WO2021028043A1 - Path switch assembly, chamber and substrate processing system having the same, and methods therefor - Google Patents

Path switch assembly, chamber and substrate processing system having the same, and methods therefor Download PDF

Info

Publication number
WO2021028043A1
WO2021028043A1 PCT/EP2019/071839 EP2019071839W WO2021028043A1 WO 2021028043 A1 WO2021028043 A1 WO 2021028043A1 EP 2019071839 W EP2019071839 W EP 2019071839W WO 2021028043 A1 WO2021028043 A1 WO 2021028043A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
switch assembly
path switch
transport
pivotable
Prior art date
Application number
PCT/EP2019/071839
Other languages
French (fr)
Inventor
Oliver Heimel
Michael Scholz
Klaus SCHÜHLER
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to CN201980099369.3A priority Critical patent/CN114258584A/en
Priority to PCT/EP2019/071839 priority patent/WO2021028043A1/en
Priority to KR1020227007853A priority patent/KR20220043206A/en
Publication of WO2021028043A1 publication Critical patent/WO2021028043A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

Definitions

  • Embodiments of the present disclosure relate to apparatuses and methods for transportation of carriers, particularly carriers used during processing of large area substrates.
  • embodiments of the present disclosure relate to apparatuses and methods for contactless transportation of carriers employable in processing systems for vertical substrate processing, e.g. material deposition on large area substrates for display production.
  • embodiments of the present disclosure relate to a path switch assembly, e.g. arranged in a chamber of a processing system, configured to move a carrier transversal to a transport direction of a transport path provided by one or more transport systems for carrier transportation.
  • Coated substrates may be used in several applications and in several technical fields. For instance, coated substrates may be used in the field of display devices. Display devices can be used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, and the like for displaying information. Typically, displays are produced by coating a substrate with a stack of layers of different materials.
  • An in-line processing system includes a plurality of subsequent processing modules, such as deposition modules and optionally further processing modules, e.g., cleaning modules and/or etching modules, wherein processing aspects are subsequently conducted in the processing modules such that a plurality of substrates can continuously or quasi-continuously be processed in the in-line processing system.
  • subsequent processing modules such as deposition modules and optionally further processing modules, e.g., cleaning modules and/or etching modules, wherein processing aspects are subsequently conducted in the processing modules such that a plurality of substrates can continuously or quasi-continuously be processed in the in-line processing system.
  • the substrate may be carried by a carrier, i.e. a carrying device for carrying the substrate.
  • the carrier is typically transported through a vacuum chamber using one or more transport systems.
  • the transport systems may be configured for conveying the carrier along one or more transport paths. At least two transport paths can be provided next to each other in the vacuum system, e.g. a first transport path for transporting the carrier in a forward direction and a second transport path for transporting the carrier in a return direction opposite to the forward direction.
  • a path switch assembly includes one or more pivotable carrier transfer elements for moving a carrier from a first transport path in a path switch direction to a laterally offset second transport path.
  • a method of switching a transport path of a carrier includes handing over the carrier from a first transport system to one or more pivotable carrier transfer elements, particularly of a path switch assembly according to embodiments described herein. Additionally, the method includes pivoting the one or more pivotable carrier transfer elements from the first transport system to a second transport system. Further, the method includes handing over the carrier from the one or more pivotable carrier transfer elements to the second transport system.
  • a method of processing a substrate includes handing over a carrier carrying the substrate from a first transport system to one or more pivotable carrier transfer elements, particularly of a path switch assembly according to any embodiments described herein. Additionally, the method includes pivoting the one or more pivotable carrier transfer elements from the first transport system to a processing position. Further, the method includes processing the substrate by using a processing device.
  • a chamber including a path switch assembly according to any embodiments described herein.
  • the chamber includes a first transport system provided along a first transport path for transporting a carrier. Additionally, the chamber includes a second transport system provided along a second transport path horizontally offset from the first transport path. Further, the chamber includes the path switch assembly, wherein the one or more pivotable carrier transfer elements are pivot-mounted in bearings provided in at least one of an upper chamber wall and a bottom chamber wall.
  • a processing system for vertically processing a substrate is provided. The processing system includes at least one chamber according to any embodiments described herein.
  • a method of manufacturing a device includes using at least one of the path switch assembly according to any embodiments of the present disclosure, the chamber according to any embodiments of the present disclosure, the processing system according to any embodiments of the present disclosure, and the method of processing a substrate according to any embodiments of the present disclosure.
  • Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner.
  • embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus.
  • FIG. 1A shows a schematic side view of a path switch assembly according to embodiments described herein;
  • FIG. 1B shows a schematic top view of a path switch assembly according to embodiments described herein
  • FIGS. 2 A and 2B show a schematic side view and a schematic top view of a path switch assembly according to further embodiments described herein;
  • FIGS. 3 A and 3B show a schematic side view and a schematic top view of a path switch assembly illustrating further aspects of a path switch assembly according to embodiments described herein;
  • FIG. 4A shows a schematic side view of a chamber including a path switch assembly according to embodiments described herein;
  • FIG. 4B shows a schematic top view of a chamber including a path switch assembly according to embodiments described herein
  • FIG. 5 shows a schematic view of a processing system according to embodiments described herein;
  • FIG. 6A shows a flowchart for illustrating a method of switching a transport path of a carrier according to embodiments described herein;
  • FIG. 6B shows a schematic illustration for describing a method of switching a transport path of a carrier according to embodiments described herein;
  • FIG. 7A shows a flowchart for illustrating a method of processing a substrate according to embodiments described herein.
  • FIG. 7B shows a schematic illustration for describing a method of processing a substrate according to embodiments described herein.
  • FIG. 8 shows a flowchart for illustrating a method of manufacturing a device according to embodiments described herein.
  • FIG. 1 A shows a side view of the path switch assembly
  • FIG. 1B shows a top view of the path switch assembly.
  • the path switch assembly 150 includes one or more pivotable carrier transfer elements 152 for moving a carrier 10 from a first transport path T1 in a path switch direction S to a laterally offset second transport path T2.
  • the first transport path TI and the second transport path T2 are substantially parallel to each other.
  • the one or more pivotable carrier transfer elements 152 are pivotable about a rotation axis 155.
  • the rotation axis 155 is vertical, i.e. the rotation axis 155 extends in the vertical direction.
  • a “vertical direction” is considered a direction substantially parallel to the direction along which the force of gravity extends.
  • a vertical direction may deviate from exact verticality (the latter being defined by the gravitational force) by an angle of, e.g., up to 15 degrees.
  • a “lateral direction” is to be understood to distinguish over a vertical direction.
  • a lateral direction may be perpendicular or substantially perpendicular to the exact vertical direction defined by gravity.
  • the first transport path T1 and the second transport path T2 typically extend in the transport direction T. Further, in FIG. 1B the path switch direction S is indicated. Accordingly, it is to be understood that the transport direction T and the path switch direction S typically define a horizontal plane.
  • a “path switch assembly” can be understood as an assembly configured to move a carrier between different positions, e.g. different transportation paths, laterally offset from each other.
  • the path switch assembly is configured for laterally moving a carrier in a path switch direction S.
  • path switch direction can be understood as a horizontal direction, particularly being perpendicular to the transport direction T.
  • the transport direction T is also a substantially horizontal direction. Accordingly, the transport direction T and the path switch direction S typically span a horizontal plane.
  • embodiments of the path switch assembly of the present disclosure are improved compared to conventional path switch systems.
  • embodiments of the path switch assembly as described herein provide for lower tact time, lower cost, and simpler implementation.
  • a “carrier” can be understood as a carrier configured for holding a substrate, also referred to as a substrate carrier.
  • the carrier can be a substrate carrier for carrying a large area substrate.
  • the embodiments of the path switch assembly may also be used for other carrier types, e.g. mask carriers.
  • the carrier may be a carrier configured for carrying a mask.
  • the term “substrate” may particularly embrace substantially inflexible substrates, e.g., a wafer, slices of transparent crystal such as sapphire or the like, or a glass plate.
  • the present disclosure is not limited thereto, and the term “substrate” may also embrace flexible substrates such as a web or a foil.
  • the term “substantially inflexible” is understood to distinguish over “flexible”.
  • a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates.
  • the substrate may be made of any material suitable for material deposition.
  • the substrate may be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.
  • a large area substrate refers to a substrate having a main surface with an area of 0.5 m 2 or larger, particularly of 1 m 2 or larger.
  • a large area substrate can be GEN 4.5, which corresponds to about 0.67 m 2 of substrate (0.73 x 0.92m), GEN 5, which corresponds to about 1.4 m 2 of substrate ( 1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m 2 of substrate (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7 m 2 of substrate (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m 2 of substrate (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.
  • the substrate thickness can be from 0.1 to 1.8 mm, particularly about 0.9 mm or below, such as 0.7 mm or 0.5.
  • the one or more pivotable carrier transfer elements 152 have a rotation axis 155 being laterally offset from the first transport path T1 by a first distance D1. Additionally, the rotation axis 155 of the one or more pivotable carrier transfer elements 152 can be laterally offset from the second transport path T2 by a second distance D2. Typically, the second distance D2 is smaller than the first distance D1 (i.e. D2 ⁇ D1).
  • the one or more pivotable carrier transfer elements 152 include carrier holding elements 153 radially extending from the rotation axis.
  • the radial direction R is exemplarily indicated in FIGS. 1 A and 1B.
  • the one or more pivotable carrier transfer elements 152, particularly the carrier holding elements 153 include carrier holding interfaces 154 for holding the carrier 10.
  • the carrier holding elements 153, particularly the carrier holding interfaces 154 are adapted to be coupled to respective coupling elements provided at the carrier 10.
  • the carrier holding interfaces 154 may include a coupling allowing for a rotational movement about a vertical axis.
  • the orientation of the carrier can be maintained.
  • the carrier may remain substantially parallel to the first transport path T1 and/or the second transport path T2.
  • the one or more pivotable carrier transfer elements 152 include a first pivotable carrier transfer element 152A having a first rotation axis 155 A and a second pivotable carrier transfer element 152B having a second rotation axis 155B.
  • the second rotation axis 155B is parallel to the first rotation axis 155A.
  • the first rotation axis 155A and the second rotation axis 155B are spaced apart by a distance D corresponding substantially to a length L of the carrier 10, as exemplarily indicated in FIG. 2 A.
  • the first pivotable carrier transfer element 152A and the second pivotable carrier transfer element 152B may have a different configuration, as exemplarily shown in FIG. 2A.
  • the first pivotable carrier transfer element 152A may include a vertically oriented shaft 159 having a vertical extension of at least a height H of the carrier 10.
  • the carrier holding elements 153 of the first pivotable carrier transfer element 152A may be arranged to be coupled to an upper and a lower portion of the carrier, respectively, as exemplarily shown in FIG. 2A.
  • the second pivotable carrier transfer element 152B may include an arm 157 radially extending from the second rotation axis 155B. Further, as exemplarily shown in FIG.
  • the arm may include a hook-like configuration.
  • the second pivotable carrier transfer element 152B may have a hook-like configuration, wherein one end of the hook includes the second rotation axis 155B and the other end of the hook includes the carrier holding interface 154 for coupling the carrier to the second pivotable carrier transfer element 152B.
  • an upper second pivotable carrier transfer element 152BU and a lower second pivotable carrier transfer element 152BL may be provided.
  • the upper second pivotable carrier transfer element 152BU and the lower second pivotable carrier transfer element 152BL can be mounted to be mirror symmetrical to each other, particularly with respect to a horizontal symmetry plane.
  • the one or more pivotable carrier transfer elements 152 are pivot-mounted in bearings 156.
  • the bearings 156 can be feedthrough bearings, e.g. provided in an upper and bottom chamber wall as exemplarily described with reference to FIG. 4 A.
  • at least one of the one or more pivotable carrier transfer elements 152 is connected to a drive 158 for pivoting the one or more pivotable carrier transfer elements 152 about the rotation axis 155, as exemplarily shown in FIG. 3A.
  • the first pivotable carrier transfer element is connected to a drive 158 and the second pivotable carrier transfer element 152B may be connected to a drive 158.
  • the upper second pivotable carrier transfer element I52BU and/or the lower second pivotable carrier transfer element 152BL can be connected to a drive.
  • a synchronization mechanism may be provided for synchronizing the motion of the first pivotable carrier transfer element 152 A with the second pivotable carrier transfer element 152B. Accordingly, a further synchronization mechanism may be provided for synchronizing the motion of the upper second pivotable carrier transfer element 152BU with the lower second pivotable carrier transfer element 152BL.
  • the path switch assembly 150 as described herein is configured for laterally moving a carrier to any position within the reach of the radial extension of the carrier holding elements 153.
  • the carrier may be moved to a processing position PR laterally offset from the second transport path T2 as exemplarily indicated in FIG. 3B.
  • a chamber 210 including a path switch assembly 150 according to the present disclosure is described.
  • the chamber 210 can be a vacuum chamber of a substrate processing system 200 for vertically processing a substrate as described herein.
  • the chamber 210 may be a vacuum chamber.
  • vacuum can be understood in the sense of a technical vacuum having a vacuum pressure of less than, for example, 10 mbar.
  • the pressure in a vacuum chamber as described herein may be between 10 -5 mbar and about 10 -8 mbar, more typically between 10 -5 mbar and 10 -7 mbar, and even more typically between about 10 -6 mbar and about 10 -7 mbar.
  • the pressure in the vacuum chamber may be considered to be either the partial pressure of the evaporated material within the vacuum chamber or the total pressure (which may approximately be the same when only the evaporated material is present as a component to be deposited in the vacuum chamber).
  • the total pressure in the vacuum chamber may range from about 10 -4 mbar to about 10 -7 mbar, especially in the case that a second component besides the evaporated material is present in the vacuum chamber (such as a gas or the like).
  • the vacuum chamber can be a “vacuum deposition chamber”, i.e. a vacuum chamber configured for vacuum deposition.
  • the chamber 210 includes a first transport system 101 provided along a first transport path T1 for transporting a carrier 10. Additionally, the chamber includes a second transport system 102 provided along a second transport path T2 horizontally offset from the first transport path T1.
  • a “transport system” can be understood as a system configured for transporting a carrier in a transport direction along a transport path.
  • transport direction can be understood as the direction in which the carrier is transported along the transport path.
  • the transport direction can be an essentially horizontal direction.
  • the chamber 210 includes a path switch assembly 150 according to any embodiments described herein.
  • the one or more pivotable carrier transfer elements 152 of the path switch assembly 150 are pivot-mounted in bearings 156, particularly feedthrough bearings, provided in at least one of an upper chamber wall 210U and a bottom chamber wall 210B.
  • the chamber includes a processing device 205 laterally offset from the second transport system 102, as exemplarily shown in FIG. 4B.
  • the processing device 205 may be selected from the group consisting of a deposition source, an evaporation source, a sputter source or any other processing device, particularly configured for vertical large area substrate processing.
  • the first transport system 101 and the second transport system 102 are magnetic levitation systems.
  • a “magnetic levitation system” can be understood as a system configured for holding an object, e.g. a carrier, in a contactless manner by using magnetic force.
  • the term “levitating” or “levitation” refers to a state of an object, e.g. a carrier carrying a substrate or a mask, wherein the object floats without mechanical contact or support.
  • moving or transporting an object refers to providing a driving force, e.g. a force in a direction different than that of the levitation force, wherein the object is moved from one position to another, different position, for example a different position along the transport direction.
  • a carrier carrying a substrate or a mask can be levitated, i.e. by a force counteracting gravity, and can be moved in a direction different than a direction parallel to gravity while being levitated.
  • a substrate processing system 200 for vertically processing a substrate is described.
  • a “substrate processing system” can be understood as a system configured for substrate processing, particularly for material deposition on a substrate.
  • the substrate processing system 200 includes at least one chamber, i.e. chamber 210, according to any embodiments described herein. Further, the substrate processing system 200 may include one or more further chambers, e.g. one or more further vacuum chambers arranged in line. Accordingly, the substrate processing system can be an in-line processing system. In particular, an in-line processing system can be understood as an arrangement of two or more modules arranged in line. Modules can be or include chambers.
  • an in-line processing system can be configured for deposition of one or more layers on a vertical substrate.
  • the substrate processing system can be a vertical substrate processing system, i.e. configured for processing substrates in a substantially vertical substrate orientation.
  • one or more layers can be deposited in a stationary deposition process or a dynamic deposition process.
  • the deposition process can be a PVD-process, e.g. sputter process, or a CVD process.
  • typically the substrate processing system is a vacuum processing system having one or more chambers configured for providing vacuum conditions.
  • the substrate processing system can include an atmospheric module.
  • the atmospheric module may include a swing module 201, as exemplarily shown in FIG. 5.
  • the swing module 201 is configured for bringing a substrate to be processed from a horizontal position into a substantially vertical position.
  • the processing system may include a load lock module 202.
  • a load lock module may also be referred to herein as a “pre-vacuum module”.
  • the processing system may include a transfer module 203.
  • the transfer module 203 may be a high-vacuum module.
  • the substrate processing system 100 typically includes a processing module 204.
  • the load lock modules 202, the transfer module 203, and the processing module 204 are typically configured for providing vacuum conditions in the respective module.
  • the swing module 201 may be connected to the load lock module 202.
  • the load lock module 202 may be connected to the transfer module 203 and the transfer module 203 may be connected to the processing module 204.
  • the modules may be connected via gate valves 115.
  • a “gate valve” can be understood as a mouth which allows for a vacuum seal to an adjacent module or chamber.
  • the load lock module or chamber may assist in equalizing pressure differences between modules. For example, atmospheric pressure is applied in one module and a vacuum is applied in the module which is connected to the one module via the load lock module.
  • the substrate processing system typically includes a first transport system 101 provided along a first transport path T1 for transporting a carrier 10. Further, the substrate processing system typically includes a second transport system 102 provided along a second transport path T2 horizontally offset from the first transport path T1.
  • the first transport path T1 and the second transport path T2 may also be referred to as a first track and a second track.
  • the first track can be a track configured for transporting an unprocessed substrate, e.g. from an entry of the substrate processing system towards a substrate processing chamber.
  • the second track can be a track configured for transporting a processed substrate, e.g. from the substrate processing chamber towards an exit of the substrate processing system.
  • the first track and the second track may also be referred to as substrate transportation tracks, respectively.
  • a “track” can be understood as a guiding structure, e.g. a guide rail, for guiding the substrate along the substrate transport direction. Accordingly, a “track” can be understood as a mechanical structure.
  • the substrate transportation system can be a contactless transportation system, e.g. based on magnetic levitation.
  • the first track can be provided for transporting an unprocessed substrate towards a processing module, also referred to as substrate processing chamber.
  • the second track can be provided for transporting a processed substrate from the processing module towards an atmospheric module.
  • the second track is laterally displaced with respect to the first track.
  • the first track and the second track can be substantially parallel to each other.
  • the substrate transportation system can be configured for transporting one or more substrates from an atmospheric module through one or more transfer modules to one or more processing modules and vice versa.
  • the processing module 204 includes the chamber 210 with the path switch assembly 150.
  • the processing system can includes one or more further chambers or modules including the path switch assembly 150.
  • the method includes handing over the carrier from a first transport system 101 to one or more pivotable carrier transfer elements 152 (represented by block 301 in FIG. 6A), particularly of a path switch assembly according to any embedments described herein. Additionally, the method includes pivoting the one or more pivotable carrier transfer elements 152 from the first transport system 101 to a second transport system 102 (represented by block 302 in FIG. 6A). Further, the method includes handing over the carrier from the one or more pivotable carrier transfer elements 152 to the second transport system 102 (represented by block 303 in FIG. 6A).
  • handing over the carrier from a first transport system 101 to one or more pivotable carrier transfer elements 152 includes decreasing a magnetic force acting between the first transport system and the carrier.
  • the carrier By decreasing the magnetic force acting between the first transport system and the carrier, the carrier can be lowered, i.e. the vertical position of the carrier can be lowered.
  • a mechanical contact between the one or more pivotable carrier transfer elements 152 and tiie carrier may be established, such that the carrier can be transferred from the first transport system 101 to the second transport system 102 by pivoting the one or more pivotable carrier transfer elements 152.
  • handing over the carrier from the one or more pivotable carrier transfer elements 152 to the second transport system 102 includes increasing a magnetic force acting between the second transport system and the carrier.
  • the carrier By increasing the magnetic force acting between the second transport system and the carrier, the carrier can be lifted, i.e. the vertical position of the carrier can be lifted up. Accordingly, a mechanical contact between the one or more pivotable earner transfer elements 152 and the carrier may be released.
  • a position sequence of the one or more pivotable carrier transfer elements 152 is described, for transferring a carrier from a first transport system 101 to a second transport system 102.
  • the carrier holding elements 153 of the first pivotable carrier transfer element 152A are at position P3 and the carrier holding elements 153 of the second pivotable carrier transfer element 152B are at position Q3.
  • the positions P3 and Q3 are laterally displaced from the first transport path T1 as well as from the second transport path T2.
  • the carrier holding elements 153 of the first pivotable carrier transfer element 152A are at position P3 and the carrier holding elements 153 of the second pivotable carrier transfer element 152B are at position Q3, the carrier can enter the chamber.
  • the carrier is provided on the first transport path T1 in the chamber, the carrier holding elements 153 of the first pivotable carrier transfer element 152A are moved from position P3 to position PI.
  • the carrier holding elements 153 of the second pivotable carrier transfer element 152B are moved from position Q3 to position Q1, particularly simultaneously with the carrier holding elements 153 of the first pivotable carrier transfer element 152A.
  • Position P1 and position Q1 are in line with the first transport path T1. Subsequently, the carrier is moved down, e.g. by a few millimeters, particularly by decreasing a magnetic force acting between the first transport system and the carrier. Accordingly, the carrier is handed over from the first transport system to the one or more pivotable carrier transfer elements 152, particularly the carrier holding elements 153 of the first pivotable carrier transfer element 152A and the second pivotable carrier transfer element 152B, respectively. Then, the carrier holding elements 153 of the first pivotable carrier transfer element 152 A are moved from position P 1 to position P3 and the carrier holding elements 153 of the second pivotable carrier transfer element 152B are moved from position Q1 to position Q2.
  • the positions P2 and Q2 are in line with the second transport path T2. Subsequently, the carrier is lifted up, e.g. by a few millimeters, particularly by increasing a magnetic force acting between the second transport system and the carrier. Accordingly, the carrier is handed over from the one or more pivotable carrier transfer elements 152 to the second transport system 102.
  • the carrier may be transported out of the chamber by the second transport system 102 and leave the carrier on the second transport path T2. In this regard, it is to be understood that when the carrier leaves the chamber on the second transport path T2, synchronously the next carrier may enter the chamber on the first transport path T1.
  • the method includes handing over a carrier carrying the substrate from a first transport system 101 to one or more pivotable carrier transfer elements 152 (represented by block 401 in FIG. 7A), particularly of a path switch assembly according to any embodiments described herein. Additionally, the method 300 includes pivoting the one or more pivotable carrier transfer elements 152 from the first transport system 101 to a processing position PR (represented by block 402 in FIG. 7AB). Further, the method 300 includes processing the substrate by using a processing device 205 (represented by block 403 in FIG. 7A).
  • the method 400 of processing a substrate may include the method 300 of switching a transport path.
  • the one or more pivotable carrier transfer elements 152 can be moved from position P1 and Q1 to positions P4 and Q4.
  • the positions P4 and Q4 are laterally offset with respect to the second transport path T2.
  • positions P4 and Q4 are on a line parallel to the second transport path T2.
  • the line extending between positions P4 and Q4 may be referred to as processing position PR.
  • the carrier can be moved from the processing position PR to the second transport path T2 and handed over to the second transport system 102.
  • the method 500 includes using at least one of the path switch assembly 150 according to any embodiments described herein (represented by block 501 in FIG. 8), the chamber 210 according to any embodiments described herein (represented by block 502 in FIG. 8), the substrate processing system 200 according to any embodiments described herein (represented by block 503 in FIG. 8), and the method 400 of processing a substrate according to any embodiments described herein (represented by block 504 in FIG. 8).
  • embodiments of the present disclosure beneficially provide for a path switch assembly and methods therefor which provide for lower tact time, lower cost, and simpler implementation. Accordingly, by employing the path switch assembly and the methods as described herein in a substrate processing system, particularly in a processing chamber of a substrate processing system, the tact time and the costs of the processing system can be decreased.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A path switch assembly (150) for transversally moving a carrier is described. The path switch assembly (150) includes one or more pivotable carrier transfer elements (152) for moving a carrier ( 10) from a first transport path (T1) in a path switch direction (S) to a laterally offset second transport path (T2). Further, a chamber including the path switch assembly, a processing system including the chamber, a method of switching a transport path of a carrier, and a method of processing a substrate are described.

Description

PATH SWITCH ASSEMBLY, CHAMBER AND SUBSTRATE PROCESSING SYSTEM HAVING THE SAME, AND METHODS THEREFOR
TECHNICAL FIELD
[0001] Embodiments of the present disclosure relate to apparatuses and methods for transportation of carriers, particularly carriers used during processing of large area substrates. In particular, embodiments of the present disclosure relate to apparatuses and methods for contactless transportation of carriers employable in processing systems for vertical substrate processing, e.g. material deposition on large area substrates for display production. More specifically, embodiments of the present disclosure relate to a path switch assembly, e.g. arranged in a chamber of a processing system, configured to move a carrier transversal to a transport direction of a transport path provided by one or more transport systems for carrier transportation.
BACKGROUND
[0002] Techniques for layer deposition on a substrate include, for example, sputter deposition, physical vapor deposition (PVD), chemical vapor deposition (CVD) and thermal evaporation. Coated substrates may be used in several applications and in several technical fields. For instance, coated substrates may be used in the field of display devices. Display devices can be used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, and the like for displaying information. Typically, displays are produced by coating a substrate with a stack of layers of different materials.
[0003] In order to deposit a layer stack, an in-line arrangement of processing modules can be used. An in-line processing system includes a plurality of subsequent processing modules, such as deposition modules and optionally further processing modules, e.g., cleaning modules and/or etching modules, wherein processing aspects are subsequently conducted in the processing modules such that a plurality of substrates can continuously or quasi-continuously be processed in the in-line processing system.
[0004] During the processing, the substrate may be carried by a carrier, i.e. a carrying device for carrying the substrate. The carrier is typically transported through a vacuum chamber using one or more transport systems. The transport systems may be configured for conveying the carrier along one or more transport paths. At least two transport paths can be provided next to each other in the vacuum system, e.g. a first transport path for transporting the carrier in a forward direction and a second transport path for transporting the carrier in a return direction opposite to the forward direction.
[0005] Conventional transport systems have rollers or other supports configured to support and convey the carrier along the transport paths and/or from one transport path to another transport path (also referred to as a “path switch” or “track switch”). The friction between the carrier and a carrier support during the movement of the carrier can generate particles that may contaminate the layers deposited on the substrates. One approach to reduce or minimize particle generation during carrier transportation is to employ contactless transport systems. However, there are some challenges with respect to providing path switch systems for contactless transport systems. In particular, there is a demand for path switch systems which provide for lower tact time, lower cost, and simpler implementation.
SUMMARY
[0006] In light of the above, a path switch assembly, a method of switching a transport path of a carrier, and a method of processing a substrate according to the independent claims are provided. Additionally, a chamber including a path switch assembly according to embodiments of the present disclosure as well as a substrate processing system including such a chamber are provided. Further aspects, advantages, and features are apparent from the dependent claims, the description, and the accompanying drawings. [0007] According to an aspect of the present disclosure, a path switch assembly is provided. The path switch assembly includes one or more pivotable carrier transfer elements for moving a carrier from a first transport path in a path switch direction to a laterally offset second transport path. [0008] According to a further aspect of the present disclosure, a method of switching a transport path of a carrier is provided. The method includes handing over the carrier from a first transport system to one or more pivotable carrier transfer elements, particularly of a path switch assembly according to embodiments described herein. Additionally, the method includes pivoting the one or more pivotable carrier transfer elements from the first transport system to a second transport system. Further, the method includes handing over the carrier from the one or more pivotable carrier transfer elements to the second transport system.
[0009] According to another aspect of the present disclosure, a method of processing a substrate is provided. The method includes handing over a carrier carrying the substrate from a first transport system to one or more pivotable carrier transfer elements, particularly of a path switch assembly according to any embodiments described herein. Additionally, the method includes pivoting the one or more pivotable carrier transfer elements from the first transport system to a processing position. Further, the method includes processing the substrate by using a processing device.
[0010] According to a further aspect of the present disclosure, a chamber including a path switch assembly according to any embodiments described herein is provided. The chamber includes a first transport system provided along a first transport path for transporting a carrier. Additionally, the chamber includes a second transport system provided along a second transport path horizontally offset from the first transport path. Further, the chamber includes the path switch assembly, wherein the one or more pivotable carrier transfer elements are pivot-mounted in bearings provided in at least one of an upper chamber wall and a bottom chamber wall. [0011] According to another aspect of the present disclosure, a processing system for vertically processing a substrate is provided. The processing system includes at least one chamber according to any embodiments described herein.
[0012] According to a yet further aspect of the present disclosure, a method of manufacturing a device is provided. The method includes using at least one of the path switch assembly according to any embodiments of the present disclosure, the chamber according to any embodiments of the present disclosure, the processing system according to any embodiments of the present disclosure, and the method of processing a substrate according to any embodiments of the present disclosure. [0013] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:
FIG. 1A shows a schematic side view of a path switch assembly according to embodiments described herein;
FIG. 1B shows a schematic top view of a path switch assembly according to embodiments described herein; FIGS. 2 A and 2B show a schematic side view and a schematic top view of a path switch assembly according to further embodiments described herein;
FIGS. 3 A and 3B show a schematic side view and a schematic top view of a path switch assembly illustrating further aspects of a path switch assembly according to embodiments described herein;
FIG. 4A shows a schematic side view of a chamber including a path switch assembly according to embodiments described herein;
FIG. 4B shows a schematic top view of a chamber including a path switch assembly according to embodiments described herein; FIG. 5 shows a schematic view of a processing system according to embodiments described herein;
FIG. 6A shows a flowchart for illustrating a method of switching a transport path of a carrier according to embodiments described herein;
FIG. 6B shows a schematic illustration for describing a method of switching a transport path of a carrier according to embodiments described herein;
FIG. 7A shows a flowchart for illustrating a method of processing a substrate according to embodiments described herein.
FIG. 7B shows a schematic illustration for describing a method of processing a substrate according to embodiments described herein; and
FIG. 8 shows a flowchart for illustrating a method of manufacturing a device according to embodiments described herein.
DETAILED DESCRIPTION OF EMBODIMENTS
[0015] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.
[0016] With exemplary reference to FIGS. 1A and 1B, a path switch assembly 150 according to the present disclosure is described. FIG. 1 A shows a side view of the path switch assembly and FIG. 1B shows a top view of the path switch assembly. According to embodiments which can be combined with any other embodiments described herein, the path switch assembly 150 includes one or more pivotable carrier transfer elements 152 for moving a carrier 10 from a first transport path T1 in a path switch direction S to a laterally offset second transport path T2. Typically, the first transport path TI and the second transport path T2 are substantially parallel to each other. As exemplary indicated by the double sided arrow in FIG. 1A, the one or more pivotable carrier transfer elements 152 are pivotable about a rotation axis 155. Typically, the rotation axis 155 is vertical, i.e. the rotation axis 155 extends in the vertical direction.
[0017] In the present disclosure, a “vertical direction” is considered a direction substantially parallel to the direction along which the force of gravity extends. A vertical direction may deviate from exact verticality (the latter being defined by the gravitational force) by an angle of, e.g., up to 15 degrees. A “lateral direction” is to be understood to distinguish over a vertical direction. A lateral direction may be perpendicular or substantially perpendicular to the exact vertical direction defined by gravity. [0018] Accordingly, from FIGS. 1A and 1B, it is to be understood that the term “laterally offset” can be understood as “horizontally offset” or “perpendicularly offset to the transport direction T.”
[0019] As exemplarily shown in FIG. 1B, the first transport path T1 and the second transport path T2 typically extend in the transport direction T. Further, in FIG. 1B the path switch direction S is indicated. Accordingly, it is to be understood that the transport direction T and the path switch direction S typically define a horizontal plane.
[0020] In the present disclosure, a “path switch assembly” can be understood as an assembly configured to move a carrier between different positions, e.g. different transportation paths, laterally offset from each other. In particular, typically the path switch assembly is configured for laterally moving a carrier in a path switch direction S. With exemplary reference to FIG. 1B, it is to be understood that the term “path switch direction” can be understood as a horizontal direction, particularly being perpendicular to the transport direction T. As can be understood from FIGS. I A and 1B, typically the transport direction T is also a substantially horizontal direction. Accordingly, the transport direction T and the path switch direction S typically span a horizontal plane.
[0021] Accordingly, embodiments of the path switch assembly of the present disclosure are improved compared to conventional path switch systems. In particular, embodiments of the path switch assembly as described herein provide for lower tact time, lower cost, and simpler implementation.
[0022] In the present disclosure, a “carrier” can be understood as a carrier configured for holding a substrate, also referred to as a substrate carrier. For instance, the carrier can be a substrate carrier for carrying a large area substrate. It is to be understood that the embodiments of the path switch assembly may also be used for other carrier types, e.g. mask carriers. Accordingly, additionally or alternatively, the carrier may be a carrier configured for carrying a mask.
[0023] In the present disclosure, the term “substrate” may particularly embrace substantially inflexible substrates, e.g., a wafer, slices of transparent crystal such as sapphire or the like, or a glass plate. However, the present disclosure is not limited thereto, and the term “substrate” may also embrace flexible substrates such as a web or a foil. The term “substantially inflexible” is understood to distinguish over “flexible”. Specifically, a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates. According to embodiments described herein, the substrate may be made of any material suitable for material deposition. For instance, the substrate may be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.
[0024] In the present disclosure, the term “large area substrate” refers to a substrate having a main surface with an area of 0.5 m2 or larger, particularly of 1 m2 or larger. In some embodiments, a large area substrate can be GEN 4.5, which corresponds to about 0.67 m2 of substrate (0.73 x 0.92m), GEN 5, which corresponds to about 1.4 m2 of substrate ( 1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m2 of substrate (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7 m2 of substrate (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m2 of substrate (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented. Further, the substrate thickness can be from 0.1 to 1.8 mm, particularly about 0.9 mm or below, such as 0.7 mm or 0.5.
[0025] With exemplary reference to FIG. 1B, according embodiments which can be combined with other embodiments described herein, the one or more pivotable carrier transfer elements 152 have a rotation axis 155 being laterally offset from the first transport path T1 by a first distance D1. Additionally, the rotation axis 155 of the one or more pivotable carrier transfer elements 152 can be laterally offset from the second transport path T2 by a second distance D2. Typically, the second distance D2 is smaller than the first distance D1 (i.e. D2<D1).
[0026] As exemplary indicated in FIGS. 1A and 1B, according to embodiments which can be combined with other embodiments described herein, the one or more pivotable carrier transfer elements 152 include carrier holding elements 153 radially extending from the rotation axis. The radial direction R is exemplarily indicated in FIGS. 1 A and 1B. Typically, the one or more pivotable carrier transfer elements 152, particularly the carrier holding elements 153, include carrier holding interfaces 154 for holding the carrier 10. Accordingly, it is to be understood that the carrier holding elements 153, particularly the carrier holding interfaces 154, are adapted to be coupled to respective coupling elements provided at the carrier 10. For instance, the carrier holding interfaces 154 may include a coupling allowing for a rotational movement about a vertical axis. Accordingly, when the carrier 10 is coupled to the one or more pivotable carrier transfer elements 152, during pivoting of the one or more pivotable carrier transfer elements, the orientation of the carrier can be maintained. In particular, during pivoting the carrier may remain substantially parallel to the first transport path T1 and/or the second transport path T2.
[0027] With exemplary reference to FIGS. 2A and 2B, according embodiments which can be combined with other embodiments described herein, the one or more pivotable carrier transfer elements 152 include a first pivotable carrier transfer element 152A having a first rotation axis 155 A and a second pivotable carrier transfer element 152B having a second rotation axis 155B. The second rotation axis 155B is parallel to the first rotation axis 155A. In particular, the first rotation axis 155A and the second rotation axis 155B are spaced apart by a distance D corresponding substantially to a length L of the carrier 10, as exemplarily indicated in FIG. 2 A. [0028] According embodiments which can be combined with other embodiments described herein, the first pivotable carrier transfer element 152A and the second pivotable carrier transfer element 152B may have a different configuration, as exemplarily shown in FIG. 2A. In particular, the first pivotable carrier transfer element 152A may include a vertically oriented shaft 159 having a vertical extension of at least a height H of the carrier 10. Further, the carrier holding elements 153 of the first pivotable carrier transfer element 152A may be arranged to be coupled to an upper and a lower portion of the carrier, respectively, as exemplarily shown in FIG. 2A. The second pivotable carrier transfer element 152B may include an arm 157 radially extending from the second rotation axis 155B. Further, as exemplarily shown in FIG. 2A, the arm may include a hook-like configuration. Accordingly, the second pivotable carrier transfer element 152B may have a hook-like configuration, wherein one end of the hook includes the second rotation axis 155B and the other end of the hook includes the carrier holding interface 154 for coupling the carrier to the second pivotable carrier transfer element 152B. [0029] As exemplarily shown in FIG. 2A, an upper second pivotable carrier transfer element 152BU and a lower second pivotable carrier transfer element 152BL may be provided. For instance, the upper second pivotable carrier transfer element 152BU and the lower second pivotable carrier transfer element 152BL can be mounted to be mirror symmetrical to each other, particularly with respect to a horizontal symmetry plane. [0030] With exemplary reference to FIG. 3 A, according to embodiments which can be combined with other embodiments described herein, the one or more pivotable carrier transfer elements 152 are pivot-mounted in bearings 156. In particular, the bearings 156 can be feedthrough bearings, e.g. provided in an upper and bottom chamber wall as exemplarily described with reference to FIG. 4 A. [0031] According to embodiments which can be combined with other embodiments described herein, at least one of the one or more pivotable carrier transfer elements 152 is connected to a drive 158 for pivoting the one or more pivotable carrier transfer elements 152 about the rotation axis 155, as exemplarily shown in FIG. 3A. According to an example, the first pivotable carrier transfer element is connected to a drive 158 and the second pivotable carrier transfer element 152B may be connected to a drive 158. For instance, the upper second pivotable carrier transfer element I52BU and/or the lower second pivotable carrier transfer element 152BL can be connected to a drive.
[0032] Although not explicitly shown in the figures, it is to be understood that according to embodiments which can be combined with other embodiments described herein, a synchronization mechanism may be provided for synchronizing the motion of the first pivotable carrier transfer element 152 A with the second pivotable carrier transfer element 152B. Accordingly, a further synchronization mechanism may be provided for synchronizing the motion of the upper second pivotable carrier transfer element 152BU with the lower second pivotable carrier transfer element 152BL.
[0033] With exemplary reference to FIG. 3B, it is to be understood that the path switch assembly 150 as described herein is configured for laterally moving a carrier to any position within the reach of the radial extension of the carrier holding elements 153. For instance, the carrier may be moved to a processing position PR laterally offset from the second transport path T2 as exemplarily indicated in FIG. 3B. [0034] With exemplary reference FIGS. 4A and 4B, a chamber 210 including a path switch assembly 150 according to the present disclosure is described. For instance, the chamber 210 can be a vacuum chamber of a substrate processing system 200 for vertically processing a substrate as described herein. Accordingly, the chamber 210 may be a vacuum chamber.
[0035] The term “vacuum” can be understood in the sense of a technical vacuum having a vacuum pressure of less than, for example, 10 mbar. Typically, the pressure in a vacuum chamber as described herein may be between 10-5 mbar and about 10-8 mbar, more typically between 10-5 mbar and 10-7 mbar, and even more typically between about 10-6 mbar and about 10-7 mbar. According to some embodiments, the pressure in the vacuum chamber may be considered to be either the partial pressure of the evaporated material within the vacuum chamber or the total pressure (which may approximately be the same when only the evaporated material is present as a component to be deposited in the vacuum chamber). In some embodiments, the total pressure in the vacuum chamber may range from about 10-4 mbar to about 10-7 mbar, especially in the case that a second component besides the evaporated material is present in the vacuum chamber (such as a gas or the like). Accordingly, the vacuum chamber can be a “vacuum deposition chamber”, i.e. a vacuum chamber configured for vacuum deposition. [0036] According to embodiments which can be combined with any other embodiments described herein, the chamber 210 includes a first transport system 101 provided along a first transport path T1 for transporting a carrier 10. Additionally, the chamber includes a second transport system 102 provided along a second transport path T2 horizontally offset from the first transport path T1. In the present disclosure, a “transport system” can be understood as a system configured for transporting a carrier in a transport direction along a transport path. The term “transport direction” can be understood as the direction in which the carrier is transported along the transport path. Typically, the transport direction can be an essentially horizontal direction.
[0037] Further, the chamber 210 includes a path switch assembly 150 according to any embodiments described herein. The one or more pivotable carrier transfer elements 152 of the path switch assembly 150 are pivot-mounted in bearings 156, particularly feedthrough bearings, provided in at least one of an upper chamber wall 210U and a bottom chamber wall 210B.
[0038] According to embodiments which can be combined with any other embodiments described herein, the chamber includes a processing device 205 laterally offset from the second transport system 102, as exemplarily shown in FIG. 4B. The processing device 205 may be selected from the group consisting of a deposition source, an evaporation source, a sputter source or any other processing device, particularly configured for vertical large area substrate processing.
[0039] According to embodiments which can be combined with any other embodiments described herein, the first transport system 101 and the second transport system 102 are magnetic levitation systems.
[0040] In the present disclosure, a “magnetic levitation system” can be understood as a system configured for holding an object, e.g. a carrier, in a contactless manner by using magnetic force. In the present disclosure, the term “levitating” or “levitation” refers to a state of an object, e.g. a carrier carrying a substrate or a mask, wherein the object floats without mechanical contact or support. Further, moving or transporting an object refers to providing a driving force, e.g. a force in a direction different than that of the levitation force, wherein the object is moved from one position to another, different position, for example a different position along the transport direction. For example, a carrier carrying a substrate or a mask can be levitated, i.e. by a force counteracting gravity, and can be moved in a direction different than a direction parallel to gravity while being levitated.
[0041] With exemplary reference to FIG. 5, a substrate processing system 200 for vertically processing a substrate according to the present disclosure is described. In the present disclosure, a “substrate processing system” can be understood as a system configured for substrate processing, particularly for material deposition on a substrate.
[0042] According to embodiments which can be combined with any other embodiments described herein, the substrate processing system 200 includes at least one chamber, i.e. chamber 210, according to any embodiments described herein. Further, the substrate processing system 200 may include one or more further chambers, e.g. one or more further vacuum chambers arranged in line. Accordingly, the substrate processing system can be an in-line processing system. In particular, an in-line processing system can be understood as an arrangement of two or more modules arranged in line. Modules can be or include chambers.
[0043] Further, an in-line processing system can be configured for deposition of one or more layers on a vertical substrate. Accordingly, the substrate processing system can be a vertical substrate processing system, i.e. configured for processing substrates in a substantially vertical substrate orientation. For instance, one or more layers can be deposited in a stationary deposition process or a dynamic deposition process. The deposition process can be a PVD-process, e.g. sputter process, or a CVD process. Yet further, it is to be noted that typically the substrate processing system is a vacuum processing system having one or more chambers configured for providing vacuum conditions.
[0044] The substrate processing system can include an atmospheric module. In particular, the atmospheric module may include a swing module 201, as exemplarily shown in FIG. 5. Typically, the swing module 201 is configured for bringing a substrate to be processed from a horizontal position into a substantially vertical position. Furthermore, the processing system may include a load lock module 202. A load lock module may also be referred to herein as a “pre-vacuum module”.
[0045] Further, the processing system may include a transfer module 203. The transfer module 203 may be a high-vacuum module. Further, as exemplarily shown in FIG. 4, the substrate processing system 100 typically includes a processing module 204.
[0046] It is to be understood that the load lock modules 202, the transfer module 203, and the processing module 204 are typically configured for providing vacuum conditions in the respective module. [0047] As exemplarily shown in FIG. 5, according to embodiments which can be combined with other embodiments described herein, the swing module 201 may be connected to the load lock module 202. The load lock module 202 may be connected to the transfer module 203 and the transfer module 203 may be connected to the processing module 204. As exemplarily shown in FIG. 5, the modules may be connected via gate valves 115. In the present disclosure, a “gate valve” can be understood as a mouth which allows for a vacuum seal to an adjacent module or chamber.
[0048] The load lock module or chamber may assist in equalizing pressure differences between modules. For example, atmospheric pressure is applied in one module and a vacuum is applied in the module which is connected to the one module via the load lock module.
[0049] As exemplarily shown in FIG. 5, the substrate processing system typically includes a first transport system 101 provided along a first transport path T1 for transporting a carrier 10. Further, the substrate processing system typically includes a second transport system 102 provided along a second transport path T2 horizontally offset from the first transport path T1. The first transport path T1 and the second transport path T2 may also be referred to as a first track and a second track.
[0050] For instance, the first track can be a track configured for transporting an unprocessed substrate, e.g. from an entry of the substrate processing system towards a substrate processing chamber. The second track can be a track configured for transporting a processed substrate, e.g. from the substrate processing chamber towards an exit of the substrate processing system. The first track and the second track may also be referred to as substrate transportation tracks, respectively. A “track” can be understood as a guiding structure, e.g. a guide rail, for guiding the substrate along the substrate transport direction. Accordingly, a “track” can be understood as a mechanical structure. Further, it is to be noted that the substrate transportation system can be a contactless transportation system, e.g. based on magnetic levitation.
[0051] For instance, the first track can be provided for transporting an unprocessed substrate towards a processing module, also referred to as substrate processing chamber. The second track can be provided for transporting a processed substrate from the processing module towards an atmospheric module. Typically, the second track is laterally displaced with respect to the first track. For instance, the first track and the second track can be substantially parallel to each other. Accordingly, it is to be understood that the substrate transportation system can be configured for transporting one or more substrates from an atmospheric module through one or more transfer modules to one or more processing modules and vice versa.
[0052] As exemplarily shown in FIG. 5, according to embodiments which can be combined with other embodiments described herein, the processing module 204 includes the chamber 210 with the path switch assembly 150. Although not explicitly shown, it is to be understood that the processing system can includes one or more further chambers or modules including the path switch assembly 150.
[0053] With exemplarily reference to FIGS. 6A and 6B, a method 300 of switching a transport path of a carrier according to the present disclosure is described. According to embodiments which can be combined with any other embodiments described herein, the method includes handing over the carrier from a first transport system 101 to one or more pivotable carrier transfer elements 152 (represented by block 301 in FIG. 6A), particularly of a path switch assembly according to any embedments described herein. Additionally, the method includes pivoting the one or more pivotable carrier transfer elements 152 from the first transport system 101 to a second transport system 102 (represented by block 302 in FIG. 6A). Further, the method includes handing over the carrier from the one or more pivotable carrier transfer elements 152 to the second transport system 102 (represented by block 303 in FIG. 6A).
[0054] According to embodiments which can be combined with any other embodiments described herein, handing over the carrier from a first transport system 101 to one or more pivotable carrier transfer elements 152 includes decreasing a magnetic force acting between the first transport system and the carrier. By decreasing the magnetic force acting between the first transport system and the carrier, the carrier can be lowered, i.e. the vertical position of the carrier can be lowered. Accordingly, a mechanical contact between the one or more pivotable carrier transfer elements 152 and tiie carrier may be established, such that the carrier can be transferred from the first transport system 101 to the second transport system 102 by pivoting the one or more pivotable carrier transfer elements 152.
[0055] According to embodiments which can be combined with any other embodiments described herein, handing over the carrier from the one or more pivotable carrier transfer elements 152 to the second transport system 102 includes increasing a magnetic force acting between the second transport system and the carrier. By increasing the magnetic force acting between the second transport system and the carrier, the carrier can be lifted, i.e. the vertical position of the carrier can be lifted up. Accordingly, a mechanical contact between the one or more pivotable earner transfer elements 152 and the carrier may be released.
[0056] It is to be understood that decreasing and/or increasing a magnetic force acting between a transport system and a carrier as described herein can be carried out by controlling electromagnets of the transport system.
[0057] With exemplary reference to FIG. 6B, a position sequence of the one or more pivotable carrier transfer elements 152 is described, for transferring a carrier from a first transport system 101 to a second transport system 102. In particular, before the carrier enters a chamber in which the path switch assembly is arranged, the carrier holding elements 153 of the first pivotable carrier transfer element 152A are at position P3 and the carrier holding elements 153 of the second pivotable carrier transfer element 152B are at position Q3. As shown in FIG. 6B, the positions P3 and Q3 are laterally displaced from the first transport path T1 as well as from the second transport path T2.
[0058] When the carrier holding elements 153 of the first pivotable carrier transfer element 152A are at position P3 and the carrier holding elements 153 of the second pivotable carrier transfer element 152B are at position Q3, the carrier can enter the chamber. When the carrier is provided on the first transport path T1 in the chamber, the carrier holding elements 153 of the first pivotable carrier transfer element 152A are moved from position P3 to position PI. Accordingly, the carrier holding elements 153 of the second pivotable carrier transfer element 152B are moved from position Q3 to position Q1, particularly simultaneously with the carrier holding elements 153 of the first pivotable carrier transfer element 152A.
[0059] Position P1 and position Q1 are in line with the first transport path T1. Subsequently, the carrier is moved down, e.g. by a few millimeters, particularly by decreasing a magnetic force acting between the first transport system and the carrier. Accordingly, the carrier is handed over from the first transport system to the one or more pivotable carrier transfer elements 152, particularly the carrier holding elements 153 of the first pivotable carrier transfer element 152A and the second pivotable carrier transfer element 152B, respectively. Then, the carrier holding elements 153 of the first pivotable carrier transfer element 152 A are moved from position P 1 to position P3 and the carrier holding elements 153 of the second pivotable carrier transfer element 152B are moved from position Q1 to position Q2. The positions P2 and Q2 are in line with the second transport path T2. Subsequently, the carrier is lifted up, e.g. by a few millimeters, particularly by increasing a magnetic force acting between the second transport system and the carrier. Accordingly, the carrier is handed over from the one or more pivotable carrier transfer elements 152 to the second transport system 102. The carrier may be transported out of the chamber by the second transport system 102 and leave the carrier on the second transport path T2. In this regard, it is to be understood that when the carrier leaves the chamber on the second transport path T2, synchronously the next carrier may enter the chamber on the first transport path T1.
[0060] With exemplary reference to FIGS. 7A and 7B, a method 400 of processing a substrate according to the present disclosure is described. According to embodiments which can be combined with any other embodiments described herein, the method includes handing over a carrier carrying the substrate from a first transport system 101 to one or more pivotable carrier transfer elements 152 (represented by block 401 in FIG. 7A), particularly of a path switch assembly according to any embodiments described herein. Additionally, the method 300 includes pivoting the one or more pivotable carrier transfer elements 152 from the first transport system 101 to a processing position PR (represented by block 402 in FIG. 7AB). Further, the method 300 includes processing the substrate by using a processing device 205 (represented by block 403 in FIG. 7A). [0061] With exemplary reference to FIG. 7B, it is to be understood that the method 400 of processing a substrate may include the method 300 of switching a transport path. In particular, it is to be understood that after handing over the carrier from the first transport system 101 to the one or more pivotable carrier transfer elements 152 at positions P1 and Q1, the one or more pivotable carrier transfer elements 152 can be moved from position P1 and Q1 to positions P4 and Q4. The positions P4 and Q4 are laterally offset with respect to the second transport path T2. Typically, positions P4 and Q4 are on a line parallel to the second transport path T2. The line extending between positions P4 and Q4 may be referred to as processing position PR. After processing, the carrier can be moved from the processing position PR to the second transport path T2 and handed over to the second transport system 102.
[0062] With exemplary reference to the flowchart of FIG. 8, a method 500 of manufacturing a device according to embodiments of the present disclosure is described. According to embodiments which can be combined with any other embodiments described herein, the method 500 includes using at least one of the path switch assembly 150 according to any embodiments described herein (represented by block 501 in FIG. 8), the chamber 210 according to any embodiments described herein (represented by block 502 in FIG. 8), the substrate processing system 200 according to any embodiments described herein (represented by block 503 in FIG. 8), and the method 400 of processing a substrate according to any embodiments described herein (represented by block 504 in FIG. 8).
[0063] In view of the above, it is to be understood that compared to the state of the art, embodiments of the present disclosure beneficially provide for a path switch assembly and methods therefor which provide for lower tact time, lower cost, and simpler implementation. Accordingly, by employing the path switch assembly and the methods as described herein in a substrate processing system, particularly in a processing chamber of a substrate processing system, the tact time and the costs of the processing system can be decreased.
[0064] While the foregoing is directed to embodiments, other and further embodiments may be devised without departing from the basic scope, and the scope is determined by the claims that follow.

Claims

1. A path switch assembly (150), comprising one or more pivotable carrier transfer elements (152) for moving a carrier (10) from a first transport path (T1) in a path switch direction (S) to a laterally offset second transport path (T2).
2. The path switch assembly (150) of claim 1, the one or more pivotable carrier transfer elements (152) having a rotation axis (155) being laterally offset from the first transport path (T1) by a first distance (Dl).
3. The path switch assembly (150) of claim 2, the rotation axis (155) of the one or more pivotable carrier transfer elements (152) being laterally offset from the second transport path (T2) by a second distance (D2), the second distance (D2) being smaller than the first distance (Dl).
4. The path switch assembly (150) of any of claims 1 to 3, the one or more pivotable carrier transfer elements (152) comprising carrier holding elements (153) radially extending from the rotation axis.
5. The path switch assembly (150) of any of claims 1 to 4, the one or more pivotable carrier transfer elements (152) comprising carrier holding interfaces (154) for holding the carrier (10).
6. The path switch assembly (150) of any of claims 1 to 5, wherein the one or more pivotable carrier transfer elements (152) are pivot-mounted in bearings (156), particularly feedthrough bearings.
7. The path switch assembly (150) of any of claims 1 to 6, wherein at least one of the one or more carrier transfer elements (152) is connected to a drive (158) for rotating the one or more carrier transfer elements (152) about the rotation axis (155).
8. The path switch assembly (150) of any of claims 1 to 7, the one or more pivotable carrier transfer elements (152) comprising a first pivotable carrier transfer element (152A) having a first rotation axis (155A) and a second pivotable carrier transfer element (152B) having a second rotation axis (155B) being parallel to the first rotation axis (155A).
9. The path switch assembly (150) of claim 8, the first rotation axis (155A) and the second rotation axis (155B) being spaced apart by a distance (D) corresponding substantially to a length (L) of the carrier (10).
10. A chamber (210), comprising
- a first transport system (101) provided along a first transport path (TI) for transporting a carrier ( 10);
- a second transport system ( 102) provided along a second transport path (T2) horizontally offset from the first transport path (T1); and
- a path switch assembly (150) according to any of claims 1 to 9, wherein the one or more pivotable carrier transfer elements (152) are pivot-mounted in bearings (156), particularly feedthrough bearings, provided in at least one of an upper chamber wall (210U) and a bottom chamber wall (210B).
11. The chamber ( 10) of claim 10, further comprising a processing device (205) laterally offset from the second transport system (102).
12. The chamber (10) of claim 10 or 11, wherein the first transport system (101) and the second transport system (102) are magnetic levitation systems.
13. A substrate processing system (200) for vertically processing a substrate, comprising at least one chamber according to any of claims 10 to 12, particularly the chamber being a vacuum chamber.
14. A method of switching a transport path of a carrier, comprising:
- handing over the carrier from a first transport system ( 101 ) to one or more pivotable carrier transfer elements (152), particularly of a path switch assembly according to any of claims 1 to 9;
- pivoting the one or more pivotable carrier transfer elements (152) from the first transport system (101) to a second transport system (102); and
- handing over the carrier from the one or more pivotable carrier transfer elements (152) to the second transport system (102).
15. A method of processing a substrate, comprising:
- handing over a carrier carrying the substrate from a first transport system (101) to one or more pivotable carrier transfer elements (152), particularly of a path switch assembly according to any of claims 1 to 9;
- pivoting the one or more pivotable carrier transfer elements (152) from the first transport system (101) to a processing position (PR); and
- processing the substrate by using a processing device (205).
16. A method of manufacturing a device, comprising using at least one of the path switch assembly ( 150) according to any of claims 1 to 9, the chamber (210) according to any of claims 10 to 12, the processing system (200) according to claim 13, and the method of processing a substrate according to claim 15.
PCT/EP2019/071839 2019-08-14 2019-08-14 Path switch assembly, chamber and substrate processing system having the same, and methods therefor WO2021028043A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201980099369.3A CN114258584A (en) 2019-08-14 2019-08-14 Path switching assembly, chamber and substrate processing system having the same and method thereof
PCT/EP2019/071839 WO2021028043A1 (en) 2019-08-14 2019-08-14 Path switch assembly, chamber and substrate processing system having the same, and methods therefor
KR1020227007853A KR20220043206A (en) 2019-08-14 2019-08-14 Path switching assembly, chamber and substrate processing system having same, and methods therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2019/071839 WO2021028043A1 (en) 2019-08-14 2019-08-14 Path switch assembly, chamber and substrate processing system having the same, and methods therefor

Publications (1)

Publication Number Publication Date
WO2021028043A1 true WO2021028043A1 (en) 2021-02-18

Family

ID=67660548

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/071839 WO2021028043A1 (en) 2019-08-14 2019-08-14 Path switch assembly, chamber and substrate processing system having the same, and methods therefor

Country Status (3)

Country Link
KR (1) KR20220043206A (en)
CN (1) CN114258584A (en)
WO (1) WO2021028043A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6308818B1 (en) * 1999-08-02 2001-10-30 Asyst Technologies, Inc. Transport system with integrated transport carrier and directors
WO2006024035A2 (en) * 2004-08-24 2006-03-02 Brooks Automation, Inc. Transportation system
WO2009107728A1 (en) * 2008-02-28 2009-09-03 株式会社 アルバック Transfer apparatus, vacuum processing apparatus and transfer method
US20150303090A1 (en) * 2012-09-10 2015-10-22 Applied Materials, Inc. Substrate transfer device and method of moving substrates
WO2017101971A1 (en) * 2015-12-14 2017-06-22 Applied Materials, Inc. Processing system for two-side processing of a substrate and method of two-side processing of a substrate

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6752584B2 (en) * 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US6749390B2 (en) * 1997-12-15 2004-06-15 Semitool, Inc. Integrated tools with transfer devices for handling microelectronic workpieces
TW202203356A (en) * 2012-02-10 2022-01-16 美商布魯克斯自動機械公司 Substrate processing apparatus
KR101985922B1 (en) * 2014-02-04 2019-06-04 어플라이드 머티어리얼스, 인코포레이티드 System for depositing one or more layers on a substrate supported by a carrier and method using the same
EP3405973A1 (en) * 2016-01-18 2018-11-28 Applied Materials, Inc. Apparatus for transportation of a substrate carrier in a vacuum chamber, system for vacuum processing of a substrate, and method for transportation of a substrate carrier in a vacuum chamber
WO2019096427A1 (en) * 2017-11-20 2019-05-23 Applied Materials, Inc. Magnetic levitation system, vacuum system, and method of transporting a carrier

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6308818B1 (en) * 1999-08-02 2001-10-30 Asyst Technologies, Inc. Transport system with integrated transport carrier and directors
WO2006024035A2 (en) * 2004-08-24 2006-03-02 Brooks Automation, Inc. Transportation system
WO2009107728A1 (en) * 2008-02-28 2009-09-03 株式会社 アルバック Transfer apparatus, vacuum processing apparatus and transfer method
US20150303090A1 (en) * 2012-09-10 2015-10-22 Applied Materials, Inc. Substrate transfer device and method of moving substrates
WO2017101971A1 (en) * 2015-12-14 2017-06-22 Applied Materials, Inc. Processing system for two-side processing of a substrate and method of two-side processing of a substrate

Also Published As

Publication number Publication date
KR20220043206A (en) 2022-04-05
CN114258584A (en) 2022-03-29

Similar Documents

Publication Publication Date Title
TWI624000B (en) Apparatus and method for transportation of a carrier or a substrate
US20200040445A1 (en) Vacuum system and method for depositing a plurality of materials on a substrate
US20200083452A1 (en) Apparatus for vacuum processing of a substrate, system for vacuum processing of a substrate, and method for transportation of a substrate carrier and a mask carrier in a vacuum chamber
TWI651425B (en) A deposition source assembly for evaporating source material, a deposition apparatus for depositing evaporated source material on a substrate and a method of depositing evaporated source material on two or more substrates
KR20190031315A (en) Deposition system
KR20180100563A (en) Apparatus and method for continuous evaporation with side by side substrates
KR20130087604A (en) Deposition apparatus
JP2019531399A (en) Method for handling mask device, apparatus for exchanging mask device, mask exchange chamber, and vacuum system
US20200240008A1 (en) Apparatus for vacuum processing of a substrate, system for the manufacture of devices having organic materials, and method for sealing a processing vacuum chamber and a maintenance vacuum chamber from each other
WO2021197621A1 (en) Material deposition apparatus, vacuum deposition system and method of processing a large area substrate
KR102260368B1 (en) Vacuum processing system and method of operation of vacuum processing system
WO2018210408A1 (en) Apparatus for processing a substrate, processing system and method therefor
WO2021028043A1 (en) Path switch assembly, chamber and substrate processing system having the same, and methods therefor
KR102444830B1 (en) Methods for handling masks in a vacuum system and vacuum system
KR102709259B1 (en) Systems and methods for evaporating OLED layer stacks with vertical orientation
WO2020043277A1 (en) Apparatus for transportation of a first carrier and a second carrier, processing system for vertically processing a substrate, and methods therefor
CN212084969U (en) Apparatus for supporting a substrate carrier in a substrate loading module, substrate carrier and substrate loading module
WO2019174726A1 (en) Method for processing a substrate, apparatus for vacuum processing and vacuum processing system
WO2021197586A1 (en) Carrier transportation apparatus, carrier transport system, processing system and method of transporting a carrier
KR20060128496A (en) Sputter system
WO2023093992A1 (en) Carrier transport system, vacuum deposition system, and method of carrier transport
WO2021228389A1 (en) Carrier for a roller transport system, roller transport system and vacuum processing apparatus having the same
WO2023222196A1 (en) Carrier transport system, vacuum deposition system, and method of transporting carriers
WO2019223871A1 (en) Apparatus for transportation of a carrier, processing system for vertically processing a substrate, and a method of switching a transport path of a carrier
WO2019228610A1 (en) Holder, carrier comprising at least two holders, apparatuses and methods

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19755589

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20227007853

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 19755589

Country of ref document: EP

Kind code of ref document: A1