JP6843493B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

Info

Publication number
JP6843493B2
JP6843493B2 JP2014556771A JP2014556771A JP6843493B2 JP 6843493 B2 JP6843493 B2 JP 6843493B2 JP 2014556771 A JP2014556771 A JP 2014556771A JP 2014556771 A JP2014556771 A JP 2014556771A JP 6843493 B2 JP6843493 B2 JP 6843493B2
Authority
JP
Japan
Prior art keywords
arm
transfer
link
substrate
drive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014556771A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015508236A (ja
JP2015508236A5 (enExample
Inventor
クラピイシェフ、アリグザンダー
ギルクリスト、ユリシーズ
ティー キャベニー、ロバート
ティー キャベニー、ロバート
バッブス、ダニエル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azenta Inc
Original Assignee
Azenta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Azenta Inc filed Critical Azenta Inc
Publication of JP2015508236A publication Critical patent/JP2015508236A/ja
Publication of JP2015508236A5 publication Critical patent/JP2015508236A5/ja
Application granted granted Critical
Publication of JP6843493B2 publication Critical patent/JP6843493B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/904—Devices for picking-up and depositing articles or materials provided with rotary movements only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2014556771A 2012-02-10 2013-02-11 基板処理装置 Active JP6843493B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201261597507P 2012-02-10 2012-02-10
US61/597,507 2012-02-10
US201261660900P 2012-06-18 2012-06-18
US61/660,900 2012-06-18
US201261662690P 2012-06-21 2012-06-21
US61/662,690 2012-06-21
PCT/US2013/025513 WO2013120054A1 (en) 2012-02-10 2013-02-11 Substrate processing apparatus

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2016156373A Division JP6325612B2 (ja) 2012-02-10 2016-08-09 基板処理装置
JP2020156696A Division JP7292249B2 (ja) 2012-02-10 2020-09-17 基板処理装置

Publications (3)

Publication Number Publication Date
JP2015508236A JP2015508236A (ja) 2015-03-16
JP2015508236A5 JP2015508236A5 (enExample) 2016-03-31
JP6843493B2 true JP6843493B2 (ja) 2021-03-17

Family

ID=48948087

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2014556771A Active JP6843493B2 (ja) 2012-02-10 2013-02-11 基板処理装置
JP2016156373A Active JP6325612B2 (ja) 2012-02-10 2016-08-09 基板処理装置
JP2020156696A Active JP7292249B2 (ja) 2012-02-10 2020-09-17 基板処理装置
JP2023093353A Pending JP2023113831A (ja) 2012-02-10 2023-06-06 基板処理装置

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2016156373A Active JP6325612B2 (ja) 2012-02-10 2016-08-09 基板処理装置
JP2020156696A Active JP7292249B2 (ja) 2012-02-10 2020-09-17 基板処理装置
JP2023093353A Pending JP2023113831A (ja) 2012-02-10 2023-06-06 基板処理装置

Country Status (6)

Country Link
US (3) US12142511B2 (enExample)
JP (4) JP6843493B2 (enExample)
KR (3) KR102529273B1 (enExample)
CN (2) CN107598909B (enExample)
TW (3) TWI629743B (enExample)
WO (1) WO2013120054A1 (enExample)

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2701402A1 (en) * 2007-10-24 2009-04-30 Oc Oerlikon Balzers Ag Method for manufacturing workpieces and apparatus
US8383202B2 (en) 2008-06-13 2013-02-26 Kateeva, Inc. Method and apparatus for load-locked printing
US12018857B2 (en) 2008-06-13 2024-06-25 Kateeva, Inc. Gas enclosure assembly and system
US8899171B2 (en) 2008-06-13 2014-12-02 Kateeva, Inc. Gas enclosure assembly and system
US11975546B2 (en) 2008-06-13 2024-05-07 Kateeva, Inc. Gas enclosure assembly and system
US9048344B2 (en) 2008-06-13 2015-06-02 Kateeva, Inc. Gas enclosure assembly and system
US10434804B2 (en) 2008-06-13 2019-10-08 Kateeva, Inc. Low particle gas enclosure systems and methods
US12064979B2 (en) 2008-06-13 2024-08-20 Kateeva, Inc. Low-particle gas enclosure systems and methods
US10224232B2 (en) 2013-01-18 2019-03-05 Persimmon Technologies Corporation Robot having two arms with unequal link lengths
KR20210014778A (ko) * 2013-03-15 2021-02-09 어플라이드 머티어리얼스, 인코포레이티드 기판 증착 시스템, 로봇 이송 장치, 및 전자 디바이스 제조 방법
US11201073B2 (en) 2013-08-26 2021-12-14 Brooks Automation, Inc Substrate transport apparatus
US10424498B2 (en) 2013-09-09 2019-09-24 Persimmon Technologies Corporation Substrate transport vacuum platform
KR102161685B1 (ko) 2013-09-26 2020-10-05 어플라이드 머티어리얼스, 인코포레이티드 기판 프로세싱을 위한 혼합형-플랫폼 장치, 시스템들, 및 방법들
KR20210127823A (ko) * 2013-11-04 2021-10-22 어플라이드 머티어리얼스, 인코포레이티드 증가된 개수의 측들을 갖는 이송 챔버들, 반도체 디바이스 제조 프로세싱 툴들, 및 프로세싱 방법들
EP3787016B1 (en) 2013-12-26 2023-09-20 Kateeva, Inc. Apparatus and techniques for thermal treatment of electronic devices
US11273558B2 (en) 2014-01-17 2022-03-15 Brooks Automation Us, Llc Substrate transport apparatus
WO2015112454A1 (en) 2014-01-21 2015-07-30 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
KR102432133B1 (ko) 2014-01-21 2022-08-12 퍼시몬 테크놀로지스 코포레이션 기판 이송 진공 플랫폼
KR102059313B1 (ko) 2014-04-30 2019-12-24 카티바, 인크. 가스 쿠션 장비 및 기판 코팅 기술
CN105097623A (zh) * 2014-05-07 2015-11-25 盛美半导体设备（上海）有限公司 晶圆装载端口结构
JP6577965B2 (ja) * 2015-02-12 2019-09-18 株式会社Ｆｕｊｉ 部品供給装置、および保持具決定方法
US10131020B2 (en) * 2015-03-10 2018-11-20 James P. Sullivan Part orienter with removable rotating fixture
US9889567B2 (en) * 2015-04-24 2018-02-13 Applied Materials, Inc. Wafer swapper
KR102587203B1 (ko) * 2015-07-13 2023-10-10 브룩스 오토메이션 인코퍼레이티드 온 더 플라이 자동 웨이퍼 센터링 방법 및 장치
US10515834B2 (en) * 2015-10-12 2019-12-24 Lam Research Corporation Multi-station tool with wafer transfer microclimate systems
US20170125269A1 (en) * 2015-10-29 2017-05-04 Aixtron Se Transfer module for a multi-module apparatus
JP6700130B2 (ja) * 2016-07-12 2020-05-27 東京エレクトロン株式会社 接合システム
US11167434B2 (en) * 2016-08-30 2021-11-09 HighRes Biosolutions, Inc. Robotic processing system
US10159169B2 (en) * 2016-10-27 2018-12-18 Applied Materials, Inc. Flexible equipment front end module interfaces, environmentally-controlled equipment front end modules, and assembly methods
US10651067B2 (en) 2017-01-26 2020-05-12 Brooks Automation, Inc. Method and apparatus for substrate transport apparatus position compensation
WO2018152268A1 (en) * 2017-02-15 2018-08-23 Persimmon Technologies, Corp. Material-handling robot with multiple end-effectors
SG10202110040SA (en) 2017-03-15 2021-10-28 Lam Res Corp Reduced footprint platform architecture with linear vacuum transfer module
US10420109B2 (en) * 2017-04-13 2019-09-17 Futurewei Technologies, Inc. System and method for providing explicit feedback in communications systems with multi-point connectivity
JP6881010B2 (ja) * 2017-05-11 2021-06-02 東京エレクトロン株式会社 真空処理装置
US10861723B2 (en) * 2017-08-08 2020-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. EFEM robot auto teaching methodology
DE102018100003B4 (de) * 2017-08-08 2020-03-12 Taiwan Semiconductor Manufacturing Co., Ltd. Methodologie zum automatischen Anlernen eines EFEM-Roboters
US11020852B2 (en) * 2017-10-05 2021-06-01 Brooks Automation, Inc. Substrate transport apparatus with independent accessory feedthrough
US10155309B1 (en) * 2017-11-16 2018-12-18 Lam Research Corporation Wafer handling robots with rotational joint encoders
WO2019108376A1 (en) 2017-12-01 2019-06-06 Applied Materials, Inc. Highly etch selective amorphous carbon film
GB2570510A (en) * 2018-01-30 2019-07-31 Pragmatic Printing Ltd System and method for manufacturing plurality of integrated circuits
US11282737B2 (en) 2018-02-15 2022-03-22 Lam Research Corporation Moving substrate transfer chamber
US11574830B2 (en) * 2018-03-16 2023-02-07 Brooks Automation Us, Llc Substrate transport apparatus
US10943805B2 (en) 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
US11535460B2 (en) * 2018-05-31 2022-12-27 Brooks Automation Us, Llc Substrate processing apparatus
WO2019246122A1 (en) 2018-06-18 2019-12-26 Lam Research Corporation Reduced footprint wafer handling platform
CN112840447B (zh) * 2018-10-04 2025-11-21 应用材料公司 运输系统
US11850742B2 (en) * 2019-06-07 2023-12-26 Applied Materials, Inc. Dual robot including splayed end effectors and systems and methods including same
JP7620609B2 (ja) * 2019-07-12 2025-01-23 アプライド マテリアルズ インコーポレイテッド 同時基板移送用ロボット
JP7458718B2 (ja) * 2019-07-19 2024-04-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
WO2021028043A1 (en) * 2019-08-14 2021-02-18 Applied Materials, Inc. Path switch assembly, chamber and substrate processing system having the same, and methods therefor
US11569111B2 (en) * 2019-12-02 2023-01-31 Brooks Automation Us, Llc Substrate processing apparatus
US11049740B1 (en) 2019-12-05 2021-06-29 Applied Materials, Inc. Reconfigurable mainframe with replaceable interface plate
TWI894199B (zh) * 2020-02-05 2025-08-21 美商布魯克斯自動機械美國公司 基材處理設備及其使用方法
EP4102550A4 (en) * 2020-02-05 2023-02-01 Kabushiki Kaisha Yaskawa Denki TRANSPORT SYSTEM, TRANSPORT METHOD AND TRANSPORT DEVICE
CN115136295A (zh) * 2020-02-17 2022-09-30 捷普有限公司 用于为末端执行器提供自提取夹持的装置、系统和方法
CN115427198A (zh) 2020-02-27 2022-12-02 朗姆研究公司 具有径向气帘和/或内部容积控制的晶片搬运机械手
JP7511380B2 (ja) * 2020-05-01 2024-07-05 東京エレクトロン株式会社 処理システム
JP7759192B2 (ja) * 2020-05-12 2025-10-23 エーエスエム・アイピー・ホールディング・ベー・フェー 高スループットマルチチャンバ基材処理システム
US11521870B2 (en) 2020-07-08 2022-12-06 Applied Materials, Inc. Annealing chamber
WO2022051751A1 (en) * 2020-09-01 2022-03-10 Persimmon Technologies Corporation Material-handling robot with magnetically guided end-effectors
US11602064B2 (en) 2020-09-01 2023-03-07 Applied Materials, Inc. Dynamic electrical and fluid delivery system with indexing motion for batch processing chambers
KR20220042646A (ko) 2020-09-28 2022-04-05 현대중공업지주 주식회사 기판이송장치
US12076859B2 (en) * 2020-10-14 2024-09-03 Applied Materials, Inc. Infinite rotation of vacuum robot linkage through timing belt with isolated environment
KR20220053854A (ko) * 2020-10-23 2022-05-02 피코앤테라(주) 이에프이엠
TWI745266B (zh) * 2021-05-31 2021-11-01 博斯科技股份有限公司 反應爐冷卻系統及其方法
KR20230111438A (ko) 2022-01-18 2023-07-25 삼성전자주식회사 반도체 기판 처리 장치
CN119340236A (zh) * 2023-07-21 2025-01-21 北京北方华创微电子装备有限公司 半导体工艺腔室、半导体工艺设备和半导体工艺方法
KR102638655B1 (ko) * 2023-08-07 2024-02-20 에이피티씨 주식회사 멀티 층 efem을 포함하는 기판 이송 장치
CN116985159A (zh) * 2023-08-22 2023-11-03 上海广川科技有限公司 一种手臂可升降的机械手
WO2025054550A1 (en) * 2023-09-08 2025-03-13 Brooks Automation Us, Llc Substrate transport apparatus
WO2025054493A1 (en) * 2023-09-08 2025-03-13 Brooks Automation Us, Llc Compartmental link substrate transport apparatus
CN117067189A (zh) * 2023-09-27 2023-11-17 上海广川科技有限公司 一种手臂可升降的机械手
CN119495630B (zh) * 2025-01-17 2025-04-25 素珀电子科技(上海)有限公司 基板传送设备
CN120199707B (zh) * 2025-04-09 2025-11-18 长园半导体设备(珠海)有限公司 Tcb工艺的z轴移载平台、位移装置及其键合设备

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302671A (ja) * 1993-04-16 1994-10-28 Sony Corp 真空装置
JP2761438B2 (ja) * 1993-04-16 1998-06-04 ブルックス オートメーション インコーポレイテッド 搬送装置
US5765444A (en) * 1995-07-10 1998-06-16 Kensington Laboratories, Inc. Dual end effector, multiple link robot arm system with corner reacharound and extended reach capabilities
US5789890A (en) * 1996-03-22 1998-08-04 Genmark Automation Robot having multiple degrees of freedom
TW372926B (en) * 1996-04-04 1999-11-01 Applied Materials Inc Method and system of processing semiconductor workpieces and robot for use in said system
KR100265287B1 (ko) * 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
JPH11300663A (ja) * 1998-04-24 1999-11-02 Mecs Corp 薄型基板搬送装置
JPH11330199A (ja) * 1998-05-18 1999-11-30 Sony Corp 真空プロセス装置
JP2000072248A (ja) 1998-08-27 2000-03-07 Rorze Corp 基板搬送装置
US6256555B1 (en) 1998-12-02 2001-07-03 Newport Corporation Robot arm with specimen edge gripping end effector
US6485250B2 (en) * 1998-12-30 2002-11-26 Brooks Automation Inc. Substrate transport apparatus with multiple arms on a common axis of rotation
US6634851B1 (en) * 1999-01-15 2003-10-21 Asyst Technologies, Inc. Workpiece handling robot
JP2000308984A (ja) 1999-04-23 2000-11-07 Murata Mach Ltd スカラーアームとこれを用いた搬送装置
US6440261B1 (en) 1999-05-25 2002-08-27 Applied Materials, Inc. Dual buffer chamber cluster tool for semiconductor wafer processing
JP2001147910A (ja) * 1999-11-19 2001-05-29 Nec Soft Ltd 分散バッチジョブ処理継続方式およびその記録媒体
US6297611B1 (en) 2000-07-06 2001-10-02 Genmark Automation Robot having independent end effector linkage motion
US20020061248A1 (en) * 2000-07-07 2002-05-23 Applied Materials, Inc. High productivity semiconductor wafer processing system
JP2002158272A (ja) 2000-11-17 2002-05-31 Tatsumo Kk ダブルアーム基板搬送装置
JP2008034858A (ja) * 2001-05-21 2008-02-14 Tokyo Electron Ltd 処理装置
US6852194B2 (en) 2001-05-21 2005-02-08 Tokyo Electron Limited Processing apparatus, transferring apparatus and transferring method
TW550151B (en) * 2001-07-13 2003-09-01 Brooks Automation Inc Substrate transport apparatus with multiple independent end effectors
WO2003006216A1 (en) * 2001-07-13 2003-01-23 Brooks Automation, Inc. Substrate transport apparatus with multiple independent end effectors
JP3755744B2 (ja) * 2001-08-02 2006-03-15 株式会社安川電機 基板搬送用ロボット
JP2003117877A (ja) * 2001-10-17 2003-04-23 Japan Servo Co Ltd 多関節型の産業用ロボット
US7891935B2 (en) * 2002-05-09 2011-02-22 Brooks Automation, Inc. Dual arm robot
US7578649B2 (en) * 2002-05-29 2009-08-25 Brooks Automation, Inc. Dual arm substrate transport apparatus
JP4294984B2 (ja) * 2003-03-19 2009-07-15 東京エレクトロン株式会社 基板搬送装置及び基板処理装置
KR100583727B1 (ko) * 2004-01-07 2006-05-25 삼성전자주식회사 기판 제조 장치 및 이에 사용되는 기판 이송 모듈
JP2004207750A (ja) 2004-02-12 2004-07-22 Dainippon Screen Mfg Co Ltd 基板処理装置
US6987272B2 (en) 2004-03-05 2006-01-17 Axcelis Technologies, Inc. Work piece transfer system for an ion beam implanter
KR101398665B1 (ko) 2004-06-09 2014-05-26 브룩스 오토메이션 인코퍼레이티드 이중 스카라 아암
JP2006205264A (ja) 2005-01-25 2006-08-10 Jel:Kk 基板搬送装置
TWI318195B (en) * 2005-05-26 2009-12-11 Advanced Display Proc Eng Co System for manufacturing flat-panel display
JP4925650B2 (ja) 2005-11-28 2012-05-09 東京エレクトロン株式会社 基板処理装置
US8220354B2 (en) * 2006-06-28 2012-07-17 Genmark Automation, Inc. Belt-driven robot having extended Z-axis motion
KR20080004118A (ko) * 2006-07-04 2008-01-09 피에스케이 주식회사 기판 처리 설비
TWI398335B (zh) * 2006-11-27 2013-06-11 Nidec Sankyo Corp Workpiece conveying system
JP2008135630A (ja) * 2006-11-29 2008-06-12 Jel:Kk 基板搬送装置
US9105673B2 (en) * 2007-05-09 2015-08-11 Brooks Automation, Inc. Side opening unified pod
KR100850436B1 (ko) * 2007-06-20 2008-08-05 주식회사 싸이맥스 반도체 제조설비
KR100957225B1 (ko) 2007-11-07 2010-05-11 세메스 주식회사 기판 처리 장치 및 방법
JP4746027B2 (ja) * 2007-12-10 2011-08-10 川崎重工業株式会社 基板搬送方法
JP5294681B2 (ja) * 2008-04-28 2013-09-18 東京エレクトロン株式会社 基板処理装置及びその基板搬送方法
JP5139253B2 (ja) 2008-12-18 2013-02-06 東京エレクトロン株式会社 真空処理装置及び真空搬送装置
WO2010080983A2 (en) * 2009-01-11 2010-07-15 Applied Materials, Inc. Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing
KR101689550B1 (ko) * 2009-01-11 2016-12-26 어플라이드 머티어리얼스, 인코포레이티드 기판들을 운반하기 위한 정전기 엔드 이펙터 장치, 시스템들 및 방법들
JP2011020188A (ja) 2009-07-14 2011-02-03 Seiko Epson Corp ロボット装置およびロボット装置の制御方法
JP5373517B2 (ja) * 2009-09-14 2013-12-18 株式会社ディスコ 搬送機構および加工装置
JP2011077399A (ja) 2009-09-30 2011-04-14 Tokyo Electron Ltd 被処理体の搬送方法及び被処理体処理装置
US8459922B2 (en) * 2009-11-13 2013-06-11 Brooks Automation, Inc. Manipulator auto-teach and position correction system
JP2011119556A (ja) * 2009-12-07 2011-06-16 Yaskawa Electric Corp 水平多関節ロボットおよびそれを備えた搬送装置
JP5462064B2 (ja) 2010-04-28 2014-04-02 日本電産サンキョー株式会社 産業用ロボット
JP5755844B2 (ja) * 2010-05-31 2015-07-29 株式会社ダイヘン ワーク搬送システム
US9076829B2 (en) * 2011-08-08 2015-07-07 Applied Materials, Inc. Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing
KR20230084597A (ko) 2011-09-16 2023-06-13 퍼시몬 테크놀로지스 코포레이션 운송 장치 및 이를 포함하는 처리 장치

Also Published As

Publication number Publication date
JP2021010011A (ja) 2021-01-28
CN107598909A (zh) 2018-01-19
TWI629743B (zh) 2018-07-11
KR20220019075A (ko) 2022-02-15
KR20160098524A (ko) 2016-08-18
KR102096074B1 (ko) 2020-04-01
JP2016219831A (ja) 2016-12-22
TW202203356A (zh) 2022-01-16
KR20230067705A (ko) 2023-05-16
TWI725303B (zh) 2021-04-21
CN104349872B (zh) 2017-10-13
WO2013120054A1 (en) 2013-08-15
CN104349872A (zh) 2015-02-11
JP6325612B2 (ja) 2018-05-16
JP2015508236A (ja) 2015-03-16
TW201839895A (zh) 2018-11-01
JP2023113831A (ja) 2023-08-16
US20250069939A1 (en) 2025-02-27
US20150013910A1 (en) 2015-01-15
US20160329234A1 (en) 2016-11-10
KR102529273B1 (ko) 2023-05-04
US12142511B2 (en) 2024-11-12
CN107598909B (zh) 2024-01-30
JP7292249B2 (ja) 2023-06-16
TW201349376A (zh) 2013-12-01

Similar Documents

Publication Publication Date Title
JP6843493B2 (ja) 基板処理装置
KR102359364B1 (ko) 기판 프로세싱 장치
JP6898403B2 (ja) 基板搬送システム、基板処理装置、及び基板搬送方法
US10777438B2 (en) Processing apparatus
TWI458612B (zh) 可作ｚ軸運動並具多關節手臂之線性真空機械手
CN101048861A (zh) 基于升降机的工具装载和缓冲系统
CN107112264A (zh) 晶片对准器
US9669552B2 (en) System and method for quick-swap of multiple substrates
US11535460B2 (en) Substrate processing apparatus
TW202524629A (zh) 用於基板傳送設備的緩衝器、和包括緩衝器的基板傳送設備
TW202445731A (zh) 基板處理設備與裝卸基板的方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20141010

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20141222

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160204

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160204

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170113

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170117

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20170406

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20170608

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170714

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171003

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171012

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180109

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20180314

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180709

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20180731

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181130

C60 Trial request (containing other claim documents, opposition documents)

Free format text: JAPANESE INTERMEDIATE CODE: C60

Effective date: 20181130

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20181210

C21 Notice of transfer of a case for reconsideration by examiners before appeal proceedings

Free format text: JAPANESE INTERMEDIATE CODE: C21

Effective date: 20181211

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20190208

C211 Notice of termination of reconsideration by examiners before appeal proceedings

Free format text: JAPANESE INTERMEDIATE CODE: C211

Effective date: 20190219

C22 Notice of designation (change) of administrative judge

Free format text: JAPANESE INTERMEDIATE CODE: C22

Effective date: 20190416

C22 Notice of designation (change) of administrative judge

Free format text: JAPANESE INTERMEDIATE CODE: C22

Effective date: 20190709

C22 Notice of designation (change) of administrative judge

Free format text: JAPANESE INTERMEDIATE CODE: C22

Effective date: 20191015

C22 Notice of designation (change) of administrative judge

Free format text: JAPANESE INTERMEDIATE CODE: C22

Effective date: 20200114

C13 Notice of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: C13

Effective date: 20200317

C22 Notice of designation (change) of administrative judge

Free format text: JAPANESE INTERMEDIATE CODE: C22

Effective date: 20200414

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20200616

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200917

C22 Notice of designation (change) of administrative judge

Free format text: JAPANESE INTERMEDIATE CODE: C22

Effective date: 20201006

C23 Notice of termination of proceedings

Free format text: JAPANESE INTERMEDIATE CODE: C23

Effective date: 20201215

C03 Trial/appeal decision taken

Free format text: JAPANESE INTERMEDIATE CODE: C03

Effective date: 20210126

C30A Notification sent

Free format text: JAPANESE INTERMEDIATE CODE: C3012

Effective date: 20210126

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210224

R150 Certificate of patent or registration of utility model

Ref document number: 6843493

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250