CN104934502B - 一种硒气压可控的铜铟镓硒薄膜硒化装置 - Google Patents

一种硒气压可控的铜铟镓硒薄膜硒化装置 Download PDF

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CN104934502B
CN104934502B CN201510295806.2A CN201510295806A CN104934502B CN 104934502 B CN104934502 B CN 104934502B CN 201510295806 A CN201510295806 A CN 201510295806A CN 104934502 B CN104934502 B CN 104934502B
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褚君浩
孙雷
马建华
姚娘娟
江锦春
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Shanghai Institute of Technical Physics of CAS
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    • HELECTRICITY
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    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L31/0256Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
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    • H01L31/032Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
    • H01L31/0322Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • H01L31/1864Annealing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/541CuInSe2 material PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
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Abstract

本发明公开了一种可控制硒气压的制备铜铟镓硒薄膜的硒化装置,该硒化装置由石英腔体、真空系统、气体流量控制系统、加热系统和石墨盒构成,其特征在于,石墨盒上除了常规的上盖以外,还在上盖中间开孔,并在此开孔中放置一个圆锥体型小盖子,通过改变小盖子质量和开孔面积可以调节石墨盒内的硒气压。本发明的优点在于:装置提高了铟镓硒薄膜固态源硒化过程的可控性、稳定性和重复性。

Description

一种硒气压可控的铜铟镓硒薄膜硒化装置
技术领域
本发明属于光电材料新能源领域,涉及薄膜太阳电池材料,具体是指一种用于制备铜铟镓硒系列太阳电池的吸收层——铜铟镓硒薄膜的硒化装置。
背景技术
铜铟镓硒(CIGS)系列薄膜太阳电池以其廉价、高效、高稳定性和抗辐射性等优点被誉为最有前途的太阳能电池之一。其基本结构是:衬底/金属背电极/吸收层/缓冲层/窗口层/透明电极层/金属栅状电极/减反射层。其中,CIGS吸收层材料的制备是电池制作过程中最为核心的问题。目前,CIGS吸收层常用金属预置层后硒化法制备,即先采用真空磁控溅射、加热蒸发或电沉积法在镀Mo的钠钙玻璃衬底上根据化学式配比量沉积Cu、In、Ga的合金或叠层膜,然后在高温硒气氛下进行退火,通过硒化反应制备CIGS薄膜。目前硒化方法主要分为硒化氢硒化和固态源硒化两种方式。硒化氢硒化法制备的CIGS太阳电池吸收层具有更好的性能,但由于硒化氢有剧毒,对设备和实际操作的要求非常高。固态源硒化法因操作简单,逐渐被国内外研究者和生产企业广泛采用。固态源硒化过程中,硒气压非常关键,硒气压过高会造成大量的硒分子团簇,使CIGS薄膜表面硒浓度过高,膜层粗糙疏松;硒气压过低会造成硒化不透彻,影响晶粒生长。硒气压直接影响硒化效果,因此要求在硒化过程中有效地控制硒气压。
固态源硒化法通常是在硒化腔体内放置密闭石墨盒,再将硒粉和等待硒化的样品置于石墨盒内,加热硒化腔体后,可以在封闭的匀热空间里得到非常大的硒蒸气压,获得比较好的硒化效果。密闭的石墨盒内,硒气压受温度影响。常规的石墨盒只有一个上盖,高温阶段硒蒸气大量挥发,石墨盒内的硒气压一直上升,达到一定的数值,甚至可能顶翻盖子,硒蒸气完全溢出,整个过程中硒气压不能得到很好的控制。
发明内容
针对上述已有技术存在的问题,本发明的目的是提供一种可控制硒气压的制备铜铟镓硒薄膜的硒化装置,从而实现CIGS薄膜固态源硒化过程中对硒气压的控制。
本发明采用的硒化装置由石英腔体、真空系统、气体流量控制系统、加热系统和石墨盒构成。石英腔体为尺寸足够放入石墨盒的石英管;真空系统包括真空泵、真空计和连接管道;气体流量控制系统包括进气接口及精密针阀,可通入惰性气体并控制其流量大小;加热系统由上下两排均匀间隔分布在石英腔体周围的卤素灯管组成;石墨盒为密闭盒体,盒内凹槽装有硒粉,盒底平面放置待硒化样品。石英腔体内放置石墨盒,两端设有密封装置,且均装有阀门,其一端连接真空系统,另一端连接气体流量控制系统。通过调节石英腔体两端的阀门,可以控制真空系统的抽气速率和气体流量控制系统的气体流量,进而调节石英腔体内的气压大小。
本发明的特征在于,石墨盒上除了常规的上盖以外,还在上盖中间开孔,并在此开孔中放置一个圆锥体型小盖子。通过改变小盖子质量和开孔面积可以调节石墨盒内的硒气压。设小盖子的质量为m,石墨盒上放置小盖子的开孔面积为S,石英腔体内的气压为P0,则石墨盒内的最高硒气压Pmax
P m a x = P 0 + m g S
其中P0可以通过调节真空泵的抽气速率和气体流量控制系统的惰性气体流量来调节。因此石墨盒内的最高硒气压由小盖子质量、开孔面积和石英腔体内气压共同决定。在硒化过程中,随着温度的升高,石墨盒凹槽内的硒粉大量蒸发为硒蒸气,充满整个石墨盒,硒气压也不断增大。当硒气压超过最大压力Pmax时,硒蒸气会顶起石墨盒上方的小盖子,并从小盖子与石墨盒上盖之间的间隙中溢出,石墨盒内的硒气压随之下降。当硒气压降至Pmax以下时,小盖子将回落到石墨盒上,由此形成一个保持相对稳定的硒气压的机制。
本发明的优点是:在CIGS薄膜固态源硒化过程中,通过在石墨盒上增加一个调节压力的小盖子,实现了对硒气压的控制,从而提高了硒化过程的可控性、稳定性和重复性。
附图说明
图1为石墨盒的结构示意图,其中(a)为俯视图,(b)为侧视图。
图2为硒化装置的整体结构示意图。
图中:1-硒粉;2-待硒化样品;3-石墨盒;4-石墨盒上盖;5-石墨盒小盖子;6-石英腔体;7-卤素灯管;8-密封法兰;9-过滤网;10-抽气调节阀;11-真空泵。
具体实施方式
下面结合附图和实施例对本发明的具体实施方式作进一步的详细说明:
如图1所示,硒粉1和待硒化样品2(采用磁控溅射法,在玻璃衬底上制备CuInGa前驱体)分别被放置于石墨盒3的盒内凹槽和盒底平面上。石墨盒3上除了与其紧密贴合的上盖4(上盖4与石墨盒3之间的接触面为磨口工艺,其密封性良好)以外,还在上盖4中间开孔,并放置一个上大下小的圆锥体型小盖子5。本实例采用的小盖子5的质量m为10g,石墨盒3上放置小盖子5的开孔面积S为0.1cm2,石英腔体内的气压P0控制为200Pa,则石墨盒内的最高硒气压Pmax为:
P m a x = P 0 + m g S = 200 P a + 0.01 k g × 9.8 N / k g 10 - 5 m 2 = 10 4 P a
本实例的CIGS薄膜硒化装置如图2所示。装有硒粉和待硒化样品的石墨盒(如图1所示)被放置在石英腔体6中,卤素灯管7分上下两排均匀间隔分布在石英腔体6周围,并用隔热材料包裹。石英腔体6两端装有密封法兰8,一端连接气体流量控制系统,通入氮气,另一端连接真空泵11。过滤网9用于过滤进入真空泵11的硒蒸气,抽气调节阀10用来调节真空泵11的抽气速率,进而调节石英腔体内的气压大小。
具体的硒化步骤如下:
1.用分析天平称取高纯硒粉1,用量:0.1-2克。
2.将硒粉1均匀地洒在石墨盒3的盒内凹槽,将待硒化样品2放在石墨盒3的盒底平面上,盖上石墨盒上盖4。将石墨盒3放入石英腔体6中,并装好石英腔体6两端的密封法兰8。
3.打开真空泵11和抽气调节阀10,将石英腔体6内气压抽至0.1Pa以下,然后打开气体流量控制系统,通入氮气。调节氮气流量和真空泵11抽速,将石英腔体6内气压控制在200Pa左右。
4.打开卤素灯管7的控制电源,按照CIGS薄膜硒化加热过程加热石英腔体6和石墨盒3。通常的加热过程为,首先加热至270℃并保持10分钟,使硒粉1蒸发成硒蒸气并充满石墨盒3;在升温至500℃并保持30分钟,使硒蒸汽与待硒化样品2放生高温硒化反应。
5.硒化完成后,关闭卤素灯管7,待石英腔体6和石墨盒3冷却至室温后,关闭真空泵11和气体流量控制系统。
6.打开密封法兰8,从石英腔体6中取出石墨盒3。
调整小盖子5的质量、开孔面积S和石英腔体内的气压P0,可以改变石墨盒内的最高硒气压Pmax,从而得到不同的硒化条件。本实施例可制备出硒化均匀的CIGS薄膜样品,继续在此样品上制备后续功能层,可得到了高效的CIGS薄膜太阳能电池。

Claims (1)

1.一种硒气压可控的铜铟镓硒薄膜硒化装置,由石英腔体、真空系统、气体流量控制系统、加热系统和石墨盒构成,其特征在于:
所述的石墨盒上为密闭盒体,盒内凹槽装有硒粉,盒底平面放置待硒化样品;除了常规的上盖以外,还在上盖中间开孔,并在此开孔中放置一个圆锥体型小盖子,通过改变小盖子质量和开孔面积调节石墨盒内的硒气压;
所述的石英腔体为可放置石墨盒的石英管;
所述的真空系统包括真空泵、真空计和连接管道;
所述的气体流量控制系统包括进气接口及精密针阀,可通入惰性气体并控制其流量大小;
所述的加热系统由上下两排均匀间隔分布在石英腔体周围的卤素灯管组成;
石英腔体内放置石墨盒,两端设有密封装置,且均装有阀门,其一端连接真空系统,另一端连接气体流量控制系统,通过调节石英腔体两端的阀门,可以控制真空系统的抽气速率和气体流量控制系统的气体流量,进而调节石英腔体内的气压大小。
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6337003B1 (en) * 1998-08-19 2002-01-08 Shibaura Mechatronics Corporation Vacuum apparatus and driving mechanism therefor
CN102610543A (zh) * 2012-01-18 2012-07-25 清华大学 用于内部稀薄气流模拟验证及压力检测的变结构真空腔室
CN204680681U (zh) * 2015-06-02 2015-09-30 中国科学院上海技术物理研究所 硒气压可控的铜铟镓硒薄膜硒化装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4895167B2 (ja) * 2006-01-31 2012-03-14 東京エレクトロン株式会社 ガス供給装置,基板処理装置,ガス供給方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6337003B1 (en) * 1998-08-19 2002-01-08 Shibaura Mechatronics Corporation Vacuum apparatus and driving mechanism therefor
CN102610543A (zh) * 2012-01-18 2012-07-25 清华大学 用于内部稀薄气流模拟验证及压力检测的变结构真空腔室
CN204680681U (zh) * 2015-06-02 2015-09-30 中国科学院上海技术物理研究所 硒气压可控的铜铟镓硒薄膜硒化装置

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