CN212084969U - Apparatus for supporting a substrate carrier in a substrate loading module, substrate carrier and substrate loading module - Google Patents

Apparatus for supporting a substrate carrier in a substrate loading module, substrate carrier and substrate loading module Download PDF

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Publication number
CN212084969U
CN212084969U CN202020515086.2U CN202020515086U CN212084969U CN 212084969 U CN212084969 U CN 212084969U CN 202020515086 U CN202020515086 U CN 202020515086U CN 212084969 U CN212084969 U CN 212084969U
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substrate
substrate carrier
carrier
fastening device
supporting
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莱内尔·欣特舒斯特
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Abstract

An apparatus (100) for supporting a substrate carrier in a substrate loading module is described. The apparatus comprises a carrier locking mechanism (140) configured to engage the substrate carrier (210) at a side of the substrate carrier, the carrier locking mechanism comprising a body (145) and a movable fastening device (142) engaging the side of the carrier.

Description

Apparatus for supporting a substrate carrier in a substrate loading module, substrate carrier and substrate loading module
Technical Field
The present disclosure relates generally to substrate processing, such as large area substrate processing. In particular, the present disclosure relates to substrate processing in which a substrate carrier transports a substrate for material deposition or layer deposition through a deposition system. Furthermore, the present disclosure relates to an apparatus for supporting a substrate carrier, a substrate carrier and a method for supporting a substrate carrier.
Background
Techniques for layer deposition on a substrate include, for example, sputter deposition, thermal evaporation, and chemical vapor deposition. A sputter deposition process may be used to deposit a layer of material, such as a layer of conductive or insulating material, on the substrate. The coating material can be used in several applications and in several technical fields. For example, one application is in the field of microelectronics, such as for producing semiconductor devices. Also, substrates for displays are typically coated by Physical Vapor Deposition (PVD) (e.g., a sputter deposition process) or Chemical Vapor Deposition (CVD). Further applications include insulating panels, substrates with TFTs, color filters or the like.
The substrate processing system or deposition system may include an atmospheric portion, such as a clean room, a substrate loading module, or the like, for loading and unloading substrates on and from the substrate carrier. Although the carrier increases the equipment that is guided through the system and may have some drawbacks, the carrier has the advantage that glass breakage can be reduced, in particular when considering that the substrate has a substrate area of up to several square meters and a thickness below 1mm, such as several tenths of a millimeter.
Handling of the substrate carrier can be difficult due to the size of the substrate and due to contaminants introduced in the deposition system. Especially contaminants, may reduce the deposition results and the yield of the processed substrate. In view of the above, an apparatus, system, and method that overcome at least some of the problems in the art would be beneficial.
SUMMERY OF THE UTILITY MODEL
According to an aspect of the present disclosure, there is provided an apparatus for supporting a substrate carrier in a substrate loading module. The apparatus includes a carrier locking mechanism configured to engage the substrate carrier at a side of the substrate carrier, the carrier locking mechanism including a body and a movable fastening device that engages the side of the carrier.
According to another aspect, the body of the carrier locking mechanism may be fixedly arranged relative to a wall of the substrate loading module.
According to another aspect, the movable fastening device may be configured to engage with the one side of the substrate carrier by movement of the movable fastening device selected from the group consisting of: rotational movement and translational movement.
According to a further aspect, the movable fastening means may comprise a movable piston, in particular a movable T-piston.
According to another aspect, the movable fastening means may comprise first magnetic means configured to establish a force towards the one side of the substrate carrier selected from the group consisting of: attractive and repulsive forces.
According to another aspect, the carrier locking mechanism may comprise one or more reaction force devices configured to clamp the substrate carrier between the movable fastening device and the one or more reaction force devices. The one or more reaction force devices may be selected from the group consisting of: a piston and a hollow tube or a combination thereof.
According to another aspect, the carrier locking mechanism may comprise an actuator for moving a device selected from the group consisting of: the movable fastening means and the one or more reaction force means.
According to another aspect, the carrier locking mechanism may be arranged at one position selected from the group consisting of: a robotic device, a wall of the substrate loading module, and a transport system.
According to another aspect of the present disclosure, a substrate carrier having a front side and a back side is provided. The substrate carrier includes a fastening device receiving structure disposed at the back side of the substrate carrier and configured to engage a movable fastening device of a carrier locking mechanism.
According to another aspect, the fastening device receiving structure may include a cover plate and a recess configured to receive the removable fastening device. In particular, the cover plate may comprise an opening comprising a tapered end sized to receive the removable fastening means. The cover plate may further comprise a hardened surface for preventing particle formation.
According to another aspect, the fastening device receiving structure may comprise a second magnetic device configured to establish a force selected from the group consisting of: attractive and repulsive forces.
According to a further aspect, the substrate carrier may comprise more than one fastening device receiving structure, in particular four fastening device receiving structures. The substrate carrier may further comprise a substrate carrier frame comprising more than one of the fastening device receiving structures.
According to another aspect of the present disclosure, there is provided a substrate loading module for loading and unloading a substrate on and from a substrate carrier. The load module includes an apparatus for supporting a substrate carrier according to embodiments described herein.
According to another aspect, the substrate loading module may be configured to receive the substrate carrier configured to engage the apparatus for supporting the substrate carrier.
Embodiments are also directed to apparatuses for practicing the disclosed methods and including apparatus portions for performing each of the described method aspects. These method aspects may be performed by means of hardware components, a computer programmed by suitable software, any combination of the two or in any other manner.
Drawings
So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The drawings relate to embodiments of the disclosure and are described below:
fig. 1 shows a side view of a carrier locking mechanism according to embodiments described herein;
figure 2 illustrates a side view of a substrate loading chamber according to embodiments described herein;
FIG. 3 illustrates a side view of a carrier locking mechanism engaging a fastening device receiving structure according to embodiments described herein;
FIGS. 4A and 4B illustrate a cover plate and a fastening device according to embodiments described herein;
FIG. 5 shows a flow diagram of a method according to embodiments described herein; and
fig. 6 illustrates a deposition system according to embodiments described herein.
Detailed Description
Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, like reference numerals refer to like parts. Only the differences with respect to the respective embodiments are described. Each example is provided by way of explanation of the disclosure, and is not meant as a limitation of the disclosure. In addition, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. The description is intended to include such modifications and alterations.
Layer deposition includes depositing a material onto a substrate, such as a glass substrate, in a deposition system. The vaporized material is generated and directed to the substrate to be processed. The deposition is performed in a processing chamber that establishes a vacuum environment. The substrate to be processed is transported through the deposition system by a substrate carrier. For example, one carrier may carry one substrate at a time. Additionally or alternatively, one substrate carrier may carry more than one substrate at a time.
Several substrates on a substrate carrier are moved through the system to allow for the sequential processing of multiple substrates. Unprocessed substrates are loaded onto a substrate carrier in a substrate loading module of the deposition system, transported through the deposition system, and processed in a processing chamber. In addition, the processed substrate may be unloaded into the substrate loading module. Accordingly, the substrate loading module may also be referred to as a substrate loading/unloading module. After deposition of material onto the substrate has occurred, the substrate is transported out of the processing chamber and unloaded from the substrate carrier in the substrate loading module under atmospheric conditions. In order to achieve a high yield, contamination of the untreated substrate or of the treated substrate, in particular of the untreated substrate, has to be avoided, since particles can degrade the layer to be treated.
In deposition systems, free material particles, i.e. particles that do not reach the substrate during deposition, are a source of contamination. For example, during deposition, the substrate carrier may receive material particles that remain on a surface of the substrate carrier after deposition. Therefore, it is beneficial to prevent these excess particles from falling onto the substrate to achieve high throughput of defect-free processed substrates, and to prevent particles from falling from the substrate carrier onto unprocessed substrates loaded onto the substrate carrier.
According to embodiments described herein and as exemplarily shown in fig. 1, there is provided an apparatus 100 for supporting a substrate carrier in a substrate loading module. The apparatus includes a carrier lock mechanism 140 configured to engage the substrate carrier at one side of the substrate carrier. The carrier locking mechanism 140 includes a body 145 and a removable fastening device 142 to engage one side of the carrier.
According to embodiments described herein, a substrate loading module may be included in a deposition system. The deposition system is further described with respect to fig. 6. The substrate loading module comprises an apparatus 100 for supporting a substrate carrier. The substrate loading module is configured for loading or unloading a substrate on or from a substrate carrier. The substrate loading module may be configured to receive a substrate carrier, and the substrate carrier may be configured to engage a device for supporting the substrate carrier.
According to an embodiment, the substrate loading module may comprise one or more apparatuses 100 for supporting substrate carriers, e.g. a first apparatus may be arranged such that a substrate carrier on a top side of a substrate may be arranged with the first apparatus and a second apparatus may be arranged such that a substrate carrier on a bottom side of a substrate may be arranged with the second apparatus. According to an embodiment, the two or more devices may be arranged such that the substrate carrier on the top side of the substrate may be arranged with the plurality of devices, and the two or more devices may be arranged such that the substrate carrier on the bottom side of the substrate may be arranged with the plurality of devices.
According to embodiments, the substrate loading module may be configured to load and/or unload substrates on and/or from a substrate carrier. For example, the substrate loading module may include a substrate transport device. The substrate transport device may be a robot for arranging the substrate at the carrier and/or for removing the substrate from the carrier. The substrate transport device may be arranged at a side of the substrate where the substrate is substantially free of deposition material.
According to an embodiment, the apparatus may be arranged at a wall 105 of the substrate loading module. Additionally or alternatively, the apparatus 100 may be arranged at a movable device arranged at the substrate loading module. The movable device may be a robotic arm or the like. Thus, the apparatus 100 may be adjustably disposed at the substrate carrier such that the carrier locking mechanism may engage one side of the substrate carrier. For example, the apparatus 100, in particular the carrier locking mechanism 140, may be arranged at one selected from the group consisting of: a robot apparatus and a transport system for transporting a substrate carrier.
According to an embodiment, the apparatus 100 is configured to support a substrate carrier in a substrate loading module. The apparatus 100 may be configured to hold a substrate carrier in a position to facilitate loading and/or unloading of substrates at the substrate carrier. Advantageously, the apparatus 100 may be arranged such that the substrate carrier may be bonded on one side. The side of the substrate carrier may be the side of the carrier facing away from the side of the substrate arranged at the carrier where the material is deposited onto the substrate, i.e. the side of the substrate carrier may face away from the front side of the substrate. Thus, the apparatus 100 may be arranged in a substrate loading module such that the apparatus or carrier locking mechanism may engage the substrate carrier on the back side.
As used throughout this disclosure, "back side of the substrate carrier" or "back side of the carrier" may be understood as the side of the carrier that is not facing the deposition source during deposition of material onto the substrate. Thus, the "backside of the substrate carrier" or "backside of the carrier" may be understood as the side of the carrier facing the rear wall of the deposition system, e.g. the side of the carrier facing the rear wall of the process chamber and the rear wall of the substrate loading module. In other words, the "backside of the substrate carrier" or "backside of the carrier" may be considered to be the side of the carrier that does not directly receive the deposition material.
According to embodiments described herein, the apparatus 100 includes a carrier locking mechanism 140. A carrier locking mechanism is configured to engage the substrate carrier at one side of the substrate carrier, the carrier locking mechanism comprising a body 145 and a movable fastening device 142 engaging one side of the carrier.
Advantageously, the carrier locking mechanism is configured to engage one side of the carrier. The carrier locking mechanism may engage the back side of the substrate carrier. In particular, the carrier locking mechanism may engage a fastening device receiving structure arranged at the back side of the substrate carrier. More particularly, the fastening means of the carrier locking mechanism may be introduced into the fastening means receiving structure and may be fastened at the fastening means receiving structure.
According to embodiments described herein, the body 145 of the carrier locking mechanism may be arranged at a wall of the substrate loading module. For example, the body of the carrier locking mechanism may be fixedly arranged at the wall 105 of the substrate loading module. The term "fixed" as used throughout this disclosure may be understood as a portion of the device being immovable relative to the component's own axis. However, a fixedly arranged body may not exclude that the body is arranged at a movable device or that the body may comprise a movable device.
According to embodiments described herein, the body 145 may include a removable fastening device 142. The movable fastening means may be configured to engage with a side of the carrier by rotational and/or translational movement of the fastening means. In particular, the movable fastening device 142 may engage a fastening device receiving structure arranged at the back side of the substrate carrier.
According to embodiments, which can be combined with other embodiments described herein, the carrier locking mechanism may comprise an actuator 150 for moving the carrier locking mechanism. In particular, the actuator may move the movable fastening means 142. The actuator may provide rotational and/or translational movement to the movable fastening device 142. Thus, the fastening device may be moved towards one side of the carrier, i.e. arranged together with the fastening device receiving structure for fixing the fastening device at the fastening device receiving structure. More particularly, the movable fastening device 142 may be introduced into the fastening device receiving structure at the substrate carrier.
According to an embodiment, the carrier locking mechanism 140 may comprise one or more reaction force devices 144 configured to clamp the carrier between the movable fastening device 142 and the one or more reaction force devices. When the fastening device is arranged at the fastening device receiving structure at the substrate carrier, one or more reaction force devices 144 may be arranged at the surface of the substrate carrier to provide a reaction force for clamping the substrate carrier between the fastening device and the reaction force device. According to an embodiment, the one or more reaction force devices 144 may be selected from the group consisting of: a piston and a hollow tube or a combination thereof.
According to an embodiment, actuator 150 may move one or more reaction force devices 144. Thus, the actuator may be configured to move the movable fastening device 142 and/or the one or more reaction force devices 144. For example, the actuator may provide a translational movement to the one or more reaction force devices such that the one or more reaction force devices are arranged at a surface of the substrate carrier, in particular at a surface at the backside of the substrate carrier.
According to embodiments described herein, the carrier locking mechanism may comprise a first magnetic device configured to establish an attractive force and/or a repulsive force towards a second magnetic device arranged at a side of the carrier. In particular, the fastening means may comprise first magnetic means to hold the substrate carrier at the carrier locking mechanism.
Advantageously, the substrate carrier may be clamped between the fastened fastening means and the one or more counter force means to be supported for loading and/or unloading of substrates at the substrate carrier. Furthermore, the substrate carrier may advantageously be supported at its rear side. For processed substrates, the operation of removing the substrate from the substrate carrier is improved, since the falling of particles already deposited on the front side of the substrate carrier can be reduced or avoided. Furthermore, advantageously, the loading of unprocessed substrates to the carrier is improved, since the dropping of particles remaining on the substrate carrier due to processing of one or more previous substrates may be reduced or avoided. Thus, a higher yield of processed substrates is achieved. Even more advantageously, the fastening means introduced into the fastening means receiving structure may further avoid particles falling off the substrate carrier, as the fastening means may be arranged at a portion of the substrate carrier substantially free of deposited particles.
As seen in fig. 2, the substrate carrier 210 may be supported by the apparatus 200 in a substrate loading module 270. The substrate carrier may be transported by a transport system 230. The transport system 230 may be arranged on the top and bottom sides of the substrate carriers in the substrate loading module. For example, the transport system 230 may be a magnetic levitation system.
According to an embodiment, the substrate carrier may be vertically disposed at the apparatus 200 in the substrate loading module 270 for loading and/or unloading the substrate 220. For example, the substrate carrier is supported by the apparatus 200 to stabilize the substrate carrier during loading and/or unloading of substrates.
According to embodiments described herein, the substrate carrier may comprise more than one fastening device receiving structure 212, in particular eight fastening device receiving structures, more in particular four fastening device receiving structures. One or more fastening device receiving structures may be disposed on the back side of the substrate carrier 210 and may be configured to engage the movable fastening devices 242 of the carrier locking mechanism 240. The substrate carrier may include a substrate carrier frame. The substrate carrier frame may include more than one fastening device receiving structure 212.
According to embodiments described herein, the fastening device receiving structure 212 may include a cover plate and a recess configured to receive a removable fastening device 242. The cover plate may be arranged at the substrate carrier frame and may comprise a recess for receiving the movable fastening means 242.
According to an embodiment, the substrate carrier 210 may be oriented in a vertical orientation in the deposition system and may thus be arranged vertically in the substrate loading module. The substrate may be oriented in a vertical orientation at the substrate carrier such that the substrate may be transported vertically through the deposition system by the vertical substrate carrier. The substrate may be surrounded by a substrate carrier, i.e. the substrate carrier may extend beyond the substrate in the x and y directions of the two-dimensional coordinate system. Alternatively, substrate carriers may be arranged on the top and bottom sides of the substrate in the y-direction to carry the substrate. The substrate may be arranged at the substrate carrier by holding means, for example by a clamp, to hold the substrate at the carrier at the top and bottom sides of the substrate.
As used throughout this disclosure, the terms "vertical" or "vertical orientation" are understood to be distinguished from "horizontal" or "horizontal orientation. That is, "vertical orientation" relates to, for example, a substantially vertical orientation of the substrate carrier and the substrate, wherein deviations of a few degrees from a strictly vertical direction or vertical orientation (e.g., up to 10 ° or even up to 15 °) are still considered to be "substantially vertical orientation".
According to embodiments, which can be combined with other embodiments described herein, the substrate can be a large area substrate. The large area substrate may have at least 0.01m2In particular at least 0.1m2More particularly at least 0.5m2The size of (c). For example, the large area substrate or carrier may be generation 4.5 (which corresponds to about 0.67 m)2Substrate (0.73m × 0.92m)), generation 5 (which corresponds to about 1.4 m)2Substrate (1.1m × 1.3m)), generation 7.5 (which corresponds to about 4.29 m)2Substrate (1.95m × 2.2m)), generation 8.5 (which corresponds to about 5.7 m)2Substrate (2.2m × 2.5m)), or even generation 10 (which corresponds to about 8.7 m)2Substrate (2.85m × 3.05 m)). Even higher generations, such as 11 th generation and 12 th generation, and corresponding substrate areas may be similarly implemented.
Fig. 3 exemplarily shows a fastening device 342 introduced into the fastening device receiving structure 312. In particular, the fastening device 342 may be introduced through the cover plate 346 into the groove 348. The cover plate may comprise an opening through which the fastening means may be guided to engage in the groove 348. The cover plate can be fixed on the substrate carrier via fixing means 349, in particular screws or rivets. According to an embodiment, the cover plate 346 may include a hardened surface for preventing particle formation. Advantageously, the hardened surface further contributes to preventing particle formation.
Advantageously, the opening of the cover plate is configured to guide the fastening device through the opening such that the fastening device does not come into contact with the cover plate, the opening and/or the recess when introduced into the fastening device receiving structure. Thus, particle generation may be avoided or reduced. Furthermore, a long service life of the fastening device and the fastening device receiving structure can be ensured.
According to an embodiment, the fastening device may comprise a fastening unit for fastening together with the fastening device receiving structure. According to an embodiment, the movable fastening means 342 may comprise a movable piston, in particular a movable T-piston. Additionally or alternatively, the fastening device receiving structure 312 may comprise a second magnetic device configured to establish an attractive force and/or a repulsive force towards the first magnetic device comprised by the movable fastening device of the carrier locking mechanism. The second magnetic means may be a magnetic material or a magnet. The magnetic force of the first and second magnetic means may be inducible. Thus, the fastening of the substrate carrier by the carrier locking mechanism and the fastening device receiving structure may be controlled by inducing a magnetic force at the first and second magnetic means. The first and second magnetic means may for example be electromagnetic coils.
According to embodiments described herein, the carrier locking mechanism may include one or more reaction force devices 344. The one or more reaction force devices 344 may help to clamp the substrate carrier between the carrier locking mechanism and the fastening device receiving structure 312 arranged at one side of the substrate carrier, in particular at the back side of the substrate carrier.
Fig. 4A and 4B exemplarily show front views of the fastening device engaged to the fastening device receiving structure. The fastening means receiving structure may be fixed at the carrier via fixing means 449. Fig. 4A exemplarily shows the fastening device 442 engaged to the fastening device receiving structure 412 by a rotational movement of the fastening device 442. The shape of the opening in the fastening device receiving structure (i.e., in the cover plate 446) may be similar to the shape of the fastening device to allow the fastening device to be introduced into the recess 448 through the shaped opening. For example, the opening may include an open T-shape to allow a T-shaped piston to be introduced into the recess 448.
According to embodiments described herein, the fastening means may be guided through the cover plate 446, in particular through an opening in the cover plate, and received by the groove 448. After being introduced, the actuator may rotate the fastening means 442 so that the fastening means may be locked at the opening of the cover plate. For example, the fastening device may be rotated about 45 degrees, in particular about 90 degrees. As an example, a T-shaped piston may be guided through an opening, wherein the opening may comprise a similar T-shape. The T-shaped piston may be rotated so that the T-shaped piston may be arranged at the opening portion without a similar T-shape. Thus, the T-shaped piston can be fastened to the cover plate. To unlock the fastening device, the fastening device may be rotated in the opposite direction.
According to embodiments, which can be combined with other embodiments described herein, the carrier locking mechanism may comprise one or more counter force devices. The one or more reaction force devices may be configured to provide a reaction force to a fastened fastening device when engaging a fastening device receiving structure disposed on the substrate carrier.
Alternatively and as exemplarily shown in fig. 4B, the fastening means may be fastened by a translational movement. The cover plate may be configured to engage the fastening device by translational movement of the fastening device. The fastening device 442 may be guided through the cover plate 446 and translationally moved to the locked position. For example, the fastening means may be pushed down into a locking groove of an opening in the cover plate. The opening in the cover plate may be tapered at one end such that the tapered end is sized to receive the fastening means. For example, the tapered end may include a diameter substantially similar to a diameter of a T-shaped piston to receive the T-shaped piston. The diameter may be smaller than a T-shaped tip (tip) of the piston such that the piston is locked in the tapered end of the opening. Alternatively, the tapered end may include a diameter that is greater than a diameter of the piston (e.g., a T-shaped piston). The diameter of the end of the piston including the enlarged portion may be larger than the diameter of the tapered end portion such that the cover plate 446 may be clamped between the T-shaped end of the piston and the one or more reaction force devices. Making the diameter of the piston smaller compared to the tapered end allows for a contactless movement, in particular without scratching on the surface during the movement. When fastening the fastening device at the fastening device receiving structure, no additional particles are generated. According to some embodiments, to unlock the fastening device, the fastening device may be translated in the opposite direction.
Fig. 5 shows a flow diagram of a method 500 according to embodiments described herein. According to an embodiment, a method for supporting a carrier in a substrate loading module for loading and unloading substrates on and from a substrate carrier is provided. The method includes transporting the substrate carrier to a substrate loading module in block 510 and securing the substrate carrier to a carrier locking mechanism including a securing device configured to engage a securing device receiving structure disposed at a back side of the substrate carrier in block 520.
According to embodiments described herein, a substrate carrier may be transported to a substrate loading module. The substrate carrier may carry processed substrates or may be empty to receive unprocessed substrates in the substrate loading module. The substrate carrier may be supported in the substrate loading module during loading and/or unloading of substrates from the substrate carrier. The substrate carrier may be fastened to the apparatus according to embodiments described herein, in particular, the substrate carrier may be fastened to the carrier locking mechanism according to embodiments described herein.
According to an embodiment, the method may further comprise removing the substrate from the carrier while securing the carrier to the carrier locking mechanism. For example, processed substrates may be transported from the process chamber to a substrate loading module to unload the substrates from the substrate carrier. Additionally or alternatively, the untreated substrate may be removed from the substrate carrier, for example, when the untreated substrate includes defects or impurities. Advantageously, the substrate carrier is secured to a carrier locking mechanism support carrier to facilitate loading and/or unloading of the substrate. Furthermore, advantageously, the carrier locking mechanism may be arranged at the back side of the substrate carrier. Accordingly, particle formation and particle dropping can be prevented to avoid any impurities and contamination of unprocessed and/or processed substrates, thereby achieving a high process yield.
According to an embodiment, the method may further comprise loading the unprocessed substrate on a substrate carrier, releasing the substrate carrier from the carrier locking mechanism, and transporting the carrier away from the substrate loading module. A substrate carrier without a substrate may be provided with an untreated substrate. During loading, the substrate carrier may be secured at the apparatus according to embodiments described herein. After loading the unprocessed substrate onto the substrate carrier, the substrate carrier may be released from the carrier locking mechanism. The substrate carrier and the substrate may then be transported into the processing chamber at the transport system to process the substrate.
Fig. 6 schematically illustrates a substrate deposition system 601 according to embodiments described herein. The deposition system includes a substrate loading module 670. The substrate loading module may include one or more apparatuses 600 and a substrate moving device 602.
According to embodiments described herein, a deposition system may include one or more substrate loading modules 670, one or more transfer chambers 680, and one or more processing chambers 690. The deposition system may comprise an apparatus according to embodiments described herein.
According to embodiments described herein, the processing system includes one or more process chambers 690. Vacuum conditions may be applied to one or more of the processing chambers 690 and/or the transfer chamber 680. The transfer chamber 680 may include a pre-vacuum chamber and a high vacuum chamber. In the process chamber, a substrate 620 may be processed.
Processing of a substrate may be understood as transferring material to the substrate. For example, the deposition material may be deposited on the substrate, for example, by a CVD process or a PVD process (such as sputtering or evaporation). The substrate 620 may include a deposition material receiving side. The deposition material receiving side of the substrate may be considered to be the side of the substrate facing the deposition source. Further, the processing of the substrate may also include etching, cleaning, or thermal processing of the substrate.
According to embodiments described herein, the substrate loading module may be coupled to one or more transfer chambers 680. Additionally or alternatively, the substrate loading module 670 may be connected to one or more process chambers 690. For example, a load lock module may connect the substrate loading module and one or more high vacuum modules and/or processing chambers 690. The loadlock module or chamber may help equalize pressure differences between modules. For example, atmospheric pressure is applied in one module and vacuum is applied in a module connected to the one module via a load lock module.
The substrate deposition system 601 may include a transport system 630 for transporting one or more substrates 620. In particular, the transport system 630 may include a transport path extending through the processing system. For example, one or more substrates 620 may be transferred from the substrate loading module to one or more process chambers. Fig. 6 shows the load module on the left hand side of the processing chamber. According to some embodiments, which can be combined with other embodiments described herein, the unloading module can be provided at the opposite side of the process chamber, i.e. the right-hand side in fig. 6. The unloading module may be provided similar to the loading module as described in embodiments of the present disclosure. In addition, one or more substrates may be transported between one or more process chambers. For example, multiple substrates may be transported. Substrate carriers and/or substrates may enter the system via the substrate loading module 670, pass through the transfer chamber 680 and the process chamber 690, and exit the system via the process chamber 690 and the further transfer chamber 680 and another substrate loading module (not shown in fig. 6) (i.e., an unloading module).
According to some embodiments, the deposition system may include a vacuum spin module (not shown in fig. 6). The vacuum rotation module may be disposed at an opposite side of the process chamber from the substrate loading module, i.e., a right-hand side in fig. 6. The vacuum rotation module may be configured to rotate the substrate carrier and move the rotated substrate carrier laterally to a vacuum return transport system, i.e., a return track. One or more additional deposition sources may be arranged for depositing material on a substrate carried by the substrate carrier at the vacuum return track.
Further, a pre-vacuum chamber may be disposed between the substrate loading module and the one or more process chambers. The substrate loading module may include atmospheric conditions. For example, the air pressure in the load module may include atmospheric air pressure. Thus, particles, like e.g. O2、H2O and N2As such, may be present in the substrate loading module or generally outside the vacuum chamber. The pre-vacuum chamber may include different pressure conditions compared to the substrate loading module. For example, the pre-vacuum chamber includes a lower pressure condition. The pressure in the pre-vacuum chamber may be lower than 10-1mbar. The pre-vacuum chamber may be connected to one or more process chambers. The processing chamber may include different pressure conditions compared to the substrate loading module and/or the pre-vacuum chamber. A load lock module may be disposed between the pre-vacuum chamber and the process chamber. For example, the process chamber may include vacuum conditions.
Vacuum conditions as used herein include below 10-1mbar or less than 10-3Pressure conditions in the mbar range, such as 10-7mbar to 10-2Pressure conditions of mbar. For example, the vacuum conditions in the load lock module may be at atmospheric pressure conditions and sub-atmospheric pressure conditions (e.g., at 10)-1In the mbar or lower range). To transfer the substrate into the high vacuum chamber, the substrate may be inserted into a load lock module set at atmospheric pressure, the load lock module may be sealed, and then may be set below 10 f-1Sub-atmospheric pressure in the mbar range. Subsequently, an opening between the load lock chamber and the high vacuum chamber may be opened, and the substrate may be inserted into the high vacuum chamber to be transported into the processing chamber.
Further, the vacuum condition in the process chamber may include equal to or lower than 10-2Process pressure conditions of mbar, such as 10-3mbar to 10-4mbar. The base pressure condition in the process chamber may be at 10-7mbar to 10-6mbar, especially in the range of 1 x 10-7mbar to 5 x 10-6In the mbar range. The vacuum conditions may be applied by using a vacuum pump or other vacuum generating technique.
According to embodiments described herein, one or more process chambers or multiple chambers may include one or more deposition sources 660. According to some embodiments, which can be combined with other embodiments described herein, one or more deposition sources can be installed in a cathode door, i.e., a sealing element for sealing a vacuum chamber, which can be removed to provide access from the atmosphere to the deposition sources. For example, a deposition source, such as a sputtering cathode, may be provided in the door. Further, a pair of cathodes may be installed in the door, or a greater number of cathodes may be installed. In particular, the deposition system or deposition apparatus may comprise one to ten deposition sources. According to some embodiments, the process chamber may include more than ten deposition sources. The one or more deposition sources may comprise one or more cathodes, in particular rotatable sputtering cathodes. If there is more than one deposition source, the deposition sources may be arranged in pairs. For example, the deposition sources are arranged adjacent to each other. The deposition source may extend vertically in length. According to embodiments, one or more deposition sources may be rotatably fixed to the bottom or top side of the process chamber. In particular, there may be two to ten deposition sources in one or more process chambers. More particularly, there may be three or more deposition sources in one or more process chambers.
While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims (20)

1. Apparatus (100) for supporting a substrate carrier in a substrate loading module, characterized by comprising:
a carrier locking mechanism (140) configured to engage the substrate carrier (210) at a side of the substrate carrier, the carrier locking mechanism comprising:
a main body (145); and
a movable securing device (142) engaging the one side of the substrate carrier.
2. The apparatus (100) for supporting a substrate carrier according to claim 1, wherein the body (145) of the carrier locking mechanism is fixedly arranged with respect to a wall (105) of the substrate loading module.
3. The apparatus (100) for supporting a substrate carrier according to claim 1, wherein the movable securing device (142) is configured to engage the one side of the substrate carrier by a movement of the movable securing device selected from the group consisting of: rotational movement and translational movement.
4. The apparatus (100) for supporting a substrate carrier (210) according to claim 1, wherein the movable securing device (142) comprises a movable piston.
5. The apparatus (100) for supporting a substrate carrier (210) according to claim 1, wherein the movable securing device (142) comprises a movable T-shaped piston.
6. The apparatus (100) for supporting a substrate carrier according to claim 1, wherein the movable fastening device (142) comprises a first magnetic device configured to establish a force towards the one side of the substrate carrier selected from the group consisting of: attractive and repulsive forces.
7. The apparatus (100) for supporting a substrate carrier according to claim 1, wherein the carrier locking mechanism (140) comprises one or more reaction force devices (144) configured to clamp the substrate carrier between the movable fastening device (142) and the one or more reaction force devices.
8. The apparatus (100) for supporting a substrate carrier according to any of claims 1 to 7, wherein the carrier locking mechanism (140) comprises an actuator (150) for moving a device selected from the group consisting of: the movable fastening means (142) and the one or more reaction force means (144).
9. The apparatus (100) for supporting a substrate carrier according to claim 7, wherein the one or more reaction force devices (144) are selected from the group consisting of: a piston and a hollow tube or a combination thereof.
10. The apparatus (100) for supporting a substrate carrier according to claim 8, wherein the carrier locking mechanism (140) is arranged at one position selected from the group consisting of: a robotic device, a wall of the substrate loading module, and a transport system (230).
11. A substrate carrier (310) having a front side and a back side, characterized in that the substrate carrier comprises:
a fastening device receiving structure (212) disposed at the back side of the substrate carrier (210) and configured to engage a movable fastening device of a carrier locking mechanism (140).
12. The substrate carrier (210) of claim 11, wherein the fastening device receiving structure (212) comprises a cover plate (346) and a groove (348) configured to receive the removable fastening device (142).
13. The substrate carrier (210) of claim 12, wherein the cover plate comprises an opening comprising a tapered end sized to receive the movable fastening device.
14. The substrate carrier (210) of claim 11, wherein the securing device receiving structure (212) comprises a second magnetic device configured to establish a force selected from the group consisting of: attractive and repulsive forces.
15. The substrate carrier (210) of claim 12, wherein the cover plate (346) comprises a hardened surface for preventing particle formation.
16. The substrate carrier (210) according to any of claims 11 to 15, wherein the substrate carrier (310) comprises more than one fastening device receiving structure (212).
17. The substrate carrier (210) according to any of claims 11 to 15, wherein the substrate carrier (310) comprises four fastening device receiving structures.
18. The substrate carrier (210) according to claim 16, wherein the substrate carrier comprises a substrate carrier frame comprising more than one of the fastening device receiving structures (212).
19. A substrate loading module (670) for loading and unloading substrates on and from a substrate carrier, characterized in that the substrate loading module comprises:
an apparatus for supporting the substrate carrier according to any one of claims 1 to 7.
20. The substrate loading module (670) of claim 19, wherein the substrate loading module is configured to receive the substrate carrier (210) configured to engage the apparatus (100) for supporting the substrate carrier.
CN202020515086.2U 2020-03-05 2020-04-09 Apparatus for supporting a substrate carrier in a substrate loading module, substrate carrier and substrate loading module Active CN212084969U (en)

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