TWI794886B - 蒸氣腔、電子機器及蒸氣腔之製造方法 - Google Patents
蒸氣腔、電子機器及蒸氣腔之製造方法 Download PDFInfo
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- TWI794886B TWI794886B TW110125873A TW110125873A TWI794886B TW I794886 B TWI794886 B TW I794886B TW 110125873 A TW110125873 A TW 110125873A TW 110125873 A TW110125873 A TW 110125873A TW I794886 B TWI794886 B TW I794886B
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- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000007788 liquid Substances 0.000 claims abstract description 142
- 229910052751 metal Inorganic materials 0.000 claims description 244
- 239000002184 metal Substances 0.000 claims description 244
- 239000012530 fluid Substances 0.000 claims description 190
- 238000004891 communication Methods 0.000 claims description 63
- 238000005530 etching Methods 0.000 claims description 29
- 238000007789 sealing Methods 0.000 claims description 3
- 230000009471 action Effects 0.000 description 49
- 238000002347 injection Methods 0.000 description 35
- 239000007924 injection Substances 0.000 description 35
- 238000001704 evaporation Methods 0.000 description 33
- 230000002093 peripheral effect Effects 0.000 description 26
- 230000008020 evaporation Effects 0.000 description 17
- 238000012546 transfer Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 9
- 239000007769 metal material Substances 0.000 description 9
- 238000012986 modification Methods 0.000 description 8
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- 238000009792 diffusion process Methods 0.000 description 7
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- 238000005304 joining Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000001154 acute effect Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
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- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
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- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0283—Means for filling or sealing heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-033622 | 2017-02-24 | ||
| JP2017033622 | 2017-02-24 | ||
| JP2017217593 | 2017-11-10 | ||
| JP2017-217633 | 2017-11-10 | ||
| JP2017-217593 | 2017-11-10 | ||
| JP2017217633 | 2017-11-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202140982A TW202140982A (zh) | 2021-11-01 |
| TWI794886B true TWI794886B (zh) | 2023-03-01 |
Family
ID=63253812
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107106230A TWI736745B (zh) | 2017-02-24 | 2018-02-23 | 蒸氣腔、電子機器、蒸氣腔用金屬片材及蒸氣腔之製造方法 |
| TW110125873A TWI794886B (zh) | 2017-02-24 | 2018-02-23 | 蒸氣腔、電子機器及蒸氣腔之製造方法 |
| TW113150546A TW202516142A (zh) | 2017-02-24 | 2018-02-23 | 蒸氣腔、電子機器及蒸氣腔用金屬片材 |
| TW112102667A TWI870768B (zh) | 2017-02-24 | 2018-02-23 | 蒸氣腔、電子機器、蒸氣腔用金屬片材及蒸氣腔之製造方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107106230A TWI736745B (zh) | 2017-02-24 | 2018-02-23 | 蒸氣腔、電子機器、蒸氣腔用金屬片材及蒸氣腔之製造方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113150546A TW202516142A (zh) | 2017-02-24 | 2018-02-23 | 蒸氣腔、電子機器及蒸氣腔用金屬片材 |
| TW112102667A TWI870768B (zh) | 2017-02-24 | 2018-02-23 | 蒸氣腔、電子機器、蒸氣腔用金屬片材及蒸氣腔之製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (4) | US11578927B2 (enExample) |
| JP (6) | JP6853962B2 (enExample) |
| KR (5) | KR102442311B1 (enExample) |
| CN (2) | CN110325810B (enExample) |
| TW (4) | TWI736745B (enExample) |
| WO (1) | WO2018155641A1 (enExample) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102442311B1 (ko) * | 2017-02-24 | 2022-09-13 | 다이니폰 인사츠 가부시키가이샤 | 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법 |
| KR20250005523A (ko) | 2017-09-28 | 2025-01-09 | 다이니폰 인사츠 가부시키가이샤 | 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법 |
| JP6801700B2 (ja) * | 2017-11-10 | 2020-12-16 | 大日本印刷株式会社 | ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法 |
| JP7015197B2 (ja) * | 2018-03-26 | 2022-02-02 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
| JP7363199B2 (ja) * | 2018-08-31 | 2023-10-18 | 大日本印刷株式会社 | ベーパーチャンバー、電子機器 |
| TWI738179B (zh) | 2019-01-18 | 2021-09-01 | 李克勤 | 薄形散熱裝置及其製造方法 |
| CN119812143A (zh) * | 2019-03-11 | 2025-04-11 | 大日本印刷株式会社 | 蒸发室、电子设备以及蒸发室用片 |
| KR102570354B1 (ko) * | 2019-05-28 | 2023-08-25 | 미쯔이가가꾸가부시끼가이샤 | 냉각 장치 및 냉각 장치의 제조 방법 |
| CN110572981B (zh) | 2019-07-31 | 2020-12-22 | 华为技术有限公司 | 一种导热装置及终端设备 |
| WO2021045211A1 (ja) * | 2019-09-06 | 2021-03-11 | 大日本印刷株式会社 | ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、ベーパーチャンバ用の中間体が多面付けされたシート、ベーパーチャンバ用の中間体が多面付けされたシートが巻かれたロール、ベーパーチャンバ用の中間体 |
| CN112484544A (zh) * | 2019-10-30 | 2021-03-12 | 株式会社Cgi | 非定向型均热板 |
| TWI811504B (zh) * | 2019-12-16 | 2023-08-11 | 訊凱國際股份有限公司 | 散熱裝置 |
| US12256520B2 (en) * | 2020-01-10 | 2025-03-18 | Dai Nippon Printing Co., Ltd. | Wick sheet for vapor chamber, vapor chamber, and electronic apparatus |
| CN113270382B (zh) * | 2020-02-14 | 2025-03-18 | 昇印光电（昆山）股份有限公司 | 一种散热组件及搭载其的电子设备 |
| KR102381018B1 (ko) * | 2020-03-23 | 2022-03-31 | 화인시스 주식회사 | 베이퍼 체임버 |
| KR102442845B1 (ko) * | 2020-03-23 | 2022-09-15 | 화인시스 주식회사 | 베이퍼 체임버 |
| CN113465420A (zh) * | 2020-03-30 | 2021-10-01 | 超众科技股份有限公司 | 热传导部件、接合热传导部件的接合装置 |
| TWI747305B (zh) * | 2020-06-01 | 2021-11-21 | 建準電機工業股份有限公司 | 均溫板結構 |
| JP7568431B2 (ja) * | 2020-06-30 | 2024-10-16 | 古河電気工業株式会社 | ベーパーチャンバおよびベーパーチャンバの製造方法 |
| CN113883936B (zh) * | 2020-07-03 | 2025-08-19 | 台达电子工业股份有限公司 | 薄型均温板结构 |
| CN112118711A (zh) * | 2020-09-18 | 2020-12-22 | 南昌欧菲显示科技有限公司 | 均热板及其制作方法及电子设备 |
| KR20220055070A (ko) | 2020-10-26 | 2022-05-03 | 주식회사 엘지화학 | 증기 챔버 |
| JP7283641B2 (ja) * | 2020-11-04 | 2023-05-30 | 株式会社村田製作所 | 熱拡散デバイス |
| TWI817052B (zh) * | 2020-11-09 | 2023-10-01 | 欣興電子股份有限公司 | 均溫板裝置及其製作方法 |
| JP7593793B2 (ja) * | 2020-11-26 | 2024-12-03 | 古河電気工業株式会社 | ベーパーチャンバおよびベーパーチャンバの製造方法 |
| KR102864843B1 (ko) * | 2020-11-30 | 2025-09-25 | 주식회사 엘지화학 | 증기 챔버 |
| KR102864842B1 (ko) * | 2020-11-30 | 2025-09-25 | 주식회사 엘지화학 | 증기 챔버 |
| KR20220075763A (ko) | 2020-11-30 | 2022-06-08 | 주식회사 엘지화학 | 증기 챔버 |
| KR102864840B1 (ko) * | 2020-11-30 | 2025-09-25 | 주식회사 엘지화학 | 증기 챔버 |
| WO2022181453A1 (ja) * | 2021-02-26 | 2022-09-01 | 京セラ株式会社 | 熱デバイス |
| TWI878479B (zh) * | 2021-03-04 | 2025-04-01 | 宸寰科技有限公司 | 薄型化封裝接著結構 |
| KR20230156088A (ko) | 2021-03-10 | 2023-11-13 | 다이니폰 인사츠 가부시키가이샤 | 베이퍼 챔버, 베이퍼 챔버용 윅 시트 및 전자 기기 |
| CN113316355A (zh) * | 2021-04-20 | 2021-08-27 | 江西展耀微电子有限公司 | 均热结构及电子设备 |
| KR102620257B1 (ko) * | 2021-07-20 | 2024-01-03 | 주식회사 씨지아이 | 베이퍼 챔버 및 그에 사용되는 작동 유체 |
| FR3128821B1 (fr) * | 2021-11-04 | 2023-12-22 | Commissariat Energie Atomique | Chambre à vapeur |
| JP2024053369A (ja) | 2022-10-03 | 2024-04-15 | 新光電気工業株式会社 | ループ型ヒートパイプ及びループ型ヒートパイプの製造方法 |
| CN222514294U (zh) * | 2024-03-11 | 2025-02-21 | 讯强电子(惠州)有限公司 | 均热板、散热器 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007212028A (ja) * | 2006-02-08 | 2007-08-23 | Fujikura Ltd | ヒートパイプ |
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