TWI725303B - 基材處理設備 - Google Patents
基材處理設備 Download PDFInfo
- Publication number
- TWI725303B TWI725303B TW107113574A TW107113574A TWI725303B TW I725303 B TWI725303 B TW I725303B TW 107113574 A TW107113574 A TW 107113574A TW 107113574 A TW107113574 A TW 107113574A TW I725303 B TWI725303 B TW I725303B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- transfer
- arm
- conveying
- arm link
- Prior art date
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/904—Devices for picking-up and depositing articles or materials provided with rotary movements only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H10P72/0452—
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- H10P72/0461—
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- H10P72/0464—
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- H10P72/3302—
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- H10P72/7602—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261597507P | 2012-02-10 | 2012-02-10 | |
| US61/597,507 | 2012-02-10 | ||
| US201261660900P | 2012-06-18 | 2012-06-18 | |
| US61/660,900 | 2012-06-18 | ||
| US201261662690P | 2012-06-21 | 2012-06-21 | |
| US61/662,690 | 2012-06-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201839895A TW201839895A (zh) | 2018-11-01 |
| TWI725303B true TWI725303B (zh) | 2021-04-21 |
Family
ID=48948087
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107113574A TWI725303B (zh) | 2012-02-10 | 2013-02-08 | 基材處理設備 |
| TW102105348A TWI629743B (zh) | 2012-02-10 | 2013-02-08 | 基材處理設備 |
| TW110109529A TW202203356A (zh) | 2012-02-10 | 2013-02-08 | 基材處理設備 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102105348A TWI629743B (zh) | 2012-02-10 | 2013-02-08 | 基材處理設備 |
| TW110109529A TW202203356A (zh) | 2012-02-10 | 2013-02-08 | 基材處理設備 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US12142511B2 (enExample) |
| JP (4) | JP6843493B2 (enExample) |
| KR (3) | KR102096074B1 (enExample) |
| CN (2) | CN104349872B (enExample) |
| TW (3) | TWI725303B (enExample) |
| WO (1) | WO2013120054A1 (enExample) |
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| KR20100086490A (ko) * | 2007-10-24 | 2010-07-30 | 오씨 외를리콘 발처스 악티엔게젤샤프트 | 작업편 제조방법 및 장치 |
| US8899171B2 (en) | 2008-06-13 | 2014-12-02 | Kateeva, Inc. | Gas enclosure assembly and system |
| US9048344B2 (en) | 2008-06-13 | 2015-06-02 | Kateeva, Inc. | Gas enclosure assembly and system |
| US12064979B2 (en) | 2008-06-13 | 2024-08-20 | Kateeva, Inc. | Low-particle gas enclosure systems and methods |
| US12018857B2 (en) | 2008-06-13 | 2024-06-25 | Kateeva, Inc. | Gas enclosure assembly and system |
| US11975546B2 (en) | 2008-06-13 | 2024-05-07 | Kateeva, Inc. | Gas enclosure assembly and system |
| US8383202B2 (en) | 2008-06-13 | 2013-02-26 | Kateeva, Inc. | Method and apparatus for load-locked printing |
| US10434804B2 (en) | 2008-06-13 | 2019-10-08 | Kateeva, Inc. | Low particle gas enclosure systems and methods |
| US10224232B2 (en) | 2013-01-18 | 2019-03-05 | Persimmon Technologies Corporation | Robot having two arms with unequal link lengths |
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| CN116985159A (zh) * | 2023-08-22 | 2023-11-03 | 上海广川科技有限公司 | 一种手臂可升降的机械手 |
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| WO2025054493A1 (en) * | 2023-09-08 | 2025-03-13 | Brooks Automation Us, Llc | Compartmental link substrate transport apparatus |
| CN117067189A (zh) * | 2023-09-27 | 2023-11-17 | 上海广川科技有限公司 | 一种手臂可升降的机械手 |
| WO2025259930A1 (en) * | 2024-06-14 | 2025-12-18 | Brooks Automation Us, Llc | Robotic transport for handling multiple payload types |
| CN119495630B (zh) * | 2025-01-17 | 2025-04-25 | 素珀电子科技(上海)有限公司 | 基板传送设备 |
| CN120199707B (zh) * | 2025-04-09 | 2025-11-18 | 长园半导体设备(珠海)有限公司 | Tcb工艺的z轴移载平台、位移装置及其键合设备 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW550151B (en) * | 2001-07-13 | 2003-09-01 | Brooks Automation Inc | Substrate transport apparatus with multiple independent end effectors |
| TW201032970A (en) * | 2009-01-11 | 2010-09-16 | Applied Materials Inc | Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing |
| US7891935B2 (en) * | 2002-05-09 | 2011-02-22 | Brooks Automation, Inc. | Dual arm robot |
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2013
- 2013-02-08 TW TW107113574A patent/TWI725303B/zh active
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- 2013-02-08 TW TW110109529A patent/TW202203356A/zh unknown
- 2013-02-11 KR KR1020167021551A patent/KR102096074B1/ko active Active
- 2013-02-11 WO PCT/US2013/025513 patent/WO2013120054A1/en not_active Ceased
- 2013-02-11 KR KR1020237014866A patent/KR20230067705A/ko active Pending
- 2013-02-11 CN CN201380019263.0A patent/CN104349872B/zh active Active
- 2013-02-11 US US14/377,987 patent/US12142511B2/en active Active
- 2013-02-11 JP JP2014556771A patent/JP6843493B2/ja active Active
- 2013-02-11 KR KR1020227003606A patent/KR102529273B1/ko active Active
- 2013-02-11 CN CN201710826869.5A patent/CN107598909B/zh active Active
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2016
- 2016-07-20 US US15/215,143 patent/US20160329234A1/en active Pending
- 2016-08-09 JP JP2016156373A patent/JP6325612B2/ja active Active
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2020
- 2020-09-17 JP JP2020156696A patent/JP7292249B2/ja active Active
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2023
- 2023-06-06 JP JP2023093353A patent/JP2023113831A/ja active Pending
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- 2024-11-12 US US18/945,026 patent/US20250069939A1/en active Pending
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Also Published As
| Publication number | Publication date |
|---|---|
| KR102096074B1 (ko) | 2020-04-01 |
| TW202203356A (zh) | 2022-01-16 |
| KR20220019075A (ko) | 2022-02-15 |
| JP6325612B2 (ja) | 2018-05-16 |
| JP2015508236A (ja) | 2015-03-16 |
| US20160329234A1 (en) | 2016-11-10 |
| US20250069939A1 (en) | 2025-02-27 |
| TW201349376A (zh) | 2013-12-01 |
| CN104349872A (zh) | 2015-02-11 |
| TWI629743B (zh) | 2018-07-11 |
| JP2023113831A (ja) | 2023-08-16 |
| CN107598909A (zh) | 2018-01-19 |
| KR20230067705A (ko) | 2023-05-16 |
| JP2016219831A (ja) | 2016-12-22 |
| KR102529273B1 (ko) | 2023-05-04 |
| US20150013910A1 (en) | 2015-01-15 |
| CN107598909B (zh) | 2024-01-30 |
| JP2021010011A (ja) | 2021-01-28 |
| JP7292249B2 (ja) | 2023-06-16 |
| KR20160098524A (ko) | 2016-08-18 |
| JP6843493B2 (ja) | 2021-03-17 |
| WO2013120054A1 (en) | 2013-08-15 |
| CN104349872B (zh) | 2017-10-13 |
| TW201839895A (zh) | 2018-11-01 |
| US12142511B2 (en) | 2024-11-12 |
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