/94041 | 1999-03-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000011237A1 true WO2000011237A1 (fr) | 2000-03-02 |
Family
ID=26435356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1999/004434 WO2000011237A1 (fr) | 1998-08-19 | 1999-08-18 | Dispositif a depression et mecanisme d'entrainement a cet effet |
Country Status (9)
Country | Link |
---|---|
US (1) | US6337003B1 (ja) |
EP (1) | EP1029942B9 (ja) |
JP (1) | JP2000133693A (ja) |
KR (1) | KR100414514B1 (ja) |
CN (1) | CN1170001C (ja) |
AT (1) | ATE377662T1 (ja) |
DE (1) | DE69937483T2 (ja) |
TW (1) | TW533247B (ja) |
WO (1) | WO2000011237A1 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4557418B2 (ja) * | 2000-12-27 | 2010-10-06 | 芝浦メカトロニクス株式会社 | 多層膜の形成装置 |
DE10100427A1 (de) | 2001-01-08 | 2002-07-18 | Steag Hamatech Ag | Verfahren und Vorrichtung zum Zusammenfügen von Substraten |
JP2003195246A (ja) * | 2001-12-14 | 2003-07-09 | Internatl Business Mach Corp <Ibm> | 固定装置、基板の固定方法及びこれを用いた液晶表示パネルの製造装置及び製造方法 |
JP2004196626A (ja) * | 2002-12-20 | 2004-07-15 | Sumitomo Chem Co Ltd | 酸化チタンの製造方法 |
EP1639629B1 (en) * | 2003-06-13 | 2011-04-27 | WEN, Sophia | Apparatus for thin-layer chemical processing of semiconductor wafers |
TW200641880A (en) * | 2005-04-26 | 2006-12-01 | Steag Hamatech Ag | Process and device for coating disk-shaped substrates for optical data carriers |
DE102005056323A1 (de) * | 2005-11-25 | 2007-05-31 | Aixtron Ag | Prozesskammermodul zum gleichzeitigen Abscheiden von Schichten auf mehreren Substraten |
US7638022B2 (en) * | 2006-02-27 | 2009-12-29 | Ascentool, Inc | Magnetron source for deposition on large substrates |
KR100829923B1 (ko) * | 2006-08-30 | 2008-05-16 | 세메스 주식회사 | 스핀헤드 및 이를 이용하는 기판처리방법 |
US8687835B2 (en) | 2011-11-16 | 2014-04-01 | Wolo Mfg. Corp. | Diaphragm for an electropneumatic horn system |
WO2009032442A1 (en) | 2007-09-06 | 2009-03-12 | Wolo Mfg.Corp. | Electropneumatic horn system |
US7802535B2 (en) * | 2007-09-06 | 2010-09-28 | Wolo Mfg. Corp. | Electropneumatic horn system |
JP4979566B2 (ja) * | 2007-12-14 | 2012-07-18 | キヤノン株式会社 | 記録装置及び記録装置の制御方法 |
JP4971294B2 (ja) * | 2008-12-02 | 2012-07-11 | 三菱電機株式会社 | 基板処理装置、基板処理方法、及び表示装置の製造方法 |
JP5482500B2 (ja) * | 2010-06-21 | 2014-05-07 | 東京エレクトロン株式会社 | 基板処理装置 |
JP6293499B2 (ja) * | 2014-01-27 | 2018-03-14 | 株式会社日立ハイテクノロジーズ | 真空処理装置 |
JP2016089919A (ja) * | 2014-11-04 | 2016-05-23 | 日本電産株式会社 | 流体軸受装置の製造方法およびスピンドルモータ |
CN104934502B (zh) * | 2015-06-02 | 2017-02-01 | 中国科学院上海技术物理研究所 | 一种硒气压可控的铜铟镓硒薄膜硒化装置 |
CN106931768B (zh) * | 2017-04-25 | 2020-08-14 | 深圳力士智造科技有限公司 | 一种用于真空干燥炉中的自动夹紧机构 |
CN108315695B (zh) * | 2018-05-04 | 2023-11-17 | 苏州东福来机电科技有限公司 | 一种智能真空镀膜机构 |
CN108385081B (zh) * | 2018-05-04 | 2024-01-12 | 华仪行(北京)科技有限公司 | 一种双仓自动镀膜装置 |
CN112758696B (zh) * | 2021-01-19 | 2023-07-11 | 埃特曼半导体技术有限公司 | 真空样品驱动装置 |
CN114990513B (zh) * | 2022-06-16 | 2024-01-09 | 广东迪生力汽配股份有限公司 | 一种轮毂的真空镀膜装置及真空镀膜方法 |
CN115196166B (zh) * | 2022-07-13 | 2023-09-01 | 扬州亿芯微电子有限公司 | 一种晶圆测试用转运装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0182376U (ja) * | 1987-11-24 | 1989-06-01 | ||
JPH0325559U (ja) * | 1989-07-19 | 1991-03-15 | ||
JPH03188277A (ja) * | 1989-12-14 | 1991-08-16 | Shimadzu Corp | 真空プロセス装置 |
JPH08165571A (ja) * | 1994-12-08 | 1996-06-25 | Nissin Electric Co Ltd | 基板保持装置およびその製造方法 |
JPH08199336A (ja) * | 1995-01-27 | 1996-08-06 | Sony Disc Technol:Kk | メカニカルチャック式ローディング装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55142350A (en) * | 1979-04-23 | 1980-11-06 | Oodoko Seisakusho:Kk | Shotening apparatus for vacuum contact time of composer for offset printing |
NL8200902A (nl) * | 1982-03-05 | 1983-10-03 | Philips Nv | Magnetron-kathodesputtersysteem. |
DE3716498C2 (de) * | 1987-05-16 | 1994-08-04 | Leybold Ag | Vorrichtung zum Ein- und Ausschleusen von Werkstücken in eine Beschichtungskammer |
JPS6425559A (en) | 1987-07-22 | 1989-01-27 | Matsushita Electronics Corp | Manufacture of mis type semiconductor device |
JPS6482376A (en) | 1987-09-22 | 1989-03-28 | Tdk Corp | Head supporting device |
JP3466607B2 (ja) * | 1989-09-13 | 2003-11-17 | ソニー株式会社 | スパッタリング装置 |
JPH07116586B2 (ja) * | 1990-05-31 | 1995-12-13 | 株式会社芝浦製作所 | バルブ機構を備えた配管装置 |
JPH0639697B2 (ja) * | 1990-11-30 | 1994-05-25 | 株式会社芝浦製作所 | 基板のローディング装置 |
JPH0688227A (ja) * | 1992-09-08 | 1994-03-29 | Fujitsu Ltd | 成膜装置 |
US5415754A (en) * | 1993-10-22 | 1995-05-16 | Sierra Applied Sciences, Inc. | Method and apparatus for sputtering magnetic target materials |
US5637200A (en) * | 1995-02-08 | 1997-06-10 | Nobler Technologies, Inc. | Compact disk locking apparatus |
US5762544A (en) * | 1995-10-27 | 1998-06-09 | Applied Materials, Inc. | Carrier head design for a chemical mechanical polishing apparatus |
DE19605599C1 (de) * | 1996-02-15 | 1996-10-31 | Singulus Technologies Gmbh | Vorrichtung zum Transport von Substraten |
JPH1046337A (ja) * | 1996-08-02 | 1998-02-17 | Fujitsu Ltd | 成膜装置 |
-
1999
- 1999-03-31 JP JP11094041A patent/JP2000133693A/ja active Pending
- 1999-08-18 EP EP99938509A patent/EP1029942B9/en not_active Expired - Lifetime
- 1999-08-18 US US09/529,664 patent/US6337003B1/en not_active Expired - Fee Related
- 1999-08-18 CN CNB998013765A patent/CN1170001C/zh not_active Expired - Fee Related
- 1999-08-18 AT AT99938509T patent/ATE377662T1/de not_active IP Right Cessation
- 1999-08-18 DE DE69937483T patent/DE69937483T2/de not_active Expired - Fee Related
- 1999-08-18 WO PCT/JP1999/004434 patent/WO2000011237A1/ja active IP Right Grant
- 1999-08-18 KR KR10-2000-7004137A patent/KR100414514B1/ko not_active IP Right Cessation
- 1999-08-19 TW TW088114202A patent/TW533247B/zh not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0182376U (ja) * | 1987-11-24 | 1989-06-01 | ||
JPH0325559U (ja) * | 1989-07-19 | 1991-03-15 | ||
JPH03188277A (ja) * | 1989-12-14 | 1991-08-16 | Shimadzu Corp | 真空プロセス装置 |
JPH08165571A (ja) * | 1994-12-08 | 1996-06-25 | Nissin Electric Co Ltd | 基板保持装置およびその製造方法 |
JPH08199336A (ja) * | 1995-01-27 | 1996-08-06 | Sony Disc Technol:Kk | メカニカルチャック式ローディング装置 |
Also Published As
Publication number | Publication date |
---|---|
EP1029942B9 (en) | 2008-05-07 |
ATE377662T1 (de) | 2007-11-15 |
EP1029942B1 (en) | 2007-11-07 |
TW533247B (en) | 2003-05-21 |
KR100414514B1 (ko) | 2004-01-07 |
KR20010031194A (ko) | 2001-04-16 |
US6337003B1 (en) | 2002-01-08 |
DE69937483T2 (de) | 2008-08-21 |
DE69937483D1 (de) | 2007-12-20 |
EP1029942A4 (en) | 2004-11-10 |
EP1029942A1 (en) | 2000-08-23 |
JP2000133693A (ja) | 2000-05-12 |
CN1170001C (zh) | 2004-10-06 |
CN1275174A (zh) | 2000-11-29 |
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