KR102096074B1 - 기판 프로세싱 장치 - Google Patents
기판 프로세싱 장치 Download PDFInfo
- Publication number
- KR102096074B1 KR102096074B1 KR1020167021551A KR20167021551A KR102096074B1 KR 102096074 B1 KR102096074 B1 KR 102096074B1 KR 1020167021551 A KR1020167021551 A KR 1020167021551A KR 20167021551 A KR20167021551 A KR 20167021551A KR 102096074 B1 KR102096074 B1 KR 102096074B1
- Authority
- KR
- South Korea
- Prior art keywords
- transfer
- arm
- substrate
- transport
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/904—Devices for picking-up and depositing articles or materials provided with rotary movements only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261597507P | 2012-02-10 | 2012-02-10 | |
| US61/597,507 | 2012-02-10 | ||
| US201261660900P | 2012-06-18 | 2012-06-18 | |
| US61/660,900 | 2012-06-18 | ||
| US201261662690P | 2012-06-21 | 2012-06-21 | |
| US61/662,690 | 2012-06-21 | ||
| PCT/US2013/025513 WO2013120054A1 (en) | 2012-02-10 | 2013-02-11 | Substrate processing apparatus |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020147024510A Division KR102359364B1 (ko) | 2012-02-10 | 2013-02-11 | 기판 프로세싱 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160098524A KR20160098524A (ko) | 2016-08-18 |
| KR102096074B1 true KR102096074B1 (ko) | 2020-04-01 |
Family
ID=48948087
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227003606A Active KR102529273B1 (ko) | 2012-02-10 | 2013-02-11 | 기판 프로세싱 장치 |
| KR1020167021551A Active KR102096074B1 (ko) | 2012-02-10 | 2013-02-11 | 기판 프로세싱 장치 |
| KR1020237014866A Pending KR20230067705A (ko) | 2012-02-10 | 2013-02-11 | 기판 프로세싱 장치 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227003606A Active KR102529273B1 (ko) | 2012-02-10 | 2013-02-11 | 기판 프로세싱 장치 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237014866A Pending KR20230067705A (ko) | 2012-02-10 | 2013-02-11 | 기판 프로세싱 장치 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US12142511B2 (enExample) |
| JP (4) | JP6843493B2 (enExample) |
| KR (3) | KR102529273B1 (enExample) |
| CN (2) | CN104349872B (enExample) |
| TW (3) | TWI629743B (enExample) |
| WO (1) | WO2013120054A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220042646A (ko) | 2020-09-28 | 2022-04-05 | 현대중공업지주 주식회사 | 기판이송장치 |
Families Citing this family (74)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101835922B (zh) * | 2007-10-24 | 2012-05-02 | Oc欧瑞康巴尔斯公司 | 用于制造工件的方法和装置 |
| US12064979B2 (en) | 2008-06-13 | 2024-08-20 | Kateeva, Inc. | Low-particle gas enclosure systems and methods |
| US10434804B2 (en) | 2008-06-13 | 2019-10-08 | Kateeva, Inc. | Low particle gas enclosure systems and methods |
| US9048344B2 (en) | 2008-06-13 | 2015-06-02 | Kateeva, Inc. | Gas enclosure assembly and system |
| US8899171B2 (en) | 2008-06-13 | 2014-12-02 | Kateeva, Inc. | Gas enclosure assembly and system |
| US11975546B2 (en) | 2008-06-13 | 2024-05-07 | Kateeva, Inc. | Gas enclosure assembly and system |
| US8383202B2 (en) | 2008-06-13 | 2013-02-26 | Kateeva, Inc. | Method and apparatus for load-locked printing |
| US12018857B2 (en) | 2008-06-13 | 2024-06-25 | Kateeva, Inc. | Gas enclosure assembly and system |
| US10224232B2 (en) | 2013-01-18 | 2019-03-05 | Persimmon Technologies Corporation | Robot having two arms with unequal link lengths |
| KR102214394B1 (ko) * | 2013-03-15 | 2021-02-08 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 증착 시스템, 로봇 이송 장치, 및 전자 디바이스 제조 방법 |
| WO2015031380A1 (en) | 2013-08-26 | 2015-03-05 | Brooks Automation, Inc. | Substrate transport apparatus |
| US10424498B2 (en) | 2013-09-09 | 2019-09-24 | Persimmon Technologies Corporation | Substrate transport vacuum platform |
| KR102161685B1 (ko) | 2013-09-26 | 2020-10-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 프로세싱을 위한 혼합형-플랫폼 장치, 시스템들, 및 방법들 |
| TWI699850B (zh) * | 2013-11-04 | 2020-07-21 | 美商應用材料股份有限公司 | 半導體裝置處理工具及用於該半導體裝置處理工具的介面單元 |
| CN105900258A (zh) | 2013-12-26 | 2016-08-24 | 科迪华公司 | 电子装置的热加工 |
| CN113270350A (zh) * | 2014-01-17 | 2021-08-17 | 布鲁克斯自动化公司 | 衬底运输设备 |
| KR102371308B1 (ko) | 2014-01-21 | 2022-03-07 | 퍼시몬 테크놀로지스 코포레이션 | 기판 이송 진공 플랫폼 |
| CN107611287A (zh) | 2014-01-21 | 2018-01-19 | 科迪华公司 | 用于电子装置封装的设备和技术 |
| US9586226B2 (en) | 2014-04-30 | 2017-03-07 | Kateeva, Inc. | Gas cushion apparatus and techniques for substrate coating |
| CN105097623A (zh) * | 2014-05-07 | 2015-11-25 | 盛美半导体设备(上海)有限公司 | 晶圆装载端口结构 |
| CN107251673B (zh) * | 2015-02-12 | 2019-10-22 | 株式会社富士 | 元件供给装置 |
| US10131020B2 (en) * | 2015-03-10 | 2018-11-20 | James P. Sullivan | Part orienter with removable rotating fixture |
| US9889567B2 (en) * | 2015-04-24 | 2018-02-13 | Applied Materials, Inc. | Wafer swapper |
| KR102837080B1 (ko) * | 2015-07-13 | 2025-07-23 | 브룩스 오토메이션 인코퍼레이티드 | 온 더 플라이 자동 웨이퍼 센터링 방법 및 장치 |
| US10515834B2 (en) * | 2015-10-12 | 2019-12-24 | Lam Research Corporation | Multi-station tool with wafer transfer microclimate systems |
| US20170125269A1 (en) * | 2015-10-29 | 2017-05-04 | Aixtron Se | Transfer module for a multi-module apparatus |
| JP6700130B2 (ja) * | 2016-07-12 | 2020-05-27 | 東京エレクトロン株式会社 | 接合システム |
| US11167434B2 (en) * | 2016-08-30 | 2021-11-09 | HighRes Biosolutions, Inc. | Robotic processing system |
| US10159169B2 (en) * | 2016-10-27 | 2018-12-18 | Applied Materials, Inc. | Flexible equipment front end module interfaces, environmentally-controlled equipment front end modules, and assembly methods |
| US10651067B2 (en) * | 2017-01-26 | 2020-05-12 | Brooks Automation, Inc. | Method and apparatus for substrate transport apparatus position compensation |
| KR102373081B1 (ko) * | 2017-02-15 | 2022-03-11 | 퍼시몬 테크놀로지스 코포레이션 | 다수의 엔드-이펙터들을 가진 재료-핸들링 로봇 |
| KR102577199B1 (ko) | 2017-03-15 | 2023-09-08 | 램 리써치 코포레이션 | 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture) |
| US10420109B2 (en) * | 2017-04-13 | 2019-09-17 | Futurewei Technologies, Inc. | System and method for providing explicit feedback in communications systems with multi-point connectivity |
| JP6881010B2 (ja) * | 2017-05-11 | 2021-06-02 | 東京エレクトロン株式会社 | 真空処理装置 |
| DE102018100003B4 (de) * | 2017-08-08 | 2020-03-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Methodologie zum automatischen Anlernen eines EFEM-Roboters |
| US10861723B2 (en) * | 2017-08-08 | 2020-12-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | EFEM robot auto teaching methodology |
| US11020852B2 (en) * | 2017-10-05 | 2021-06-01 | Brooks Automation, Inc. | Substrate transport apparatus with independent accessory feedthrough |
| US10155309B1 (en) * | 2017-11-16 | 2018-12-18 | Lam Research Corporation | Wafer handling robots with rotational joint encoders |
| SG11202005150YA (en) | 2017-12-01 | 2020-06-29 | Applied Materials Inc | Highly etch selective amorphous carbon film |
| GB2570510A (en) * | 2018-01-30 | 2019-07-31 | Pragmatic Printing Ltd | System and method for manufacturing plurality of integrated circuits |
| JP7344887B2 (ja) | 2018-02-15 | 2023-09-14 | ラム リサーチ コーポレーション | 移動式基板搬送チャンバ |
| TW202401627A (zh) * | 2018-03-16 | 2024-01-01 | 美商布魯克斯自動機械美國公司 | 基板輸送裝置及用於基板輸送裝置之方法 |
| US10943805B2 (en) | 2018-05-18 | 2021-03-09 | Applied Materials, Inc. | Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing |
| US11535460B2 (en) * | 2018-05-31 | 2022-12-27 | Brooks Automation Us, Llc | Substrate processing apparatus |
| TWI828710B (zh) * | 2018-06-18 | 2024-01-11 | 美商蘭姆研究公司 | 基板處理系統及基板處理方法 |
| KR102531483B1 (ko) * | 2018-10-04 | 2023-05-10 | 어플라이드 머티어리얼스, 인코포레이티드 | 이송 시스템 |
| US11850742B2 (en) * | 2019-06-07 | 2023-12-26 | Applied Materials, Inc. | Dual robot including splayed end effectors and systems and methods including same |
| JP7620609B2 (ja) * | 2019-07-12 | 2025-01-23 | アプライド マテリアルズ インコーポレイテッド | 同時基板移送用ロボット |
| JP7458718B2 (ja) * | 2019-07-19 | 2024-04-01 | 株式会社Screenホールディングス | 基板処理装置および基板搬送方法 |
| CN114258584B (zh) * | 2019-08-14 | 2025-05-02 | 应用材料公司 | 路径切换组件、具有该路径切换组件的腔室和基板处理系统及其方法 |
| US11569111B2 (en) * | 2019-12-02 | 2023-01-31 | Brooks Automation Us, Llc | Substrate processing apparatus |
| US11049740B1 (en) | 2019-12-05 | 2021-06-29 | Applied Materials, Inc. | Reconfigurable mainframe with replaceable interface plate |
| EP4102550A4 (en) * | 2020-02-05 | 2023-02-01 | Kabushiki Kaisha Yaskawa Denki | TRANSPORT SYSTEM, TRANSPORT METHOD AND TRANSPORT DEVICE |
| TWI894199B (zh) * | 2020-02-05 | 2025-08-21 | 美商布魯克斯自動機械美國公司 | 基材處理設備及其使用方法 |
| US20230139939A1 (en) * | 2020-02-17 | 2023-05-04 | Jabil Inc. | Apparatus, system and method for providing self extracting grips for an end effector |
| KR20220146594A (ko) | 2020-02-27 | 2022-11-01 | 램 리써치 코포레이션 | 방사상 가스 커튼 및/또는 내부 볼륨 제어를 갖는 웨이퍼 핸들링 로봇 |
| JP7511380B2 (ja) | 2020-05-01 | 2024-07-05 | 東京エレクトロン株式会社 | 処理システム |
| TWI867219B (zh) * | 2020-05-12 | 2024-12-21 | 荷蘭商Asm Ip私人控股有限公司 | 半導體處理系統 |
| US11521870B2 (en) | 2020-07-08 | 2022-12-06 | Applied Materials, Inc. | Annealing chamber |
| US11602064B2 (en) | 2020-09-01 | 2023-03-07 | Applied Materials, Inc. | Dynamic electrical and fluid delivery system with indexing motion for batch processing chambers |
| KR20230078686A (ko) * | 2020-09-01 | 2023-06-02 | 퍼시몬 테크놀로지스 코포레이션 | 자기적으로 안내되는 엔드-이펙터들을 가지는 재료-핸들링 로봇 |
| US12076859B2 (en) * | 2020-10-14 | 2024-09-03 | Applied Materials, Inc. | Infinite rotation of vacuum robot linkage through timing belt with isolated environment |
| KR20220053854A (ko) * | 2020-10-23 | 2022-05-02 | 피코앤테라(주) | 이에프이엠 |
| TWI745266B (zh) * | 2021-05-31 | 2021-11-01 | 博斯科技股份有限公司 | 反應爐冷卻系統及其方法 |
| US20230008072A1 (en) * | 2021-07-08 | 2023-01-12 | Applied Materials, Inc. | Method and mechanism for contact-free process chamber characterization |
| KR20230111438A (ko) | 2022-01-18 | 2023-07-25 | 삼성전자주식회사 | 반도체 기판 처리 장치 |
| CN119340236A (zh) * | 2023-07-21 | 2025-01-21 | 北京北方华创微电子装备有限公司 | 半导体工艺腔室、半导体工艺设备和半导体工艺方法 |
| KR102638655B1 (ko) * | 2023-08-07 | 2024-02-20 | 에이피티씨 주식회사 | 멀티 층 efem을 포함하는 기판 이송 장치 |
| CN116985159A (zh) * | 2023-08-22 | 2023-11-03 | 上海广川科技有限公司 | 一种手臂可升降的机械手 |
| WO2025054550A1 (en) * | 2023-09-08 | 2025-03-13 | Brooks Automation Us, Llc | Substrate transport apparatus |
| WO2025054493A1 (en) * | 2023-09-08 | 2025-03-13 | Brooks Automation Us, Llc | Compartmental link substrate transport apparatus |
| CN117067189A (zh) * | 2023-09-27 | 2023-11-17 | 上海广川科技有限公司 | 一种手臂可升降的机械手 |
| CN119495630B (zh) * | 2025-01-17 | 2025-04-25 | 素珀电子科技(上海)有限公司 | 基板传送设备 |
| CN120199707B (zh) * | 2025-04-09 | 2025-11-18 | 长园半导体设备(珠海)有限公司 | Tcb工艺的z轴移载平台、位移装置及其键合设备 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030223853A1 (en) * | 2002-05-29 | 2003-12-04 | Caveney Robert T. | Dual arm substrate transport apparatus |
| JP2008016815A (ja) * | 2006-07-04 | 2008-01-24 | Psk Inc | 基板搬送装置及びこの基板搬送装置を用いた基板処理設備 |
| JP2008135630A (ja) | 2006-11-29 | 2008-06-12 | Jel:Kk | 基板搬送装置 |
| JP2011230256A (ja) | 2010-04-28 | 2011-11-17 | Nidec Sankyo Corp | 産業用ロボット |
Family Cites Families (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69415517T3 (de) * | 1993-04-16 | 2005-03-17 | Brooks Automation, Inc., Lowell | Handhabungseinrichtung mit gelenkarm |
| JPH06302671A (ja) * | 1993-04-16 | 1994-10-28 | Sony Corp | 真空装置 |
| US5765444A (en) * | 1995-07-10 | 1998-06-16 | Kensington Laboratories, Inc. | Dual end effector, multiple link robot arm system with corner reacharound and extended reach capabilities |
| US5789890A (en) * | 1996-03-22 | 1998-08-04 | Genmark Automation | Robot having multiple degrees of freedom |
| TW372926B (en) * | 1996-04-04 | 1999-11-01 | Applied Materials Inc | Method and system of processing semiconductor workpieces and robot for use in said system |
| KR100265287B1 (ko) * | 1998-04-21 | 2000-10-02 | 윤종용 | 반도체소자 제조용 식각설비의 멀티챔버 시스템 |
| JPH11300663A (ja) | 1998-04-24 | 1999-11-02 | Mecs Corp | 薄型基板搬送装置 |
| JPH11330199A (ja) * | 1998-05-18 | 1999-11-30 | Sony Corp | 真空プロセス装置 |
| JP2000072248A (ja) | 1998-08-27 | 2000-03-07 | Rorze Corp | 基板搬送装置 |
| US6256555B1 (en) | 1998-12-02 | 2001-07-03 | Newport Corporation | Robot arm with specimen edge gripping end effector |
| US6485250B2 (en) | 1998-12-30 | 2002-11-26 | Brooks Automation Inc. | Substrate transport apparatus with multiple arms on a common axis of rotation |
| WO2000041855A1 (en) * | 1999-01-15 | 2000-07-20 | Asyst Technologies, Inc. | Workpiece handling robot |
| JP2000308984A (ja) | 1999-04-23 | 2000-11-07 | Murata Mach Ltd | スカラーアームとこれを用いた搬送装置 |
| US6440261B1 (en) | 1999-05-25 | 2002-08-27 | Applied Materials, Inc. | Dual buffer chamber cluster tool for semiconductor wafer processing |
| JP2001147910A (ja) * | 1999-11-19 | 2001-05-29 | Nec Soft Ltd | 分散バッチジョブ処理継続方式およびその記録媒体 |
| US6297611B1 (en) | 2000-07-06 | 2001-10-02 | Genmark Automation | Robot having independent end effector linkage motion |
| US20020061248A1 (en) | 2000-07-07 | 2002-05-23 | Applied Materials, Inc. | High productivity semiconductor wafer processing system |
| JP2002158272A (ja) | 2000-11-17 | 2002-05-31 | Tatsumo Kk | ダブルアーム基板搬送装置 |
| JP2008034858A (ja) * | 2001-05-21 | 2008-02-14 | Tokyo Electron Ltd | 処理装置 |
| US6852194B2 (en) | 2001-05-21 | 2005-02-08 | Tokyo Electron Limited | Processing apparatus, transferring apparatus and transferring method |
| TW550151B (en) * | 2001-07-13 | 2003-09-01 | Brooks Automation Inc | Substrate transport apparatus with multiple independent end effectors |
| WO2003006216A1 (en) * | 2001-07-13 | 2003-01-23 | Brooks Automation, Inc. | Substrate transport apparatus with multiple independent end effectors |
| JP3755744B2 (ja) * | 2001-08-02 | 2006-03-15 | 株式会社安川電機 | 基板搬送用ロボット |
| JP2003117877A (ja) * | 2001-10-17 | 2003-04-23 | Japan Servo Co Ltd | 多関節型の産業用ロボット |
| US7891935B2 (en) * | 2002-05-09 | 2011-02-22 | Brooks Automation, Inc. | Dual arm robot |
| JP4294984B2 (ja) | 2003-03-19 | 2009-07-15 | 東京エレクトロン株式会社 | 基板搬送装置及び基板処理装置 |
| KR100583727B1 (ko) * | 2004-01-07 | 2006-05-25 | 삼성전자주식회사 | 기판 제조 장치 및 이에 사용되는 기판 이송 모듈 |
| JP2004207750A (ja) | 2004-02-12 | 2004-07-22 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| US6987272B2 (en) | 2004-03-05 | 2006-01-17 | Axcelis Technologies, Inc. | Work piece transfer system for an ion beam implanter |
| WO2005123565A2 (en) | 2004-06-09 | 2005-12-29 | Brooks Automation, Inc. | Dual sacra arm |
| JP2006205264A (ja) | 2005-01-25 | 2006-08-10 | Jel:Kk | 基板搬送装置 |
| TWI318195B (en) * | 2005-05-26 | 2009-12-11 | Advanced Display Proc Eng Co | System for manufacturing flat-panel display |
| JP4925650B2 (ja) | 2005-11-28 | 2012-05-09 | 東京エレクトロン株式会社 | 基板処理装置 |
| US8220354B2 (en) | 2006-06-28 | 2012-07-17 | Genmark Automation, Inc. | Belt-driven robot having extended Z-axis motion |
| TWI398335B (zh) | 2006-11-27 | 2013-06-11 | Nidec Sankyo Corp | Workpiece conveying system |
| TWI475627B (zh) * | 2007-05-17 | 2015-03-01 | Brooks Automation Inc | 基板運送機、基板處理裝置和系統、於基板處理期間降低基板之微粒污染的方法,及使運送機與處理機結合之方法 |
| KR100850436B1 (ko) | 2007-06-20 | 2008-08-05 | 주식회사 싸이맥스 | 반도체 제조설비 |
| KR100957225B1 (ko) | 2007-11-07 | 2010-05-11 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
| JP4746027B2 (ja) * | 2007-12-10 | 2011-08-10 | 川崎重工業株式会社 | 基板搬送方法 |
| JP5294681B2 (ja) * | 2008-04-28 | 2013-09-18 | 東京エレクトロン株式会社 | 基板処理装置及びその基板搬送方法 |
| JP5139253B2 (ja) | 2008-12-18 | 2013-02-06 | 東京エレクトロン株式会社 | 真空処理装置及び真空搬送装置 |
| CN102349145B (zh) * | 2009-01-11 | 2015-05-27 | 应用材料公司 | 用于传送基板的静电末端执行器设备、系统和方法 |
| WO2010080983A2 (en) * | 2009-01-11 | 2010-07-15 | Applied Materials, Inc. | Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing |
| JP2011020188A (ja) | 2009-07-14 | 2011-02-03 | Seiko Epson Corp | ロボット装置およびロボット装置の制御方法 |
| JP5373517B2 (ja) * | 2009-09-14 | 2013-12-18 | 株式会社ディスコ | 搬送機構および加工装置 |
| JP2011077399A (ja) | 2009-09-30 | 2011-04-14 | Tokyo Electron Ltd | 被処理体の搬送方法及び被処理体処理装置 |
| US8459922B2 (en) * | 2009-11-13 | 2013-06-11 | Brooks Automation, Inc. | Manipulator auto-teach and position correction system |
| JP2011119556A (ja) * | 2009-12-07 | 2011-06-16 | Yaskawa Electric Corp | 水平多関節ロボットおよびそれを備えた搬送装置 |
| JP5755844B2 (ja) * | 2010-05-31 | 2015-07-29 | 株式会社ダイヘン | ワーク搬送システム |
| US9076829B2 (en) * | 2011-08-08 | 2015-07-07 | Applied Materials, Inc. | Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing |
| US10569430B2 (en) | 2011-09-16 | 2020-02-25 | Persimmon Technologies Corporation | Low variability robot |
-
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- 2013-02-08 TW TW102105348A patent/TWI629743B/zh active
- 2013-02-08 TW TW107113574A patent/TWI725303B/zh active
- 2013-02-08 TW TW110109529A patent/TW202203356A/zh unknown
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- 2024-11-12 US US18/945,026 patent/US20250069939A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030223853A1 (en) * | 2002-05-29 | 2003-12-04 | Caveney Robert T. | Dual arm substrate transport apparatus |
| JP2008016815A (ja) * | 2006-07-04 | 2008-01-24 | Psk Inc | 基板搬送装置及びこの基板搬送装置を用いた基板処理設備 |
| JP2008135630A (ja) | 2006-11-29 | 2008-06-12 | Jel:Kk | 基板搬送装置 |
| JP2011230256A (ja) | 2010-04-28 | 2011-11-17 | Nidec Sankyo Corp | 産業用ロボット |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220042646A (ko) | 2020-09-28 | 2022-04-05 | 현대중공업지주 주식회사 | 기판이송장치 |
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| CN107598909B (zh) | 2024-01-30 |
| CN104349872B (zh) | 2017-10-13 |
| KR20220019075A (ko) | 2022-02-15 |
| TW201839895A (zh) | 2018-11-01 |
| KR102529273B1 (ko) | 2023-05-04 |
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| US20250069939A1 (en) | 2025-02-27 |
| JP2015508236A (ja) | 2015-03-16 |
| JP2016219831A (ja) | 2016-12-22 |
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| KR20230067705A (ko) | 2023-05-16 |
| JP6325612B2 (ja) | 2018-05-16 |
| JP7292249B2 (ja) | 2023-06-16 |
| JP2021010011A (ja) | 2021-01-28 |
| WO2013120054A1 (en) | 2013-08-15 |
| KR20160098524A (ko) | 2016-08-18 |
| JP2023113831A (ja) | 2023-08-16 |
| TWI725303B (zh) | 2021-04-21 |
| TW201349376A (zh) | 2013-12-01 |
| CN107598909A (zh) | 2018-01-19 |
| US20160329234A1 (en) | 2016-11-10 |
| US20150013910A1 (en) | 2015-01-15 |
| US12142511B2 (en) | 2024-11-12 |
| JP6843493B2 (ja) | 2021-03-17 |
| CN104349872A (zh) | 2015-02-11 |
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