JP6843493B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
- Publication number
- JP6843493B2 JP6843493B2 JP2014556771A JP2014556771A JP6843493B2 JP 6843493 B2 JP6843493 B2 JP 6843493B2 JP 2014556771 A JP2014556771 A JP 2014556771A JP 2014556771 A JP2014556771 A JP 2014556771A JP 6843493 B2 JP6843493 B2 JP 6843493B2
- Authority
- JP
- Japan
- Prior art keywords
- arm
- transfer
- link
- substrate
- drive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/904—Devices for picking-up and depositing articles or materials provided with rotary movements only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261597507P | 2012-02-10 | 2012-02-10 | |
| US61/597,507 | 2012-02-10 | ||
| US201261660900P | 2012-06-18 | 2012-06-18 | |
| US61/660,900 | 2012-06-18 | ||
| US201261662690P | 2012-06-21 | 2012-06-21 | |
| US61/662,690 | 2012-06-21 | ||
| PCT/US2013/025513 WO2013120054A1 (en) | 2012-02-10 | 2013-02-11 | Substrate processing apparatus |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016156373A Division JP6325612B2 (ja) | 2012-02-10 | 2016-08-09 | 基板処理装置 |
| JP2020156696A Division JP7292249B2 (ja) | 2012-02-10 | 2020-09-17 | 基板処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015508236A JP2015508236A (ja) | 2015-03-16 |
| JP2015508236A5 JP2015508236A5 (enExample) | 2016-03-31 |
| JP6843493B2 true JP6843493B2 (ja) | 2021-03-17 |
Family
ID=48948087
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014556771A Active JP6843493B2 (ja) | 2012-02-10 | 2013-02-11 | 基板処理装置 |
| JP2016156373A Active JP6325612B2 (ja) | 2012-02-10 | 2016-08-09 | 基板処理装置 |
| JP2020156696A Active JP7292249B2 (ja) | 2012-02-10 | 2020-09-17 | 基板処理装置 |
| JP2023093353A Pending JP2023113831A (ja) | 2012-02-10 | 2023-06-06 | 基板処理装置 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016156373A Active JP6325612B2 (ja) | 2012-02-10 | 2016-08-09 | 基板処理装置 |
| JP2020156696A Active JP7292249B2 (ja) | 2012-02-10 | 2020-09-17 | 基板処理装置 |
| JP2023093353A Pending JP2023113831A (ja) | 2012-02-10 | 2023-06-06 | 基板処理装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US12142511B2 (enExample) |
| JP (4) | JP6843493B2 (enExample) |
| KR (3) | KR102096074B1 (enExample) |
| CN (2) | CN104349872B (enExample) |
| TW (3) | TWI629743B (enExample) |
| WO (1) | WO2013120054A1 (enExample) |
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| CA2701402A1 (en) * | 2007-10-24 | 2009-04-30 | Oc Oerlikon Balzers Ag | Method for manufacturing workpieces and apparatus |
| US8383202B2 (en) | 2008-06-13 | 2013-02-26 | Kateeva, Inc. | Method and apparatus for load-locked printing |
| US9048344B2 (en) | 2008-06-13 | 2015-06-02 | Kateeva, Inc. | Gas enclosure assembly and system |
| US12064979B2 (en) | 2008-06-13 | 2024-08-20 | Kateeva, Inc. | Low-particle gas enclosure systems and methods |
| US8899171B2 (en) | 2008-06-13 | 2014-12-02 | Kateeva, Inc. | Gas enclosure assembly and system |
| US10434804B2 (en) | 2008-06-13 | 2019-10-08 | Kateeva, Inc. | Low particle gas enclosure systems and methods |
| US11975546B2 (en) | 2008-06-13 | 2024-05-07 | Kateeva, Inc. | Gas enclosure assembly and system |
| US12018857B2 (en) | 2008-06-13 | 2024-06-25 | Kateeva, Inc. | Gas enclosure assembly and system |
| US10224232B2 (en) | 2013-01-18 | 2019-03-05 | Persimmon Technologies Corporation | Robot having two arms with unequal link lengths |
| CN105164799B (zh) * | 2013-03-15 | 2020-04-07 | 应用材料公司 | 基板沉积系统、机械手移送设备及用于电子装置制造的方法 |
| KR102285254B1 (ko) | 2013-08-26 | 2021-08-03 | 브룩스 오토메이션 인코퍼레이티드 | 기판 이송 장치 |
| US10424498B2 (en) | 2013-09-09 | 2019-09-24 | Persimmon Technologies Corporation | Substrate transport vacuum platform |
| KR102161685B1 (ko) * | 2013-09-26 | 2020-10-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 프로세싱을 위한 혼합형-플랫폼 장치, 시스템들, 및 방법들 |
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| KR20230104993A (ko) | 2014-01-17 | 2023-07-11 | 브룩스 오토메이션 인코퍼레이티드 | 기판 이송 장치 |
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| WO2025054513A1 (en) * | 2023-09-08 | 2025-03-13 | Brooks Automation Us, Llc | Buffer for substrate transport apparatus and substrate transport apparatus including the buffer |
| WO2025054493A1 (en) * | 2023-09-08 | 2025-03-13 | Brooks Automation Us, Llc | Compartmental link substrate transport apparatus |
| CN117067189A (zh) * | 2023-09-27 | 2023-11-17 | 上海广川科技有限公司 | 一种手臂可升降的机械手 |
| CN119495630B (zh) * | 2025-01-17 | 2025-04-25 | 素珀电子科技(上海)有限公司 | 基板传送设备 |
| CN120199707B (zh) * | 2025-04-09 | 2025-11-18 | 长园半导体设备(珠海)有限公司 | Tcb工艺的z轴移载平台、位移装置及其键合设备 |
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- 2013-02-08 TW TW110109529A patent/TW202203356A/zh unknown
- 2013-02-08 TW TW107113574A patent/TWI725303B/zh active
- 2013-02-11 CN CN201380019263.0A patent/CN104349872B/zh active Active
- 2013-02-11 JP JP2014556771A patent/JP6843493B2/ja active Active
- 2013-02-11 KR KR1020167021551A patent/KR102096074B1/ko active Active
- 2013-02-11 WO PCT/US2013/025513 patent/WO2013120054A1/en not_active Ceased
- 2013-02-11 CN CN201710826869.5A patent/CN107598909B/zh active Active
- 2013-02-11 US US14/377,987 patent/US12142511B2/en active Active
- 2013-02-11 KR KR1020227003606A patent/KR102529273B1/ko active Active
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|---|---|
| US12142511B2 (en) | 2024-11-12 |
| TW202203356A (zh) | 2022-01-16 |
| CN107598909B (zh) | 2024-01-30 |
| KR20220019075A (ko) | 2022-02-15 |
| KR20160098524A (ko) | 2016-08-18 |
| US20160329234A1 (en) | 2016-11-10 |
| WO2013120054A1 (en) | 2013-08-15 |
| CN104349872B (zh) | 2017-10-13 |
| JP2015508236A (ja) | 2015-03-16 |
| CN104349872A (zh) | 2015-02-11 |
| TWI629743B (zh) | 2018-07-11 |
| KR102529273B1 (ko) | 2023-05-04 |
| TW201349376A (zh) | 2013-12-01 |
| JP2016219831A (ja) | 2016-12-22 |
| JP6325612B2 (ja) | 2018-05-16 |
| JP2023113831A (ja) | 2023-08-16 |
| TW201839895A (zh) | 2018-11-01 |
| CN107598909A (zh) | 2018-01-19 |
| JP7292249B2 (ja) | 2023-06-16 |
| TWI725303B (zh) | 2021-04-21 |
| JP2021010011A (ja) | 2021-01-28 |
| US20150013910A1 (en) | 2015-01-15 |
| KR102096074B1 (ko) | 2020-04-01 |
| US20250069939A1 (en) | 2025-02-27 |
| KR20230067705A (ko) | 2023-05-16 |
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