TWI629743B - 基材處理設備 - Google Patents

基材處理設備 Download PDF

Info

Publication number
TWI629743B
TWI629743B TW102105348A TW102105348A TWI629743B TW I629743 B TWI629743 B TW I629743B TW 102105348 A TW102105348 A TW 102105348A TW 102105348 A TW102105348 A TW 102105348A TW I629743 B TWI629743 B TW I629743B
Authority
TW
Taiwan
Prior art keywords
transfer
arm
substrate
module
substrate processing
Prior art date
Application number
TW102105348A
Other languages
English (en)
Chinese (zh)
Other versions
TW201349376A (zh
Inventor
亞力山大 庫魯比雪夫
亞瑟 吉爾克萊史特
羅勃 卡維尼
丹尼爾 巴比斯
Original Assignee
布魯克斯自動機械公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 布魯克斯自動機械公司 filed Critical 布魯克斯自動機械公司
Publication of TW201349376A publication Critical patent/TW201349376A/zh
Application granted granted Critical
Publication of TWI629743B publication Critical patent/TWI629743B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/904—Devices for picking-up and depositing articles or materials provided with rotary movements only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW102105348A 2012-02-10 2013-02-08 基材處理設備 TWI629743B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201261597507P 2012-02-10 2012-02-10
US61/597,507 2012-02-10
US201261660900P 2012-06-18 2012-06-18
US61/660,900 2012-06-18
US201261662690P 2012-06-21 2012-06-21
US61/662,690 2012-06-21

Publications (2)

Publication Number Publication Date
TW201349376A TW201349376A (zh) 2013-12-01
TWI629743B true TWI629743B (zh) 2018-07-11

Family

ID=48948087

Family Applications (3)

Application Number Title Priority Date Filing Date
TW102105348A TWI629743B (zh) 2012-02-10 2013-02-08 基材處理設備
TW110109529A TW202203356A (zh) 2012-02-10 2013-02-08 基材處理設備
TW107113574A TWI725303B (zh) 2012-02-10 2013-02-08 基材處理設備

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW110109529A TW202203356A (zh) 2012-02-10 2013-02-08 基材處理設備
TW107113574A TWI725303B (zh) 2012-02-10 2013-02-08 基材處理設備

Country Status (6)

Country Link
US (3) US12142511B2 (enExample)
JP (4) JP6843493B2 (enExample)
KR (3) KR102096074B1 (enExample)
CN (2) CN104349872B (enExample)
TW (3) TWI629743B (enExample)
WO (1) WO2013120054A1 (enExample)

Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2701402A1 (en) * 2007-10-24 2009-04-30 Oc Oerlikon Balzers Ag Method for manufacturing workpieces and apparatus
US8383202B2 (en) 2008-06-13 2013-02-26 Kateeva, Inc. Method and apparatus for load-locked printing
US9048344B2 (en) 2008-06-13 2015-06-02 Kateeva, Inc. Gas enclosure assembly and system
US12064979B2 (en) 2008-06-13 2024-08-20 Kateeva, Inc. Low-particle gas enclosure systems and methods
US8899171B2 (en) 2008-06-13 2014-12-02 Kateeva, Inc. Gas enclosure assembly and system
US10434804B2 (en) 2008-06-13 2019-10-08 Kateeva, Inc. Low particle gas enclosure systems and methods
US11975546B2 (en) 2008-06-13 2024-05-07 Kateeva, Inc. Gas enclosure assembly and system
US12018857B2 (en) 2008-06-13 2024-06-25 Kateeva, Inc. Gas enclosure assembly and system
US10224232B2 (en) 2013-01-18 2019-03-05 Persimmon Technologies Corporation Robot having two arms with unequal link lengths
CN105164799B (zh) * 2013-03-15 2020-04-07 应用材料公司 基板沉积系统、机械手移送设备及用于电子装置制造的方法
KR102285254B1 (ko) 2013-08-26 2021-08-03 브룩스 오토메이션 인코퍼레이티드 기판 이송 장치
US10424498B2 (en) 2013-09-09 2019-09-24 Persimmon Technologies Corporation Substrate transport vacuum platform
KR102161685B1 (ko) * 2013-09-26 2020-10-05 어플라이드 머티어리얼스, 인코포레이티드 기판 프로세싱을 위한 혼합형-플랫폼 장치, 시스템들, 및 방법들
WO2015066624A1 (en) * 2013-11-04 2015-05-07 Applied Materials, Inc Transfer chambers with an increased number of sides, semiconductor device manufacturing processing tools, and processing methods
US10468279B2 (en) 2013-12-26 2019-11-05 Kateeva, Inc. Apparatus and techniques for thermal treatment of electronic devices
KR20230104993A (ko) 2014-01-17 2023-07-11 브룩스 오토메이션 인코퍼레이티드 기판 이송 장치
EP3975229A1 (en) 2014-01-21 2022-03-30 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
KR102424958B1 (ko) 2014-01-21 2022-07-25 퍼시몬 테크놀로지스 코포레이션 기판 이송 진공 플랫폼
KR102315014B1 (ko) * 2014-04-30 2021-10-20 카티바, 인크. 가스 쿠션 장비 및 기판 코팅 기술
CN105097623A (zh) * 2014-05-07 2015-11-25 盛美半导体设备（上海）有限公司 晶圆装载端口结构
JP6577965B2 (ja) * 2015-02-12 2019-09-18 株式会社Ｆｕｊｉ 部品供給装置、および保持具決定方法
US10131020B2 (en) * 2015-03-10 2018-11-20 James P. Sullivan Part orienter with removable rotating fixture
US9889567B2 (en) * 2015-04-24 2018-02-13 Applied Materials, Inc. Wafer swapper
JP6918770B2 (ja) * 2015-07-13 2021-08-11 ブルックス オートメーション インコーポレイテッド オンザフライ方式の自動ウェハセンタリング方法および装置
US10515834B2 (en) * 2015-10-12 2019-12-24 Lam Research Corporation Multi-station tool with wafer transfer microclimate systems
US20170125269A1 (en) * 2015-10-29 2017-05-04 Aixtron Se Transfer module for a multi-module apparatus
JP6700130B2 (ja) * 2016-07-12 2020-05-27 東京エレクトロン株式会社 接合システム
US11167434B2 (en) * 2016-08-30 2021-11-09 HighRes Biosolutions, Inc. Robotic processing system
US10159169B2 (en) * 2016-10-27 2018-12-18 Applied Materials, Inc. Flexible equipment front end module interfaces, environmentally-controlled equipment front end modules, and assembly methods
US10651067B2 (en) 2017-01-26 2020-05-12 Brooks Automation, Inc. Method and apparatus for substrate transport apparatus position compensation
CN117754552A (zh) * 2017-02-15 2024-03-26 柿子技术公司 具有多个末端执行器的物料操纵机器人
EP3596752B1 (en) 2017-03-15 2025-01-08 Lam Research Corporation Reduced footprint platform architecture with linear vacuum transfer module
US10420109B2 (en) * 2017-04-13 2019-09-17 Futurewei Technologies, Inc. System and method for providing explicit feedback in communications systems with multi-point connectivity
JP6881010B2 (ja) * 2017-05-11 2021-06-02 東京エレクトロン株式会社 真空処理装置
DE102018100003B4 (de) * 2017-08-08 2020-03-12 Taiwan Semiconductor Manufacturing Co., Ltd. Methodologie zum automatischen Anlernen eines EFEM-Roboters
US10861723B2 (en) * 2017-08-08 2020-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. EFEM robot auto teaching methodology
US11020852B2 (en) * 2017-10-05 2021-06-01 Brooks Automation, Inc. Substrate transport apparatus with independent accessory feedthrough
US10155309B1 (en) * 2017-11-16 2018-12-18 Lam Research Corporation Wafer handling robots with rotational joint encoders
KR102787198B1 (ko) 2017-12-01 2025-03-25 어플라이드 머티어리얼스, 인코포레이티드 고 에칭 선택성 비정질 탄소 막
GB2570510A (en) * 2018-01-30 2019-07-31 Pragmatic Printing Ltd System and method for manufacturing plurality of integrated circuits
CN111742400B (zh) 2018-02-15 2025-04-29 朗姆研究公司 移动衬底传送室
TWI815869B (zh) * 2018-03-16 2023-09-21 美商布魯克斯自動機械美國公司 基板輸送裝置及用於基板輸送裝置之方法
US10943805B2 (en) 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
US11535460B2 (en) * 2018-05-31 2022-12-27 Brooks Automation Us, Llc Substrate processing apparatus
CN112335030B (zh) * 2018-06-18 2025-10-10 朗姆研究公司 占用面积减小的晶片搬运平台
JP7231721B2 (ja) * 2018-10-04 2023-03-01 アプライド マテリアルズ インコーポレイテッド 搬送システム
US11850742B2 (en) 2019-06-07 2023-12-26 Applied Materials, Inc. Dual robot including splayed end effectors and systems and methods including same
CN114097069B (zh) * 2019-07-12 2025-03-04 应用材料公司 用于同步基板传送的机械手
JP7458718B2 (ja) * 2019-07-19 2024-04-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
CN114258584B (zh) * 2019-08-14 2025-05-02 应用材料公司 路径切换组件、具有该路径切换组件的腔室和基板处理系统及其方法
US11569111B2 (en) * 2019-12-02 2023-01-31 Brooks Automation Us, Llc Substrate processing apparatus
US11049740B1 (en) 2019-12-05 2021-06-29 Applied Materials, Inc. Reconfigurable mainframe with replaceable interface plate
KR102483600B1 (ko) * 2020-02-05 2022-12-30 가부시키가이샤 야스카와덴키 반송 시스템, 반송 방법 및 반송 장치
TWI894199B (zh) * 2020-02-05 2025-08-21 美商布魯克斯自動機械美國公司 基材處理設備及其使用方法
CN115136295A (zh) * 2020-02-17 2022-09-30 捷普有限公司 用于为末端执行器提供自提取夹持的装置、系统和方法
US11833662B2 (en) 2020-02-27 2023-12-05 Lam Research Corporation Wafer handling robot with radial gas curtain and/or interior volume control
JP7511380B2 (ja) 2020-05-01 2024-07-05 東京エレクトロン株式会社 処理システム
JP7759192B2 (ja) * 2020-05-12 2025-10-23 エーエスエム・アイピー・ホールディング・ベー・フェー 高スループットマルチチャンバ基材処理システム
US11521870B2 (en) 2020-07-08 2022-12-06 Applied Materials, Inc. Annealing chamber
US11602064B2 (en) 2020-09-01 2023-03-07 Applied Materials, Inc. Dynamic electrical and fluid delivery system with indexing motion for batch processing chambers
KR20230078686A (ko) * 2020-09-01 2023-06-02 퍼시몬 테크놀로지스 코포레이션 자기적으로 안내되는 엔드-이펙터들을 가지는 재료-핸들링 로봇
KR20220042646A (ko) 2020-09-28 2022-04-05 현대중공업지주 주식회사 기판이송장치
US12076859B2 (en) * 2020-10-14 2024-09-03 Applied Materials, Inc. Infinite rotation of vacuum robot linkage through timing belt with isolated environment
KR20220053854A (ko) * 2020-10-23 2022-05-02 피코앤테라(주) 이에프이엠
TWI745266B (zh) * 2021-05-31 2021-11-01 博斯科技股份有限公司 反應爐冷卻系統及其方法
US20230008072A1 (en) * 2021-07-08 2023-01-12 Applied Materials, Inc. Method and mechanism for contact-free process chamber characterization
KR20230111438A (ko) 2022-01-18 2023-07-25 삼성전자주식회사 반도체 기판 처리 장치
CN119340236A (zh) * 2023-07-21 2025-01-21 北京北方华创微电子装备有限公司 半导体工艺腔室、半导体工艺设备和半导体工艺方法
KR102638655B1 (ko) * 2023-08-07 2024-02-20 에이피티씨 주식회사 멀티 층 efem을 포함하는 기판 이송 장치
CN116985159A (zh) * 2023-08-22 2023-11-03 上海广川科技有限公司 一种手臂可升降的机械手
WO2025054513A1 (en) * 2023-09-08 2025-03-13 Brooks Automation Us, Llc Buffer for substrate transport apparatus and substrate transport apparatus including the buffer
WO2025054493A1 (en) * 2023-09-08 2025-03-13 Brooks Automation Us, Llc Compartmental link substrate transport apparatus
CN117067189A (zh) * 2023-09-27 2023-11-17 上海广川科技有限公司 一种手臂可升降的机械手
CN119495630B (zh) * 2025-01-17 2025-04-25 素珀电子科技(上海)有限公司 基板传送设备
CN120199707B (zh) * 2025-04-09 2025-11-18 长园半导体设备(珠海)有限公司 Tcb工艺的z轴移载平台、位移装置及其键合设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW550151B (en) * 2001-07-13 2003-09-01 Brooks Automation Inc Substrate transport apparatus with multiple independent end effectors
TW200702264A (en) * 2005-05-26 2007-01-16 Advanced Display Proc Eng Co System for manufacturing flat-panel display
TW200949972A (en) * 2007-05-17 2009-12-01 Brooks Automation Inc Side opening substrate carrier and load port
TW201032970A (en) * 2009-01-11 2010-09-16 Applied Materials Inc Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing
TW201034108A (en) * 2009-01-11 2010-09-16 Applied Materials Inc Electrostatic end effector apparatus, systems and methods for transporting susbtrates
TW201134624A (en) * 2009-12-31 2011-10-16 Brooks Automation Inc Manipulator auto-teach and position correction system

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2761438B2 (ja) * 1993-04-16 1998-06-04 ブルックス オートメーション インコーポレイテッド 搬送装置
JPH06302671A (ja) * 1993-04-16 1994-10-28 Sony Corp 真空装置
US5765444A (en) * 1995-07-10 1998-06-16 Kensington Laboratories, Inc. Dual end effector, multiple link robot arm system with corner reacharound and extended reach capabilities
US5789890A (en) 1996-03-22 1998-08-04 Genmark Automation Robot having multiple degrees of freedom
TW372926B (en) * 1996-04-04 1999-11-01 Applied Materials Inc Method and system of processing semiconductor workpieces and robot for use in said system
KR100265287B1 (ko) * 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
JPH11300663A (ja) 1998-04-24 1999-11-02 Mecs Corp 薄型基板搬送装置
JPH11330199A (ja) * 1998-05-18 1999-11-30 Sony Corp 真空プロセス装置
JP2000072248A (ja) 1998-08-27 2000-03-07 Rorze Corp 基板搬送装置
US6256555B1 (en) 1998-12-02 2001-07-03 Newport Corporation Robot arm with specimen edge gripping end effector
US6485250B2 (en) 1998-12-30 2002-11-26 Brooks Automation Inc. Substrate transport apparatus with multiple arms on a common axis of rotation
CN1151910C (zh) * 1999-01-15 2004-06-02 阿西斯特技术公司 工件处理机器人
JP2000308984A (ja) 1999-04-23 2000-11-07 Murata Mach Ltd スカラーアームとこれを用いた搬送装置
US6440261B1 (en) 1999-05-25 2002-08-27 Applied Materials, Inc. Dual buffer chamber cluster tool for semiconductor wafer processing
JP2001147910A (ja) * 1999-11-19 2001-05-29 Nec Soft Ltd 分散バッチジョブ処理継続方式およびその記録媒体
US6297611B1 (en) 2000-07-06 2001-10-02 Genmark Automation Robot having independent end effector linkage motion
US20020061248A1 (en) * 2000-07-07 2002-05-23 Applied Materials, Inc. High productivity semiconductor wafer processing system
JP2002158272A (ja) 2000-11-17 2002-05-31 Tatsumo Kk ダブルアーム基板搬送装置
US6852194B2 (en) 2001-05-21 2005-02-08 Tokyo Electron Limited Processing apparatus, transferring apparatus and transferring method
JP2008034858A (ja) * 2001-05-21 2008-02-14 Tokyo Electron Ltd 処理装置
WO2003006216A1 (en) * 2001-07-13 2003-01-23 Brooks Automation, Inc. Substrate transport apparatus with multiple independent end effectors
JP3755744B2 (ja) * 2001-08-02 2006-03-15 株式会社安川電機 基板搬送用ロボット
JP2003117877A (ja) * 2001-10-17 2003-04-23 Japan Servo Co Ltd 多関節型の産業用ロボット
US7891935B2 (en) * 2002-05-09 2011-02-22 Brooks Automation, Inc. Dual arm robot
US7578649B2 (en) * 2002-05-29 2009-08-25 Brooks Automation, Inc. Dual arm substrate transport apparatus
JP4294984B2 (ja) * 2003-03-19 2009-07-15 東京エレクトロン株式会社 基板搬送装置及び基板処理装置
KR100583727B1 (ko) * 2004-01-07 2006-05-25 삼성전자주식회사 기판 제조 장치 및 이에 사용되는 기판 이송 모듈
JP2004207750A (ja) 2004-02-12 2004-07-22 Dainippon Screen Mfg Co Ltd 基板処理装置
US6987272B2 (en) 2004-03-05 2006-01-17 Axcelis Technologies, Inc. Work piece transfer system for an ion beam implanter
JP5264171B2 (ja) 2004-06-09 2013-08-14 ブルックス オートメーション インコーポレイテッド 基板搬送装置
JP2006205264A (ja) 2005-01-25 2006-08-10 Jel:Kk 基板搬送装置
JP4925650B2 (ja) 2005-11-28 2012-05-09 東京エレクトロン株式会社 基板処理装置
US8220354B2 (en) * 2006-06-28 2012-07-17 Genmark Automation, Inc. Belt-driven robot having extended Z-axis motion
KR20080004118A (ko) * 2006-07-04 2008-01-09 피에스케이 주식회사 기판 처리 설비
TWI398335B (zh) * 2006-11-27 2013-06-11 Nidec Sankyo Corp Workpiece conveying system
JP2008135630A (ja) 2006-11-29 2008-06-12 Jel:Kk 基板搬送装置
KR100850436B1 (ko) * 2007-06-20 2008-08-05 주식회사 싸이맥스 반도체 제조설비
KR100957225B1 (ko) 2007-11-07 2010-05-11 세메스 주식회사 기판 처리 장치 및 방법
JP4746027B2 (ja) * 2007-12-10 2011-08-10 川崎重工業株式会社 基板搬送方法
JP5294681B2 (ja) * 2008-04-28 2013-09-18 東京エレクトロン株式会社 基板処理装置及びその基板搬送方法
JP5139253B2 (ja) 2008-12-18 2013-02-06 東京エレクトロン株式会社 真空処理装置及び真空搬送装置
JP2011020188A (ja) 2009-07-14 2011-02-03 Seiko Epson Corp ロボット装置およびロボット装置の制御方法
JP5373517B2 (ja) * 2009-09-14 2013-12-18 株式会社ディスコ 搬送機構および加工装置
JP2011077399A (ja) 2009-09-30 2011-04-14 Tokyo Electron Ltd 被処理体の搬送方法及び被処理体処理装置
JP2011119556A (ja) 2009-12-07 2011-06-16 Yaskawa Electric Corp 水平多関節ロボットおよびそれを備えた搬送装置
JP5462064B2 (ja) * 2010-04-28 2014-04-02 日本電産サンキョー株式会社 産業用ロボット
JP5755844B2 (ja) * 2010-05-31 2015-07-29 株式会社ダイヘン ワーク搬送システム
US9076829B2 (en) * 2011-08-08 2015-07-07 Applied Materials, Inc. Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing
KR101829397B1 (ko) 2011-09-16 2018-02-19 퍼시몬 테크놀로지스 코포레이션 낮은 가변성을 가진 로봇

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW550151B (en) * 2001-07-13 2003-09-01 Brooks Automation Inc Substrate transport apparatus with multiple independent end effectors
TW200702264A (en) * 2005-05-26 2007-01-16 Advanced Display Proc Eng Co System for manufacturing flat-panel display
TW200949972A (en) * 2007-05-17 2009-12-01 Brooks Automation Inc Side opening substrate carrier and load port
TW201032970A (en) * 2009-01-11 2010-09-16 Applied Materials Inc Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing
TW201034108A (en) * 2009-01-11 2010-09-16 Applied Materials Inc Electrostatic end effector apparatus, systems and methods for transporting susbtrates
TW201134624A (en) * 2009-12-31 2011-10-16 Brooks Automation Inc Manipulator auto-teach and position correction system

Also Published As

Publication number Publication date
US12142511B2 (en) 2024-11-12
TW202203356A (zh) 2022-01-16
CN107598909B (zh) 2024-01-30
KR20220019075A (ko) 2022-02-15
KR20160098524A (ko) 2016-08-18
US20160329234A1 (en) 2016-11-10
WO2013120054A1 (en) 2013-08-15
CN104349872B (zh) 2017-10-13
JP2015508236A (ja) 2015-03-16
CN104349872A (zh) 2015-02-11
JP6843493B2 (ja) 2021-03-17
KR102529273B1 (ko) 2023-05-04
TW201349376A (zh) 2013-12-01
JP2016219831A (ja) 2016-12-22
JP6325612B2 (ja) 2018-05-16
JP2023113831A (ja) 2023-08-16
TW201839895A (zh) 2018-11-01
CN107598909A (zh) 2018-01-19
JP7292249B2 (ja) 2023-06-16
TWI725303B (zh) 2021-04-21
JP2021010011A (ja) 2021-01-28
US20150013910A1 (en) 2015-01-15
KR102096074B1 (ko) 2020-04-01
US20250069939A1 (en) 2025-02-27
KR20230067705A (ko) 2023-05-16

Similar Documents

Publication Publication Date Title
TWI629743B (zh) 基材處理設備
KR102359364B1 (ko) 기판 프로세싱 장치
US11302564B2 (en) Substrate transport apparatus
US10777438B2 (en) Processing apparatus
US11020852B2 (en) Substrate transport apparatus with independent accessory feedthrough
US11894252B2 (en) Substrate transport apparatus
US20200002104A1 (en) Substrate processing apparatus
TW202445731A (zh) 基板處理設備與裝卸基板的方法